JPS6379670U - - Google Patents
Info
- Publication number
- JPS6379670U JPS6379670U JP17387086U JP17387086U JPS6379670U JP S6379670 U JPS6379670 U JP S6379670U JP 17387086 U JP17387086 U JP 17387086U JP 17387086 U JP17387086 U JP 17387086U JP S6379670 U JPS6379670 U JP S6379670U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- board according
- magnetic material
- molding material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012778 molding material Substances 0.000 claims description 4
- 229910000859 α-Fe Inorganic materials 0.000 claims description 3
- 239000000696 magnetic material Substances 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図は本考案の第一実施例に係るプリント基
板の断面図、第２図は同第二実施例に係るプリン
ト基板の断面図、第３図は同第三実施例に係るプ
リント基板の断面図である。
１，１ａ，１ｂ……プリント基板、２……成形
材、３……フエライト、４，４ａ，４ｂ……銅箔
パターン、５，５ａ……フエライト混入層、６，
６ａ……成形材層、７……スルーホール。
FIG. 1 is a sectional view of a printed circuit board according to a first embodiment of the present invention, FIG. 2 is a sectional view of a printed circuit board according to a second embodiment, and FIG. 3 is a sectional view of a printed circuit board according to a third embodiment of the present invention. FIG. 1, 1a, 1b... Printed circuit board, 2... Molding material, 3... Ferrite, 4, 4a, 4b... Copper foil pattern, 5, 5a... Ferrite mixed layer, 6,
6a...Molding material layer, 7...Through hole.
Claims (1)
を特徴とするプリント基板。 (2) 前記磁性材はフエライトとしたことを特徴
とする登録請求の範囲第１項に記載のプリント基
板。 (3) 前記磁性材を混入した成形材を中層に配置
してあることを特徴とする登録請求の範囲第１項
、又は第２項に記載のプリント基板。 (4) スルーホールによつて表裏面を導通させて
いることを特徴とする登録請求の範囲第１項、第
２項、又は第３項に記載のプリント基板。[Claims for Utility Model Registration] (1) A printed circuit board characterized by having a magnetic material mixed into a molding material. (2) The printed circuit board according to claim 1, wherein the magnetic material is ferrite. (3) The printed circuit board according to claim 1 or 2, characterized in that a molding material mixed with the magnetic material is disposed in an intermediate layer. (4) The printed circuit board according to claim 1, 2, or 3, wherein the front and back surfaces are electrically connected by through holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17387086U JPS6379670U (en) | 1986-11-12 | 1986-11-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17387086U JPS6379670U (en) | 1986-11-12 | 1986-11-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6379670U true JPS6379670U (en) | 1988-05-26 |
Family
ID=31111736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17387086U Pending JPS6379670U (en) | 1986-11-12 | 1986-11-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6379670U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07245495A (en) * | 1994-03-03 | 1995-09-19 | Cmk Corp | Printed board material containing magnetic material in insulation layer |
-
1986
- 1986-11-12 JP JP17387086U patent/JPS6379670U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07245495A (en) * | 1994-03-03 | 1995-09-19 | Cmk Corp | Printed board material containing magnetic material in insulation layer |
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