JPS6339325A - Lamination of photosensitive dry film on base - Google Patents
Lamination of photosensitive dry film on baseInfo
- Publication number
- JPS6339325A JPS6339325A JP61143169A JP14316986A JPS6339325A JP S6339325 A JPS6339325 A JP S6339325A JP 61143169 A JP61143169 A JP 61143169A JP 14316986 A JP14316986 A JP 14316986A JP S6339325 A JPS6339325 A JP S6339325A
- Authority
- JP
- Japan
- Prior art keywords
- base
- substrate
- rolls
- laminating
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003475 lamination Methods 0.000 title description 4
- 238000010030 laminating Methods 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 239000011889 copper foil Substances 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
Landscapes
- Photosensitive Polymer And Photoresist Processing (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野ン
本発明は、プリント配線板の回路形成工程に於いて、感
光性ドライン、イルムを基板にラミネ−1する方法に関
すイ)ものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to a method of laminating photosensitive lines and ilms onto a substrate in the process of forming a circuit on a printed wiring board.
(従来の技術フ
プリント配線板の回路形成U、”、 4%に於い−(感
光性ドライフィルムを基板にIt、!、リイ・1けろ際
第2図に示す様に、フィルム巻き出し[」−ル23より
保護フィルムを巻き取りな力・ら、ラミネート「]−ル
罠工り、基板全フランジし、加熱、加用[ながら、基板
上下[ni K貼り(・Iけでいく。−蝦に上下のラミ
ネートロール(工、′1イ11.f双]圧され、上下の
ロールが接触した秋!^にl「っている。第2図に於て
21は基板、22Qコ一対のラミネー IO−ル、23
は感光性ドライフィルム巻キ出しロール、24は保膿フ
ィルム巻き取りロール、25は加圧用アンクランプ、2
6は感光(’l ト’ライフィルムである。(Circuit formation U,", 4% of conventional technology printed wiring board) - Wind up the protective film from the base 23, laminate it, wrap the entire board, heat and apply it. The upper and lower laminating rolls (English, '1, 11. Laminaire IO-Rule, 23
2 is a photosensitive dry film unwinding roll, 24 is a purulent film winding roll, 25 is an unclamp for pressurization, 2
6 is a photosensitive ('l try' film).
(発明が解決しようとする問題点)
この工うに接触し、加圧されている一幻のうミネートロ
ール間に基板を投入する際、基板厚みが厚い場合あるい
は基板端部に銅箔 エリ等がある場合、基板のエツジに
よりラミネートロール表面にキズ、ヘコミ等をつけるこ
とがある。(Problem to be Solved by the Invention) When a board is placed between the lamination rolls that are in contact with this mechanism and are pressurized, if the board is thick or there is a copper foil edge etc. at the edge of the board. In some cases, the edges of the substrate may cause scratches, dents, etc. on the surface of the laminating roll.
ラミネートロール表面にキズ、ヘコミ等があるとフィル
ム貼り付は時に、フィルムと基板の間に気泡、シワ等が
はいる原因となる。If there are scratches, dents, etc. on the surface of the laminating roll, the adhesion of the film may sometimes cause air bubbles, wrinkles, etc. to appear between the film and the substrate.
本発明は基板の端部によりラミネートロールが損傷を受
けないラミネート装置を提供するものである。The present invention provides a laminating apparatus in which the laminating roll is not damaged by the edge of the substrate.
(問題点を解決するための手段)
本発明では基板に感光性ドライフィルムを貼り付ける際
、基板のエツジによりラミネートロールをキズ付けぬよ
うフィルム貼り付は時以外は、上下のラミネートロール
を接触させずあるいはロールが接触していても圧力をか
けない状態にしておくよ5にする。(Means for Solving the Problems) In the present invention, when pasting a photosensitive dry film onto a substrate, the upper and lower laminating rolls are brought into contact with each other except when the film is pasted to prevent the edges of the board from damaging the laminating roll. Set it to 5 so that no pressure is applied even if the rollers or rollers are in contact with each other.
第1図により説明する。This will be explained with reference to FIG.
第1図+AI (BI K示すように通常は、ラミネー
トロール13を非接触あるいは接触していても圧力をか
けない状態にしておき、基板11前端を・ ラミネート
ロール投入側に設けた、非徽触式あるいは接触式の検出
器22により、検出し、基板前端が、上下ラミネートロ
ール軸脚Aを通過した直後にロール13に圧力をかけ、
基板11をクランプする工う、タイマニ等を介しタイミ
ングをとり、フィルム15を貼り付けていく。Figure 1 + AI (BIK As shown in the figure, normally the laminating rolls 13 are kept in a non-contact state or in a state where no pressure is applied even if they are in contact, and the front end of the substrate 11 is placed in a non-contact type on the laminating roll input side. Immediately after the front end of the substrate passes through the upper and lower laminating roll shaft legs A, pressure is applied to the roll 13.
The substrate 11 is clamped and the film 15 is pasted at the right time using a timer or the like.
さらに第1図(C)に示すように前述と同様の方式で基
板11後端を検出し基板後端が、上下ラミネートロール
13軸巌を通過する直前にロール13をアンクランプあ
るいは圧力を抜いた状態にする。この動作を投入される
基板毎にくり返す。Furthermore, as shown in FIG. 1(C), the rear end of the substrate 11 was detected using the same method as described above, and the roll 13 was unclamped or the pressure was released just before the rear end of the substrate passed through the shafts of the upper and lower laminating rolls 13. state. This operation is repeated for each board to be inserted.
このように本発明に於ては、 ■ 投入された基板を反射式九′声管が感知する。In this way, in the present invention, ■The reflective nine-tone tube detects the inserted board.
■ 基板前端感知後、タイマーでタイミングを取り、上
下ロール軸&!通過後基板をクランプし、ラミネートを
開始する。■ After sensing the front edge of the board, set the timing with a timer and move the vertical roll axis &! After passing, the substrate is clamped and lamination begins.
■ 基板後端感知後、別タイマーでタイミングをとり、
基板後端が軸線通過直前に基板をアンクランプする。■ After sensing the rear edge of the board, set the timing with a separate timer,
Unclamp the board just before the rear end of the board passes the axis.
ように1−だものである。As in, it is 1-.
(発明の効果)
この方法により、厚い基板また基板端部に、#箔カエリ
等がある基板についてもラミネートロールキズ等を付け
ることなく、感光性ドライフィルムの貼り付けが行なえ
る。(Effects of the Invention) By this method, a photosensitive dry film can be attached to a thick substrate or a substrate with # foil burrs or the like on the edge of the substrate without causing lamination roll scratches or the like.
第1図(5)tB)tcJは本発明の方法を示すラミネ
ート装置の要部の側面図、第2図tA)tB)は従来の
方法を示すラミネート装置のそれぞれ側面図、正面図で
ある。
符号の説明
11、基板
12、基板検出センサ
1& ラミネートロール
14 加圧用エアシリンダーFIG. 1(5)tB)tcJ is a side view of the main parts of a laminating apparatus showing the method of the present invention, and FIGS. Explanation of symbols 11, substrate 12, substrate detection sensor 1 & laminating roll 14 Pressurizing air cylinder
Claims (1)
ムを基板に連続的押圧する感光性ドライフィルムを基板
にラミネートする方法に於て、ラミネートロールを非接
触あるいは接触していても圧力をかけない状態にしてお
き、基板前端をラミネートロール投入側に設けた、検出
器により、検出し基板前端が、上下ラミネートロール軸
線を通過した直後にロールに圧力をかけ、基板をクラン
プするようにし更に、基板後端を検出し基板後端が、上
下ラミネートロール軸線を通過する直前にロールをアン
クランプあるいは、圧力を抜いた状態にするようにした
ことを特徴とする感光性ドライフィルムを基板にラミネ
ートする方法。1. In the method of laminating a photosensitive dry film onto a substrate by continuously pressing the photosensitive dry film onto the substrate using a pair of laminating rolls, the laminating rolls are kept in a non-contact state or in a state where no pressure is applied even if they are in contact. Then, the front end of the substrate is detected by a detector installed on the input side of the laminating roll, and immediately after the front end of the substrate passes through the axes of the upper and lower laminating rolls, pressure is applied to the roll to clamp the substrate. A method for laminating a photosensitive dry film onto a substrate, characterized in that the rear end of the substrate is detected and the roll is unclamped or the pressure is released just before the rear end of the substrate passes through the axes of the upper and lower laminating rolls.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61143169A JPS6339325A (en) | 1986-06-19 | 1986-06-19 | Lamination of photosensitive dry film on base |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61143169A JPS6339325A (en) | 1986-06-19 | 1986-06-19 | Lamination of photosensitive dry film on base |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6339325A true JPS6339325A (en) | 1988-02-19 |
Family
ID=15332520
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61143169A Pending JPS6339325A (en) | 1986-06-19 | 1986-06-19 | Lamination of photosensitive dry film on base |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6339325A (en) |
-
1986
- 1986-06-19 JP JP61143169A patent/JPS6339325A/en active Pending
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