JPWO2007026877A1 - Circuit board inspection apparatus and circuit board inspection method - Google Patents

Abstract

[Summary] Reliable electrical inspection can be performed even if the circuit board to be inspected has electrodes of fine pitch, and the inspection work should be performed smoothly even when the circuit board is continuously inspected. Provided is a circuit board inspection apparatus capable of A plurality of conductive pins arranged at a predetermined pitch between the connector board of the first inspection jig and the connector board of the second inspection jig, and a pair of spaced apart insulating plates that support the conductive pins A first auxiliary relay pin unit arranged on the connector substrate side of the first inspection jig, a plurality of conductive pins arranged at a predetermined pitch, and a pair of spaced apart insulating plates supporting the conductive pins Auxiliary connection circuit unit comprising a second auxiliary relay pin unit provided, and an auxiliary anisotropic conductive sheet for electrically connecting the first auxiliary relay pin unit and the second auxiliary relay pin unit to each other When the number of electrodes of one tester side connector is insufficient, it is configured to bypass the auxiliary connection circuit unit and be electrically connected to the electrode of the other tester side connector.

Description

  The present invention provides a circuit to be inspected by clamping a circuit board (hereinafter referred to as “circuit board to be inspected”) to be inspected for electrical inspection from both sides with an upper inspection jig and a lower inspection jig. The present invention relates to a circuit board inspection apparatus and a circuit board inspection method for inspecting electrical characteristics of a circuit board to be inspected in a state where electrodes formed on both surfaces of the board are electrically connected to a tester.

  A printed circuit board for mounting an integrated circuit or the like is inspected for electrical characteristics in order to confirm that the wiring pattern of the circuit board has a predetermined performance before mounting the integrated circuit or the like.

  In this electrical inspection, for example, an inspection head is incorporated into an inspection tester having a circuit board transport mechanism, and different circuit boards are inspected by exchanging the inspection head portion.

  For example, as disclosed in Patent Document 1 (Japanese Patent Application Laid-Open No. 6-94768), a metal inspection pin that is in electrical contact with an inspection target electrode of a circuit board to be inspected is implanted in the substrate. A method using an inspection jig has been proposed.

  Further, as disclosed in Patent Document 2 (Japanese Patent Laid-Open No. 5-159821), an inspection head having a conductive pin, a circuit board for pitch conversion called an off-grid adapter, and an anisotropic conductive sheet are provided. A method using a combined inspection jig is known.

  However, as in Patent Document 1 (Japanese Patent Laid-Open No. 6-94768), in a method using an inspection jig in which a metal inspection pin is directly brought into contact with an inspection electrode of a circuit board to be inspected, contact with a conductive pin made of metal As a result, the electrodes of the circuit board to be inspected may be damaged.

  Especially in recent years. Circuits on a circuit board are becoming finer and higher in density, and when inspecting such a printed circuit board, in order to bring a large number of conductive pins into conductive contact simultaneously with the electrodes to be inspected at a high pressure, It is necessary to pressurize the inspection jig, and the inspected electrode is easily damaged.

  In such an inspection jig for inspecting a miniaturized and high-density printed circuit board, it is becoming technically difficult to implant a large number of high-density metal pins on the board. In addition, the manufacturing cost is expensive, and it is difficult to repair or replace some of the metal pins when they are damaged.

  On the other hand, as in Patent Document 2 (Japanese Patent Application Laid-Open No. 5-159821), in an inspection jig using an anisotropic conductive sheet, the electrodes to be inspected of the circuit board to be inspected are pitched through the anisotropic conductive sheet. Since it comes into contact with the electrode of the conversion substrate, there is an advantage that the electrode to be inspected of the circuit board to be inspected is hardly damaged. In addition, since a substrate that performs pitch conversion is used, inspection pins to be implanted on the substrate can be implanted at a pitch wider than the pitch of the electrode to be inspected on the circuit substrate to be inspected, so that inspection is performed at a fine pitch. There is an advantage that the manufacturing cost of the inspection jig can be saved without having to plant pins.

  However, in this inspection jig, since it is necessary to create a pitch conversion board and an inspection jig in which an inspection pin is implanted for each circuit board to be inspected, the circuit board to be inspected The same number of inspection jigs as the printed circuit board is required.

  For this reason, in the case where a plurality of printed circuit boards are produced, there is a problem that a plurality of inspection jigs must be held correspondingly. In particular, in recent years, the product cycle of electronic devices has been shortened, and the production period of printed circuit boards used in products has been shortened. With this, inspection jigs cannot be used for a long time, There is a problem that an inspection jig must be produced each time the production of a printed circuit board is switched.

  As a countermeasure against such a problem, for example, a relay pin unit such as Patent Documents 3 to 5 (Japanese Patent Laid-Open Nos. 7-248350, 8-27169, and 8-338858) is used. An inspection apparatus using a so-called universal type inspection jig has been proposed.

  FIG. 33 is a cross-sectional view of an inspection apparatus using such a universal type inspection jig.

  The inspection apparatus includes an upper inspection jig 111a and a lower inspection jig 111b. These inspection jigs include circuit board side connectors 121a and 121b, relay pin units 131a and 131b, a tester side connector 141a, 141b.

  The circuit board side connectors 121a and 121b have pitch conversion boards 123a and 123b and anisotropic conductive sheets 122a, 122b, 126a and 126b arranged on both sides thereof.

  The relay pin units 131a and 131b have a large number of conductive pins 132a and 132b (for example, 5000 pins) arranged on lattice points at a constant pitch (for example, 2.54 mm pitch), and the conductive pins 132a and 132b can be moved up and down. Insulating plates 134a and 134b to support.

  The tester-side connectors 141a and 141b include connector boards 143a and 143b that electrically connect the tester and the conductive pins 132a and 132b when the circuit board 101 to be inspected is clamped by the inspection jigs 111a and 111b. 143a, 143b has anisotropic conductive sheets 142a, 142b disposed on the conductive pins 132a, 132b side, and base plates 146a, 146b.

  The inspection jig using the relay pin unit only needs to replace the circuit board side connectors 121a and 121b with those corresponding to the circuit board 101 to be inspected when inspecting a printed circuit board which is a different object to be inspected. The relay pin units 131a and 131b and the tester side connectors 141a and 141b can be used in common.

  However, in such a conventional universal type inspection jig, as the anisotropic conductive sheets 122a and 122b constituting the circuit board side connectors 121a and 121b, a plurality of conductive path forming portions extending in the thickness direction and their conductive properties are provided. It consists of an insulating part that insulates the path forming part from each other, and the conductive particles are contained only in the conductive path forming part and are unevenly distributed in the plane direction, and the conductive path forming part protrudes on one side of the sheet. The anisotropic conductive sheets 122a and 122b are used.

  For this reason, the anisotropic conductive sheets 122a and 122b are frequently used in the anisotropic conductive sheets 122a and 122b because the conductive path forming portion deteriorates (the resistance value increases) due to repeated use in inspection and the service life is short. When replacing, it is necessary to align the anisotropic conductive sheets 122a and 122b with the pitch conversion substrates 123a and 123b and to align the circuit board connectors 121a and 121b with the relay pin units 131a and 131b. Therefore, the replacement work is complicated and the inspection efficiency is lowered.

  Further, when the electrodes of the circuit board 101 to be inspected have a minute pitch of, for example, 200 μm or less, the anisotropic conductive sheet 122a is used when using the unevenly distributed anisotropic conductive sheets 122a and 122b as described above. , 122b and the pitch conversion substrates 123a and 123b are difficult to align, and when a plurality of circuit boards 101 to be inspected are continuously inspected, they are anisotropic by repeatedly contacting the circuit board 101 to be inspected. The displacement of the conductive sheets 122a and 122b is likely to occur.

  As a result, the conductive path forming portions of the anisotropic conductive sheets 122a and 122b do not match the electrode positions of the circuit board 101 to be inspected, and good electrical connection cannot be obtained, so an excessive resistance value is measured. A printed circuit board that should be judged as a non-defective product tends to be erroneously judged as a defective product.

  On the other hand, for example, when a connector in which an anisotropic conductive sheet and a pitch conversion board are integrated as described in Patent Document 6 (Japanese Patent Laid-Open No. 6-82531) is used, alignment is easy. However, when the anisotropic conductive sheet portion deteriorates, the entire pitch conversion substrate must be replaced, which requires a large number of pitch conversion substrates and increases the inspection cost.

  For this reason, the present applicant has already disclosed unevenly distributed anisotropic conductive sheets as the anisotropic conductive sheets 122a and 122b in Patent Document 7 (Japanese Patent Application No. 2004-058282) as shown in FIG. Instead of using it, a universal type inspection jig using a dispersed anisotropic conductive sheet in which insulating part conductive particles having insulating properties are arranged in the thickness direction and uniformly dispersed in the surface direction has been proposed.

  By the way, the printed wiring board which is the circuit board 101 to be inspected has been multi-layered and densified. Actually, in the thickness direction, for example, the height variation due to the inspected electrodes 102 and 103 such as solder ball electrodes such as BGA, The substrate itself is warped. Therefore, in order to achieve electrical connection to the electrodes 102 and 103 to be inspected on the circuit board 101 to be inspected, the upper inspection jig 111a and the lower inspection jig 111b are pressurized with high pressure. Then, the circuit board 101 to be inspected is deformed flat, and the heights of the electrodes 102 and 103 to be inspected on the upper inspection jig 111a and the lower inspection jig 111b side with respect to the height variation of the electrodes 102 and 103 to be inspected. Follow-up performance is required.

  In such a conventional universal type inspection jig, in order to ensure followability with respect to the height of the electrodes 102 and 103 to be inspected, the conductive pins 132a and 132b are followed by movement in the axial direction. Since the amount of movement in the axial direction of 132a and 132b is also limited, the following ability to the height of the electrodes 102 and 103 to be inspected may not be good, and a continuity failure occurs and accurate inspection cannot be performed. Become.

  In such a universal type inspection jig, as shown in FIG. 34, the press pressure when the circuit board 101 to be inspected is clamped by the upper inspection jig 111a and the lower inspection jig 111b. The upper and lower anisotropic conductive sheets 122a, 122b, 126a, 126b, 142a, 142b absorb pressure.

  Therefore, in such a universal type inspection jig, it is necessary to dispose the conductive pins 132a and 132b at regular intervals in order to support the pitch conversion substrates 123a and 123b and disperse the press pressure.

  Further, in the conventional universal type inspection jig, the press pressure is received by the conductive pins 132a and 132b, so that it is necessary to arrange a large number of conductive pins 132a and 132b at regular intervals.

  For this reason, in response to the miniaturization of the electrodes of the circuit board 101 to be inspected, for example, when forming the insulating plates 134a and 134b having 10,000 or more through holes at a pitch of 0.75 mm, the substrates of the insulating plates 134a and 134b If the thickness of the insulating plate 134 is thin, the strength becomes low, and it may crack when bent. Therefore, it is necessary to make the insulating plates 134a and 134b thicker.

  For this reason, the present applicant has already proposed a universal type inspection jig as shown in FIG. 35 in Patent Document 8 (Japanese Patent Application No. 2005-126431).

  That is, in this inspection jig, the relay pin unit 131 includes the first insulating plates 134a and 134b disposed on the circuit board to be inspected 1 side through which the conductive pins 132a and 132b are inserted and supported, and the circuit board 101 to be inspected. Two insulating plates, second insulating plates 135a and 135b, arranged on the opposite side are provided. The two insulating plates 134 are held so that the conductive pins 132 can move up and down.

  In the relay pin unit 131, intermediate holding plates 136a and 136b are disposed between the first insulating plates 134a and 134b and the second insulating plates 135a and 135b.

  The first support pins 133a and 133b are arranged between the first insulating plates 134a and 134b and the intermediate holding plates 136a and 136b, whereby the first insulating plates 134a and 134b and the intermediate holding plates are arranged. The space between 136a and 136b is fixed.

  Similarly, the second support pins 137a and 137b are disposed between the second insulating plates 135a and 135b and the intermediate holding plates 136a and 136b, whereby the second insulating plates 135a and 135b and the intermediate holding plates are intermediately held. The space between the plates 136a and 136b is fixed.

  Then, as shown in FIG. 35, a second contact between the first contact support position 138A of the first support pin 133 with the intermediate holding plate 136 and the intermediate holding plate 136 of the second support pin 137 is achieved. The contact support position 138B is arranged at a different position on the intermediate holding plate projection plane A where the inspection device 110 is projected in the thickness direction of the intermediate holding plate (from the upper side to the lower side in FIG. 35).

  With this configuration, when performing electrical inspection by clamping both surfaces of the circuit board to be inspected between the first inspection jig and the second inspection jig, an initial stage of pressurization Then, the pressure is absorbed by compression of the conductive pins of the relay pin unit, rubber elastic compression of the first anisotropic conductive sheet, the second anisotropic conductive sheet, and the third anisotropic conductive sheet. Thus, it is possible to absorb some variation in the height of the electrodes to be inspected on the circuit board to be inspected.

The first abutment support position of the first support pin with the intermediate holding plate and the second abutment support position of the second support pin with the intermediate holding plate are the thickness of the intermediate holding plate. When the circuit board to be inspected is further pressurized between the first inspection jig and the second inspection jig because the intermediate holding plate projection surface projected in the direction is arranged at different positions. In addition to the rubber elastic compression of the first anisotropic conductive sheet, the second anisotropic conductive sheet, and the third anisotropic conductive sheet, the first insulating plate of the relay pin unit, Variation of the electrodes to be inspected of the circuit board to be inspected, for example, the height of the solder ball electrodes, by the spring elasticity of the two insulating plates and the intermediate holding plate disposed between the first insulating plate and the second insulating plate It is possible to disperse the pressure concentration against the variation and to avoid local stress concentration.

As a result, stable electrical contact is ensured for each of the electrodes to be inspected on the circuit board to be inspected having a height variation, and further, stress concentration is reduced. Damage is suppressed. As a result, since the repeated use durability of the anisotropic conductive sheet is improved, the number of times of replacement of the anisotropic conductive sheet is reduced, and the inspection work efficiency is improved.

However, in the conventional universal type inspection jigs described above, when the number of tester side electrodes of the tester side connectors in the upper and lower tester side connectors 141a and 141b is, for example, 6000 points, In the relationship between the number of electrodes to be inspected 102 on the upper side of the circuit board 101 and the number of electrodes 103 to be inspected on the lower side of the circuit board 101 to be inspected, it may be difficult to perform inspection if the following pattern is generated . That is, (tester side)
Number of electrodes of upper tester side connector 141a = 6000 points Number of electrodes of lower tester side connector 141b = 6000 points (circuit board to be inspected)
Number of electrodes of upper test electrode 102 = 8000 points Number of electrodes of lower test electrode 103 = 4000 points That is, the number of tester side electrodes 144a of the upper tester side connector 141a is 6000 points, When the number of electrodes of the tester side electrode 144b of the tester side connector 141b is 6000, the number of electrodes 102 to be inspected on the upper side of the circuit board 101 to be inspected is 8000 points, and the lower side of the circuit board 101 to be inspected. When the number of electrodes 103 to be inspected is 4000, it may be difficult to execute the inspection.

  That is, the number of tester-side electrodes 144a of the upper tester-side connector 141a corresponding to the upper test electrode 102 is insufficient at 6000 points−8000 points = −2000 points.

  However, in this state, the number of tester side electrodes 144b of the lower tester side connector 141b corresponding to the lower test target electrode 103 of the circuit board 101 to be inspected is 6000 points-4000 points = + 2000 points. Remains as.

  Accordingly, the present inventors bypass the electrical connection circuit for the upper electrode 102 to be inspected in this way, which has 2000 points short, to the tester side electrode 144b of the lower tester side connector 141b in which 2000 points remain as surplus. By (bypassing), it has been found that inspection can be made possible even in the above case, and the present invention has been completed.

  By the way, in the inspection apparatus using the universal type inspection jig, as shown in FIG. 36, in the pitch conversion substrates 123a and 123b, the electrodes 102 and 103 to be inspected on the circuit board 101 to be inspected. The terminal electrodes 125a and 125b on the circuit board 101 side of the circuit board 101 to be inspected are disposed so as to be electrically connected to each of the pitch conversion substrates 123a and 123b.

  Accordingly, the pin-side electrodes 145a and 145b of the connector boards 143a and 143b, the anisotropic conductive sheets 142a and 142b, the conductive pins 132a and 132b of the relay pin units 131a and 131b, the anisotropic conductive sheets 126a and 126b, and the pitch conversion From the terminal electrodes 124a and 124b on the relay pin unit side of the boards 123a and 123b, the terminal electrodes 125a and 125b on the circuit board 101 side of the circuit board 101 to be inspected for pitch conversion, and the anisotropic conductive sheets 122a and 122b, Conductive paths to the electrodes to be inspected 102 and 103 of the substrate 101 are formed.

  As shown in FIG. 36, by applying a voltage from the pair of upper and lower pin-side electrodes 145a and 145b of the connector boards 143a and 143b to the electrodes 102 and 103 to be inspected of the circuit board 101 to be inspected. By measuring the voltage and current with a tester through the same pair of upper and lower pin-side electrodes 145a and 145b, the electrical characteristics as to whether or not the wiring pattern of the circuit board 101 to be inspected has a predetermined performance can be obtained. It has been confirmed.

However, using the pair of upper and lower pin-side electrodes 145a and 145b in this way, a voltage is applied to each of the electrodes for inspection 102 and 103 of the circuit board 101 to be inspected, so that the same pair of upper and lower pins In the method of measuring both voltage and current via the side electrodes 145a and 145b, an accurate confirmation test of electrical characteristics as to whether or not the wiring pattern of the circuit board 101 to be inspected has a predetermined performance is performed. In addition, it takes time for the confirmation test.
JP-A-6-94768 Japanese Patent Laid-Open No. 5-159821 JP 7-248350 A Japanese Patent Application Laid-Open No. 8-271469 JP-A-8-338858 JP-A-6-82531 Japanese Patent Application No. 2004-058282 Japanese Patent Application No. 2005-126431

  In view of such a current situation, the present invention can perform an accurate confirmation test on electrical characteristics as to whether or not the wiring pattern of the circuit board to be inspected has a predetermined performance, and the time required for the confirmation test. It is another object of the present invention to provide a circuit board inspection apparatus that can be implemented in a short time.

In addition, the present invention provides a circuit board inspection apparatus capable of performing a highly reliable electrical inspection of a circuit board even if the circuit board to be inspected has minute electrodes with a fine pitch. The purpose is to provide.
It is in.

  In addition, the present invention requires a circuit board inspection with good workability of inspection with little need to correct misalignment of the anisotropic conductive sheet when repeatedly inspecting a circuit board to be inspected. An object is to provide an apparatus.

  Furthermore, the present invention provides a circuit board inspection apparatus in which an anisotropic conductive sheet can be easily replaced when the anisotropic conductive sheet deteriorates in repeated continuous inspection of a circuit board to be inspected. For the purpose.

  In addition, the present invention can provide any circuit to be inspected only by changing the circuit board for inspection without separately preparing the entire inspection apparatus (entire inspection jig) even if the circuit board to be inspected is changed. An object of the present invention is to provide a circuit board inspection apparatus capable of inspecting a substrate.

  Furthermore, the present invention provides a circuit board that can perform electrical inspection of a circuit board to be inspected with high reliability even if the circuit board to be inspected has minute electrodes with a fine pitch. An object of the present invention is to provide an inspection method using the inspection apparatus.

  Further, the present invention provides a predetermined inspection of the tester-side connector, wherein the number of electrodes of the inspected electrode on one surface of the circuit board to be inspected is larger than the number of electrodes of the inspected electrode on the other surface of the circuit board to be inspected. An object of the present invention is to provide an inspection method using a circuit board inspection apparatus that can perform electrical inspection of a circuit board to be inspected with high reliability even when the number of electrodes is larger than the number of possible electrodes.

The present invention has been invented in order to achieve the problems and objects in the prior art as described above, and the circuit board inspection apparatus of the present invention comprises:
A circuit board inspection apparatus that performs electrical inspection by sandwiching both surfaces of a circuit board to be inspected between a pair of first inspection jigs and a second inspection jig between the inspection jigs. ,
The first inspection jig and the second inspection jig are respectively
A pitch conversion substrate that converts the electrode pitch between one surface side and the other surface side of the substrate;
A first anisotropic conductive sheet disposed on the circuit board side to be inspected of the pitch conversion board;
A second anisotropic conductive sheet disposed on the opposite side of the circuit board to be inspected of the pitch conversion board;
A circuit board side connector with
A plurality of conductive pins arranged at a predetermined pitch;
A pair of spaced apart insulation plates that support the conductive pins;
A relay pin unit with
A third anisotropic conductive sheet disposed on the opposite side of the second anisotropic conductive sheet of the relay pin unit;
With a connection circuit unit for inspection with
A connector board for electrically connecting the tester and the relay pin unit;
A base plate disposed on the opposite side of the connector board from the relay pin unit;
With a tester side connector with
Between the connector board of the first inspection jig and the connector board of the second inspection jig,
An auxiliary connection circuit unit is provided to bypass the inspection connection circuit unit and electrically connect from one tester side connector to the electrode of the other tester side connector.

Further, the circuit board inspection apparatus of the present invention comprises:
A circuit board inspection apparatus that performs electrical inspection by sandwiching both surfaces of a circuit board to be inspected between a pair of first inspection jigs and a second inspection jig between the inspection jigs. ,
The first inspection jig and the second inspection jig are respectively
A pitch conversion substrate that converts the electrode pitch between one surface side and the other surface side of the substrate;
A first anisotropic conductive sheet disposed on the circuit board side to be inspected of the pitch conversion board;
A second anisotropic conductive sheet disposed on the opposite side of the circuit board to be inspected of the pitch conversion board;
A circuit board side connector with
A plurality of conductive pins arranged at a predetermined pitch;
A pair of spaced apart insulation plates that support the conductive pins;
A relay pin unit with
A third anisotropic conductive sheet disposed on the opposite side of the second anisotropic conductive sheet of the relay pin unit;
With a connection circuit unit for inspection with
A connector board for electrically connecting the tester and the relay pin unit;
A base plate disposed on the opposite side of the connector board from the relay pin unit;
With a tester side connector with
Between the connector board of the first inspection jig and the connector board of the second inspection jig,
An auxiliary connection circuit unit that electrically connects from one tester side connector to an electrode of a tester connected to the other tester side connector is provided, bypassing the inspection connection circuit unit.

Further, in the circuit board inspection apparatus of the present invention, the auxiliary connection circuit unit includes:
Between the connector board of the first inspection jig and the connector board of the second inspection jig,
A first auxiliary relay pin unit that is provided on the connector board side of the first inspection jig, and includes a plurality of conductive pins arranged at a predetermined pitch and a pair of spaced apart insulating plates that support the conductive pins;
A second auxiliary relay pin unit that is provided on the connector substrate side of the second inspection jig, and includes a plurality of conductive pins arranged at a predetermined pitch and a pair of spaced apart insulating plates that support the conductive pins;
An auxiliary anisotropic conductive sheet that electrically connects the first auxiliary relay pin unit and the second auxiliary relay pin unit; and
Auxiliary connection circuit unit with
The test connection circuit unit is bypassed and electrically connected from one tester side connector to the electrode of the other tester side connector.

  With this configuration, the number of electrodes to be inspected on one surface of the circuit board to be inspected is larger than the number of electrodes to be inspected on the other surface of the circuit board to be inspected, and the predetermined number of the tester side connector is set. Even if the number of electrodes of one tester side connector is insufficient, the number of electrodes is larger than the number of electrodes that can be inspected, and is arranged between the connector board of the first inspection jig and the connector board of the second inspection jig. Bypassing the inspection connection circuit unit via the auxiliary connection circuit unit including the first auxiliary relay pin unit, the second auxiliary relay pin unit, and the auxiliary anisotropic conductive sheet, The tester side connector can be electrically connected to the electrode of the other tester side connector, and the electrical inspection of the circuit board to be inspected can be performed with high reliability.

Further, the circuit board inspection apparatus of the present invention comprises:
The auxiliary connection circuit unit is
Between the connector board of the first inspection jig and the connector board of the second inspection jig,
A plurality of conductive pins arranged at a predetermined pitch, and a pair of spaced apart insulating plates supporting the conductive pins, an auxiliary relay pin unit arranged on the connector substrate side of one inspection jig;
An auxiliary relay substrate body including an insulating substrate and a plurality of conductive portions formed on the insulating substrate;
A biasing device that biases the auxiliary relay substrate body toward the auxiliary relay pin unit;
Auxiliary relay board provided on the connector board side of the other inspection jig, comprising a connection wiring for electrically connecting the base end part of the conductive part and the electrode of the tester connected to the other tester side connector Equipment,
An auxiliary anisotropic conductive sheet for electrically connecting the auxiliary relay pin unit and the auxiliary relay board device to each other;
Auxiliary connection circuit unit with
An auxiliary connection circuit unit that electrically connects from one tester side connector to an electrode of a tester connected to the other tester side connector is provided, bypassing the inspection connection circuit unit.

  With this configuration, the number of electrodes to be inspected on one surface of the circuit board to be inspected is larger than the number of electrodes to be inspected on the other surface of the circuit board to be inspected, and the predetermined number of the tester side connector is set. Even if the number of electrodes of one tester side connector is insufficient, the auxiliary relay pin unit arranged on the connector board side of one inspection jig and the other inspection jig Via the auxiliary connection circuit unit provided with the auxiliary relay board device arranged on the connector board side and the auxiliary anisotropic conductive sheet, the test connection circuit unit is detoured from one tester side connector to the other. It can be electrically connected to the electrode of the tester connected to the tester side connector, and the electrical inspection of the circuit board to be inspected can be carried out with high reliability.

  Moreover, although the size and thickness differ depending on the type of circuit board to be inspected, as described above, the first auxiliary relay pin unit, the second auxiliary relay pin unit, and the auxiliary anisotropic conductive sheet In the provided auxiliary connection circuit unit, when the type of circuit board to be inspected is changed, the thickness of the auxiliary anisotropic conductive sheet must be changed and prepared for each type of circuit board to be inspected. In addition, the cost is high, the inspection work is complicated, the continuous electrical inspection cannot be performed, and the inspection efficiency is lowered.

  Furthermore, when the type of circuit board to be inspected is changed and the thickness of the circuit board to be inspected changes greatly, the size of the first auxiliary relay pin unit and the second auxiliary relay pin unit themselves are also changed. Therefore, the cost is high, the inspection work is complicated, the continuous electrical inspection cannot be performed, and the inspection efficiency is lowered.

  However, as described above, the auxiliary relay board body provided with a plurality of conductive portions is attached to the auxiliary relay pin unit side by the biasing device of the auxiliary relay board device arranged on the connector board side of the other inspection jig. Even if the type of circuit board to be inspected is changed and the thickness of the circuit board to be inspected is changed, the urging force of this urging device absorbs the change in thickness, and the auxiliary connection circuit unit Can be ensured.

Further, the circuit board inspection apparatus of the present invention comprises:
The auxiliary connection circuit unit is
Between the connector board of the first inspection jig and the connector board of the second inspection jig,
A first auxiliary relay pin unit that is provided on the connector board side of the first inspection jig, and includes a plurality of conductive pins arranged at a predetermined pitch and a pair of spaced apart insulating plates that support the conductive pins;
An auxiliary relay substrate body including an insulating substrate and a plurality of conductive portions formed on the insulating substrate;
A biasing device that biases the auxiliary relay substrate body toward the first auxiliary relay pin unit;
A connection wiring for electrically connecting a base end portion of the conductive portion and an electrode of a tester connected to the second tester side connector, and disposed on the connector substrate side of the second inspection jig; Two auxiliary relay board devices;
An auxiliary anisotropic conductive sheet for electrically connecting the first auxiliary relay pin unit and the second auxiliary relay board device to each other;
Auxiliary connection circuit unit with
Auxiliary connection circuit unit that electrically connects from the first tester side connector to the electrode of the tester connected to the second tester side connector is provided, bypassing the inspection connection circuit unit. To do.

  With this configuration, the number of electrodes to be inspected on one surface of the circuit board to be inspected is larger than the number of electrodes to be inspected on the other surface of the circuit board to be inspected, and the predetermined number of the tester side connector is set. The first auxiliary relay pin unit disposed on the connector board side of the first inspection jig, and the first tester side connector, even when the number of electrodes of the first tester side connector is insufficient, Bypassing the inspection connection circuit unit via the auxiliary connection circuit unit provided with the second auxiliary relay board device disposed on the connector board side of the inspection jig 2 and the auxiliary anisotropic conductive sheet, The first tester side connector can be electrically connected to the electrode of the tester connected to the second tester side connector, and the electrical inspection of the circuit board to be inspected should be performed with high reliability. It can be.

  In addition, as described above, the auxiliary relay board body having a plurality of conductive portions is formed by the urging device of the second auxiliary relay board device arranged on the connector board side of the second inspection jig. Since it is biased toward the auxiliary relay pin unit, even if the type of circuit board to be inspected is changed and the thickness of the circuit board to be inspected changes, the biasing force of this biasing device absorbs the change in thickness. Thus, electrical conduction of the auxiliary connection circuit unit can be ensured.

Further, the circuit board inspection apparatus of the present invention comprises:
The auxiliary connection circuit unit is
Between the connector board of the first inspection jig and the connector board of the second inspection jig,
A second auxiliary relay pin unit that is provided on the connector substrate side of the second inspection jig, and includes a plurality of conductive pins arranged at a predetermined pitch and a pair of spaced apart insulating plates that support the conductive pins;
An auxiliary relay substrate body including an insulating substrate and a plurality of conductive portions formed on the insulating substrate;
A biasing device that biases the auxiliary relay substrate body toward the second auxiliary relay pin unit;
A connection wiring for electrically connecting a base end portion of the conductive portion and an electrode of a tester connected to the first tester-side connector, and disposed on the connector substrate side of the first inspection jig; 1 auxiliary relay board device;
An auxiliary anisotropic conductive sheet for electrically connecting the second auxiliary relay pin unit and the first auxiliary relay board device to each other;
Auxiliary connection circuit unit with
Auxiliary connection circuit unit that electrically connects from the second tester side connector to the electrode of the tester connected to the first tester side connector is provided, bypassing the inspection connection circuit unit. It is characterized by doing.

  With this configuration, the number of electrodes to be inspected on one surface of the circuit board to be inspected is larger than the number of electrodes to be inspected on the other surface of the circuit board to be inspected, and the predetermined number of the tester side connector is set. A second auxiliary relay pin unit disposed on the connector board side of the second inspection jig, and the second tester side connector, when the number of electrodes of the second tester side connector is insufficient. Bypassing the inspection connection circuit unit via the auxiliary connection circuit unit including the first auxiliary relay board device disposed on the connector board side of the inspection jig and the auxiliary anisotropic conductive sheet, The second tester side connector can be electrically connected to the electrode of the tester connected to the first tester side connector, and the electrical inspection of the circuit board to be inspected is performed with high reliability. Door can be.

  Moreover, as described above, the auxiliary relay board body having a plurality of conductive portions is formed by the biasing device of the first auxiliary relay board device arranged on the connector board side of the first inspection jig. Since it is biased toward the auxiliary relay pin unit, even if the type of circuit board to be inspected is changed and the thickness of the circuit board to be inspected changes, the biasing force of this biasing device absorbs the change in thickness. Thus, electrical conduction of the auxiliary connection circuit unit can be ensured.

Further, the circuit board inspection apparatus of the present invention comprises:
The auxiliary connection circuit unit is
Between the connector board of the first inspection jig and the connector board of the second inspection jig,
A plurality of conductive pins arranged at a predetermined pitch, and a pair of spaced apart insulating plates supporting the conductive pins, an auxiliary relay pin unit arranged on the connector substrate side of one inspection jig;
A pair of spaced-apart auxiliary relay substrate bodies including an insulating substrate and a plurality of conductive portions formed on the insulating substrate;
An urging device for urging the pair of auxiliary relay substrate bodies in a direction away from each other;
An auxiliary relay board device disposed on the connector board side of the other inspection jig, and a connection wiring that electrically connects the base ends of the conductive parts of the pair of auxiliary relay board bodies;
An auxiliary anisotropic conductive sheet for electrically connecting the auxiliary relay pin unit and the auxiliary relay board device to each other;
Auxiliary connection circuit unit with
An auxiliary connection circuit unit is provided to bypass the inspection connection circuit unit and electrically connect from one tester side connector to the electrode of the other tester side connector.

  With this configuration, the number of electrodes to be inspected on one surface of the circuit board to be inspected is larger than the number of electrodes to be inspected on the other surface of the circuit board to be inspected, and the predetermined number of the tester side connector is set. Even if the number of electrodes of one tester side connector is insufficient, the auxiliary relay pin unit arranged on the connector board side of one inspection jig and the other inspection jig Via the auxiliary connection circuit unit provided with the auxiliary relay board device arranged on the connector board side and the auxiliary anisotropic conductive sheet, the test connection circuit unit is detoured from one tester side connector to the other. It is possible to electrically connect to the electrode of the tester side connector, and the electrical inspection of the circuit board to be inspected can be performed with high reliability.

  Moreover, as described above, the plurality of conductive portions are provided by the biasing device that biases the pair of auxiliary relay board bodies of the auxiliary relay board device arranged on the connector board side of the other inspection jig in a direction away from each other. Since the pair of auxiliary relay board bodies provided with is biased to the auxiliary relay pin unit side and the electrode side of the other tester side connector, the type of the circuit board to be inspected is changed, Even if the thickness changes, the urging force of the urging device can absorb the change in thickness and ensure electrical continuity of the auxiliary connection circuit unit.

Further, the circuit board inspection apparatus of the present invention comprises:
The auxiliary connection circuit unit is
Between the connector board of the first inspection jig and the connector board of the second inspection jig,
A first auxiliary relay pin unit that is provided on the connector board side of the first inspection jig, and includes a plurality of conductive pins arranged at a predetermined pitch and a pair of spaced apart insulating plates that support the conductive pins;
A pair of spaced-apart auxiliary relay substrate bodies including an insulating substrate and a plurality of conductive portions formed on the insulating substrate;
An urging device for urging the pair of auxiliary relay substrate bodies in a direction away from each other;
A second auxiliary relay board device disposed on the connector board side of the second inspection jig, and a connection wiring that electrically connects the base ends of the conductive parts of the pair of auxiliary relay board bodies;
An auxiliary anisotropic conductive sheet for electrically connecting the first auxiliary relay pin unit and the second auxiliary relay board device to each other;
Auxiliary connection circuit unit with
An auxiliary connection circuit unit is provided to bypass the inspection connection circuit unit and electrically connect from one tester side connector to the electrode of the other tester side connector.

  With this configuration, the number of electrodes to be inspected on one surface of the circuit board to be inspected is larger than the number of electrodes to be inspected on the other surface of the circuit board to be inspected, and the predetermined number of the tester side connector is set. The first auxiliary relay pin unit disposed on the connector board side of the first inspection jig, and the second auxiliary pin unit, even when the number of electrodes of one of the tester side connectors is insufficient, Bypassing the inspection connection circuit unit via the auxiliary connection circuit unit having the second auxiliary relay board device arranged on the connector board side of the inspection jig and the auxiliary anisotropic conductive sheet, The tester side connector can be electrically connected to the electrode of the other tester side connector, and the electrical inspection of the circuit board to be inspected can be performed with high reliability.

  Moreover, as described above, by the biasing device that biases the pair of auxiliary relay board bodies of the second auxiliary relay board device arranged on the connector board side of the second inspection jig in a direction away from each other, Since the pair of auxiliary relay board bodies having a plurality of conductive portions are biased toward the first auxiliary relay pin unit side and the electrode side of the second tester side connector, the type of circuit board to be inspected is Even if the thickness of the circuit board to be inspected is changed, the urging force of the urging device can absorb the change in the thickness and ensure the electrical connection of the auxiliary connection circuit unit.

Further, the circuit board inspection apparatus of the present invention comprises:
The auxiliary connection circuit unit is
Between the connector board of the first inspection jig and the connector board of the second inspection jig,
A second auxiliary relay pin unit that is provided on the connector substrate side of the second inspection jig, and includes a plurality of conductive pins arranged at a predetermined pitch and a pair of spaced apart insulating plates that support the conductive pins;
A pair of spaced-apart auxiliary relay substrate bodies including an insulating substrate and a plurality of conductive portions formed on the insulating substrate;
An urging device for urging the pair of auxiliary relay substrate bodies in a direction away from each other;
A first auxiliary relay board device disposed on the connector board side of the first inspection jig, and a connection wiring that electrically connects the base ends of the conductive parts of the pair of auxiliary relay board bodies;
An auxiliary anisotropic conductive sheet for electrically connecting the second auxiliary relay pin unit and the first auxiliary relay board device to each other;
Auxiliary connection circuit unit with
An auxiliary connection circuit unit is provided to bypass the inspection connection circuit unit and electrically connect from one tester side connector to the electrode of the other tester side connector.

  With this configuration, the number of electrodes to be inspected on one surface of the circuit board to be inspected is larger than the number of electrodes to be inspected on the other surface of the circuit board to be inspected, and the predetermined number of the tester side connector is set. The second auxiliary relay pin unit disposed on the connector substrate side of the second inspection jig, the first auxiliary relay pin unit, even when the number of electrodes of one tester side connector is insufficient. Bypassing the inspection connection circuit unit via the auxiliary connection circuit unit including the first auxiliary relay board device disposed on the connector board side of the inspection jig and the auxiliary anisotropic conductive sheet, The tester side connector can be electrically connected to the electrode of the other tester side connector, and the electrical inspection of the circuit board to be inspected can be performed with high reliability.

  Moreover, as described above, by the biasing device that biases the pair of auxiliary relay board bodies of the first auxiliary relay board device arranged on the connector board side of the first inspection jig in a direction away from each other, Since the pair of auxiliary relay board bodies having a plurality of conductive portions are biased toward the second auxiliary relay pin unit side and the electrode side of the first tester side connector, the type of circuit board to be inspected is Even if the thickness of the circuit board to be inspected is changed, the urging force of the urging device can absorb the change in the thickness and ensure the electrical connection of the auxiliary connection circuit unit.

Further, the circuit board inspection apparatus of the present invention comprises:
The auxiliary connection circuit unit is
Between the connector board of the first inspection jig and the connector board of the second inspection jig,
A pair of spaced-apart auxiliary relay substrate bodies including an insulating substrate and a plurality of conductive portions formed on the insulating substrate;
An urging device for urging the pair of auxiliary relay substrate bodies in a direction away from each other;
A first auxiliary relay board device disposed on the connector board side of the first inspection jig, and a connection wiring that electrically connects the base ends of the conductive parts of the pair of auxiliary relay board bodies;
A pair of spaced-apart auxiliary relay substrate bodies including an insulating substrate and a plurality of conductive portions formed on the insulating substrate;
An urging device for urging the pair of auxiliary relay substrate bodies in a direction away from each other;
A second auxiliary relay board device disposed on the connector board side of the second inspection jig, and a connection wiring that electrically connects the base ends of the conductive parts of the pair of auxiliary relay board bodies;
An auxiliary anisotropic conductive sheet for electrically connecting the first auxiliary relay board device and the second auxiliary relay board device to each other;
Auxiliary connection circuit unit with
An auxiliary connection circuit unit is provided to bypass the inspection connection circuit unit and electrically connect from one tester side connector to the electrode of the other tester side connector.

  With this configuration, the number of electrodes to be inspected on one surface of the circuit board to be inspected is larger than the number of electrodes to be inspected on the other surface of the circuit board to be inspected, and the predetermined number of the tester side connector is set. The first auxiliary relay board device disposed on the connector board side of the first inspection jig, the second auxiliary relay board device, even when the number of electrodes of one of the tester side connectors is insufficient. Bypassing the inspection connection circuit unit via the auxiliary connection circuit unit having the second auxiliary relay board device arranged on the connector board side of the inspection jig and the auxiliary anisotropic conductive sheet, The tester side connector can be electrically connected to the electrode of the other tester side connector, and the electrical inspection of the circuit board to be inspected can be performed with high reliability.

Moreover, as described above, by the biasing device that biases the pair of auxiliary relay board bodies of the first auxiliary relay board device arranged on the connector board side of the first inspection jig in a direction away from each other, A pair of auxiliary relay board bodies having a plurality of conductive portions are biased toward the second auxiliary relay pin unit side and the electrode side of the first tester side connector,
A plurality of conductive portions are provided by a biasing device that biases a pair of auxiliary relay board bodies of the second auxiliary relay board device arranged on the connector board side of the second inspection jig in a direction away from each other. Since the pair of auxiliary relay board bodies are biased toward the first auxiliary relay pin unit side and the electrode side of the second tester side connector, the type of the circuit board to be inspected is changed, and the circuit board to be inspected is changed. Even when the thickness of the auxiliary connection circuit unit changes, the biasing force of the biasing device can absorb the change in thickness and ensure electrical conduction of the auxiliary connection circuit unit.

  The circuit board inspection apparatus of the present invention is characterized in that the conductive portion of the auxiliary relay board device is a conductive pin implanted in an insulating board.

  In this way, if the conductive portion of the auxiliary relay board device is a conductive pin implanted in the insulating board, the circuit board to be inspected is inspected between the first inspection jig and the second inspection jig. When the electrical inspection is performed with both sides sandwiched, electrical connection of the auxiliary connection circuit unit can be reliably performed.

In the circuit board inspection apparatus of the present invention, the relay pin unit includes a plurality of conductive pins arranged at a predetermined pitch,
A pair of spaced apart insulating plates for supporting the conductive pins movably in the axial direction;
It is characterized by having.

  By configuring in this way, when conducting electrical inspection by clamping both sides of the circuit board to be inspected between the first inspection jig and the second inspection jig, the conductive pins are axially arranged. Therefore, it is possible to absorb some variation in the height of the electrodes to be inspected on the circuit board to be inspected.

In the circuit board inspection apparatus of the present invention, the auxiliary relay pin unit includes a plurality of conductive pins arranged at a predetermined pitch,
A pair of spaced apart insulating plates for supporting the conductive pins movably in the axial direction;
It is characterized by having.

  By configuring in this way, when conducting electrical inspection by clamping both sides of the circuit board to be inspected between the first inspection jig and the second inspection jig, the conductive pins are axially arranged. Therefore, the impact can be absorbed, and the durability of the auxiliary anisotropic conductive sheet can be improved.

In the circuit board inspection apparatus of the present invention, the relay pin unit is
An intermediate holding plate disposed between the first insulating plate and the second insulating plate;
A first support pin disposed between the first insulating plate and the intermediate holding plate;
A second support pin disposed between the second insulating plate and the intermediate holding plate;
With
A first abutment support position of the first support pin with respect to the intermediate holding plate and a second abutment support position of the second support pin with respect to the intermediate holding plate are projected in the thickness direction of the intermediate holding plate. In the intermediate holding plate projection plane, they are arranged at different positions.

  With this configuration, when performing electrical inspection by clamping both surfaces of the circuit board to be inspected between the first inspection jig and the second inspection jig, an initial stage of pressurization In the movement of the relay pin unit in the thickness direction by the conductive pins, and the rubber elastic compression of the first anisotropic conductive sheet, the second anisotropic conductive sheet, and the third anisotropic conductive sheet By absorbing the pressure, it is possible to absorb some variation in the height of the electrodes to be inspected on the circuit board to be inspected.

  The first contact support position of the first support pin with respect to the intermediate holding plate and the second contact support position of the second support pin with respect to the intermediate support plate are in the thickness direction of the intermediate support plate. On the projected intermediate holding plate projection surface, they are arranged at different positions.

  Accordingly, when the circuit board to be inspected is further pressed between the first inspection jig and the second inspection jig, the first anisotropic conductive sheet and the second anisotropic conduction In addition to the rubber elastic compression of the conductive sheet and the third anisotropic conductive sheet, between the first insulating plate, the second insulating plate, and the first insulating plate and the second insulating plate of the relay pin unit Due to the spring elasticity of the arranged intermediate holding plate, the pressure concentration is distributed to the height variation of the inspected electrode of the circuit board to be inspected, for example, the height variation of the solder ball electrode, and the local stress concentration is distributed. It can be avoided.

  As a result, stable electrical contact is ensured for each of the electrodes to be inspected on the circuit board to be inspected having a height variation, and stress concentration is reduced, so that the anisotropic conductive sheet is localized. Damage is suppressed. As a result, the repeated use durability of the anisotropic conductive sheet is improved, so that the number of replacements of the anisotropic conductive sheet is reduced and the inspection work efficiency is improved.

Further, the circuit board inspection apparatus of the present invention comprises:
The auxiliary relay pin unit is
An intermediate holding plate disposed between the first insulating plate and the second insulating plate;
A first support pin disposed between the first insulating plate and the intermediate holding plate;
A second support pin disposed between the second insulating plate and the intermediate holding plate;
With
A first abutment support position of the first support pin with respect to the intermediate holding plate and a second abutment support position of the second support pin with respect to the intermediate holding plate are projected in the thickness direction of the intermediate holding plate. In the intermediate holding plate projection plane, they are arranged at different positions.

  With this configuration, when performing electrical inspection by clamping both surfaces of the circuit board to be inspected between the first inspection jig and the second inspection jig, an initial stage of pressurization Then, the impact force can be absorbed to some extent by the movement of the relay pin unit in the thickness direction by the conductive pins and the auxiliary anisotropic conductive sheet.

  The first contact support position of the first support pin with respect to the intermediate holding plate and the second contact support position of the second support pin with respect to the intermediate support plate are in the thickness direction of the intermediate support plate. On the projected intermediate holding plate projection surface, they are arranged at different positions.

  Therefore, when the circuit board to be inspected is further pressurized between the first inspection jig and the second inspection jig, in addition to the rubber elastic compression of the auxiliary anisotropic conductive sheet, the relay pin The stress concentration is distributed by the spring elasticity of the first insulating plate, the second insulating plate, and the intermediate holding plate disposed between the first insulating plate and the second insulating plate, thereby reducing the local stress. Concentration can be avoided.

  As a result, stable electrical contact is ensured, and stress concentration is further reduced, so that local breakage of the auxiliary anisotropic conductive sheet is suppressed. As a result, the durability of repeated use of the auxiliary anisotropic conductive sheet is improved, so that the number of replacement of the auxiliary anisotropic conductive sheet is reduced and the inspection work efficiency is improved.

The circuit board inspection apparatus according to the present invention sandwiches both surfaces of the circuit board to be inspected between the two inspection jigs by the pair of the first inspection jig and the second inspection jig. When
The intermediate holding plate bends in the direction of the second insulating plate around the first contact support position with the intermediate holding plate of the first support pin, and
The intermediate holding plate is configured to bend in the direction of the first insulating plate around a second contact support position with the intermediate holding plate of the second support pin.

By configuring in this way, the intermediate holding plate bends in opposite directions with the first contact support position and the second contact support position as the center, so the first inspection jig and the second inspection plate When the circuit board to be inspected is further pressed between the inspection jigs, the spring elastic force of the intermediate holding plate is further exerted, and the height of the electrode to be inspected of the circuit board to be inspected Dispersion of pressure concentration against dispersion can avoid local stress concentration, and local damage of anisotropic conductive sheet is suppressed. As a result, repeated use durability of anisotropic conductive sheet Therefore, the number of times the anisotropic conductive sheet is replaced is reduced, and the inspection work efficiency is improved.

  In addition, even when the auxiliary relay pin unit is configured in this way, local stress concentration can be avoided, and local breakage of the auxiliary anisotropic conductive sheet is suppressed. Since the durability of repeated use of the anisotropic conductive sheet is improved, the number of replacements of the auxiliary anisotropic conductive sheet is reduced, and the inspection work efficiency is improved.

Further, in the circuit board inspection apparatus of the present invention, the first contact support position with the intermediate holding plate of the first support pin is arranged in a grid pattern on the intermediate holding plate projection surface,
Second contact and support positions of the second support pins with the intermediate holding plate are arranged in a grid pattern on the intermediate holding plate projection surface,
On the intermediate holding plate projection surface, one second abutment support position is arranged in a unit cell region composed of the four adjacent first abutment support position groups, and
On the intermediate holding plate projection surface, one first abutment support position is arranged in a unit cell region composed of the four adjacent second abutment support position groups. It is characterized by.

  With this configuration, the first abutment support position and the second abutment support position are arranged in a grid pattern, and the grids of the first abutment support position and the second abutment support position are arranged. The point positions are all arranged at positions shifted.

  Accordingly, the intermediate holding plate bends in opposite directions around the first contact support position and the second contact support position, and the first inspection jig and the second inspection jig. When the circuit board to be inspected is pressed between, the spring elastic force of the intermediate holding plate will be further exerted, and against the height variation of the electrode to be inspected of the circuit board to be inspected, Dispersion of pressure concentration can further avoid local stress concentration, and local damage of the anisotropic conductive sheet is suppressed, and as a result, repeated use durability of the anisotropic conductive sheet is improved. Therefore, the number of times the anisotropic conductive sheet is replaced is reduced, and the inspection work efficiency is improved.

  In addition, even when the auxiliary relay pin unit is configured in this way, local stress concentration can be avoided, and local breakage of the auxiliary anisotropic conductive sheet is suppressed. Since the durability of repeated use of the anisotropic conductive sheet is improved, the number of replacements of the auxiliary anisotropic conductive sheet is reduced, and the inspection work efficiency is improved.

In the circuit board inspection apparatus of the present invention, a plurality of intermediate holding plates are arranged at a predetermined interval between the first insulating plate and the second insulating plate,
A holding plate support pin is disposed between the adjacent intermediate holding plates.

  With this configuration, the spring elasticity is further exhibited by the plurality of intermediate holding plates, and the pressure concentration is dispersed with respect to the height variation of the inspected electrode of the inspected circuit board. , Local stress concentration can be further avoided, local damage of the anisotropic conductive sheet is suppressed, and as a result, the repeated use durability of the anisotropic conductive sheet is improved. The number of sheet replacements is reduced, and inspection work efficiency is improved.

  In addition, even when the auxiliary relay pin unit is configured in this way, local stress concentration can be avoided, and local breakage of the auxiliary anisotropic conductive sheet is suppressed. Since the durability of repeated use of the anisotropic conductive sheet is improved, the number of replacements of the auxiliary anisotropic conductive sheet is reduced, and the inspection work efficiency is improved.

  In the circuit board inspection apparatus of the present invention, the contact support position of the support plate support pin with the intermediate support plate is different between adjacent intermediate support plates, and the contact support position is different on the intermediate support plate projection surface. It is arranged at a position.

  As a result, the abutting support position of the holding plate support pin with the intermediate holding plate is shifted between the adjacent intermediate holding plates, so that the spring elasticity of the plurality of intermediate holding plates is further exhibited. Therefore, the pressure concentration can be dispersed against the height variation of the electrode to be inspected on the circuit board to be inspected, and the local stress concentration can be further avoided, and the anisotropic conductive sheet is locally damaged. As a result, since the repeated use durability of the anisotropic conductive sheet is improved, the number of replacement of the anisotropic conductive sheet is reduced, and the inspection work efficiency is improved.

  In addition, even when the auxiliary relay pin unit is configured in this way, local stress concentration can be avoided, and local breakage of the auxiliary anisotropic conductive sheet is suppressed. Since the durability of repeated use of the anisotropic conductive sheet is improved, the number of replacements of the auxiliary anisotropic conductive sheet is reduced, and the inspection work efficiency is improved.

  In the circuit board inspection apparatus according to the present invention, the first contact support position with the intermediate holding plate of the first support pin and the second contact with the intermediate holding plate of the second support pin. The support position and the contact support position of the holding plate support pin with the intermediate holding plate are arranged at different positions on the intermediate holding plate projection surface.

  As described above, the first abutting support position, the second abutting support position, and the abutting support position of the holding plate support pin are arranged at positions shifted from each other. Further, the elastic force of the second insulating plate and the intermediate holding plate is further exerted, and the local stress concentration is distributed by distributing the pressure concentration against the height variation of the inspected electrode of the circuit board to be inspected. Can be avoided, local damage of the anisotropic conductive sheet is suppressed, and as a result, the durability of repeated use of the anisotropic conductive sheet is improved, so that the number of replacement of the anisotropic conductive sheet is reduced. , Inspection work efficiency is improved.

  In addition, even when the auxiliary relay pin unit is configured in this way, local stress concentration can be avoided, and local breakage of the auxiliary anisotropic conductive sheet is suppressed. Since the durability of repeated use of the anisotropic conductive sheet is improved, the number of replacements of the auxiliary anisotropic conductive sheet is reduced, and the inspection work efficiency is improved.

The circuit board inspection apparatus of the present invention is the connection electrode comprising a pair of current terminal electrodes and voltage terminal electrodes for each of the electrodes to be inspected of the circuit board to be inspected in the pitch conversion substrate. Are arranged to connect electrically,
In the connector board, the current pin side electrode and the voltage pin side electrode are arranged so as to be electrically connected to the current terminal electrode and the voltage terminal electrode of the pitch conversion board, respectively. And

  With this configuration, when an electrical inspection is performed by sandwiching both surfaces of the circuit board to be inspected between the first inspection jig and the second inspection jig, Both the current terminal electrode and the voltage terminal electrode of the connection electrode of the pitch conversion substrate are electrically connected to each of the electrodes to be inspected via the first anisotropic conductive sheet.

  Then, the current terminal electrode of the pitch conversion board is connected to the current pin side electrode of the connector board via the second anisotropic conductive sheet, the conductive pin of the relay pin unit, and the third anisotropic conductive sheet. While being electrically connected, the voltage terminal electrode of the pitch conversion board is electrically connected to the voltage terminal electrode of the connector board.

  As a result, a current supply path is configured for each of the electrodes to be inspected on the circuit board to be inspected via the current terminal electrodes of one upper and lower pitch conversion board. A voltage measurement path is configured via the voltage terminal electrodes of one upper and lower pitch conversion substrate for each electrode to be inspected on the substrate.

  Therefore, a constant current is supplied to the current supply path using, for example, a constant current supply device via the current terminal electrodes of the upper and lower pitch conversion substrates for each electrode to be inspected on the circuit board to be inspected. The circuit under test is measured by measuring the voltage from each of the electrodes to be inspected on the circuit board to be inspected through the voltage measuring path through the voltage terminal electrodes of the upper and lower one pitch conversion board while supplying It is possible to perform a confirmation test of electrical characteristics as to whether or not the wiring pattern of the substrate has a predetermined performance.

  Conversely, for each electrode to be inspected on the circuit board to be inspected, a constant voltage device is used for the voltage measurement path, for example, via a voltage terminal electrode on one upper and lower pitch conversion board. While applying a voltage, the current from each of the electrodes to be inspected on the circuit board to be inspected is measured by an ammeter through the current supply path through the current terminal electrodes of the upper and lower pitch conversion boards, thereby inspecting It is also possible to perform a test for checking the electrical characteristics as to whether or not the wiring pattern of the circuit board has a predetermined performance.

  In this way, the voltage and current can be separately measured for each electrode to be inspected on the circuit board to be inspected via the separate voltage measurement path and current supply path, so that the wiring pattern of the inspection circuit board can be measured. It is possible to perform an accurate confirmation test on the electrical characteristics as to whether or not the battery has a predetermined performance, and the confirmation test can be performed in a short time.

  In the circuit board inspection apparatus of the present invention, the first anisotropic conductive sheet is an anisotropic conductive sheet in which conductive particles are arranged in the thickness direction and uniformly dispersed in the surface direction. Features.

  As described above, since the anisotropic conductive sheet in which the conductive particles are arranged in the thickness direction and dispersed in the plane direction is used as the first anisotropic conductive sheet, the position is slightly shifted in the lateral direction of the sheet. Even so, good electrical connection between the circuit board to be inspected and the first anisotropic conductive sheet is ensured.

  In the circuit board inspection apparatus according to the present invention, the second anisotropic conductive sheet includes a plurality of conductive path forming portions extending in a thickness direction and insulating portions that insulate the conductive path forming portions from each other. The conductive particles are contained only in the conductive path forming portion, whereby the conductive particles are dispersed non-uniformly in the surface direction, and the conductive path forming portion protrudes on one side of the sheet. .

  In the circuit board inspection apparatus of the present invention, the third anisotropic conductive sheet includes a plurality of conductive path forming portions extending in a thickness direction and insulating portions that insulate these conductive path forming portions from each other. The conductive particles are contained only in the conductive path forming portion, whereby the conductive particles are dispersed non-uniformly in the surface direction, and the conductive path forming portion protrudes on one side of the sheet. .

  As described above, the second anisotropic conductive sheet and the third anisotropic conductive sheet are composed of the conductive path forming portion and the insulating portion, and the conductive particles are contained only in the conductive path forming portion and are in the plane direction. By using the unevenly anisotropic anisotropic conductive sheet that is unevenly distributed and the conductive path forming part protrudes on one side of the sheet, the pressure and impact due to the pressing of the inspection jig are absorbed by these sheets, Thereby, deterioration of the first anisotropic conductive sheet is suppressed.

The circuit board inspection method of the present invention is a circuit board inspection method using the circuit board inspection apparatus described above,
The electrical inspection is performed by sandwiching both surfaces of the circuit board to be inspected between the two inspection jigs by the pair of the first inspection jig and the second inspection jig.

  By configuring in this way, the voltage and current can be separately measured for each electrode to be inspected on the circuit board to be inspected via a separate voltage measurement path and current supply path. An accurate confirmation test can be performed on the electrical characteristics as to whether or not the wiring pattern of the substrate has a predetermined performance, and the time required for the confirmation test can be performed in a short time.

  According to the present invention, the number of electrodes to be inspected on one surface of the circuit board to be inspected is larger than the number of electrodes to be inspected on the other surface of the circuit board to be inspected, and a predetermined inspection of the tester side connector is performed. Even when the number of electrodes of one of the tester side connectors is larger than the possible number of electrodes, it is arranged between the connector board of the first inspection jig and the connector board of the second inspection jig. One tester bypassing the inspection connection circuit unit via the auxiliary connection circuit unit including the first auxiliary relay pin unit, the second auxiliary relay pin unit, and the auxiliary anisotropic conductive sheet It is possible to electrically connect from the side connector to the electrode of the other tester side connector, and the electrical inspection of the circuit board to be inspected can be performed with high reliability.

  In addition, according to the present invention, even when a circuit board to be inspected is one having a fine electrode with a fine pitch, a highly reliable circuit board can be electrically inspected.

  In addition, when the circuit board to be inspected, which is the inspection target, is repeatedly subjected to continuous inspection, there is little need to correct the misalignment of the anisotropic conductive sheet, and the inspection workability is good.

  Furthermore, when the anisotropic conductive sheet is deteriorated in the repeated continuous inspection of the circuit board to be inspected, it is easy to replace the anisotropic conductive sheet.

  In addition, even if the circuit board to be inspected is changed, it is possible to perform inspections on any circuit board to be inspected by changing the circuit board for inspection without preparing the entire inspection device. It is.

  Furthermore, there is no need to arrange the conductive pins at regular intervals, so there is less drilling work by drilling through holes in the insulating plate holding the conductive pins, and the number of through holes formed in the insulating plate is reduced. The thickness of the insulating plate is thin and can withstand processing, and it is possible to reduce costs without causing defects.

  Furthermore, the voltage and current can be separately measured for each electrode to be inspected on the circuit board to be inspected via the separate voltage measurement path and current supply path, so that the wiring pattern of the inspection circuit board is predetermined. Thus, it is possible to perform an accurate confirmation test on the electrical characteristics as to whether or not it has the above-mentioned performance, and to perform the confirmation test in a short time.

  Since the voltage can be measured while supplying a current to the circuit to be inspected on the circuit board to be inspected, the circuit to be inspected is set at a set voltage lower than the set voltage for determining whether the conduction resistance value in the conventional inspection apparatus is good or bad. Stable measurement of the conduction resistance value of the circuit under test on the substrate becomes possible.

  That is, it is necessary to judge the quality of a circuit at a low set voltage as a requirement for high-precision inspection. According to the present invention, a circuit to be inspected that has a potential electrical defect as compared with the conventional inspection apparatus. Since the board can be judged and removed as a defective product with high probability, it is possible to carry out a highly reliable circuit board confirmation test.

FIG. 1 is a cross-sectional view for explaining an embodiment of the inspection apparatus of the present invention. FIG. 2 is a cross-sectional view showing a stacked state when the inspection apparatus of FIG. 1 is used for inspection. FIG. 3 is a diagram showing the surface of the pitch conversion board on the circuit board side. FIG. 4 is a diagram showing the pin side surface of the pitch conversion substrate. FIG. 5 is a partial cross-sectional view of the first anisotropic conductive sheet. FIG. 6 is a partial cross-sectional view of the second anisotropic conductive sheet. FIG. 7 is a cross-sectional view showing a state in which the first anisotropic conductive sheet is laminated on the pitch conversion substrate. FIG. 8 is a partially enlarged cross-sectional view for explaining a use state of the embodiment of the inspection apparatus of the present invention. FIG. 9 is a cross-sectional view showing a part of the conductive pin, the intermediate holding plate, and the insulating plate of the relay pin unit. FIG. 10 is a sectional view for explaining another embodiment of the inspection apparatus of the present invention. FIG. 11 is a cross-sectional view showing a stacked state when the inspection apparatus of FIG. 10 is used for inspection. FIG. 12 is a cross-sectional view of the relay pin unit. FIG. 13 is a partially enlarged view of the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate of the relay pin unit. FIG. 14 is a partially enlarged sectional view for explaining an embodiment of the inspection apparatus of the present invention. FIG. 15 is a partially enlarged cross-sectional view for explaining a use state of the embodiment of the inspection apparatus of the present invention. FIG. 16 is a partially enlarged cross-sectional view for explaining the use state of the relay pin unit of the inspection apparatus of the present invention. FIG. 17 is a partially enlarged cross-sectional view for explaining a use state of the embodiment of the inspection apparatus of the present invention. 18 is a cross-sectional view similar to FIG. 14 for explaining another embodiment of the inspection apparatus of the present invention. FIG. 19 is an enlarged cross-sectional view of the relay pin unit in the embodiment of FIG. FIG. 20 is a cross-sectional view similar to FIG. 1 for explaining another embodiment of the inspection apparatus of the present invention. FIG. 21 is a cross-sectional view similar to FIG. 2 showing a stacked state when the inspection apparatus of FIG. 20 is used for inspection. FIG. 22 is a partially enlarged view of the inside of the auxiliary relay board body 302. FIG. 23 is a partially enlarged view showing an example of a connection state between the base end portion of the conductive pin of the auxiliary relay substrate body and the wiring. FIG. 24 is a cross-sectional view similar to FIG. 1 for explaining another embodiment of the inspection apparatus of the present invention. FIG. 25 is a cross-sectional view similar to FIG. 2 showing a stacked state when the inspection apparatus of FIG. 24 is used for inspection. FIG. 26 is a cross-sectional view similar to FIG. 1 for explaining another embodiment of the inspection apparatus of the present invention. FIG. 27 is a cross-sectional view similar to FIG. 1 for explaining another embodiment of the inspection apparatus of the present invention. FIG. 28 is a cross-sectional view similar to FIG. 1 for explaining another embodiment of the inspection apparatus of the present invention. FIG. 29 is a cross-sectional view similar to FIG. 1 for explaining another embodiment of the inspection apparatus of the present invention. 30 is a cross-sectional view similar to FIG. 1 for explaining another embodiment of the inspection apparatus of the present invention. FIG. 31 is a cross-sectional view similar to FIG. 1 for explaining another embodiment of the inspection apparatus of the present invention. FIG. 32 is a cross-sectional view similar to FIG. 1 for explaining another embodiment of the inspection apparatus of the present invention. FIG. 33 is a cross-sectional view of a conventional circuit board inspection apparatus. FIG. 34 is a sectional view of a conventional circuit board inspection apparatus. FIG. 35 is a sectional view of a conventional circuit board inspection apparatus. FIG. 36 is a partially enlarged cross-sectional view for explaining a use state of a conventional inspection apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Inspection apparatus 11a 1st inspection jig 11b 2nd inspection jig 21a, 21b Circuit board side connector 22a, 22b 1st anisotropically conductive sheet 23a, 23b Pitch conversion board | substrate 24 Terminal electrode 25 Connection electrode 26a, 26b Second anisotropic conductive sheet 27a, 27b Current terminal electrode 28a, 28b Voltage terminal electrode 31a, 31b Relay pin unit 32a, 32b Conductive pin 34a, 34b Insulating plate (first insulating plate)
35a, 35b Second insulating plate 36a Intermediate holding plate 37a, 37b Second support pin 38A First contact support position 38B Second contact support position 39 Holding plate support pin 39A Contact support position 41a, 41b Tester Side connectors 42a, 42b Third anisotropic conductive sheets 43a, 43b Connector boards 44a, 44b Tester side electrodes 45a, 45b Pin side electrodes 46a, 46b Base plates 47a, 47b Current pin side electrodes 48a, 48b Voltage pin side Electrode 51 Insulating substrate 52 Wiring 53 Internal wiring 54 Insulating layer 55 Insulating layers 56a and 56b Connection circuit unit for inspection 61 Sheet base material 62 Conductive particles 71 Insulating part 72 Conducting path forming part 73 Projection part 81a, 81b End part 82 Central part 83 Through-hole 101 Inspected circuit board 102 Inspected electrode 111a Upper inspection jig 111b Lower side Inspection jig 121a Circuit board side connector 122a Anisotropic conductive sheet 123a Pitch conversion board 131a Relay pin unit 132a Conductive pin 134a Insulating plate 141a Tester side connector 142a Anisotropic conductive sheet 143a Connector board 146a Base board 200 Auxiliary connection circuit unit 222 Auxiliary anisotropic conductive sheet 231a First auxiliary relay pin unit 231b Second auxiliary relay pin unit 232a, 232b Conductive pins 233a, 233b First support pins 234a, 234b Insulating plate (first insulating plate)
235a, 235b second insulating plates 236a, 236b intermediate holding plates 237a, 237b second support pins 300a first auxiliary relay board device 300b second auxiliary relay board device 302a first auxiliary relay board body 302b second Auxiliary relay substrate bodies 304a and 304b Energizing devices 306a and 306b Lower frame bodies 308a and 308b Slide guide members 310a and 310b Elastic members 312a and 312b Insulating substrates 314a and 314b Base insulating substrates 316a and 316b Planting holes 320a and 320b Conductive pins 322a 322b Retaining flange 324a, 324b Retaining hole 326a, 326b Base end portion 328a, 328b Connection wiring 330a, 330b Connection opening 340a, 340b Second auxiliary relay board body 342a, 342b Connection wiring A Intermediate holding plate projection surface L Distance L2 distance Q1 diagonal Q2 diagonal R1 unit lattice region R2 unit cell area

  Hereinafter, embodiments (examples) of the present invention will be described in more detail with reference to the drawings.

  In the following description, a pair of identical components in the first inspection jig and the second inspection jig (for example, the circuit board connector 21a and the circuit board connector 21b, the first anisotropic conductive sheet 22a). And the first anisotropic conductive sheet 22b, etc., the symbols “a” and “b” may be omitted (for example, the first anisotropic conductive sheet 22a and the first anisotropic conductive sheet 22b). The directionally conductive sheet 22b is sometimes collectively referred to as “first anisotropically conductive sheet 22”.

  FIG. 1 is a cross-sectional view for explaining an embodiment of the inspection apparatus of the present invention, FIG. 2 is a cross-sectional view showing a stacked state when the inspection apparatus of FIG. 1 is used for inspection, and FIG. FIG. 4 shows the surface on the inspection circuit board side, and FIG. 4 shows the pin unit side surface of the pitch conversion board.

  This inspection apparatus 10 performs an electrical inspection of a circuit board to be inspected by measuring an electrical resistance between electrodes to be inspected in a circuit board 1 to be inspected such as a printed circuit board for mounting an integrated circuit or the like. Is what you do.

  1 and 2, the inspection apparatus 10 includes a first inspection jig 11a disposed on the upper surface side of the circuit board 1 to be inspected and a second inspection treatment disposed on the lower surface side. The tool 11b is arrange | positioned so that it may mutually oppose up and down.

  The first inspection jig 11a includes a circuit board side connector 21a including anisotropic conductive sheets 22a and 26a on both sides thereof, and a relay pin unit 31a. The first inspection jig 11a includes a connector substrate 43a on which the third anisotropic conductive sheet 42a is disposed on the relay pin unit 31a side, and a tester-side connector 41a including a base plate 46a.

The second inspection jig 11b is also configured in the same manner as the first inspection jig 11a, and includes a circuit board side connector 21b having anisotropic conductive sheets 22b and 26b on both sides thereof, and a relay pin unit 31b. Yes. The second inspection jig 11b includes a connector substrate 43b on which the anisotropic conductive sheet 42b is disposed on the relay pin unit 31b side, and a tester-side connector 41b including a base plate 46b.

  An electrode 2 to be inspected is formed on the upper surface of the circuit board 1 to be inspected, and an electrode 3 to be inspected is also formed on the lower surface thereof, and these are electrically connected to each other.

  The circuit board side connectors 21a and 21b have pitch conversion boards 23a and 23b, and first anisotropic conductive sheets 22a and 22b and second anisotropic conductive sheets 26a and 26b arranged on both sides thereof. ing.

  And circuit board side connectors 21a and 21b composed of the pitch conversion boards 23a and 23b, the first anisotropic conductive sheets 22a and 22b, and the second anisotropic conductive sheets 26a and 26b, The connection circuit units for inspection 56a and 56b are constituted by the relay pin units 31a and 31b and the third anisotropic conductive sheets 42a and 42b.

  Further, connector boards 43a and 43b for electrically connecting the tester and the relay pin units 31a and 31b, and base plates 46a and 46b arranged on the opposite side of the relay pin units 31a and 31b of the connector boards 43a and 43b, and Thus, tester-side connectors 41a and 41b are configured.

  FIG. 3 is a view showing the surface of the pitch conversion substrate 23 on the circuit board 1 side to be inspected, and FIG. 4 is a view showing the surface of the relay pin unit 31 side.

  As shown in FIG. 3, a plurality of connection electrodes electrically connected to the electrodes 2 and 3 of the circuit board 1 to be inspected are provided on one surface of the pitch conversion board 23, that is, the circuit board 1 to be inspected. 25 is formed. These connection electrodes 25 are arranged so as to correspond to the patterns of the electrodes 2 and 3 to be inspected of the circuit board 1 to be inspected.

  Further, as shown in FIGS. 3, 7, and 8, the connection electrode 25 is connected to one of the electrodes 2 and 3 to be inspected of the circuit board 1 to be inspected as a pair. The current terminal electrode 27 and the voltage terminal electrode 28 are separated from each other by a predetermined distance.

  In this case, the shape of the current terminal electrode 27 and the voltage terminal electrode 28 is rectangular in FIG. 3, but this shape is not particularly limited, and various shapes such as a circular shape and a triangular shape are used. be able to. The region occupied by the pair of current terminal electrode 27 and voltage terminal electrode 28 is substantially the same as the region occupied by one of the electrodes 2 and 3 to be inspected of the circuit board 1 to be inspected. It is desirable to reduce the measurement error.

  In this case, in the pitch conversion substrate 23, the separation distance L1 between the current terminal electrode 27 and the voltage terminal electrode 28 is preferably 10 μm or more. When the separation distance L1 is smaller than 10 μm, the current flowing between the current terminal electrode 27 and the voltage terminal electrode 28 via the first anisotropic conductive sheets 22a and 22b is increased, so that high accuracy is achieved. This is because it may be difficult to measure the electrical resistance, and an accurate electrical property test cannot be performed.

  On the other hand, the upper limit of the separation distance L1 between the current terminal electrode 27 and the voltage terminal electrode 28 is the size and pitch of the electrodes 2 and 3 to be inspected of the circuit board 1 to be inspected, and the current terminal electrode 27 and Although it is determined by the dimensions of the voltage terminal electrode 28 and is not particularly limited, it is usually 500 μm or less. When the separation distance L1 is too large, both the current terminal electrode 27 and the voltage terminal electrode 28 are appropriately set to one of the electrodes 2 and 3 to be inspected of the circuit board 1 having a small size. It is because it becomes difficult to arrange in.

  On the other hand, the other surface of the pitch conversion board 23, that is, the side opposite to the circuit board 1 to be inspected, is electrically connected to the conductive pins 32a and 32b of the relay pin unit 31 as shown in FIG. A plurality of terminal electrodes 24 are formed. These terminal electrodes 24 have, for example, a pitch of 2.54 mm, 1.8 mm, 1.27 mm, 1.06 mm, 0.8 mm, 0.75 mm, 0.5 mm, 0.45 mm, 0.3 mm or 0.2 mm. The pitch is the same as the pitch of the conductive pins 32a and 32b of the relay pin unit.

  In this case, in FIG. 4, a plurality of terminal electrodes 24 are arranged on lattice points having a constant pitch on a part of the surface of the pitch conversion substrate 23, but the surface of the pitch conversion substrate 23 is not shown. It is also possible to arrange the plurality of terminal electrodes 24 on the lattice points with a constant pitch throughout.

  Each of the connection electrodes 25 in FIG. 3, that is, the current terminal electrode 27 and the voltage terminal electrode 28 are respectively connected to the corresponding terminals in FIG. 4 by separate wirings 52 and internal wirings 53 penetrating in the thickness direction of the insulating substrate 51. As shown in FIGS. 7 and 8, the electrode 24 is electrically connected.

  For example, as shown in FIG. 7, the insulating portion on the surface of the pitch conversion substrate 23 includes an insulating layer 54 formed on the surface of the insulating substrate 51 so that the connection electrodes 25 are exposed. The thickness of the insulating layer 54 is preferably 5 to 100 μm, more preferably 10 to 60 μm. This is because if the thickness is too small, it may be difficult to form an insulating layer having a small surface roughness. On the other hand, if this thickness is excessive, it may be difficult to electrically connect the connection electrode 25 and the anisotropic conductive sheet.

  As a material for forming the insulating substrate 51 of the pitch conversion substrate, a material generally used as a base material of a printed circuit board can be used. Specific examples include polyimide resins, glass fiber reinforced polyimide resins, glass fiber reinforced epoxy resins, glass fiber reinforced bismaleimide triazine resins, and the like.

  As a material for forming the insulating layers 54 and 55 in FIG. 7, a polymer material that can be formed into a thin film can be used. Specifically, for example, an epoxy resin, an acrylic resin, a phenol resin, a polyimide resin, a polyamide resin, A mixture thereof, a resist material, and the like can be given.

  The pitch conversion substrate 23 can be manufactured, for example, as follows. First, a laminated material in which thin metal layers are laminated on both sides of a flat insulating substrate is prepared, and this laminated material penetrates in the thickness direction of the laminated material corresponding to the pattern corresponding to the terminal electrode to be formed. A plurality of through holes are formed by a numerically controlled drilling apparatus, a photo etching process, a laser processing process, or the like.

  Next, electroless plating and electrolytic plating are performed in the through holes formed in the laminated material to form via holes connected to the thin metal layers on both sides of the substrate. Thereafter, a photoetching process is performed on the thin metal layer to form a wiring pattern and connection electrodes on the surface of the insulating substrate, and to form terminal electrodes on the opposite surface.

  Then, as shown in FIG. 7, the insulating layer 54 is formed on the surface of the insulating substrate 51 so that the connection electrodes 25 are exposed, and the terminal electrodes 24 are exposed on the opposite surface. The pitch conversion substrate 23 is obtained by forming the insulating layer 55 on the substrate. The thickness of the insulating layer 55 is preferably 5 to 100 μm, more preferably 10 to 60 μm.

  The first anisotropic conductive sheet 22 constituting the circuit board side connector 21 and laminated with the circuit board 23 for pitch conversion is a sheet base 61 made of an insulating elastic polymer as shown in FIG. A large number of conductive particles 62 are dispersed in the plane direction and are arranged in the thickness direction.

  The thickness of the first anisotropic conductive sheet 22 is preferably 0.03 to 0.5 mm, and more preferably 0.05 to 0.2 mm. When this minimum thickness is less than 0.03 mm, the mechanical strength of the first anisotropic conductive sheet 22 tends to be low, and the required durability may not be obtained. On the other hand, when the thickness of the first anisotropic conductive sheet 22 exceeds 0.5 mm, the electrical resistance in the thickness direction tends to be large, and the pitch of the electrodes to be connected is small. In some cases, the required insulation between the conductive paths formed by pressurization cannot be obtained, and an electrical short circuit occurs between the electrodes to be inspected, making it difficult to electrically inspect the circuit board to be inspected.

  The elastic polymer material constituting the sheet base 61 of the first anisotropic conductive sheet 22 has a durometer hardness of 30 to 90, preferably 35 to 80, and more preferably 40. ~ 70.

  In the present invention, “durometer hardness” refers to a value measured by a type A durometer based on a durometer hardness test of JIS K6253. When the durometer hardness of the elastic polymer material is less than 30, the anisotropic conductive sheet is greatly compressed and deformed when pressed in the thickness direction, resulting in large permanent distortion. Deteriorates at an early stage, making it difficult to use for inspection and low durability.

  On the other hand, when the durometer hardness of the elastic polymer material exceeds 90, since the amount of deformation in the thickness direction becomes insufficient when the anisotropic conductive sheet is pressed in the thickness direction, a good connection is obtained. Reliability is not obtained and connection failure is likely to occur.

  The elastic polymer material constituting the base material of the first anisotropic conductive sheet 22 is not particularly limited as long as it exhibits the above durometer hardness. From the viewpoint of forming processability and electrical characteristics, silicone rubber Is preferably used.

The conductive particles 62 composing the first anisotropic conductive sheet 22, when using the magnetic conductive particles preferably have a number average particle diameter D ₁ is 3 to 50 [mu] m, further 5~30μm It is preferable that it is, and it is especially preferable that it is 8-20 micrometers.

  Here, the “number average particle diameter of the magnetic conductive particles” means that measured by a laser diffraction scattering method.

When the number average particle diameter D ₁ of the magnetic conductive particles is 3 μm or more, the resulting anisotropic conductive sheet can be easily subjected to pressure deformation of the portion containing the magnetic conductive particles. In the manufacturing process, when magnetically conductive particles are oriented by magnetic field orientation treatment, the orientation of the magnetically conductive particles tends to be easy, so that the anisotropically conductive sheet obtained becomes highly anisotropic and anisotropically conductive. The sheet resolution (the ability to maintain electrical insulation between the electrodes adjacent to the lateral method while pressing the anisotropic conductive sheet to achieve electrical continuity between the electrodes facing the thickness method) is good. Become.

On the other hand, when the number average particle diameter D _{1 of} the magnetic conductive particles is 50 μm or less, the obtained anisotropic conductive sheet has good elasticity and can be easily deformed under pressure. Also, the resolution is good.

Then, in the first anisotropically conductive sheet 22, and the thickness W ₁ ([mu] m), the ratio W ₁ / D ₁ of the number average particle diameter D ₁ of the magnetic conductive particles ([mu] m) 1.1 to 10 is preferable.

When the ratio W ₁ / D ₁ is less than 1.1, the diameter of the magnetic conductive particles is equal to or larger than the thickness of the anisotropic conductive sheet. Therefore, the anisotropic conductive sheet is placed between an object to be inspected (circuit board 1 to be inspected) such as a printed wiring board and an inspection electrode, and pressurization is performed to achieve a contact conduction state. In this case, the inspection object is easily damaged.

On the other hand, when the ratio W ₁ / D ₁ exceeds 10, an anisotropic conductive sheet is placed between an inspection object such as a printed wiring board and an inspection electrode, and pressurization is performed to achieve a contact conduction state. In this case, a large number of conductive particles are arranged between the object to be inspected and the inspection electrode to form a chain. Therefore, since there are contacts between the large number of conductive particles, the electrical resistance value is It tends to be expensive and it is difficult to use electrical inspection.

The magnetic conductive particles are saturated from the viewpoint that the magnetic conductive particles can be easily moved by the action of a magnetic field in a sheet molding material for forming an anisotropic conductive sheet by a manufacturing method described later. Those having a magnetization of 0.1 Wb / m ² or more can be preferably used, more preferably 0.3 Wb / m ² or more, and particularly preferably 0.5 Wb / m ² or more.

Since the saturation magnetization is 0.1 Wb / m ² or more, the magnetic conductive particles can be reliably moved by the action of a magnetic field in the production process to obtain a desired orientation state. When used, a chain of magnetic conductive particles can be formed.

  Specific examples of magnetic conductive particles include particles of metals such as iron, nickel, cobalt, etc., particles of alloys thereof, particles containing these metals, or particles containing these particles as core particles, and the core particles. Composite particles with a surface coated with a highly conductive metal, or non-magnetic metal particles or inorganic particles such as glass beads or polymer particles were used as core particles, and the surface of the core particles was plated with a highly conductive metal. Examples include composite particles or composite particles in which core particles are coated with both a conductive magnetic material such as ferrite and an intermetallic compound and a highly conductive metal.

Here, the “high conductivity metal” refers to a metal having an electrical conductivity at 0 ° C. of 5 × 10 ⁶ Ω ⁻¹ m ⁻¹ or more.

  Specific examples of such highly conductive metals include gold, silver, rhodium, platinum, and chromium. Among these, gold is used because it is chemically stable and has high conductivity. It is preferable to use it.

  Among these magnetic conductive particles, composite particles in which nickel particles are used as core particles and the surfaces thereof are plated with a highly conductive metal such as gold or silver are preferable.

  The means for coating the surface of the core particles with the highly conductive metal is not particularly limited, and for example, an electroless plating method can be used.

  The magnetic conductive particles preferably have a coefficient of variation of the number average particle diameter of 50% or less, more preferably 40% or less, still more preferably 30% or less, and particularly preferably 20% or less. .

  Here, the “coefficient of variation of the number average particle diameter” is an expression: (σ / Dn) × 100 (where σ represents the value of the standard deviation of the particle diameter, and Dn represents the number average particle diameter of the particles. Is required).

  When the coefficient of variation of the number average particle diameter of the magnetic conductive particles is 50% or less, the degree of unevenness of the particle diameter is reduced, so that the partial conductivity variation in the anisotropically conductive sheet obtained is reduced. be able to.

  Such magnetic conductive particles can be obtained by making a metal material into particles by a conventional method, or preparing commercially available metal particles and subjecting the particles to a classification treatment.

  The particle classification treatment can be performed by, for example, a classification device such as an air classification device or a sonic sieving device.

  The specific conditions for the classification treatment are appropriately set according to the number average particle diameter of the target conductive metal particles, the type of the classification device, and the like.

  The specific shape of the magnetic conductive particles is not particularly limited, but particles having a shape composed of secondary particles in which a plurality of spherical primary particles are integrally connected are preferably shaped particles. Can be mentioned.

  In the case of using composite particles in which the surface of the core particle is coated with a highly conductive metal (hereinafter, also referred to as “conductive composite metal particles”) as magnetic conductive particles, a viewpoint of obtaining good conductivity. Therefore, the coverage of the highly conductive metal on the surface of the conductive composite metal particles (ratio of the coated area of the highly conductive metal to the surface area of the core particles) is preferably 40% or more, more preferably 45% or more. Especially preferably, it is 47 to 95%.

  The coating amount of the highly conductive metal is preferably 2.5 to 50% by mass, more preferably 3 to 45% by mass, still more preferably 3.5 to 40% by mass, particularly the weight of the core particles. Preferably it is 5-30 mass%.

  An anisotropic conductive sheet in which a large number of conductive particles 62 are dispersed in the surface direction and arranged in the thickness direction in such an insulating elastic polymer material is disclosed in, for example, JP-A-2003-77560. As shown in the publication, a fluid molding material is prepared in which conductive particles exhibiting magnetism are contained in a polymer material that is cured to become an elastic polymer material. A molding material layer is formed between the one-surface-side molded member in contact with one surface of the molding material layer and the other-surface-side molded member in contact with the other surface of the molding material layer, and the thickness direction with respect to the molding material layer It can be produced by a method of applying a magnetic field to the material and curing the molding material layer.

  As shown in FIG. 6, the second anisotropic conductive sheet 26 disposed on the pitch conversion substrate 23 on the relay pin unit 31 side has a large number of conductive particles 62 in an insulating elastic polymer material. The conductive path forming portions 72 are arranged in the thickness direction, and the insulating portions 71 separate the conductive path forming portions 72 from each other. As described above, the conductive particles 62 are non-uniformly dispersed in the surface direction only in the conductive path forming portion 72.

The thickness W ₂ of the conductive path forming portion 72 is preferably 0.1 to ₂ mm, more preferably 0.2 to
1.5 mm. When the thickness W ₂ is less than 0.1 mm, the absorption capacity for pressurization in the thickness direction is low, the absorption of the applied pressure by the inspection jig during inspection is reduced, and the impact on the circuit board side connector 21 is reduced. The effect is reduced. For this reason, it becomes difficult to suppress the deterioration of the first anisotropic conductive sheet 22, and as a result, the number of replacements of the first anisotropic conductive sheet 22 during the repeated inspection of the circuit board 1 to be inspected increases, Decreases the efficiency. On the other hand, when the thickness W ₂ exceeds ₂ mm, the electrical resistance in the thickness direction tends to increase and electrical inspection may be difficult.

  The thickness of the insulating part 71 is preferably substantially the same as or smaller than the thickness of the conductive path forming part 72. As shown in FIG. 6, the thickness of the insulating portion 71 is made smaller than the thickness of the conductive path forming portion 72, and the conductive path forming portion 72 forms a protruding portion 73 that protrudes from the insulating portion 71. Since the conductive path forming portion 72 is easily deformed by pressurization and the pressure absorption capacity is increased, the pressure applied by the inspection jig is absorbed during the inspection, and the impact of the circuit board connector 21 is reduced. can do.

  When magnetic conductive particles are used for the conductive particles 62 constituting the second anisotropic conductive sheet 26, the number average particle diameter is preferably 5 to 200 μm, more preferably 5 to 150 μm, and still more preferably 10 ˜100 μm. Here, the “number average particle diameter of the magnetic conductive particles” means that measured by a laser diffraction scattering method. When the number average particle diameter of the magnetic conductive particles is 5 μm or more, the pressure deformation of the conductive path forming portion of the anisotropic conductive sheet becomes easy. Further, when the magnetic conductive particles are oriented by a magnetic field orientation process in the manufacturing process, the magnetic conductive particles are easily oriented. When the number average particle diameter of the magnetic conductive particles is 200 μm or less, the elasticity of the conductive path forming portion 72 of the anisotropic conductive sheet is good and the pressure deformation is easy.

The ratio W ₂ / D ₂ between the thickness W ₂ (μm) of the conductive path forming portion 72 and the number average particle diameter D ₂ (μm) of the magnetic conductive particles is preferably 1.1-10.

When the ratio W ₂ / D ₂ is less than 1.1, the diameter of the magnetic conductive particles is equal to or larger than the thickness of the conductive path forming portion 72, and therefore the elasticity of the conductive path forming portion 72 is low. Thus, the ability to absorb the pressure in the thickness direction is reduced. Absorption of the pressurizing pressure of the inspection jig at the time of inspection is reduced, and the effect of mitigating the impact on the circuit board side connector 21 is reduced. As a result, during the repeated inspection of the circuit board 1 to be inspected, the number of replacements of the first anisotropic conductive sheet 22 increases, and the inspection efficiency tends to decrease.

On the other hand, when the ratio W ₂ / D ₂ exceeds 10, a large number of conductive particles are arranged in the conductive path forming portion 72 to form a chain, and there are a large number of contacts between the conductive particles. The electrical resistance value tends to be high.

  The elastic polymer (elastomer) that is the base material of the conductive path forming portion 72 preferably has a durometer hardness measured by a type A durometer of 15 to 60, more preferably 20 to 50, still more preferably 25 to 45. is there.

  When the durometer hardness of the elastic polymer is less than 15, the sheet is greatly compressed and deformed when pressed in the thickness direction, and a large permanent distortion is generated. Connection is likely to be difficult. When the durometer hardness of the elastic polymer is larger than 60, the deformation when pressed in the thickness direction is small, so that the ability to absorb pressure in the thickness direction is small. For this reason, it becomes difficult to suppress the deterioration of the first anisotropic conductive sheet 22, and as a result, the number of replacements of the first anisotropic conductive sheet 22 increases during the repeated inspection of the circuit board 1 to be inspected. , Inspection efficiency tends to decrease.

  The elastic polymer serving as the base material of the conductive path forming portion 72 is not particularly limited as long as it exhibits the durometer hardness described above, but it is preferable to use silicone rubber from the viewpoint of processability and electrical characteristics.

  The insulating portion 71 of the second anisotropic conductive sheet 26 is formed of an insulating material that does not substantially contain conductive particles. As the insulating material, for example, an insulating polymer material, an inorganic material, a metal material with an insulating surface can be used, and the same material as the elastic polymer used for the conductive path forming portion is used. Easy to produce. When an elastic polymer is used as the material for the insulating portion, it is preferable to use a material having a durometer hardness in the above range.

  As the magnetic conductive particles, the conductive particles used in the first anisotropic conductive sheet described above can be used.

  The second anisotropic conductive sheet 26 of the present invention can be manufactured as follows.

  For example, each of the overall shapes is substantially flat, and is composed of an upper mold and a lower mold that correspond to each other, and a magnetic field is applied to a material layer filled in a molding space between the upper mold and the lower mold. An anisotropic conductive sheet molding die having a configuration capable of heat-curing the material layer is prepared.

  In this anisotropic conductive sheet molding die, a magnetic field is applied to the material layer to form a conductive portion at an appropriate position. Therefore, both the upper die and the lower die are made of strong iron or nickel. On a substrate made of a magnetic material, a ferromagnetic part made of iron, nickel or the like for generating an intensity distribution in the magnetic field in the mold and a nonmagnetic part made of nonmagnetic metal or resin such as copper are mutually connected. It has a structure having mosaic layers alternately arranged so as to be adjacent to each other, and the ferromagnetic portions are arranged according to a pattern corresponding to the pattern of the conductive path forming portion to be formed.

  Here, the molding surface of the upper mold is flat, and the molding surface of the lower mold has slight irregularities corresponding to the conductive path forming portion of the anisotropic conductive sheet to be formed.

  And an anisotropic conductive sheet is manufactured as follows using said anisotropic conductive sheet shaping die.

  First, molding is performed by injecting a molding material containing conductive particles exhibiting magnetism into a polymer material that is cured and becomes an elastic polymer substance in the molding space of the anisotropic conductive sheet molding die. A material layer is formed.

  Next, by using a ferromagnetic part and a non-magnetic part in each of the upper mold and the lower mold, a magnetic field having an intensity distribution in the thickness direction is applied to the formed molding material layer to thereby obtain the magnetic force. As a result, the conductive particles are gathered between the ferromagnetic part in the upper mold and the ferromagnetic part in the lower mold located immediately below it, and the conductive particles are aligned in the thickness direction. Let And the anisotropic conductive sheet which has a structure by which the some columnar conductive path formation part is mutually insulated by the insulation part by hardening-processing the said molding material layer in the state is manufactured.

  On the other hand, the tester-side connectors 41a and 41b include third anisotropic conductive sheets 42a and 42b, connector boards 43a and 43b, and base plates 46a and 46b, as shown in FIG. The third anisotropic conductive sheets 42a and 42b are the same as the second anisotropic conductive sheet 26 described above, and a large number of them are contained in the insulating elastic polymer material as shown in FIG. The conductive path forming part is formed by arranging the conductive particles in the thickness direction, and an insulating part that separates the conductive path forming parts.

  The connector substrates 43a and 43b are made of an insulating substrate, and pin-side electrodes 45a and 45b are formed on the surface thereof on the relay pin unit 31 side as shown in FIGS.

  As shown in FIG. 8, these pin-side electrodes 45 are electrically connected separately to the connection electrodes 25 of the pitch conversion substrate 23, that is, the current terminal electrodes 27 and the voltage terminal electrodes 28, respectively. As described above, the current pin side electrode 47 and the voltage pin side electrode 48 are configured to be disposed at positions corresponding to the conductive pins 32 of the relay pin unit 31 described later.

  In this case, these pin-side electrodes 45 have a constant pitch, for example, 2.54 mm, 1.8 mm, 1.27 mm, 1.06 mm, 0.8 mm, 0.75 mm, 0.5 mm, 0.45 mm,. They are arranged on lattice points with a constant pitch of 3 mm or 0.2 mm, and the arrangement pitch is the same as the arrangement pitch of the conductive pins 32 of the relay pin unit 31.

  Each pin-side electrode 45 is electrically connected to the tester-side electrodes 44a and 44b by a wiring pattern formed on the surface of the insulating substrate and an internal wiring formed therein.

  In this embodiment, the pin-side electrode 45 has a pin shape. However, the shape is not limited to the pin shape, and various modifications such as a flat electrode can be made.

  As shown in FIGS. 1 and 2, the relay pin unit 31 includes a large number of conductive pins 32 a and 32 b provided at a predetermined pitch in parallel so as to face in the vertical direction. Further, the relay pin unit 31 is provided on both end sides of the conductive pins 32a and 32b, and is provided with insulating plates 34a and 34b disposed on the circuit board 1 side to be inspected for inserting and supporting the conductive pins 32a and 32b. Two (a pair of) insulating plates of insulating plates 34a and 34b disposed on the side opposite to the circuit board 1 side are provided.

  For example, as shown in FIG. 9, the conductive pin 32 includes a central portion 82 having a large diameter and end portions 81 a and 81 b having a smaller diameter.

  Through holes 83 into which the end portions 81 of the conductive pins 32 are inserted are formed in the pair of insulating plates 34a and 34b. The diameter of the through hole 83 is formed larger than the diameter of the end portion 81 of the conductive pin 32 and smaller than the diameter of the central portion 82, thereby holding the conductive pin 32 so as not to drop off.

  The two insulating plates 34 are fixed by the support pins 33a and 33b so that the distance between them is longer than the length of the central portion 82 of the conductive pin 32, whereby the conductive pin 32 is held so as to move up and down. ing.

  The length of the end portion 81 of the conductive pin 32 is formed to be longer than the thickness of the insulating plate 34, so that the conductive pin 32 protrudes from at least one of the insulating plates 34.

  In the relay pin unit, a large number of conductive pins have a constant pitch, for example, 2.54 mm, 1.8 mm, 1.27 mm, 1.06 mm, 0.8 mm, 0.75 mm, 0.5 mm, 0.45 mm,. They are arranged on lattice points with a pitch of 3 mm or 0.2 mm.

  By making the arrangement pitch of the conductive pins 32 of the relay pin unit 31 the same as the arrangement pitch of the terminal electrodes 24 provided on the pitch conversion board 23, the pitch conversion board 23 is connected to the tester side via the conductive pins 32. It is designed to be connected electrically.

  The distance between the two insulating plates 34 is not particularly limited, but is 20 mm or more, preferably 40 mm or more.

Specifically, the material of the insulating plate 34 is an insulating material having a specific resistance of 1 × 10 ¹⁰ Ω · cm or more, such as polyimide resin, polyester resin, polyamide resin, phenol resin, polyacetal resin, polybutylene terephthalate resin, potty Resins with high mechanical strength such as ethylene terephthalate resin, syndiotactic polystyrene resin, polyphenylene sulfide resin, polyether ethyl ketone resin, fluorine resin, polyether nitrile resin, polyether sulfone resin, polyarylate resin, polyamideimide resin Materials, glass fiber reinforced epoxy resin, glass fiber reinforced polyester resin, glass fiber reinforced polyimide resin, glass fiber reinforced phenolic resin, glass fiber reinforced fluororesin, etc., carbon fiber Strong fiber epoxy resin, carbon fiber reinforced polyester resin, carbon fiber reinforced polyimide resin, carbon fiber reinforced phenol resin, carbon fiber reinforced fluororesin and other carbon fiber composite resins, epoxy resin, phenol resin, silica, alumina A composite resin material filled with an inorganic material such as boron nitride, a composite resin material containing a mesh in an epoxy resin, a phenol resin, or the like is used. Moreover, the composite board material etc. which were comprised by laminating | stacking two or more board | plate materials which consist of these materials can also be used.

  The thickness of each of the insulating plates 34 is appropriately selected according to the type of material constituting the insulating plate 34, but is preferably 1 to 10 mm, for example.

  Specifically, the insulating plate 34 is made of a glass fiber reinforced epoxy resin and has a thickness of 2 to 5 mm.

  In the inspection apparatus 10 configured as described above, as shown in FIG. 2, the electrode 2 and the electrode 3 of the circuit board 1 to be inspected are the first anisotropic conductive sheets 22a and 22b, the pitch conversion substrate 23a, 23b, the second anisotropic conductive sheet 26a, 26b, the conductive pins 32a, 32b, the third anisotropic conductive sheet 42a, 42b, and the base plate 46a disposed on the outermost side via the connector boards 43a, 43b. , 46b are pressed to a tester (not shown) by pressing with a pressurizing mechanism of the tester, and an electrical test such as an electrical resistance measurement between the electrodes of the circuit board 1 to be tested is performed.

  The pressure pressed from the upper and lower first inspection jigs 11a and the second inspection jig 11b with respect to the substrate to be inspected at the time of measurement is, for example, 100 to 250 kgf.

  In this case, as shown in FIG. 8, one of the electrodes 2 and 3 for inspection of the circuit board 1 to be inspected is subjected to pitch conversion via the first anisotropic conductive sheet 22. A pair of current terminal electrodes 27 and voltage terminal electrodes 28 on the circuit board 1 side of the circuit board 23 are electrically connected.

  From the pair of current terminal electrodes 27 and voltage terminal electrodes 28 on the circuit board 1 side of the pitch conversion board 23, the terminal electrodes 24 on the opposite side of the circuit board 1 to be inspected of the pitch conversion board 23, The current terminal electrode 27 of the pitch conversion board 23 is connected to the current of the connector board 43 via the two anisotropic conductive sheets 26, the conductive pins 32 of the relay pin unit 31, and the third anisotropic conductive sheet 42. In addition to being electrically connected to the pin-side electrode 47, the voltage terminal electrode 28 of the pitch conversion substrate 23 is electrically connected to the voltage terminal electrode 48 of the connector substrate 43.

  As a result, as shown in FIG. 8, with respect to each of the electrodes 2 and 3 to be inspected of the circuit board 1 to be inspected, the current terminal electrodes 27a and 27b of the upper and lower pitch conversion substrates 23a and 23b are respectively connected. Thus, the current measurement path I is configured. On the other hand, the voltage terminal electrodes of the upper and lower pitch conversion substrates 2 and 3 are respectively provided for the electrodes 2 and 3 for the circuit board 1 to be inspected. The voltage measurement path V is configured via 28a and 28b.

  Therefore, a voltage is applied to the voltage measurement path V via the voltage terminal electrodes 28a and 28b of the upper and lower pitch conversion substrates 23a and 23b with respect to the electrodes 2 and 3 to be inspected of the circuit board 1 to be inspected. However, the current is measured for each of the electrodes to be inspected 2 and 3 of the circuit board 1 to be inspected by the current measuring path I through the current terminal electrodes 27a and 27b of the one upper and lower pitch conversion substrate 23. Thus, it is possible to perform an electrical property confirmation test as to whether or not the wiring pattern of the circuit board 1 to be inspected has a predetermined performance.

  On the contrary, a current is supplied to the current measurement path I through the current terminal electrodes 27a and 27b of the upper and lower pitch conversion substrates 23a and 23b for each of the electrodes 2 and 3 to be inspected of the circuit board 1 to be inspected. While supplying, to each of the electrodes to be inspected 2 and 3 of the circuit board 1 to be inspected by the voltage measuring path V through the voltage terminal electrodes 28a and 28b of the upper and lower one pitch conversion substrates 23a and 23b, By measuring the voltage, it is possible to perform a test for checking the electrical characteristics as to whether or not the wiring pattern of the circuit board 1 to be inspected has a predetermined performance.

  In this way, the voltage and current can be separately measured via the separate voltage measurement path V and current measurement path I for each of the electrodes for inspection 2 and 3 of the circuit board 1 to be tested. An accurate confirmation test can be performed on the electrical characteristics of whether or not the wiring pattern of the inspection circuit board has a predetermined performance, and the time required for the confirmation test can also be performed in a short time.

  Further, since the voltage can be measured while supplying current to the circuit to be inspected of the circuit board 1 to be inspected, the circuit under test can be inspected at a set voltage lower than the set voltage for determining whether or not the conduction resistance value in the conventional inspection apparatus is good Stable measurement of the conduction resistance value of the circuit under test on the circuit board 1 is possible.

  That is, it is necessary to judge the quality of a circuit at a low set voltage as a requirement for high-precision inspection. According to the present invention, a circuit to be inspected that has a potential electrical defect as compared with the conventional inspection apparatus. Since the board can be judged and removed as a defective product with high probability, it is possible to carry out a highly reliable circuit board confirmation test.

  For example, a constant voltage device is used for each of the electrodes 2 and 3 to be inspected of the circuit board 1 to be inspected via the voltage terminal electrodes 28a and 28b of the upper and lower pitch conversion substrates 23a and 23b. While applying a constant voltage to the voltage measurement path V, each of the circuit boards 1 to be inspected by the current supply path I through the current terminal electrodes 27a and 27b of the upper and lower pitch conversion boards 23a and 23b. By measuring the current from the electrodes 2 and 3 to be inspected with an ammeter, it is also possible to perform a test for checking the electrical characteristics as to whether or not the wiring pattern of the circuit board 1 to be inspected has a predetermined performance.

By the way, as described in the section of the prior art above, in the conventional inspection jigs as shown in FIGS. 33 to 35, the tester side connectors 141a and 141b have the tester side connectors on the tester side. For example, when the number of electrodes is 6000, the relationship between the number of electrodes to be inspected 102 on the upper side of the circuit board 101 to be inspected and the number of electrodes 103 to be inspected on the lower side of the circuit board 101 to be inspected is as follows. When such a pattern is generated, it may be difficult to execute the inspection. That is,
(Tester side)
Number of electrodes of upper tester side connector 141a = 6000 points Number of electrodes of lower tester side connector 141b = 6000 points (circuit board to be inspected)
Number of electrodes of upper test electrode 102 = 8000 points Number of electrodes of lower test electrode 103 = 4000 points That is, the number of tester side electrodes 144a of the upper tester side connector 141a is 6000 points, When the number of electrodes of the tester side electrode 144b of the tester side connector 141b is 6000, the number of electrodes 102 to be inspected on the upper side of the circuit board 101 to be inspected is 8000 points, and the lower side of the circuit board 101 to be inspected. When the number of electrodes 103 to be inspected is 4000, it may be difficult to execute the inspection.

  That is, the number of tester-side electrodes 144a of the upper tester-side connector 141a corresponding to the upper test electrode 102 is insufficient at 6000 points−8000 points = −2000 points.

  However, in this state, the number of tester side electrodes 144b of the lower tester side connector 141b corresponding to the lower test target electrode 103 of the circuit board 101 to be inspected is 6000 points-4000 points = + 2000 points. Remains as.

  Therefore, the present inventors bypass the electrical connection circuit for the upper electrode 102 to be inspected in this way, which has 2000 points short, to the tester side electrode 144b of the lower tester side connector 141b in which 2000 points remain as surplus. It has been found that by performing (bypassing), inspection can be made possible even in the above case.

  Therefore, in the present invention, as shown in FIG. 1, the connection circuit unit for inspection 56a is provided between the connector board 43a of the first inspection jig 11a and the connector board 43b of the second inspection jig 11b. , 56b, an auxiliary connection circuit unit 200 is provided.

The auxiliary connection circuit unit 200 includes a first auxiliary relay pin unit 231a. The first auxiliary relay pin unit 231a includes a plurality of conductive pins 232a arranged at a predetermined pitch and the conductive pins 232a. And a pair of spaced apart insulating plates 234a.

  The auxiliary connection circuit unit 200 includes a second auxiliary relay pin unit 231b. The second auxiliary relay pin unit 231b includes a plurality of conductive pins 232b arranged at a predetermined pitch and the conductive pins. It comprises a pair of spaced apart insulating plates 234b that support 232b.

Furthermore, the auxiliary connection circuit unit 200 includes a first auxiliary relay pin unit 231a and a second auxiliary relay pin unit 231a.
The auxiliary relay pin unit 231b is provided with an auxiliary anisotropic conductive sheet 222 that is electrically connected to each other.

In this case, the first auxiliary relay pin unit 231a and the second auxiliary relay pin unit 231
“b” has the same configuration as that of the relay pin unit 31 and can be made of the same material.

That is, the first auxiliary relay pin unit 231a and the second auxiliary relay pin unit 231
As shown in FIGS. 1 and 2, b includes a large number of conductive pins 232a and 232b provided at a predetermined pitch in parallel so as to face in the vertical direction.

  In addition, the relay pin unit 231 is provided on both ends of the conductive pins 232a and 232b, and is provided with insulating plates 234a and 234b disposed on the circuit board 1 side to be inspected to insert and support the conductive pins 232a and 232b. Two (a pair of) insulating plates, ie, insulating plates 234a and 234b arranged on the side opposite to the circuit board 1 side, are provided.

  Similarly to the conductive pin 32 shown in FIG. 9, the conductive pin 232 includes a central portion 82 having a large diameter and end portions 81a and 81b having a smaller diameter.

  Through holes 83 into which the end portions 81 of the conductive pins 232 are inserted are formed in the pair of insulating plates 234a and 234b. The diameter of the through hole 83 is formed larger than the diameter of the end portion 81 of the conductive pin 32 and smaller than the diameter of the central portion 82, thereby holding the conductive pin 232 so as not to drop off.

  The two insulating plates 234 are fixed by the support pins 233a and 233b so that the distance between them is longer than the length of the central portion 82 of the conductive pin 232, whereby the conductive pin 232 is held so as to move up and down. ing.

  The auxiliary anisotropic conductive sheet 222 is an anisotropic conductive sheet in which conductive particles are arranged in the thickness direction and uniformly dispersed in the plane direction, like the first anisotropic conductive sheet 22. Also, similar to the second anisotropic conductive sheet 22 and the third second anisotropic conductive sheet 42, a plurality of conductive path forming portions extending in the thickness direction, and these conductive path forming portions And the conductive particles are contained only in the conductive path forming part, whereby the conductive particles are dispersed unevenly in the surface direction, and the conductive path forming part is formed on both sides of the sheet. Any of the configurations in which the protrusion protrudes can be used.

  1 and 2, for convenience of explanation, the auxiliary anisotropic conductive sheet 222 includes a plurality of conductive path forming portions extending in the thickness direction and insulating portions that insulate these conductive path forming portions from each other. The conductive particles are contained only in the conductive path forming portion, whereby the conductive particles are non-uniformly dispersed in the surface direction, and the conductive path forming portions protrude on both sides of the sheet. Yes.

  With this configuration, as shown in FIG. 2, in the inspection apparatus 10, the electrode 2 and the electrode 3 of the circuit board 1 to be inspected are the first anisotropic conductive sheets 22a and 22b, the pitch conversion substrate. 23a, 23b, second anisotropic conductive sheets 26a, 26b, conductive pins 32a, 32b, third anisotropic conductive sheets 42a, 42b, and bases disposed on the outermost side via connector boards 43a, 43b By pressing the plates 46a and 46b with a specified pressure by a tester pressurizing mechanism, they are electrically connected to a tester (not shown), and electrical inspection such as electrical resistance measurement between electrodes of the circuit board 1 to be inspected Is performed (see arrow A and arrow B in FIG. 2).

  When the number of electrodes of one of the tester side connectors is insufficient by this auxiliary connection circuit unit 200, the test connection circuit units 56a and 56b are bypassed via the auxiliary connection circuit unit 200, and one tester side Electrical connection is made from the connector to the electrode of the other tester side connector (see arrow C in FIG. 2).

  That is, as shown in FIG. 2, for example, the number of electrodes to be inspected on one surface of the circuit board 1 to be inspected, in this embodiment, the number of electrodes (8000 points) of the upper inspected electrode 2 is 8,000. 1, the number of electrodes to be inspected on the other surface, in this embodiment, larger than the number of electrodes (6000 points) of the lower electrode to be inspected 3 (6000 points), Is also getting bigger.

  As a result, the number of tester side electrodes 44a of one tester side connector, in this embodiment, the tester side connector 41a of the first inspection jig 11a is insufficient (8000−6000 = 2000 points are insufficient).

In this case, the first auxiliary relay pin unit 231 disposed between the connector board 43a of the first inspection jig 11a and the connector board 43b of the second inspection jig 11b.
As shown by the arrow C in FIG. 2, the inspection connection circuit unit 56 a is passed through the auxiliary connection circuit unit 200 including a, the second auxiliary relay pin unit 231 b, and the auxiliary anisotropic conductive sheet 222. , 56b is bypassed.

That is, the first auxiliary relay pin unit 231a is connected from one tester side connector, in this embodiment, the tester side connector 41a of the first inspection jig 11a, so as to bypass the inspection connection circuit units 56a and 56b. Via the auxiliary anisotropic conductive sheet 222 and the second auxiliary relay pin unit 231b, the other tester side connector, in this embodiment, the tester side electrode 44a of the tester side connector 41b of the second inspection jig 11b is electrically connected. So that the circuit board to be inspected can be electrically inspected.

  In this embodiment, the case where the number of tester side electrodes 44a of one tester side connector, in this embodiment, the tester side connector 41a of the first inspection jig 11a is insufficient has been described. When the number of tester side electrodes 44b of the tester side connector 41b of the inspection jig 11b is insufficient, the inspection connection circuit unit 56a is connected via the auxiliary connection circuit unit 200 as shown by an arrow D in FIG. , 56b, and is electrically connected to the tester side electrode 44a of the tester side connector 41a of the first inspection jig 11a.

  FIG. 10 is a cross-sectional view for explaining another embodiment of the inspection apparatus of the present invention, and FIG. 11 is a cross-sectional view showing a laminated state when the inspection apparatus of FIG. 10 is used for inspection.

  The inspection apparatus 10 of this embodiment has basically the same configuration as that shown in FIG. 1, and the same reference numerals are given to the same components and the detailed description thereof is omitted.

  In the inspection apparatus 10 of this embodiment, as shown in FIGS. 10 and 11, the relay pin unit 31 is held between the first insulating plates 34a and 34b and the second insulating plates 35a and 35b. Plates 36a and 36b are arranged.

  The first support pins 33a and 33b are arranged between the first insulating plates 34a and 34b and the intermediate holding plates 36a and 36b, whereby the first insulating plates 34a and 34b and the intermediate holding plate are arranged. The space between 36a and 36b is fixed.

  Similarly, second support pins 37a and 37b are arranged between the second insulating plates 35a and 35b and the intermediate holding plates 36a and 36b, whereby the second insulating plates 35a and 35b and the intermediate holding plates are held intermediately. The space between the plates 36a and 36b is fixed.

  In this case, the material of the first support pin 33 and the second support pin 37 is not particularly limited, and is made of a metal such as brass or stainless steel, for example.

  Note that the distance L1 between the first insulating plate 34 and the intermediate holding plate 36 and the distance L2 between the second insulating plate 35 and the intermediate holding plate 36 are not particularly limited, As will be described later, if the elasticity of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 is taken into consideration, the height variation of the test electrodes 2 and 3 of the circuit board 1 to be inspected is taken into consideration. 2 mm or more, preferably 2.5 mm or more.

  Then, as shown in FIG. 11, the second contact between the first contact support position 38 </ b> A of the first support pin 33 with the intermediate holding plate 36 and the intermediate holding plate 36 of the second support pin 37. The contact support position 38B is disposed at a different position on the intermediate holding plate projection plane A where the inspection apparatus 10 is projected in the thickness direction of the intermediate holding plate (from the upper side to the lower side in FIG. 10).

  In this case, the different positions are not particularly limited, but the first abutting support position 38A and the second abutting support position 38B are, as shown in FIG. It is preferably formed on the lattice on A.

  Specifically, as shown in FIG. 12, on the intermediate holding plate projection surface A, one second region is formed in the unit cell region R1 including the group of four adjacent first contact support positions 38A. A contact support position 38B is disposed. Further, on the intermediate holding plate projection surface A, one first abutment support position 38A is arranged in a unit lattice region R2 composed of four adjacent second abutment support position groups 38B. Has been. In FIG. 12, the first contact support position 38A is indicated by a black circle, and the second contact support position group 38B is indicated by a white circle.

  In this case, in this embodiment, one second abutment support position 38B is arranged at the center of the diagonal line Q1 of the unit lattice region R1 of the first abutment support position 38A, and the second abutment support position 38A is arranged. One first abutment support position 38A is arranged at the center of the diagonal line Q2 of the unit lattice region R2 at the contact support position 38B. However, these relative positions are not particularly limited, and are arranged at different positions on the intermediate holding plate projection plane A obtained by projecting the inspection apparatus 10 in the thickness direction of the intermediate holding plate as described above. It only has to be. That is, when not arranged in a grid pattern, the relative holding position is not restricted, and the intermediate holding plate projection surface A is obtained by projecting the inspection apparatus 10 in the thickness direction of the intermediate holding plate as described above. What is necessary is just to arrange | position in a different position on the top.

  In this case, the separation distance between the first contact support positions 38A adjacent to each other and the separation distance between the second contact support positions 38B are not particularly limited, and are 10 to 100 mm. Is more preferably 12 to 70 mm, and particularly preferably 15 to 50 mm.

  As the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35, those having flexibility are used.

  The degree of flexibility required for the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 is as follows.

  When both end portions of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 are horizontally arranged in a state where they are supported at intervals of 10 cm, the bending caused by pressurizing with a pressure of 50 kgf from above. However, it is preferable that it is 0.02% or less of the width of these insulating plates and that destruction and permanent deformation do not occur even when pressure is applied from above at a pressure of 200 kgf.

Specifically, as the material of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35, an insulating material having a specific resistance of 1 × 10 ¹⁰ Ω · cm or more, such as a polyimide resin, a polyester resin, Polyamide resin, phenol resin, polyacetal resin, polybutylene terephthalate resin, polyethylene terephthalate resin, syndiotactic polystyrene resin, polyphenylene sulfide resin, polyether ethyl ketone resin, fluorine resin, polyether nitrile resin, polyether sulfone resin, Resin materials with high mechanical strength such as polyarylate resin and polyamideimide resin, glass fiber reinforced epoxy resin, glass fiber reinforced polyester resin, glass fiber reinforced polyimide resin, glass fiber reinforced phenol resin, glass fiber reinforced fluororesin etc Glass fiber composite resin material, carbon fiber reinforced epoxy resin, carbon fiber reinforced polyester resin, carbon fiber reinforced polyimide resin, carbon fiber reinforced phenol resin, carbon fiber reinforced fluororesin and other carbon fiber composite resins, epoxy A composite resin material in which an inorganic material such as silica, alumina, or boron nitride is filled in a resin, a phenol resin, or the like, or a composite resin material that contains a mesh in an epoxy resin, a phenol resin, or the like is used. Moreover, the composite board material etc. which were comprised by laminating | stacking two or more board | plate materials which consist of these materials can also be used.

  The thickness of each of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 depends on the type of material constituting the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35. For example, it is preferably 1 to 10 mm.

  Specifically, the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 are made of glass fiber reinforced epoxy resin and have a thickness of 2 to 5 mm.

  In the inspection apparatus 10 configured as described above, as shown in FIG. 11, the electrode 2 and the electrode 3 of the circuit board 1 to be inspected are the first anisotropic conductive sheets 22a and 22b, the pitch conversion substrate 23a, 23b, the second anisotropic conductive sheets 26a and 26b, the conductive pins 32a and 32b, the third anisotropic conductive sheets 42a and 42b, and the base plate 46a disposed on the outermost side through the connector boards 43a and 43b. , 46b are pressed to a tester (not shown) by pressing with a pressurizing mechanism of the tester, and an electrical test such as an electrical resistance measurement between the electrodes of the circuit board 1 to be tested is performed.

  The pressure pressed from the upper and lower first inspection jigs 11a and the second inspection jig 11b with respect to the substrate to be inspected at the time of measurement is, for example, 100 to 250 kgf.

  In this case, as shown in FIG. 15, when the electrical inspection is performed by sandwiching both surfaces of the circuit board 1 to be inspected between the first inspection jig 11a and the second inspection jig 11b. In the initial stage of pressurization, the conductive pin 32 of the relay pin unit 31 is compressed, the first anisotropic conductive sheet 22, the second anisotropic conductive sheet 26, and the third anisotropic conductive sheet. The pressure is absorbed by the rubber elastic compression 42, and the height variation of the inspected electrode of the inspected circuit board 1 can be absorbed to some extent.

The first abutment support position of the first support pin with the intermediate holding plate and the second abutment support position of the second support pin with the intermediate holding plate are the thickness of the intermediate holding plate. Since the intermediate holding plate projection surface projected in the direction is arranged at different positions, as shown by the arrows in FIG. 16, a force acts in the vertical direction, as shown in FIG. 1st inspection jig 11a and 2nd

When the circuit board 1 to be inspected is further pressed between the inspection jigs 11b, the first anisotropic conductive sheet 22, the second anisotropic conductive sheet 26, and the third different In addition to the rubber elastic compression of the directionally conductive sheet 42, the first insulating plate 34, the second insulating plate 35, and the first insulating plate 34 and the second insulating plate 35 of the relay pin unit 31 are provided. Due to the spring elasticity of the arranged intermediate holding plate 36, the pressure concentration is dispersed with respect to the variation in the height of the electrode to be inspected of the circuit board 1 to be inspected, for example, the variation in the height of the solder ball electrode. Concentration can be avoided.

  That is, as shown in FIGS. 16 and 17, the intermediate holding plate 36 is the second insulating plate 35 around the first contact support position 38 </ b> A with the intermediate holding plate 36 of the first support pin 33. (Refer to a portion E surrounded by a one-dot chain line in FIG. 17), and the intermediate holding plate 36 is centered on the second contact support position 38 </ b> B with the intermediate holding plate 36 of the second support pin 37. Then, it bends in the direction of the first insulating plate 34 (see the portion D surrounded by the one-dot chain line in FIG. 17). In the following description, the terms “bend” and “bend direction” refer to the bend so that the intermediate holding plate 36 protrudes in the convex direction and the protruding direction.

  As described above, the intermediate holding plate 36 bends in the opposite directions around the first contact support position 38A and the second contact support position 38B, so that the first inspection jig 11a and the second inspection jig 11a When the circuit board 1 to be inspected is further pressed between the inspection jigs 11b, the spring elastic force of the intermediate holding plate 36 is further exhibited.

  Further, as shown by a portion B surrounded by a one-dot chain line in FIG. 17, the height of the conductive pin 32b is absorbed by the compression of the protruding portion of the conductive path forming portion of the second anisotropic conductive sheet 26. The pressure that cannot be absorbed by the compression of the protrusion is applied to the first insulating plate 34b.

  Accordingly, as shown by the portion C surrounded by the alternate long and short dash line in FIG. 17, the first insulating plate 34 and the second insulating plate 35 also have the first support pin 33 and the second support plate to some extent. Since it bends in the opposite direction at the contact position with the pin 37, the circuit board 1 to be inspected is further pressurized between the first inspection jig 11a and the second inspection jig 11b. At this time, the spring elastic force of the first insulating plate 34 and the second insulating plate 35 is further exhibited.

  As a result, stable electrical contact is ensured for each of the electrodes to be inspected of the circuit board 1 to be inspected having a height variation, and stress concentration is reduced, so that the anisotropic conductive sheet is localized. Damage is suppressed. As a result, since the repeated use durability of the anisotropic conductive sheet is improved, the number of times the anisotropic conductive sheet is replaced is reduced, and the inspection work efficiency is improved.

  Also in this embodiment, as shown in FIG. 10, an inspection connection circuit unit is provided between the connector board 43a of the first inspection jig 11a and the connector board 43b of the second inspection jig 11b. Apart from 56a and 56b, an auxiliary connection circuit unit 200 is provided.

The auxiliary connection circuit unit 200 includes a first auxiliary relay pin unit 231a. The first auxiliary relay pin unit 231a includes a plurality of conductive pins 232a arranged at a predetermined pitch and the conductive pins 232a. And a pair of spaced apart insulating plates 234a.

  The auxiliary connection circuit unit 200 includes a second auxiliary relay pin unit 231b. The second auxiliary relay pin unit 231b includes a plurality of conductive pins 232b arranged at a predetermined pitch and the conductive pins. It comprises a pair of spaced apart insulating plates 234b that support 232b.

  Further, the auxiliary connection circuit unit 200 includes an auxiliary anisotropic conductive sheet 222 that electrically connects the first auxiliary relay pin unit 231a and the second auxiliary relay pin unit 231b to each other.

In this case, the first auxiliary relay pin unit 231a and the second auxiliary relay pin unit 231
“b” has the same configuration as that of the relay pin unit 31 and can be made of the same material.

That is, the first auxiliary relay pin unit 231a and the second auxiliary relay pin unit 231
b, like the relay pin unit 31 shown in FIGS. 10 and 11, intermediate holding plates 236a and 236b are arranged between the first insulating plates 234a and 234b and the second insulating plates 235a and 235b. ing.

  The first support pins 233a and 233b are disposed between the first insulating plates 234a and 234b and the intermediate holding plates 236a and 236b, whereby the first insulating plates 234a and 234b and the intermediate holding plate are disposed. 236a and 236b are fixed.

  Similarly, second support pins 237a and 237b are disposed between the second insulating plates 235a and 235b and the intermediate holding plates 236a and 236b, whereby the second insulating plates 235a and 235b and the intermediate holding plates are intermediately held. The space between the plates 236a and 236b is fixed.

  As in the relay pin unit 31 shown in FIG. 11, the first contact support position 238A of the first support pin 233 with the intermediate holding plate 236, the intermediate holding plate 236 of the second support pin 237, and The second abutting support position 238B is arranged at a different position on the intermediate holding plate projection surface A obtained by projecting the inspection apparatus 10 in the thickness direction of the intermediate holding plate (from the upper side to the lower side in FIG. 10). ing.

  With this configuration, pressure is applied when electrical inspection is performed by clamping both surfaces of the circuit board 1 to be inspected between the first inspection jig 11a and the second inspection jig 11b. In the initial stage, the impact force can be absorbed to some extent by the movement of the relay pin unit 231 in the thickness direction by the conductive pins 232 and the auxiliary anisotropic conductive sheet 222.

  A first abutment support position 238A of the first support pin 233 with respect to the intermediate holding plate 236 and a second abutment support position 238B of the second support pin 237 with respect to the intermediate holding plate 236 are the intermediate holding plate. The intermediate holding plate projection surface projected in the thickness direction 236 is arranged at a different position.

  Therefore, when the circuit board 1 to be inspected is further pressed between the first inspection jig 11a and the second inspection jig 11b, in addition to the rubber elastic compression of the auxiliary anisotropic conductive sheet 222 Due to the spring elasticity of the first insulating plate 234, the second insulating plate 235, and the intermediate holding plate 236 disposed between the first insulating plate 234 and the second insulating plate 235 of the relay pin unit 231. The pressure concentration can be distributed to avoid local stress concentration.

  As a result, stable electrical contact is ensured and stress concentration is further reduced, so that local breakage of the auxiliary anisotropic conductive sheet 222 is suppressed. As a result, the durability of repeated use of the auxiliary anisotropic conductive sheet is improved, so that the number of replacements of the auxiliary anisotropic conductive sheet 222 is reduced and the inspection work efficiency is improved.

  With this configuration, as shown in FIG. 11, in the inspection apparatus 10, the electrodes 2 and 3 of the circuit board 1 to be inspected are the first anisotropic conductive sheets 22 a and 22 b and the pitch conversion substrate. 23a, 23b, second anisotropic conductive sheets 26a, 26b, conductive pins 32a, 32b, third anisotropic conductive sheets 42a, 42b, and bases disposed on the outermost side via connector boards 43a, 43b By pressing the plates 46a and 46b with a specified pressure by a tester pressurizing mechanism, they are electrically connected to a tester (not shown), and electrical inspection such as electrical resistance measurement between electrodes of the circuit board 1 to be inspected is performed. Is performed (see arrow A and arrow B in FIG. 11).

  When the number of electrodes of one of the tester side connectors is insufficient by this auxiliary connection circuit unit 200, the test connection circuit units 56a and 56b are bypassed via the auxiliary connection circuit unit 200, and one tester side Electrical connection is made from the connector to the electrode of the other tester side connector (see arrow C in FIG. 2).

  That is, as shown in FIG. 11, for example, the number of electrodes to be inspected on one surface of the circuit board 1 to be inspected, in this embodiment, the number of electrodes (8000 points) of the upper inspected electrode 2 is 8,000. 1, the number of electrodes to be inspected on the other surface, in this embodiment, larger than the number of electrodes (6000 points) of the lower electrode 3 to be inspected, and from the predetermined number of inspectable electrodes (6000 points) of the tester side connector Is also getting bigger.

  As a result, the number of tester side electrodes 44a of one tester side connector, in this embodiment, the tester side connector 41a of the first inspection jig 11a is insufficient (8000−6000 = 2000 points are insufficient).

In this case, the first auxiliary relay pin unit 231 disposed between the connector board 43a of the first inspection jig 11a and the connector board 43b of the second inspection jig 11b.
As shown by the arrow C in FIG. 11, the inspection connection circuit unit 56a is passed through the auxiliary connection circuit unit 200 including a, the second auxiliary relay pin unit 231b, and the auxiliary anisotropic conductive sheet 222. , 56b is bypassed.

That is, the first auxiliary relay pin unit 231a is connected from one tester side connector, in this embodiment, the tester side connector 41a of the first inspection jig 11a, so as to bypass the inspection connection circuit units 56a and 56b. Via the auxiliary anisotropic conductive sheet 222 and the second auxiliary relay pin unit 231b, the other tester side connector, in this embodiment, the tester side electrode 44a of the tester side connector 41b of the second inspection jig 11b is electrically connected. So that the circuit board to be inspected can be electrically inspected.

  In this embodiment, the case where the number of tester side electrodes 44a of one tester side connector, in this embodiment, the tester side connector 41a of the first inspection jig 11a is insufficient has been described. When the number of tester side electrodes 44b of the tester side connector 41b of the inspection jig 11b is insufficient, the connection circuit unit for inspection 56a is connected via the auxiliary connection circuit unit 200 as shown by an arrow D in FIG. , 56b, and is electrically connected to the tester side electrode 44a of the tester side connector 41a of the first inspection jig 11a.

  18 is a cross-sectional view similar to FIG. 10 for explaining another embodiment of the inspection apparatus of the present invention, and FIG. 19 is an enlarged cross-sectional view of the relay pin unit.

  The inspection apparatus 10 of this embodiment has basically the same configuration as the inspection apparatus shown in FIG. 10, and the same reference numerals are assigned to the same components.

  In the inspection apparatus 10 of this embodiment, as shown in FIGS. 18 and 19, a plurality (three in this embodiment) of intermediate holdings are provided between the first insulating plate 34 and the second insulating plate 35. The plates 36 are arranged at a predetermined interval, and holding plate support pins 39 are arranged between the adjacent intermediate holding plates 36.

  In this case, the contact support position 39A of the holding plate support pin 39 with the intermediate holding plate 36 is located between the adjacent intermediate holding plates 36, and the contact support position 39A is located at a different position on the intermediate holding plate projection plane A. It is desirable that

  Further, although not shown, the first contact support position 38A of the first support pin 33 with the intermediate holding plate 36 and the second second contact of the intermediate support plate 36 of the second support pin 37 with each other. It is desirable that the support position 38B and the contact support position 39A of the holding plate support pin 39 with the intermediate holding plate 36 are arranged at different positions on the intermediate holding plate projection plane A.

  In this case, although not described in detail, the “different position” refers to the first contact support position 38A of the first support pin 33 with the intermediate holding plate 36 and the second support as in the above-described embodiment. An arrangement similar to the relative positional relationship described in relation to the relationship between the pin 37 and the intermediate holding plate 36 and the second contact support position 38B is possible.

  With this configuration, the spring elasticity is further exhibited by the plurality of intermediate holding plates 36, and the pressure concentration is distributed with respect to the height variation of the electrodes to be inspected of the circuit board 1 to be inspected. Therefore, local stress concentration can be further avoided, local damage of the anisotropic conductive sheet is suppressed, and as a result, the repeated use durability of the anisotropic conductive sheet is improved. The number of times of replacing the conductive sheet is reduced, and the inspection work efficiency is improved.

  In this case, the number of intermediate holding plates 36 may be plural, and is not particularly limited.

Although not shown, the first auxiliary relay pin unit 23 of the auxiliary connection circuit unit 200 is also shown.
Similarly to the relay pin unit 31 shown in FIGS. 18 and 19, a plurality of the second auxiliary relay pin units 231b and the second auxiliary relay pin units 231b are provided between the first insulating plate 234 and the second insulating plate 235 (this embodiment). In this case, three intermediate holding plates 236 are arranged at a predetermined interval, and holding plate support pins 139 are arranged between the adjacent intermediate holding plates 236.

  20 is a cross-sectional view similar to FIG. 1 for explaining another embodiment of the inspection apparatus of the present invention, and FIG. 21 is a cross-sectional view similar to FIG. 2 showing a stacked state when the inspection apparatus of FIG. 20 is used for inspection. 22 is a partially enlarged view of the inside of the auxiliary relay board body 302, and FIG. 23 is a partially enlarged view showing an example of a connection state between the base end portion of the conductive pin of the auxiliary relay board body and the wiring.

  The inspection apparatus 10 of this embodiment has basically the same configuration as the inspection apparatus shown in FIG. 1, and the same reference numerals are assigned to the same components.

  In the inspection apparatus 10 of this embodiment, the inspection connection circuit units 56a and 56b are bypassed between the connector substrate 43a of the first inspection jig 11a and the connector substrate 43b of the second inspection jig 11b. The auxiliary connection circuit unit 200 is provided for electrical connection from one tester side connector to the electrode of the tester connected to the other tester side connector.

  That is, in the inspection apparatus 10 of this embodiment, as in the embodiment of FIG. 1, the second portion between the connector board 43a of the first inspection jig 11a and the connector board 43b of the second inspection jig 11b. Instead of the second auxiliary relay pin unit 231b arranged on the connector board 43b side of the inspection jig 11b, the second auxiliary relay board device 300b is arranged on the connector board 43b side of the second inspection jig 11b. ing.

  As shown in FIGS. 20 and 21, the second auxiliary relay board device 300 b includes an auxiliary relay board body 302 b. Further, an urging device 304b for urging the auxiliary relay substrate 302b toward the first auxiliary relay pin unit is provided.

  That is, the urging device 304b is interposed between the lower frame 306b, a plurality of slide guide members 308b erected on the lower frame 306b, and the auxiliary relay board 302b and the lower frame 306b. For example, it is comprised from the elastic member 310b which consists of a coil spring. Accordingly, the auxiliary relay substrate body 302b is guided along the slide guide member 308b and biased toward the first auxiliary relay pin unit 231a by the biasing force of the elastic member 310b.

  The elastic member 310b is not particularly limited as long as it urges the auxiliary relay substrate 302b toward the first auxiliary relay pin unit 231a as described above, and is not limited to a coil spring. In addition, a disc spring, elastic rubber, or the like can be appropriately changed.

  Although not shown, the slide guide member 308b is provided with a stopper member so as not to move upward beyond the upper limit position of the auxiliary relay board body 302b.

  Further, as shown in FIG. 22, the auxiliary relay substrate 302b includes an insulating substrate 312b and a base insulating substrate 314b therein, and planting holes formed in these insulating substrates 312b and 314b. Conductive pins 320b constituting conductive portions are implanted in 316b and 318b.

  In addition, a retaining flange 322b is formed at an intermediate portion of the conductive pin 320b. The retaining flange 322b is fitted into a retaining hole 324b formed in the insulating substrate 312b, and the conductive pin 320b falls off. Is to be prevented.

  In this case, the number and arrangement positions of the conductive pins 320b are arranged to be the same as the number and arrangement positions of the conductive pins 232a of the first auxiliary relay pin unit 231a.

  The material of the conductive pin 320b is not particularly limited as long as it has conductivity. However, it is desirable that the conductive pin 320b be made of the same material as that of the conductive pin 232a of the first auxiliary relay pin unit 231a. .

  The base end portion 326b of the conductive pin 320b is electrically connected to an electrode of a tester (not shown) connected to the second tester side connector 41b via the connection wiring 328b.

  Note that the connection wiring 328b is not particularly limited, and for example, an enameled wire whose surface is covered with an insulating member can be used.

  In addition, for example, as shown in FIG. 23, the base end portion 326b of the conductive pin 320b and the connection wiring 328b are connected to the inside of the connection opening 330b of the base end portion 326b of the conductive pin 320b. What is necessary is just to make it fix electrically by carrying out crimping (crushing) 332b in the state in which the one end part of the connection wiring 328b was inserted. However, the method of connecting the base end portion 326b of the conductive pin 320b and the connection wiring 328b is not limited to such a fixing method by caulking, and other connection methods such as welding can be adopted. It is not limited.

  With this configuration, the number of electrodes to be inspected on one surface of the circuit board to be inspected is larger than the number of electrodes to be inspected on the other surface of the circuit board to be inspected, and the predetermined number of the tester side connector is set. Even if the number of electrodes of one tester side connector is insufficient, the auxiliary relay pin unit arranged on the connector board side of one inspection jig and the other inspection jig Via the auxiliary connection circuit unit provided with the auxiliary relay board device arranged on the connector board side and the auxiliary anisotropic conductive sheet, the test connection circuit unit is detoured from one tester side connector to the other. It can be electrically connected to the electrode of the tester connected to the tester side connector, and the electrical inspection of the circuit board to be inspected can be carried out with high reliability.

  That is, according to the inspection apparatus 10 of this embodiment, the number of electrodes to be inspected on one surface of the circuit board to be inspected is larger than the number of electrodes to be inspected on the other surface of the circuit board to be inspected. Even when the number of electrodes of the first tester side connector 41a is larger than the predetermined number of testable electrodes of the tester side connector and the number of electrodes of the first tester side connector 41a is insufficient, the connection circuit units for inspection 56a, 56b are By detouring, the first tester side connector 41a can be electrically connected to the electrode of the tester connected to the second tester side connector 41b.

  That is, as shown by an arrow C in FIG. 21, the first auxiliary relay pin unit 231a, the auxiliary anisotropic conductive sheet 222, the second inspection arranged on the connector board side 43a of the first inspection jig 11a. Via the second auxiliary relay board device 300b arranged on the connector board 43b side of the jig 11b, the test circuit circuit units 56a and 56b are bypassed, and the second tester is connected from the first tester side connector 41a. It can be electrically connected to an electrode of a tester (not shown) connected to the side connector 41b, and the electrical inspection of the circuit board 1 to be inspected can be performed with high reliability.

  In addition, although the size and thickness differ depending on the type of circuit board 1 to be inspected, as described above, the first auxiliary relay pin unit 231a and the second auxiliary auxiliary unit 231a as in the embodiment shown in FIG. In the auxiliary connection circuit unit 200 including the relay pin unit 231b and the auxiliary anisotropic conductive sheet 222, when the type of the circuit board 1 to be inspected is changed, the thickness of the auxiliary anisotropic conductive sheet 222 is increased. The changed ones must be prepared and replaced for each type of circuit board 1 to be inspected, the cost is high, the inspection work is complicated, the continuous electrical inspection cannot be performed, and the inspection efficiency decreases. become.

  Further, when the type of the circuit board 1 to be inspected is changed and the thickness of the circuit board to be inspected greatly changes, the size of the first auxiliary relay pin unit 231a and the second auxiliary relay pin unit 231b itself is also increased. It must be used by replacing it with a changed one, and the cost becomes high, the inspection work is complicated, the continuous electric inspection cannot be performed, and the inspection efficiency is lowered.

  However, as described above, the auxiliary relay board body provided with a plurality of conductive portions is attached to the auxiliary relay pin unit side by the biasing device of the auxiliary relay board device arranged on the connector board side of the other inspection jig. Even if the type of circuit board to be inspected is changed and the thickness of the circuit board to be inspected is changed, the urging force of this urging device absorbs the change in thickness, and the auxiliary connection circuit unit Can be ensured.

  That is, according to the inspection apparatus 10 of this embodiment, as described above, a plurality of urging devices 304b of the second auxiliary relay board apparatus 300b disposed on the connector board 43b side of the second inspection jig 11b are used. Since the auxiliary relay board body 302b provided with the conductive pins 320b which are the conductive parts of the circuit board is biased toward the first auxiliary relay pin unit 231a, the type of the circuit board 1 to be inspected is changed, and the circuit board to be inspected is changed. Even if the thickness of the auxiliary connection circuit unit 200 changes, the biasing force of the biasing device 304b can absorb the change in thickness and ensure electrical connection of the auxiliary connection circuit unit 200.

  24 is a cross-sectional view similar to FIG. 1 for explaining another embodiment of the inspection apparatus of the present invention, and FIG. 25 is a cross-sectional view similar to FIG. 2 showing a stacked state when the inspection apparatus of FIG. 24 is used for inspection. FIG.

  The inspection apparatus 10 of this embodiment has basically the same configuration as the inspection apparatus shown in FIG. 20, and the same reference numerals are assigned to the same components.

  Also in the inspection apparatus 10 of this embodiment, the inspection connection circuit units 56a and 56b are bypassed between the connector board 43a of the first inspection jig 11a and the connector board 43b of the second inspection jig 11b. The auxiliary connection circuit unit 200 is provided for electrical connection from one tester side connector to the electrode of the tester connected to the other tester side connector.

  That is, in the inspection apparatus 10 of this embodiment, as in the embodiment of FIG. 1, the first inspection jig 11a is connected between the connector board 43a of the first inspection jig 11a and the connector board 43b of the second inspection jig 11b. 20 instead of the first auxiliary relay pin unit 231a disposed on the connector board 43a side of the inspection jig 11a, the second auxiliary of the embodiment of FIG. 20 is provided on the connector board 43a side of the first inspection jig 11a. A first auxiliary relay board device 300a having the same configuration as that of the relay board device 300b is arranged.

  According to the inspection apparatus 10 of this embodiment, the number of electrodes to be inspected on one surface of the circuit board to be inspected is larger than the number of electrodes to be inspected on the other surface of the circuit board to be inspected. Even when the number of electrodes of the connector that is larger than the predetermined testable electrode and the number of electrodes of the second tester side connector 41b is insufficient, the test connection circuit units 56a and 56b are bypassed via the auxiliary connection circuit unit 200. Thus, the second tester side connector 41b can be electrically connected to the electrode of the tester connected to the first tester side connector 41a.

  That is, as shown by an arrow D in FIG. 25, the second auxiliary relay pin unit 231b, the auxiliary anisotropic conductive sheet 222, the first inspection arranged on the connector board side 43b of the second inspection jig 11b. Via the first auxiliary relay board device 300a arranged on the connector board 43a side of the jig 11a, the first tester is bypassed from the second tester side connector 41b by bypassing the inspection connection circuit units 56a and 56b. It can be electrically connected to an electrode of a tester (not shown) connected to the side connector 41a, so that the electrical inspection of the circuit board 1 to be inspected can be performed with high reliability.

  Further, according to the inspection apparatus 10 of this embodiment, as described above, a plurality of urging devices 304a of the first auxiliary relay board apparatus 300a arranged on the connector board 43a side of the first inspection jig 11a are used. Since the auxiliary relay board body 302a having the conductive pins 320a which are the conductive portions of the second auxiliary relay pin unit 231b is urged, the type of the circuit board 1 to be inspected is changed, and the circuit board to be inspected is changed. Even if the thickness of the auxiliary connection circuit unit 200 changes, the biasing force of the biasing device 304a can absorb the change in the thickness and ensure the electrical connection of the auxiliary connection circuit unit 200.

  20 and FIG. 24, the first auxiliary relay pin unit 231a and the second auxiliary relay pin unit 231b in the embodiment shown in FIGS. 20 and 24 are the first insulating plates 234a and 234b as described in FIGS. The intermediate holding plates 236a and 236b are disposed between the second insulating plates 235a and 235b, and the first support pins 233a and 233b and the second support pins 237a and 237b are disposed between the insulating plates. As such a configuration, it is of course possible to avoid the local stress concentration by distributing the pressure concentration by the spring elasticity of the intermediate holding plate 236.

  For example, FIG. 26 shows a configuration in which the first auxiliary relay pin unit 231a is changed to the first auxiliary relay pin unit 231a of the embodiment shown in FIG. 10 in the inspection apparatus 10 of the embodiment of FIG. 24 shows a configuration in which the second auxiliary relay pin unit 231b is replaced with the second auxiliary relay pin unit 231b of the embodiment shown in FIG. 10 in the inspection apparatus 10 of the embodiment of FIG.

  20 and 24, the auxiliary relay substrate 302 has been described using the conductive pin 320 as the conductive portion, but other than the conductive pin 320, for example, Pogo Pin (registered trademark). It is also possible to use a conductive part such as a spring pin probe.

  FIG. 28 is a cross-sectional view similar to FIG. 1 for explaining another embodiment of the inspection apparatus of the present invention.

  The inspection apparatus 10 of this embodiment has basically the same configuration as the inspection apparatus shown in FIG. 20, and the same reference numerals are assigned to the same components.

  In the inspection apparatus 10 of this embodiment, the second auxiliary relay board apparatus 300b has a pair of similar configurations to the first auxiliary relay board body 302b instead of the lower frame body 306b of the embodiment of FIG. In addition, another auxiliary relay board body 340b that is separated from the auxiliary relay board body 302b is provided. The second auxiliary relay substrate 340b is also provided with conductive pins 320b constituting a conductive portion.

  A biasing device 304b that biases the pair of auxiliary relay substrate bodies 302b and 340b in a direction away from each other is provided.

  Furthermore, a connection wiring 342b for electrically connecting the base end portions of the conductive pins 320b, which are conductive portions of the pair of auxiliary relay substrate bodies 302b and 340b, is provided.

  With this configuration, the number of electrodes to be inspected on one surface of the circuit board to be inspected is larger than the number of electrodes to be inspected on the other surface of the circuit board to be inspected, and the predetermined number of the tester side connector is set. When the number of electrodes of one tester side connector is insufficient, the first auxiliary relay pin unit 231a disposed on the connector substrate side 43a of the first inspection jig 11a Connection for inspection through the auxiliary connection circuit unit 200 including the second auxiliary relay board device 300b arranged on the connector board 43b side of the second inspection jig 11b and the auxiliary anisotropic conductive sheet 222 By bypassing the circuit units 56a and 56b, electrical connection can be made from one tester side connector to the electrode of the other tester side connector. The electrical inspection of the circuit board can be performed with high reliability (similar to the route indicated by the arrows A to D in FIG. 2).

  In addition, as described above, the pair of auxiliary relay board bodies 302b and 340b of the second auxiliary relay board device 300b arranged on the connector board 43b side of the second inspection jig 11b are biased in a direction away from each other. By the biasing device 304b, the pair of auxiliary relay board bodies 302b and 340b having the conductive pins 320b as the conductive portions are connected to the first auxiliary relay pin unit 231a side and the electrode side of the second tester side connector 41b. Therefore, even if the type of the circuit board to be inspected is changed and the thickness of the circuit board to be inspected is changed, the biasing force of the urging device 304b absorbs the change in the thickness and assists. The electrical continuity of the connection circuit unit can be ensured.

  FIG. 29 is a cross-sectional view similar to FIG. 1 for explaining another embodiment of the inspection apparatus of the present invention.

  The inspection apparatus 10 of this embodiment has basically the same configuration as the inspection apparatus shown in FIG. 24, and the same reference numerals are assigned to the same components.

  In the inspection apparatus 10 of this embodiment, the first auxiliary relay board device 300a has a pair of similar configurations to the first auxiliary relay board body 302a instead of the lower frame body 306a of the embodiment of FIG. In addition, another auxiliary relay board body 340a that is separated from the auxiliary relay board body 302a is provided. The second auxiliary relay substrate 340a is also provided with conductive pins 320a constituting a conductive portion.

  The pair of auxiliary relay board bodies 302a and 340a are provided with a biasing device 304a that biases them in a direction away from each other.

  Furthermore, a connection wiring 342a for electrically connecting the base end portions of the conductive pins 320a, which are conductive portions of the pair of auxiliary relay substrate bodies 302a and 340a, is provided.

  With this configuration, the number of electrodes to be inspected on one surface of the circuit board to be inspected is larger than the number of electrodes to be inspected on the other surface of the circuit board to be inspected, and the predetermined number of the tester side connector is set. When the number of electrodes of one tester side connector is insufficient, the second auxiliary relay pin unit 231b disposed on the connector board side 43b of the second inspection jig 11b Connection for inspection through the auxiliary connection circuit unit 200 including the first auxiliary relay board device 300a disposed on the connector board 43a side of the first inspection jig 11a and the auxiliary anisotropic conductive sheet 222 By bypassing the circuit units 56a and 56b, electrical connection can be made from one tester side connector to the electrode of the other tester side connector. Electrical inspection of the circuit board, it is possible reliable to implement high (similar to the root of the arrow A~D in Figure 2).

  In addition, as described above, the pair of auxiliary relay board bodies 302a and 340a of the first auxiliary relay board device 300a disposed on the connector board 43a side of the first inspection jig 11a is biased in a direction away from each other. By the biasing device 304a, the pair of auxiliary relay board bodies 302a and 340a having the conductive pins 320a as the conductive portions are connected to the second auxiliary relay pin unit 231b side and the electrode side of the first tester side connector 41a. Therefore, even if the type of the circuit board to be inspected is changed and the thickness of the circuit board to be inspected is changed, the urging force of the urging device 304a absorbs the change in the thickness and assists. The electrical continuity of the connection circuit unit can be ensured.

  30 is a cross-sectional view similar to FIG. 1 for explaining another embodiment of the inspection apparatus of the present invention.

  The inspection apparatus 10 of this embodiment has basically the same configuration as the inspection apparatus shown in FIGS. 20 and 24, and the same reference numerals are assigned to the same components.

  The inspection apparatus 10 of this embodiment has a configuration including a first auxiliary relay board device 300a in FIG. 24 and a second auxiliary relay board device 300b in FIG.

  With this configuration, the number of electrodes to be inspected on one surface of the circuit board to be inspected is larger than the number of electrodes to be inspected on the other surface of the circuit board to be inspected, and the predetermined number of the tester side connector is set. The first auxiliary relay board device 300a disposed on the connector board side 43a of the first inspection jig 11a even when the number of electrodes of one of the tester side connectors is insufficient. Connection for inspection through the auxiliary connection circuit unit 200 including the second auxiliary relay board device 300b arranged on the connector board 43b side of the second inspection jig 11b and the auxiliary anisotropic conductive sheet 222 By bypassing the circuit units 56a and 56b, electrical connection can be made from one tester side connector to the electrode of the other tester side connector. Electrical inspection of the substrate, it is possible reliable to implement high (similar to the root of the arrow A~D in Figure 2).

In addition, as described above, the pair of auxiliary relay board bodies 302a and 340a of the first auxiliary relay board device 300a arranged on the connector board side 43a of the first inspection jig 11a are biased in a direction away from each other. The biasing device 304a biases the pair of auxiliary relay board bodies 302a and 340a having a plurality of conductive portions toward the second auxiliary relay pin unit 231b side and the electrode side of the first tester side connector 41a. As well as
By a biasing device 304b that biases the pair of auxiliary relay board bodies 302b and 340b of the second auxiliary relay board device 300b disposed on the connector board 43b side of the second inspection jig 11b in a direction away from each other, Since the pair of auxiliary relay board bodies 302b and 340b having the conductive pins 320b as the conductive portions are biased toward the first auxiliary relay pin unit 231a side and the electrode side of the second tester side connector 41b. Even if the type of the circuit board to be inspected is changed and the thickness of the circuit board to be inspected is changed, the biasing force of this biasing device absorbs the change in thickness and the electrical connection of the auxiliary connection circuit unit Can be secured.

  28 and 29, the first auxiliary relay pin unit 231a and the second auxiliary relay pin unit 231b of the embodiment shown in FIGS. 28 and 29 are also used as the first insulating plates 234a and 234b as described in FIGS. The intermediate holding plates 236a and 236b are disposed between the second insulating plates 235a and 235b, and the first support pins 233a and 233b and the second support pins 237a and 237b are disposed between the insulating plates. As such a configuration, it is of course possible to avoid the local stress concentration by distributing the pressure concentration by the spring elasticity of the intermediate holding plate 236.

  For example, FIG. 31 shows a configuration in which the first auxiliary relay pin unit 231a is replaced with the first auxiliary relay pin unit 231a of the embodiment shown in FIG. 24 shows a configuration in which the second auxiliary relay pin unit 231b is replaced with the second auxiliary relay pin unit 231b of the embodiment shown in FIG. 10 in the inspection apparatus 10 of the embodiment of FIG.

  As mentioned above, although embodiment of this invention was described, this invention is not limited to these embodiment, A various deformation | transformation, change, and correction are possible in the range which does not deviate from the summary.

  For example, the circuit board 1 to be inspected may be a semiconductor integrated circuit device such as a package IC, MCM, or CSP, or a circuit device formed on a wafer, in addition to a printed circuit board. Further, the printed circuit board may be a single-sided printed circuit board as well as a double-sided printed circuit board.

  The first inspection jig 11a and the second inspection jig are not necessarily the same in the materials used, the member structure, etc., and they may be different. In the above-described embodiment, the first inspection jig 11a and the second inspection jig 11b are arranged above and below, but it is also possible to adopt a horizontal placement type arranged in a so-called lateral direction.

  The tester-side connector may be configured by laminating a plurality of circuit boards such as connector boards and anisotropic conductive sheets.

  Further, in the above embodiment, the first anisotropic conductive sheet 22 is an anisotropic conductive sheet in which the conductive particles are arranged in the thickness direction and uniformly dispersed in the plane direction, and the second anisotropic conductive sheet is used. The sheet 26 and the third anisotropic conductive sheet 42 are composed of a plurality of conductive path forming parts extending in the thickness direction and insulating parts that insulate these conductive path forming parts from each other, and the conductive particles form the conductive path forming parts. It is contained only in this, so that the conductive particles are dispersed non-uniformly in the plane direction and the conductive path forming part protrudes on one side of the sheet, but this combination is particularly limited It is not a thing.

  Further, as shown in FIGS. 10, 11, 14, 15, 17, and 19, support pins 49 may be arranged between the connector board 43 and the base plate 46 in the tester side connector 41. Good. These support pins 49 have the same effects as those provided by the first support pin 33 and the second support pin 37 (the first support pin 33, the second support pin 37, and the holding plate support pin 39 in FIG. 16). It is also possible to give an effect of dispersing the surface pressure.

  In order to provide this surface pressure dispersion action, the position of the support pin 49 and the position of the second support pin 37 are different from each other in the surface direction (that is, the position of the support pin 49a and the second support pin 37a). And the positions of the support pins 49b and the second support pins 37b are preferably arranged so that they are shifted from each other in the surface direction.

  According to the inspection apparatus of the present invention configured as described above, the minimum press pressure is lower and the anisotropic conductivity is lower than that of the conventional inspection apparatus. The durability of the seat has also been greatly improved.

  Compared with the conventional inspection apparatus, according to the inspection apparatus of the present invention, the voltage can be measured while supplying the current to the circuit of the circuit board to be inspected through the dedicated current terminal, so that it is low. Since it is possible to stably determine whether the conduction resistance at the set voltage is stable, it is possible to accurately perform the electrical characteristic test of the circuit board to be inspected.

  In other words, in the case of four-terminal inspection, if the set voltage for pass / fail judgment is lowered, a circuit board having a potential defect can be detected. On the other hand, if the set voltage is lowered, a current is supplied and the inspection is performed, so that a substrate with a larger defect can be detected.

  On the other hand, in the case of two-terminal inspection, for example, if the set voltage is about 100Ω, the pass / fail judgment can be made to the same degree as the four-terminal inspection, but if the set voltage is lowered, the measurement result is not stable, The reproducibility will be lost. That is, it becomes difficult to detect a circuit board having a minute electrical defect.

  Conventionally, there is a burn-in test (accelerated test) as a method of detecting a circuit board (a board that is used as a product and becomes a defective product in a short period of time) having a small potential defect with high accuracy. In addition, the 4-terminal inspection of the present invention can be used effectively as a method for finding defects with high detection accuracy.

  As a result, the detection rate of potential defects in the circuit of the circuit board to be inspected is greatly improved, so that the circuit board to be inspected which is likely to generate a defect or has a defect at an early stage can be removed as a defective product with high accuracy. Therefore, it is possible to judge a non-defective product or a defective product with high accuracy with respect to the circuit board to be inspected.

  A printed circuit board for mounting an integrated circuit or the like can be applied to an inspection of electrical characteristics for confirming that the wiring pattern of the circuit board has a predetermined performance before mounting the integrated circuit or the like. .

Claims (12)

A circuit board inspection apparatus that performs electrical inspection by sandwiching both surfaces of a circuit board to be inspected between a pair of first inspection jigs and a second inspection jig between the inspection jigs. ,
The first inspection jig and the second inspection jig are respectively
A pitch conversion substrate that converts the electrode pitch between one surface side and the other surface side of the substrate;
A first anisotropic conductive sheet disposed on the circuit board side to be inspected of the pitch conversion board;
A second anisotropic conductive sheet disposed on the opposite side of the circuit board to be inspected of the pitch conversion board;
A circuit board side connector with
A plurality of conductive pins arranged at a predetermined pitch;
A pair of spaced apart insulation plates that support the conductive pins;
A relay pin unit with
A third anisotropic conductive sheet disposed on the opposite side of the second anisotropic conductive sheet of the relay pin unit;
With a connection circuit unit for inspection with
A connector board for electrically connecting the tester and the relay pin unit;
A base plate disposed on the opposite side of the connector board from the relay pin unit;
With a tester side connector with
Between the connector board of the first inspection jig and the connector board of the second inspection jig,
A circuit board inspection apparatus comprising an auxiliary connection circuit unit that bypasses the inspection connection circuit unit and electrically connects from one tester side connector to an electrode of the other tester side connector. A circuit board inspection apparatus that performs electrical inspection by sandwiching both surfaces of a circuit board to be inspected between a pair of first inspection jigs and a second inspection jig between the inspection jigs. ,
The first inspection jig and the second inspection jig are respectively
A pitch conversion substrate that converts the electrode pitch between one surface side and the other surface side of the substrate;
A first anisotropic conductive sheet disposed on the circuit board side to be inspected of the pitch conversion board;
A second anisotropic conductive sheet disposed on the opposite side of the circuit board to be inspected of the pitch conversion board;
A circuit board side connector with
A plurality of conductive pins arranged at a predetermined pitch;
A pair of spaced apart insulation plates that support the conductive pins;
A relay pin unit with
A third anisotropic conductive sheet disposed on the opposite side of the second anisotropic conductive sheet of the relay pin unit;
With a connection circuit unit for inspection with
A connector board for electrically connecting the tester and the relay pin unit;
A base plate disposed on the opposite side of the connector board from the relay pin unit;
With a tester side connector with
Between the connector board of the first inspection jig and the connector board of the second inspection jig,
A circuit comprising an auxiliary connection circuit unit that bypasses the connection circuit unit for inspection and electrically connects from one tester side connector to an electrode of a tester connected to the other tester side connector. Board inspection equipment. The auxiliary connection circuit unit is
Between the connector board of the first inspection jig and the connector board of the second inspection jig,
A first auxiliary relay pin unit that is provided on the connector board side of the first inspection jig, and includes a plurality of conductive pins arranged at a predetermined pitch and a pair of spaced apart insulating plates that support the conductive pins;
A second auxiliary relay pin unit that is provided on the connector substrate side of the second inspection jig, and includes a plurality of conductive pins arranged at a predetermined pitch and a pair of spaced apart insulating plates that support the conductive pins;
An auxiliary anisotropic conductive sheet that electrically connects the first auxiliary relay pin unit and the second auxiliary relay pin unit; and
Auxiliary connection circuit unit with
2. The circuit board according to claim 1, wherein the circuit board is configured to be electrically connected from one tester side connector to an electrode of the other tester side connector, bypassing the inspection connection circuit unit. Inspection device. The auxiliary connection circuit unit is
Between the connector board of the first inspection jig and the connector board of the second inspection jig,
A plurality of conductive pins arranged at a predetermined pitch, and a pair of spaced apart insulating plates supporting the conductive pins, an auxiliary relay pin unit arranged on the connector substrate side of one inspection jig;
An auxiliary relay substrate body including an insulating substrate and a plurality of conductive portions formed on the insulating substrate;
A biasing device that biases the auxiliary relay substrate body toward the auxiliary relay pin unit;
Auxiliary relay board provided on the connector board side of the other inspection jig, comprising a connection wiring for electrically connecting the base end part of the conductive part and the electrode of the tester connected to the other tester side connector Equipment,
An auxiliary anisotropic conductive sheet for electrically connecting the auxiliary relay pin unit and the auxiliary relay board device to each other;
Auxiliary connection circuit unit with
An auxiliary connection circuit unit that electrically connects from one tester side connector to an electrode of a tester connected to the second tester side connector is provided, bypassing the inspection connection circuit unit. The circuit board inspection apparatus according to claim 2. The auxiliary connection circuit unit is
Between the connector board of the first inspection jig and the connector board of the second inspection jig,
A first auxiliary relay pin unit that is provided on the connector board side of the first inspection jig, and includes a plurality of conductive pins arranged at a predetermined pitch and a pair of spaced apart insulating plates that support the conductive pins;
An auxiliary relay substrate body including an insulating substrate and a plurality of conductive portions formed on the insulating substrate;
A biasing device that biases the auxiliary relay substrate body toward the first auxiliary relay pin unit;
A connection wiring for electrically connecting a base end portion of the conductive portion and an electrode of a tester connected to the second tester side connector; and a second wiring disposed on the connector substrate side of the second inspection jig. Two auxiliary relay board devices;
An auxiliary anisotropic conductive sheet for electrically connecting the first auxiliary relay pin unit and the second auxiliary relay board device to each other;
Auxiliary connection circuit unit with
Auxiliary connection circuit unit that electrically connects from the first tester side connector to the electrode of the tester connected to the second tester side connector is provided, bypassing the inspection connection circuit unit. The circuit board inspection apparatus according to claim 4. The auxiliary connection circuit unit is
Between the connector board of the first inspection jig and the connector board of the second inspection jig,
A second auxiliary relay pin unit that is provided on the connector substrate side of the second inspection jig, and includes a plurality of conductive pins arranged at a predetermined pitch and a pair of spaced apart insulating plates that support the conductive pins;
An auxiliary relay substrate body including an insulating substrate and a plurality of conductive portions formed on the insulating substrate;
A biasing device that biases the auxiliary relay substrate body toward the second auxiliary relay pin unit;
A connection wiring for electrically connecting a base end portion of the conductive portion and an electrode of a tester connected to the first tester-side connector, and disposed on the connector substrate side of the first inspection jig; 1 auxiliary relay board device;
An auxiliary anisotropic conductive sheet for electrically connecting the second auxiliary relay pin unit and the first auxiliary relay board device to each other;
Auxiliary connection circuit unit with
Auxiliary connection circuit unit that electrically connects from the second tester side connector to the electrode of the tester connected to the first tester side connector is provided, bypassing the inspection connection circuit unit. The circuit board inspection apparatus according to claim 4. The auxiliary connection circuit unit is
Between the connector board of the first inspection jig and the connector board of the second inspection jig,
A plurality of conductive pins arranged at a predetermined pitch, and a pair of spaced apart insulating plates supporting the conductive pins, an auxiliary relay pin unit arranged on the connector substrate side of one inspection jig;
A pair of spaced-apart auxiliary relay substrate bodies including an insulating substrate and a plurality of conductive portions formed on the insulating substrate;
An urging device for urging the pair of auxiliary relay substrate bodies in a direction away from each other;
An auxiliary relay board device disposed on the connector board side of the other inspection jig, and a connection wiring that electrically connects the base ends of the conductive parts of the pair of auxiliary relay board bodies;
An auxiliary anisotropic conductive sheet for electrically connecting the auxiliary relay pin unit and the auxiliary relay board device to each other;
Auxiliary connection circuit unit with
2. The auxiliary connection circuit unit that bypasses the connection circuit unit for inspection and electrically connects from one tester side connector to the electrode of the other tester side connector is provided. Circuit board inspection equipment. The auxiliary connection circuit unit is
Between the connector board of the first inspection jig and the connector board of the second inspection jig,
A first auxiliary relay pin unit that is provided on the connector board side of the first inspection jig, and includes a plurality of conductive pins arranged at a predetermined pitch and a pair of spaced apart insulating plates that support the conductive pins;
A pair of spaced-apart auxiliary relay substrate bodies including an insulating substrate and a plurality of conductive portions formed on the insulating substrate;
An urging device for urging the pair of auxiliary relay substrate bodies in a direction away from each other;
A second auxiliary relay board device disposed on the connector board side of the second inspection jig, and a connection wiring that electrically connects the base ends of the conductive parts of the pair of auxiliary relay board bodies;
An auxiliary anisotropic conductive sheet for electrically connecting the first auxiliary relay pin unit and the second auxiliary relay board device to each other;
Auxiliary connection circuit unit with
8. The auxiliary connection circuit unit that bypasses the connection circuit unit for inspection and electrically connects from one tester side connector to the electrode of the other tester side connector is provided. Circuit board inspection equipment. The auxiliary connection circuit unit is
Between the connector board of the first inspection jig and the connector board of the second inspection jig,
A second auxiliary relay pin unit that is provided on the connector substrate side of the second inspection jig, and includes a plurality of conductive pins arranged at a predetermined pitch and a pair of spaced apart insulating plates that support the conductive pins;
A pair of spaced-apart auxiliary relay substrate bodies including an insulating substrate and a plurality of conductive portions formed on the insulating substrate;
An urging device for urging the pair of auxiliary relay substrate bodies in a direction away from each other;
A first auxiliary relay board device disposed on the connector board side of the first inspection jig, and a connection wiring that electrically connects the base ends of the conductive parts of the pair of auxiliary relay board bodies;
An auxiliary anisotropic conductive sheet for electrically connecting the second auxiliary relay pin unit and the first auxiliary relay board device to each other;
Auxiliary connection circuit unit with
8. The auxiliary connection circuit unit that bypasses the connection circuit unit for inspection and electrically connects from one tester side connector to the electrode of the other tester side connector is provided. Circuit board inspection equipment. The auxiliary connection circuit unit is
Between the connector board of the first inspection jig and the connector board of the second inspection jig,
A pair of spaced-apart auxiliary relay substrate bodies including an insulating substrate and a plurality of conductive portions formed on the insulating substrate;
An urging device for urging the pair of auxiliary relay substrate bodies in a direction away from each other;
A first auxiliary relay board device disposed on the connector board side of the first inspection jig, and a connection wiring that electrically connects the base ends of the conductive parts of the pair of auxiliary relay board bodies;
A pair of spaced-apart auxiliary relay substrate bodies including an insulating substrate and a plurality of conductive portions formed on the insulating substrate;
An urging device for urging the pair of auxiliary relay substrate bodies in a direction away from each other;
A second auxiliary relay board device disposed on the connector board side of the second inspection jig, and a connection wiring that electrically connects the base ends of the conductive parts of the pair of auxiliary relay board bodies;
An auxiliary anisotropic conductive sheet for electrically connecting the first auxiliary relay board device and the second auxiliary relay board device to each other;
Auxiliary connection circuit unit with
2. The auxiliary connection circuit unit that bypasses the connection circuit unit for inspection and electrically connects from one tester side connector to the electrode of the other tester side connector is provided. Circuit board inspection equipment.   The circuit board inspection apparatus according to claim 4, wherein the conductive portion of the auxiliary relay board device is a conductive pin implanted in an insulating board. A circuit board inspection method using the circuit board inspection apparatus according to claim 1,
A circuit board comprising: a pair of a first inspection jig and a second inspection jig, wherein both sides of a circuit board to be inspected are sandwiched between the inspection jigs to perform an electrical inspection. Inspection method.

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