JPS6344457U - - Google Patents
Info
- Publication number
- JPS6344457U JPS6344457U JP13866786U JP13866786U JPS6344457U JP S6344457 U JPS6344457 U JP S6344457U JP 13866786 U JP13866786 U JP 13866786U JP 13866786 U JP13866786 U JP 13866786U JP S6344457 U JPS6344457 U JP S6344457U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- guide frame
- circuit boards
- external
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010396 two-hybrid screening Methods 0.000 claims 3
- 239000011295 pitch Substances 0.000 claims 1
- 238000005192 partition Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の実施例を示す斜視組み立て図
、第２図は従来例を示す断面図である。
１，２……混成集積回路基板、３，４……外部
リード、５……枠体、６……ガイド枠、７……ガ
イド部、８……仕切り板、９……穴、１０……溝
。
FIG. 1 is a perspective assembled view showing an embodiment of the present invention, and FIG. 2 is a sectional view showing a conventional example. DESCRIPTION OF SYMBOLS 1, 2...Mixed integrated circuit board, 3, 4...External lead, 5...Frame body, 6...Guide frame, 7...Guide part, 8...Partition plate, 9...Hole, 10... groove.
Claims (1)
と該二枚の混成集積回路基板の少なくとも一側辺
から複数本同一方向に略直角に曲折された外部リ
ードと前記二枚の混成集積回路基板を対向離間配
置する枠体とを備えた混成集積回路において、前
記外部リードのピツチに対応する複数の穴が設け
られた枠状のガイド枠を有し、該ガイド枠に設け
られた前記穴に前記外部リードを挿入すると共に
前記ガイド枠内に前記混成集積回路を配置し、前
記外部リードを位置規制することを特徴とする混
成集積回路。 two hybrid integrated circuit boards provided with circuit elements; a plurality of external leads bent at substantially right angles in the same direction from at least one side of the two hybrid integrated circuit boards; and the two hybrid integrated circuit boards. The hybrid integrated circuit has a frame-shaped guide frame provided with a plurality of holes corresponding to the pitches of the external leads, and the holes provided in the guide frame include A hybrid integrated circuit characterized in that the external lead is inserted and the hybrid integrated circuit is placed within the guide frame to regulate the position of the external lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13866786U JPH0635476Y2 (en) | 1986-09-10 | 1986-09-10 | Hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13866786U JPH0635476Y2 (en) | 1986-09-10 | 1986-09-10 | Hybrid integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6344457U true JPS6344457U (en) | 1988-03-25 |
| JPH0635476Y2 JPH0635476Y2 (en) | 1994-09-14 |
Family
ID=31043856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13866786U Expired - Lifetime JPH0635476Y2 (en) | 1986-09-10 | 1986-09-10 | Hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0635476Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02266554A (en) * | 1989-04-07 | 1990-10-31 | Nec Corp | Integrated circuit package |
| JP2011222552A (en) * | 2010-04-02 | 2011-11-04 | Denso Corp | Surface-mount electronic component and surface-mount electronic component mounting structure |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022185515A1 (en) * | 2021-03-05 | 2022-09-09 | 三菱電機株式会社 | Semiconductor module |
-
1986
- 1986-09-10 JP JP13866786U patent/JPH0635476Y2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02266554A (en) * | 1989-04-07 | 1990-10-31 | Nec Corp | Integrated circuit package |
| JP2011222552A (en) * | 2010-04-02 | 2011-11-04 | Denso Corp | Surface-mount electronic component and surface-mount electronic component mounting structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0635476Y2 (en) | 1994-09-14 |