JPS6397319A - Press working method for wiring board or the like and its apparatus - Google Patents

Abstract

PURPOSE:To improve a working efficiency and working accuracy by automatically investigating the reference mark of a material to be worked loaded on a lower die by a photosensor, to aligning the position of the material to be worked and press working after fixing the material to be worked. CONSTITUTION:The material W to be worked is received on the lower die a1, the center position of the reference marks P1, P2 on the surface of the material to be worked are investigated by the photosensors B1, B2 provided on the upper and lower dies a2, a1 automatically, then the worked material W is aligned the positioned on the lower die a1. Then, a first pattern w1 of the material to be worked is sucked and held on the lower die a1 by a sucking device 10 and after a movable hand c' is left from the material to be worked and returned to the outer side of the lower die a1 temporarily, the press working is started. After that, the upper die a2 is descended by starting a driving source to match the upper and lower dies a2, a1, the pattern w1 is punched into prescribed shape to obtain the product. Therefore, without necessitating to punch guide holes on the material, the working efficiency can be improved and to heighten the working accuracy with few cumulative errors.

Description

[Detailed Description of the Invention] C. Industrial Field of Application] The present invention relates to a method and apparatus for press working of wiring boards, etc., and more specifically, a method for punching and press working of single-sided printed wiring boards, flexible wiring boards, nameplates, etc., and its implementation. The present invention relates to press processing equipment.

[Prior art and its problems]

Circuit patterns on printed wiring boards and letters on nameplates.

Machining accuracy between the pattern and the punched edges on the outer periphery is extremely important, and if the round holes, square holes, and outer periphery of the pattern are not punched with precision, not only will it look good, but the board will become unusable in the return process. .

Therefore, in the process of printing circuit patterns, characters, etc., wiring boards and the like are provided with reference marks for positioning during press processing by printing or etching.

However, according to the conventional processing method, as a preparatory work to the press processing process, a drilling operation is performed in which the reference mark is accurately drilled using a drilling machine equipped with a magnifying glass or an automatic drilling machine to form a guide ball. At least two of the guide holes are inserted into the bullet-shaped guide bins protruding from the lower die of the press, and the wiring board, etc. is aligned on the lower die surface, and then the upper die is lowered. Perform press molding.

Therefore, in conventional processing methods, it is necessary to drill guide holes before the press forming process, and the drilling process, which is a preliminary process to obtain the product, takes a long time, causing a decrease in work efficiency. At the same time, special equipment for drilling is required, which increases the cost of the product.
! Since the alignment of the TIG board and the lower mold is done by the fitting engagement between the guide hole and the guide bin, when automatically feeding the wiring board, it is necessary to move the board up and down, which complicates the automatic feeding mechanism. At the same time, a smooth feeding operation cannot be expected, which causes work to be interrupted.

[Object of the Invention] In view of the conventional circumstances, the present invention aims to eliminate the need for guide hole drilling work as a preliminary work and to improve the alignment between the workpiece and the lower mold by engaging the guide bin. It is an object of the present invention to provide a press working method and an apparatus therefor, which significantly improve workability compared to conventional methods and which can form products with high processing accuracy at low cost.

[Structure of the invention]

In the press processing method of the present invention, a workpiece whose surface is to be marked with reference marks is mounted on the lower mold of a press mold, and at least two references of the workpiece are detected by an optical sensor fixed at a fixed position of the press mold. The feature is that the center position of the mark is automatically searched to align the workpiece with the lower mold, and then the workpiece is held by suction, and the upper mold is lowered to perform press forming.

Further, the press processing apparatus of the present invention includes a press mold consisting of a lower mold that can be installed flush with a work table and an upper mold that can be moved up and down, a workpiece on which a reference mark is attached to the surface, and a press mold that is installed in a fixed position n. At least two sets of optical sensors for searching the reference mark, a movable arm mechanism for moving the workpiece in the X-axis direction, Y-axis direction, and θ angle direction on the work table, and controlling the optical sensor and the movable arm mechanism. The present invention is characterized by comprising a position control means for positioning the workpiece on the lower die, and a suction mechanism for suctioning and holding the aligned workpiece on the lower die.

[Effect]

According to the present invention, the position of the optical sensor becomes the reference position,
The alignment of the workpiece and the lower mold is completed when the sensor position and the center position of the reference mark on the workpiece match, and then, with the workpiece fixed to the lower mold by suction, the upper mold is lowered. Press molding is performed to obtain a pressed product having a predetermined shape defined by both upper and lower dies.

〔Effect of the invention〕

According to the present invention, the workpiece is suctioned and fixed to the lower mold after automatically detecting the reference mark of the workpiece using the optical sensor, so there is no need to drill a guide hole in the workpiece.

Therefore, it is possible to eliminate the need for drilling work before pressing, reduce the number of steps, improve workability, and reduce production costs without using special equipment such as a drilling machine.

In addition, the optical sensor detects the reference mark of the workpiece on the lower mold, aligns U, and then press-forms on the same mold, so the guide hole can be aligned with the reference mark of the workpiece as in the conventional method. Compared to the case where a hole is drilled and the hole is engaged with a guide bin, the cumulative error is smaller and the processing accuracy of the product can be improved.

Further, since the workpiece only needs to be moved in a plane over the lower die, automatic feeding of the workpiece is simplified and smooth feeding operation can be performed.

〔Example〕

Embodiments of the present invention will be described with reference to the drawings.
In the figure, a press machine (A) places a lower mold (al) on a base (2) that constitutes the upper surface of a machine frame (1), and MVll[i!
At the same time, a work table (3) is formed on the upper surface of the lower mold (al) and the road surface.
3) Place the workpiece (W) on top and perform press working to size.

An elevating plate (4) is installed inside the machine frame (1) so as to be movable up and down by a drive source (5) and a drive mechanism (5'), and elevating posts (6) (6) are attached to the elevating plate (4). . . . is planted to project on the base (2) in a conduit shape, and the upper mold (B2) is installed on the posts (6) (6) . . . via the upper mold holder (7). do.

In both molds (B+) (B2), the upper mold (B2) is raised and lowered from the boundary rib of the lifting plate (4), and when it descends, the lower mold (a
l) Both types of dice are matched.

The workpiece (W) is punched and processed using a punch.
It is free to provide an attachment g4 mechanism such as a knockout 414 on both types (al) (B2) like a general breath rock.

A servo motor is used as the drive source (5), and the drive groove (
5') includes a screw guide (5a') and a rotating nut (5b') screwed into it and driven by a servo motor.
) is used.

Both upper and lower types (B+) (aZ) are equipped with at least two sets of optical sensors (81) (B2) each including a light emitting part and a light receiving part.
Set up.

That is, the embodiment drawings show a case where the light sensor nursery (B1) is installed in the front left corner of the mold (al) (B2), and the light sensor (B2) is installed in the back right corner, and each light sensor −(
B+) (82) is the light projecting part (b) (b) on the upper mold (B2).
The light receiving portions (b') (b') are arranged on the lower mold (al).

The lower mold (al) is formed with a concave portion for accommodating the light receiving portions (b') (b'), and the light receiving portions (b') are placed therein.
(b') is installed in an embedded manner, and the light receiving part (b'
) (b') A thin vacuum tube < 81 (8
)..., so that the tubes (8) (8)... produce a weak adsorption effect on the upper surface of the lower mold (al) around the light receiving part.

In addition, the lower mold (al) has a cavity (9) opening to the upper surface at an appropriate place such as the center, and a suction device (10) is installed in the cavity (9).
is installed so as to produce a suction action on the upper surface of the lower mold (B+) above the cavity (9) in a timely manner.

In addition, the machine frame (1) has a gate-shaped support frame (11) extending in the left-right direction on one side edge of the base (2), and this support frame (11)
) is installed with a movable arm mechanism (C), and the movable arm mechanism (C) is
[al<c) is made to protrude onto the lower mold (al) and to be movable.

The movable flJ arm mechanism (C) has a movable frame (12) attached to the support frame (11).
) is attached so as to be movable in the X-axis direction (horizontal direction) and the Z-axis direction (vertical direction), and a movable arm (C) is attached to the movable frame (12) so as to be movable in the Y-axis direction (back and forth directions). A movable hand (C') is attached to the tip of the movable arm (C) so as to be rotatable in the θ angle direction about a shaft (13) (FIG. 4).

The movable frame (12) is moved in the X-axis direction by an X-axis motor (Ml), and is also moved in the Z-axis direction by a Z-axis cylinder (M2).
The movable arm (C) moves in the Y@force direction by the Y@motor (M3), and the movable hand (C') is moved by the θ angle motor (M3).
M4). In other words, the movable hand (C') at the tip of the movable arm (C) moves back and forth, left and right on the work table (3).

It can move freely up and down and in the turning direction.

The bottom of the movable hand (C') is equipped with suction cups (14) (14)... that start and stop the suction action at the appropriate time using the vacuum comb, and the suction cups (14) (14)... The workpiece (W) is held by suction.

The shaft (13) of the movable hand (C') has a light receiving section (15) provided on its upper end surface, and a light sensor (B+) as described later.
) (B2 ), in other words, the lower mold (al)
The movable hand (C′) in the movable arm mechanism corresponds to the center position of
) to detect the coordinate position.

An example of the workpiece (W) is a printed wiring board as shown in FIG. At least two fiducial marks (
P+) (P2) is printed.

In Figures 1 to 3, (D) is a transport robot for product collection, (E) is a console unit, and this console unit (E) is a transfer robot for product collection, and this console unit (E) is a robot that can manually operate the VJ arm mechanism (C). It is equipped with an operation section (16) such as a knob (16a) for activating and various function keys (16b) for performing a teasing operation, a display section (17), and a built-in microprocessor.

The operating section (16), display section (17), optical sensor (B+) (B2), drive section and position control section (F) of the movable arm mechanism (C), etc. are electrically connected to the microprocessor. , to control their operations (Fig. 9).

The operation of the above device will be explained with reference to FIGS. 10 to 14. The positioning operation of the movable arm mechanism (C) is performed in the storage mode as shown in FIG. ! [! (20) and linked mode processing (21).

In the storage mode processing (20), the center coordinates of the two optical sensors (Bl) (82) in the mold (a+') (a2) are determined by the light receiving section (15) provided on the movable hand (C'), in other words. Then, the operation to calculate the center coordinates of the lower mold (8+) (center detection work) (22) and the control knob (16) of the operation section (16) are performed.
a) to locate the reference mark (P+) in the workpiece (W).
Perform the operation (teaching operation) (23) to memorize the position coordinates of HF2 (FIG. 11).

The center detection operation (22) of the storage mode processing (20) is an operation performed in order to easily correct the inclination of the reference marks (Pl), since the positions of the reference marks (Pl) (Pl) differ depending on the workpiece (W). As shown in Figure 6, there is a movable arm (C
) is moved by the control knob (16a), and the movable hand (
The light receiving part (15) of C') is connected to the optical sensor (Bl) (B2
) of the light emitting part (b) (b) moving sequentially downward L'
(5TEP(j)), automatically detects the center of the light emitter (b) and light receiver (15) when positioned under each light emitter ridge (b).5TEP■), each light emitter (b) The center (0) between both positions is calculated (5TEP■) based on the position coordinates of (FIG. 12).

The teaching operation (22) is an operation in which the movement of the movable arm mechanism (C) is taught and memorized while actually moving the workpiece (W). As shown in Fig. 13, the workpiece is first manually moved. Align the first pattern (Wl) of the object (W) with the lower mold (al) (5TEP■).

Next, the movable hand (C') of the movable arm (C) is moved to the center position of the lower mold (al) (5 TEP ■), but the center detection work (
Since the center detection has been completed by step 22), 5TEP■ is automatically completed by pressing the function key (16b), for example, the center switch key.

Next, the suction cups (14) (14) of the movable hand (C')...
The workpiece (W) is moved to the movable hand (C') by
) is held by adsorption l! (STEP■), the movable arm (C) is
The optical sensor <81) (82) is moved slightly by the axis motor (Ml) and Y-axis motor (Ml) to the workpiece (W
) of the reference marks (P+) (Pl), and the centers of the marks (P+) (Pl) and the optical sensor -
(8I) Detect the matching position coordinates of (B2) (5
TEP ■). This detected fiducial mark (PI) (Pl
), the front/back, left/right, and tilt are calculated based on the center position coordinates of the Do it (5TEP■>).

That is, a specific calculation method for automatic correction is shown in FIGS. 15 and 16.

In FIG. 15, Baa and Bbo are optical sensors (
B+) (B2) is a fixed position, and 0 is the center of rotation, and Bat, 8b is the position of the detected reference mark (PI) (Pl) (actually, it is detected in absolute coordinates). To calculate the angle difference (θ) to correct the parallelism of B9 (Bat Bb+) to the line (Bao Bbo), θ-(LBb+, Bat, Q') -(!-Bt
lo, Bao, Q)...Equation (1). Therefore, when the workpiece (W+) is rotated by an angle of θ around the center of rotation O by the movable hand (C), Ba2*862 is obtained.

Therefore, Bbo, Bb+ with respect to the rotation center O.

The positional relationship of Bb2 is shown in Fig. 16, and as is known from Fig. 16, (OBb+) ” = (Bb+ G) ” + (O
G) 2t. . =BblQ OG OBb+ = OBb2, so Lβ=Lθ+Lα The inclination (θ) of the workpiece is corrected by the above formula (1) and θ−
When it is 0, there is no need for correction because parallelism is obtained), and since the absolute X-Y coordinates of Bb2 can be calculated using the above equation (2), the deviation from the coordinates of BbO (X, V ) is calculated and the amount of deviation is corrected by moving the workpiece in the X and Y directions using the movable arm mechanism (C).

Reference mark (
When using a cross-section sensor for the light receiving part (b') as shown in Fig. 7 (+), the center detection of P+ HF2) is performed in the direction in which the received light m received in areas 1 to 4 in the figure are all equal. The workpiece (W) is moved to the position where the workpiece (W) becomes equal, and detection is performed centering on the equal position.

In addition, as shown in Fig. 7(n), when using one sensor for the light receiving part (b'), the fog level mark (Pl) or (B2
) are detected in the x-axis direction and the Y-axis direction, respectively, and the detection is performed centering on the midpoint.

In addition, the light receiving part (b') of the optical sensor (81) (B2)
Around (b'), there are vacuum pipes (8) (8)...
- The reference mark (PI HF2) part is attracted by a weak adsorption action and brought into close contact with the lower mold (a+).

After positioning the workpiece (W), the suction device (10)
The workpiece (W) is attracted to the lower mold (a+) by
TEP ■), suction cup (14) (14) of movable hand (C')
Stop the intake action of... (5TEP■) In that state, operate the movable arm (C) with the control knob (16a) to move the movable hand (C') slightly upward, and then start the next pattern (W2 )
Move it to near the center position (5TEP■).

Next, move the movable hand (C') slightly downward and suck it! (
14) (14)... avoids suction action and holds the workpiece (W) by suction (5TEP■), and stops the suction action of the suction device (10) of the lower die (al) (5TEP [
KK]).

After that, return to 5TEP■ and do the same work (ST[:P
(2) to [phase]) are repeated until all patterns (w2, w3...) are completed, and the moving direction and movement a of the movable arm (C) are memorized by this teaching operation.

Note that the storage mode data may optionally be stored in a preset memory for each type of workpiece (W).

In the interlocking mode processing (21), the position control unit (F) operates the movable arm mechanism (C) based on the above-mentioned storage mode, and moves the workpiece (W> on the lower die (al) to its reference mark (P+). )(B2) is the optical sensor (Bl)(B2
) and move each center position of the reference mark (PI) (B2) to the position near the optical sensor (B+).
1 (B2), automatically corrects the front/back, left/right, and inclination, and after the correction, instructs the pressing operation (FIG. 14).

That is, when the workpiece (W) is set on the work table (3) and the device is started, a start instruction is output to the movable arm mechanism (C) (5TEP■), and the movable hand (C')
After adsorbing the workpiece (w) (5TEP■), the movable arm (C) moves and picks up the workpiece (W) in the first pattern (W+
) onto the lower mold (al) (5TEP■).

Next, on the lower mold (al), mark the first reference mark (Pl).
After positioning (5TEP■), optical sensor (B1)
Automatically search and detect the center position using 5TEP■),
Next, position the second parking mark (B2). 5TE
P■), the optical sensor (B2) automatically searches and detects the center position (5TEP■).

After that, the position of the workpiece is automatically corrected by calculating the front/back, left/right, and inclination using the movable arm mechanism (C). 5TEP■)
, the reference mark (P+) of the first pattern (W+) (P
2) to accurately match the optical sensor (B+) (Bz) (Fig. 8), and output the press working operation instruction (
5TEP ■).

The press processing operation is performed by suction m (10) on the workpiece (
After the first pattern (w+) of W) is suctioned and held on the lower die (at), the movable hand (C') separates from the workpiece (W>) and temporarily returns to the outside of the lower die (at). The upper mold (aZ) is lowered by starting the drive source (5), and the upper mold (at) and the upper mold (aZ) are aligned to form the first mold.
The pattern (Wl) is punched out into a predetermined shape, and depending on the pattern, holes are punched to form the product.

Then, when the press work is finished and the upper mold (aZ) is raised, the transfer robot (D) rotates to receive and collect the molded product.

Note that the transfer robot (D) is not used in the case where the press machine pulls out the product under the lower die (al), and in the case of the presser foot type where the product remains as it is on the lower die surface, A suction cup is provided on the lower surface of the tip of the arm of the transfer robot (D) to generate a suction action in a timely manner.

When the product collection operation of the above-mentioned transport robot (D) is completed,
The operation of 5TEP is started again, the movable hand (C') conveys the second pattern (W2) of the workpiece (W) onto the lower die (al), and the same 5TEP as described above is repeated.

When the entire pattern of one workpiece (W) is pressed, the outer frame part of the workpiece (W) is taken out from the work table (3) and a new workpiece (W> is placed on the table (3) and the same pressing operation is performed automatically.

In addition, when processing the same type of workpiece (W), the above-mentioned memory mode processing 1! [! (20) is performed manually only for the first sheet, and subsequent storage mode processing is unnecessary.

Also, supply the workpiece (W) onto the work table (3),
Optionally, the work of removing the outer frame portion can be automated using robots for feeding and discharging.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional side view of the device of the present invention, and FIG. 2 is its (If
)-(n) line sectional view, FIG. 3 is a partially cutaway plan view of FIG. 1, FIG. 4 is a perspective view of the movable arm mechanism, FIG. 5 is a plan view showing an example of a workpiece, and FIG. Figure 6 is a plan view illustrating the center position between the optical sensors, Figure 7 is a plan view illustrating the method of detecting the center of the reference mark using the optical sensor, and Figure 8 shows the workpiece aligned with the lower die. 9 is a block diagram for positioning the workpiece in the apparatus, FIG. 10 is a flowchart of the flexible JWM mechanism, FIG. 11 is a flowchart showing details of the storage mode processing, and FIG.
The figures are a flowchart showing details of the center detection work in Fig. 11, Fig. 13 is a flowchart showing details of the teaching work in Fig. 11, Fig. 14 is a flowchart showing details of the linked mode processing, and Fig. 15. and FIG. 16 are explanatory diagrams showing an example of an automatic correction calculation method. In the figure, (△) is the press machine, (al) is the lower die, (aZ) is the upper die, (B+) (B2) is the light sensor, (b) is the light emitter, and (b') is the light receiver. , (C) is a movable arm mechanism, (C)
is a movable arm, (C') is a movable hand, (1) is a rock frame, (3) is a work table, (10) is a suction device, (F) is a position control unit, (W) is a workpiece, ( W+)(W2)... are patterns, and (P+)(P2) are reference marks.

Claims (2)

[Claims] (1) Place the workpiece on which reference marks are to be attached on the surface of the workpiece on the lower die of the press mold, and automatically determine the center position of at least two reference marks on the workpiece using an optical sensor fixed at a fixed position on the press mold. Exploring and aligning the workpiece to the lower mold,
A press processing method for wiring boards, etc., in which the workpiece is then held by suction and the upper mold is lowered to press form it. (2) A press mold consisting of a lower mold that can be installed flush on a work table and an upper mold that can be moved up and down; a workpiece that has a reference mark attached to its surface; and a press mold that is installed at a fixed position on the press mold and has the reference mark attached thereto. at least two sets of optical sensors for exploring the workpiece, a movable arm mechanism for moving the workpiece in the X-axis direction, Y-axis direction, and θ angle direction on the work table; A press processing device for wiring boards, etc., comprising a position control means for positioning a workpiece on a lower mold, and a suction mechanism for suctioning and fixing the aligned workpiece to the lower mold.