JPS6340775A - Joining member - Google Patents
Joining memberInfo
- Publication number
- JPS6340775A JPS6340775A JP18549586A JP18549586A JPS6340775A JP S6340775 A JPS6340775 A JP S6340775A JP 18549586 A JP18549586 A JP 18549586A JP 18549586 A JP18549586 A JP 18549586A JP S6340775 A JPS6340775 A JP S6340775A
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- ceramics
- joining member
- ceramic
- interface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 150000002739 metals Chemical class 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 229910052726 zirconium Inorganic materials 0.000 claims description 2
- 229910052735 hafnium Inorganic materials 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 20
- 238000006243 chemical reaction Methods 0.000 description 7
- 238000009792 diffusion process Methods 0.000 description 4
- 238000002845 discoloration Methods 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000004453 electron probe microanalysis Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Ceramic Products (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、セラミックス−セラミックス、セラミック
ス−金属を接合する接合部材に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a joining member for joining ceramics to ceramics or ceramics to metals.
セラミックスと活性金属の反応を利用する接合方法にお
いて、融点が’１００℃以下の金属及び合金と活性金属
の組み合せからなる接合部材を用いることにより、活性
金属とセラミックスの反応が過剰になりセラミックスの
反応界面層が還元され色調変化したり、接合時の加熱時
に、セラミックス中のバインダーが溶融し、表面に凹凸
が生じるのを防止するようにした。In a bonding method that utilizes the reaction between ceramics and active metals, by using a bonding member made of a combination of a metal or alloy with a melting point of 100°C or less and an active metal, the reaction between the active metal and the ceramics becomes excessive and the reaction of the ceramics is caused. This prevents the interfacial layer from reducing and causing a change in color, and from melting the binder in the ceramics during heating during bonding, thereby preventing unevenness from occurring on the surface.
従来のこの種の接合には、Ｔｉ−Ｃｕ−へｇ、ＴｉＮ＋
等の融点が７００℃以上の接合部材が用いられていた。Conventional bonding of this type includes Ti-Cu-g, TiN+
A bonding member having a melting point of 700° C. or higher was used.
従来の接合部材であると、高温度での接合となり、接合
部材中の活性金属とセラミックスとの反応が、急速に進
むため、第２図に示す様にセラミックス中の酸素が接合
部材中へ数十μ拡散し、セラミックスの接合界面が２〜
３■ｌに渡り変色していた。更に接合時の加熱により、
セラミックス表面の溶融現象が生じ、凹凸が発生するた
め表面のラッピング後に接合できないという欠点を有し
ていた。With conventional bonding members, the bonding is performed at high temperatures, and the reaction between the active metal in the bonding member and the ceramics proceeds rapidly. As shown in Figure 2, the oxygen in the ceramics enters the bonding member. 10μ diffusion, and the bonding interface of ceramics is 2~
The color changed over 3 liters. Furthermore, due to heating during bonding,
This method has the disadvantage that the ceramic surface melts and unevenness occurs, making it impossible to bond the surface after lapping.
そこで、本発明は従来のこの様な欠点を解決するため接
合部材の検討を行い、界面の反応のコントロールができ
、低温度で接合できることを目的としている。Therefore, in order to solve these conventional drawbacks, the present invention examines bonding members, and aims to enable control of interface reactions and bonding at low temperatures.
上記問題を解決するため、この発明はＴｉ、Ｚｒ、Ｉｆ
ｆ等の活性金属と、融点が７００℃以下の金属及び合金
からなる従来にない接合部材を開発した。In order to solve the above problems, this invention provides Ti, Zr, If
We have developed an unprecedented joining member made of active metals such as F and metals and alloys with melting points of 700°C or less.
上記の様な接合部材であると、接合温度が低いので、活
性金属とセラミックスの反応を任意にコントロールでき
、セラミックス界面の変色及びセラミックス表面の凹凸
を防止することが可能となった。With the bonding member as described above, since the bonding temperature is low, the reaction between the active metal and the ceramic can be controlled as desired, making it possible to prevent discoloration of the ceramic interface and unevenness of the ceramic surface.
以下に本発明の実施例を図面に基づき説明する。 Embodiments of the present invention will be described below based on the drawings.
第１図は、本発明の接合部材を用いた接合界面の断面を
Ｅｌｅｃｔｖｏｎ Ｐｒｏｂｅ Ｍｉｃｖｏ Ａｎｌｌ
ｌｌｙｓｃｒ（以下、ＥＰＭＡと称す、）で線分析した
ものである。１はセラミックス、２は接合部材、３は拡
散層を示す。FIG. 1 shows a cross section of a bonding interface using the bonding member of the present invention using an Electvon Probe Micvo Anll.
Line analysis was performed using llyscr (hereinafter referred to as EPMA). 1 represents ceramics, 2 represents a joining member, and 3 represents a diffusion layer.
５は活性金属であるＴｉの層で、セラミックス１との界
面に層状に分布している。接合部材２ヘセラミツクス１
中の酸素が数μ拡散している。セラミックス１表面の凹
凸は常温での状態と同様のものが得られた。表−１に本
発明の接合部材のいくつかの例について、酸素の拡散距
離と変色の有無。Reference numeral 5 denotes a layer of Ti, which is an active metal, and is distributed in a layered manner at the interface with the ceramic 1. Joining member 2 Heceramics 1
Oxygen inside is diffused several micrometers. The unevenness on the surface of Ceramic 1 was similar to that at room temperature. Table 1 shows the oxygen diffusion distance and the presence or absence of discoloration for some examples of the bonding members of the present invention.
表面の凹凸発生の有無をまとめた。比較として従来の接
合部材の各特性を示した。いずれも従来の接合部材に比
較し良い結果が得られている。The presence or absence of surface irregularities was summarized. For comparison, the characteristics of conventional joining members are shown. In both cases, better results were obtained compared to conventional joining members.
本発明は、以上述べた様に活性金属と融点７００℃以下
の金属及び合金を接合部材に用いることにより、セラミ
ックスと活性金属の反応を任意にコントロールでき、変
色の生じない接合を得ることができる。更に、接合温度
を低くすることが可能となりセラミックス表面の凹凸発
生が防止できるという効果を有している。As described above, the present invention uses an active metal and a metal or alloy with a melting point of 700°C or lower as a bonding member, so that the reaction between the ceramic and the active metal can be controlled as desired, and a bond that does not cause discoloration can be obtained. . Furthermore, it has the effect that it is possible to lower the bonding temperature and prevent the occurrence of irregularities on the ceramic surface.
第１図は、本発明に関わる接合部材を用いた接合界面を
示す断面図、第２図は従来の接合部材を用いた接合界面
を示す断面図である。
１・・・セラミックス
２・・・接合部材
３・・・拡散層
４・・・変色層
以上
第１図
従来の待与仰野ｎ省軒面図
第２図FIG. 1 is a sectional view showing a bonding interface using a bonding member according to the present invention, and FIG. 2 is a sectional view showing a bonding interface using a conventional bonding member. 1...Ceramics 2...Joining member 3...Diffusion layer 4...Discoloration layer and above Fig. 1 Conventional eave surface view Fig. 2
Claims (1)
１％〜２０％で、残部がＸ融点７００℃以下の金属及び
合金からなる接合部材。(1) At least one of Ti, Zr, and Hf contains 0.
A joining member made of metals and alloys with an X melting point of 700°C or less, with the balance being 1% to 20%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18549586A JPS6340775A (en) | 1986-08-07 | 1986-08-07 | Joining member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18549586A JPS6340775A (en) | 1986-08-07 | 1986-08-07 | Joining member |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6340775A true JPS6340775A (en) | 1988-02-22 |
Family
ID=16171767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18549586A Pending JPS6340775A (en) | 1986-08-07 | 1986-08-07 | Joining member |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6340775A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019098398A (en) * | 2017-11-29 | 2019-06-24 | パナソニックＩｐマネジメント株式会社 | Joint material, semiconductor device production method using joint material, and semiconductor device |
| US11476399B2 (en) | 2017-11-29 | 2022-10-18 | Panasonic Intellectual Property Management Co., Ltd. | Jointing material, fabrication method for semiconductor device using the jointing material, and semiconductor device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6182993A (en) * | 1984-09-29 | 1986-04-26 | Tanaka Kikinzoku Kogyo Kk | Composite brazing filler metal |
| JPS6197175A (en) * | 1984-10-17 | 1986-05-15 | 住友電気工業株式会社 | Bonded body of non-oxide ceramic and metal and manufacture |
| JPS62207773A (en) * | 1986-03-05 | 1987-09-12 | 三菱重工業株式会社 | Method of joining ceramics |
-
1986
- 1986-08-07 JP JP18549586A patent/JPS6340775A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6182993A (en) * | 1984-09-29 | 1986-04-26 | Tanaka Kikinzoku Kogyo Kk | Composite brazing filler metal |
| JPS6197175A (en) * | 1984-10-17 | 1986-05-15 | 住友電気工業株式会社 | Bonded body of non-oxide ceramic and metal and manufacture |
| JPS62207773A (en) * | 1986-03-05 | 1987-09-12 | 三菱重工業株式会社 | Method of joining ceramics |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019098398A (en) * | 2017-11-29 | 2019-06-24 | パナソニックＩｐマネジメント株式会社 | Joint material, semiconductor device production method using joint material, and semiconductor device |
| US11476399B2 (en) | 2017-11-29 | 2022-10-18 | Panasonic Intellectual Property Management Co., Ltd. | Jointing material, fabrication method for semiconductor device using the jointing material, and semiconductor device |
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