JPS6381003A - Through-hole forming device - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a through-hole forming apparatus, and particularly to a through-hole forming apparatus for forming a plurality of through holes on a ceramic green sheet.

[Conventional technology]

Ceramic multilayer wiring boards have been put into practical use as high-density mounting boards for large computers and supercomputers, and are expected to become more widespread in the future. One of the manufacturing processes for the ceramic multilayer wiring board is the process of drilling holes in the ceramic green sheet.

Conventionally, holes are drilled into ceramic green sheets by etching a stainless steel plate between a convex type with a plurality of protrusions in a limited pattern on the surface and a concave type with holes that match the convex protrusions. Through-holes were formed using a press or pressure rollers with a green sheet in between.

[Problem that the invention seeks to solve]

However, with this conventional method, (1) the hole positions are determined at the time of edge blowing, and when changing the pattern, the mold must be changed; (2) a mold is required for each pattern, which increases mold manufacturing costs. (3) The rigidity of the mold is low, making it difficult to form uniform through holes due to deformation and wear during pressurization.

It is an object of the present invention to provide a through hole formation method that eliminates the above problems, allows the formation of through holes in various patterns with extremely high precision at any position on a ceramic green sheet using a device with a simple structure, and reduces the number of work steps. The goal is to provide equipment.

[Means for solving problems]

The through-hole forming device of the present invention includes a fly 1 which is provided with a pin and is movable by a laminated piezoelectric element, and a head having the pin, the hole is provided at the lower part of the head, and the hole guides the pin. a guide plate, a cassette I~ plate provided at the bottom of the guide plate and fixing it to the ceramic green sea 1, a lower die provided at the bottom of the cassette plate and having the holes thicker than the pins; The plurality of holes include a head support block and a drive device, and each of the plurality of holes includes a head up and down movement mechanism that holds the head and moves it up and down, and a head movement stage and a drive device that move the head up and down movement mechanism in the X-axis direction. a head moving mechanism section that moves the cassette plate in the Y-axis direction;
Control of the timing of energizing the laminated piezoelectric element to blow the fly 1 to the bottle, control of the drive device that drives the drilling head up and down, and control of the head up and down movement mechanism section.
It is configured to include a control section that controls a drive device that moves the force cell in the axial direction and a control section that controls a drive device that moves the force cellar 1 to the plate in the Y-axis direction.

[Effect]

By using an automatic device equipped with multiple pins that can essentially move the ceramic green sheet in the X-Y axis directions, hole-forming sheets with any pattern can be supplied at high speed, reducing the number of man-hours required. can be significantly reduced.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a partially cutaway perspective view of one embodiment of the present invention, and FIG.
The figures shown in FIG. 1 are a cross-sectional view of the central portion of the head, the blank holes in FIG. 3 are a perspective view of the head, and the blank holes in FIG.

In FIGS. 3 and 4, the head is mainly composed of an E-shaped housing 1 and a laminated piezoelectric element 2, and the flight pin 4 is provided with a pin 5. That is, each laminated piezoelectric element 2 is placed at the upper end of the circular inner surface of the E-shaped housing 1.
One end of the concave leaf spring 3 is fixed, and both ends of the concave leaf spring 3 are fixed at both inner corners of the housing 1 at both lower corners. A flight pin 4 having a spherical tip and made of a material with high hardness and high repulsive force (carbide material in this case) is fixed to the upper surface of the central part of the leaf spring 3, and the spherical tip of the fly pin 4 is It is pressurized and in contact with the other end of the laminated piezoelectric element 2. Leaf spring 3
A hole pin 5 integrally constructed with the flight pin 4 is fixed to the central lower surface of the leaf spring 3 by penetrating through the center thereof. The pin 5 for drilling is guided in the center by a guide plate 6 having a hole with an appropriate gap between the pin 5 and the pin 5 for drilling.

The hole is equipped with a lower mold support plate 7 below the pin 5, a lower mold 8 is fixed to the two sides of the lower mold support plate 7, and the hole is provided with a pin in the center of the lower mold 8. Immediately below, the diagonal hole is provided with a hole 801 having a suitable clearance with the tip edge 501 of the pin 5.

The explanation will be given below using FIG. 1 and FIG. 2 together.

The ceramic green sheet 9 is a frame-shaped cassette board 1
The lower mold 8 and the hole are inserted between the pins 5. The hole 701 provided in the lower mold support plate 7 is for making it easier for scraps to fall out when the ceramic green sheet 9 is removed. A plurality of heads 50 are stacked one on top of the other and are fixed to a head support block 11 constituting a head up-and-down movement mechanism by a shaft (not shown) through a hole 101 in the center of the housing.

The head vertical movement mechanism is formed by this head support block 11.
Straight line guide 12. It mainly consists of a head support plate 14 and a drive device 16 consisting of a linear solenoid. The head support block 11 is installed so as to be vertically slidable on a head support plate 14 fixed to a head movement stage 13 via a linear guide 12. Further, the head support block 11 is rotatably attached to a drive device 16 fixed to the top surface of the head moving stage 13 via a joint 15 fixed to the top surface, and is configured so that it can be moved up and down by the drive device 16. has been done.

This head vertical movement mechanism section is a head movement stage 13.
．． Straight line guide 17. Portal support stand 19. Screw device 20. The head is moved in the X-axis direction by a head moving mechanism mainly composed of a drive device 21 consisting of a pulse motor. The head moving stage 13 is slidably attached via a linear guide 17 to both ends of the upper surface of a gate-shaped support 19 fixed to both ends of the upper surface of the substrate 18 . Furthermore, the head moving stage 13 is configured to be movable in the X-axis direction by a screw device 20 and a drive device 21, each of which is a ball screw whose one end is rotatably fixed to the upper end of the portal support 19.

A lower die support plate 7 is fixed to the rear end surface of the head moving stage 13, and since the lower die support plate 7 is cantilever supported, it is a roller support base with extremely low frictional force fixed on the surface of the substrate 18. It is supported by 30. Since the axis of the drilling pin 5 and the axis of the hole 801 of the lower die 8 are both positioned on the head moving stage 13 so as not to deviate from each other, even if the head moving stage 13 moves, the positional relationship will not shift.

A ceramic green sheet moving stage 22 that constitutes a green sheet moving mechanism is provided below the head moving stage 13 and on the upper surface of the substrate 18 in a direction perpendicular to the head moving stage 13 .

The green sheet moving mechanism section is a ceramic green sheet moving stage 22. Straight guide 23. Screw device 24 consisting of a ball screw. It mainly consists of a drive device 25 consisting of a pulse motor.

A fixing mechanism 31 for fixing the cassette plate 10 is provided on the upper surface of the ceramic green sheet moving stage 22. The ceramic green sheet moving stage 22 is slidably mounted on a linear guide 23 fixed to the upper surface of the substrate 18, and is configured to be able to move in the Y-axis direction by a screw device 24 and a drive device 25. There is.

Photo sensor 26.2 fixed to the top edge of the substrate 18
7.28 is ceramic green sheet moving stage 22
It is for position detection, and is fixed to the upper end of the ceramic green sheet moving stage 22 and turned on and off by a shielding plate 29. The photosensor 26 is for detecting the position of the forward movement limit of the ceramic green sheet moving stage 22, the foI sensor 27 is for detecting the origin position, and the photosensor 28 is for detecting the position of the backward movement limit. Further, the photosensor 26 and the photosensor 28 also serve as a safety switch to prevent the ceramic green sheet moving stage 22 from running out of control.

Control of the timing of energizing the laminated piezoelectric element 2 and drilling are controlled by a drive device 16 that drives the head 50 up and down, and a drive device 21 that moves the head up and down movement mechanism in the X-axis direction.
The control of the driving device f25 for moving the cassette plate 10 in the Y-axis direction can be automatically controlled by a control device 60 using software.

Next, its operation will be explained.

The initial setting of the apparatus is such that the shielding plate 29 fixed on the ceramic green sheet moving stage 22 shields the photosensor 26. With the ceramic green sheet moving stage 22 stopped at this position, the cassette plate 1 has the ceramic green sheet 9 attached to its lower surface.
0 is installed on the upper surface of the ceramic green sheet moving stage 22 and fixed by a fixing mechanism 31.

Next, when the start switch of the control device 60 is turned on, the drive device starts! 25 starts operating, and the ceramic green sheet moving stage 22 moves backward until the shielding plate 29 shields (switches) the photosensor 27 for detecting the origin (through-hole starting position).

At the same time, the drive device 21 also starts operating, and the head moving stage 13 also detects the origin (the starting position of the through hole). At the same time, the drive device 16 is also excited to pull up the head support block 11 by about 21 steps. This is because the gap between the tip edge part 501 of the pin 5 and the ceramic green sheet 9 is about 0.1+am when the hole is drilled at the standard position, so the pin 5 is in contact with the side surface of the plate. This is to prevent it from being damaged.

When the ceramic green sea 1 to the moving stage 22 stop at the original position, the excitation of the drive device 16 is cut off and the head support block 11 is also lowered to a predetermined position. Subsequently, the laminated piezoelectric elements 2 at predetermined pattern positions are energized. When the laminated piezoelectric element 2 is energized, due to the characteristics of the laminated piezoelectric element 2, the laminated piezoelectric element 2 instantaneously stretches several μm, so the flight pin 4 that is in contact with the laminated piezoelectric element 2 is pressurized and is blown away, making a hole. is the tip edge part 501 of the pin 5 and the hole 80 in the lower mold.
A through hole is formed in the ceramic green sheet 9 at the outer diameter edge of the upper surface of the flight pin 4. When the flight pin 4 is blown away, the concave leaf spring 3 is deflected, but once the force reaches its limit point, the leaf spring 3 returns to its original state. The force returns it to its initial position. When the flight pin 4 returns to its initial state (in the embodiment, it is determined based on time), a pulse corresponding to one predetermined pitch is applied to the drive device 21, and the head moving stage 13 moves a distance corresponding to one pitch. When the movement is stopped, the laminated piezoelectric element 2 and the flight pins 4 perform a predetermined operation as described above, and the head moving stage 13 moves one pitch again, and the laminated piezoelectric element 2 and the flights 1 to 4 perform a predetermined operation.

When the series of operations is completed, the drive device 25 is driven to a predetermined value.
A pulse corresponding to the pitch is applied, and the ceramic green sheet moving stage 22 moves by one pitch. When the movement stops, the head moving stage 13 performs a predetermined operation as described above.

By repeating these operations as described above, a predetermined pattern of through holes is formed on the ceramic green sheet 9. When the through hole forming operation is completed, the drive device 16 is excited, and the head support block 11- is pulled -F.
can be lost. Subsequently, the driving device 25 is activated, and the ceramic green sheet moving stage 22 moves to the initial state, blocks the photosensor 26, and stops. When the ceramic green sheet moving stage 22 stops, the drive device]
-6 is also deenergized and the head support block 11 is also lowered.

Since the series of through-pole forming operations ends at [-]-, the operator only has to replace the cassette plate 10 and start the series of operations again.

〔Effect of the invention〕

- As explained above, according to the present invention, the perforator is equipped with a plurality of pins and substantially connects the ceramic green sheet to X-Y.
By being configured to be movable in the axial direction, through-pole forming sheets with various patterns can be supplied at high speed, and the number of work steps can be significantly reduced.

[Brief explanation of the drawing]

FIG. 1 is a partially cutaway perspective view of one embodiment of the present invention, and FIG.
The figures are a cross-sectional view of the central portion of the head in FIG. 1, a perspective view of the head in FIG. 3, and an enlarged cross-sectional view of the pin portion in FIG. 2. 1... Housing, 2... Laminated piezoelectric element, 3... Leaf spring,
4... Flight pin, 5... Hole is pin, 6...
・Guide plate, 7... Lower die support plate, 8... Lower die, 9...
・Ceramic green sheet, 10...Cassette 1 to plate,]1...Head support block, 12...Linear guide, 13...Head moving stage, 14...Head support plate, 15...Joint , 16... drive device, 17...
- Linear guide, 18... Board, 19... Portal support, 20... Screw device, 21... Drive device, 22...
・Ceramic Green Sea 1~Movement stage, 23...
- Linear guide, 24... Screw device, 25... Drive device, 26, 27. 28... Photo sensor, 29...
Shielding plate, 30... Roller support base, 31... Fixing mechanism, 50... Hole is head, 60... Control device, 10
1... Hole, 501... Edge portion, 701... Scrap removal hole, 801... Hole. Filler 4 Figure 3: Spring opening ° −

Claims (1)

[Claims] a drilling head having a flight pin that is provided with a drilling pin and is movable by a laminated piezoelectric element; a guide plate provided at the bottom of the drilling head for guiding the drilling pin; and a ceramic green plate provided at the bottom of the guide plate. A cassette plate for fixing a sheet, a lower mold provided at the bottom of the cassette plate and having a hole thicker than the punching pin, a head support block and a drive device, and holds a plurality of punching heads and moves them up and down. The cassette includes a moving head up and down movement mechanism, a head movement mechanism that moves the head up and down movement mechanism in the X-axis direction, which includes a head movement stage and a drive device, and a ceramic green sheet movement stage and a drive device. A green sheet moving mechanism unit that moves the plate in the Y-axis direction, control of the timing of energizing the laminated piezoelectric element to blow the flight pin, control of a drive device that drives the hole punching head up and down, and control of the drive device that moves the head up and down. A through-hole forming apparatus comprising: a control section that controls a drive device that moves the moving mechanism section in the X-axis direction and a control section that controls a drive device that moves the cassette plate in the Y-axis direction.