JPS6377355U - - Google Patents
Info
- Publication number
- JPS6377355U JPS6377355U JP17160686U JP17160686U JPS6377355U JP S6377355 U JPS6377355 U JP S6377355U JP 17160686 U JP17160686 U JP 17160686U JP 17160686 U JP17160686 U JP 17160686U JP S6377355 U JPS6377355 U JP S6377355U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- lead wire
- utility
- scope
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000005219 brazing Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第1図は、従来のリード線を有する半導体装置
の側面図、第2図は、本考案の一実施例のリード
線を有する半導体装置の側面図である。
なお図において、6……第1のわん曲部、5…
…第2のわん曲部、7……ろう付部、11,21
……スタツド、12,14,22,24……半田
、13,23……ペレツト、15……従来のリー
ド線、25……本考案のリード線である。
FIG. 1 is a side view of a conventional semiconductor device having lead wires, and FIG. 2 is a side view of a semiconductor device having lead wires according to an embodiment of the present invention. In the figure, 6...first curved portion, 5...
...Second curved part, 7...Brazing part, 11, 21
... stud, 12, 14, 22, 24 ... solder, 13, 23 ... pellet, 15 ... conventional lead wire, 25 ... lead wire of the present invention.
Claims (1)
けたことを特徴とする半導体装置。 A semiconductor device characterized in that at least a lead wire is provided with two or more curved parts.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17160686U JPS6377355U (en) | 1986-11-07 | 1986-11-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17160686U JPS6377355U (en) | 1986-11-07 | 1986-11-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6377355U true JPS6377355U (en) | 1988-05-23 |
Family
ID=31107387
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17160686U Pending JPS6377355U (en) | 1986-11-07 | 1986-11-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6377355U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100321849B1 (en) * | 1999-06-29 | 2002-02-01 | 곽정소 | stress shock-absorbing of pole terminal for electronic semiconductor module |
-
1986
- 1986-11-07 JP JP17160686U patent/JPS6377355U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100321849B1 (en) * | 1999-06-29 | 2002-02-01 | 곽정소 | stress shock-absorbing of pole terminal for electronic semiconductor module |