JPS6337962A - Base paper plate-making apparatus for mimeograph and printing apparatus - Google Patents

Abstract

PURPOSE:To obtain good printing quality and perforation quality, by a method wherein not only the time until a perforation pulse is applied to a thermal head after a drive pulse is applied but also the time until a base paper feed drive pulse is applied after the finish of application are set, and the driving condition at the time of thermal printing and that at the plate-making time of a stencil are set independently. CONSTITUTION:When a perforation pulse is inputted to a signal electrode 1d, a current flows between said signal electrode 1d and common electrodes 1c on both sides thereof only for the time corresponding to the width of the perforation pulse and a heat generating resistor 1a generates head and the perforation layer 5a of stencil base paper 5 is melted to form perforations. Since the resin film at the peripheral part of each of perforations becomes a high temp. molten state, said film becomes easy to adhere the surface of the abrasion resistance layer 1b being the upper layer of the heat generating resistor 1a. At the point of time when Tb elapses after the application of the perforation pulse, a drive pulse is applied to a stepping motor and the stencil base paper 5 is fed by one line. At the point of time when Ta elapses after the application of the drive pulse to the stepping motor, the perforation pulse is inputted to a specific signal electrode 1d. By setting Ta to 5.83msec or less and Tb to 0.83msec or more, the adhesion of the molten resin of the stencil paper to a thermal head is reduced to delay the deterioration of said head.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a mimeograph base paper plate-making device that thermally perforates base paper using a thermal head, and a printing device that prints using this plate-made base paper.

11. Recently, mimeograph printing systems have become popular. This is because when printing a large number of sheets, the running cost is lower than that of a copying machine. Another advantage is that plate making can be done at a lower cost and easier than other printing systems.

As a mimeograph printing system, for example, there is a flash exposure type paper plate making device. In this process, the manuscript is superimposed on the base paper and then flash-engraved. However, this method has problems such as the plate-making work is time-consuming, the original is easily damaged, and color originals with poor infrared absorption are more likely to suffer from plate-making defects.

In addition, paper plate making machines using wire dot printers or duplex type (copy type) printers have already been put into practical use. These have the advantage of making it easier to create manuscripts by combining them with a word processor, for example.

However, the former paper plate making machine using a wire dot printer has problems such as slow plate making speed and noisy sound during plate making, while the latter paper plate making machine using a double electric printer also has slow plate making speed and produces a bad odor during plate making. There is a problem that occurs.

As a solution to the above problem, Japanese Unexamined Patent Publication No. 55-103
No. 957 proposes a plate-making process using a thermal head. According to this plate-making process using a thermal head, a base paper is thermally perforated in the form of an image, the perforated base paper (master) is superimposed on a paper, and ink is supplied from the mask side to perform printing.

However, the problem with this plate-making process is that the perforation layer of the base paper adheres to the surface of the heating resistor of the thermal head, reducing the perforation quality. As a means to solve this problem, in the above publication, paper is interposed between the thermal head and the base paper, or the thermal head is brought into contact with the base paper layer side of the base paper, so that the thermal head and the perforated layer of the base paper are directly connected. There are ways to avoid contact. However, in these solutions, most of the heat from the thermal head is reflected, absorbed, or diffused in the paper or base paper layer of the base paper between the thermal head and the perforated layer, and the heat is not transmitted as information reaching the perforated layer. The amount of heat generated is very small, and the perforation quality is significantly lower than when the perforation layer is directly thermally perforated. Therefore, there has been a strong desire for a method that does not cause the perforated layer to adhere to the thermal head even when the perforated layer is directly thermally perforated with a thermal head.

The inventor investigated the cause of the deterioration in perforation quality in the plate-making process using the thermal head, and first completed the plate-making process using the thermal head. Next, the optimum thermal head driving conditions were determined through experiments for both thermal printing and stencil plate making, and the present invention was completed.

An object of the present invention is to improve the perforation quality by preventing the base paper from adhering to the thermal head during perforation of the base paper.

Means for Solving the Problems In order to achieve the above object, the mimeograph base paper plate making device of the present invention includes a base paper plate making mechanism that perforates the mimeograph base paper using a thermal head, and feeds the base paper at least during base paper plate making. The time from applying a driving pulse to the driving means until applying a drilling pulse to the thermal head is 5.8.
3 ssec or less, and the time from the end of the application of the punching pulse to the application of the base paper transport drive pulse is set to 0.83 msec or more.

The printing apparatus of the present invention includes a base paper plate-making material mechanism that perforates base paper for a mimeograph using a thermal head, and at least during base paper plate-making, a perforation pulse is applied to the thermal head after applying a driving pulse to a drive means for feeding the base paper. The time until application is 5.83ISeC or less, and the time from application of the perforation pulse to application of the base paper transport drive pulse is 0.
．． 83 msec or more, a thermal printing mechanism for performing thermal printing using a thermal head, and means for independently setting thermal head driving conditions for thermal printing and stencil plate making.

Operation According to the mimeograph base paper making device of the present invention, at least during stencil making, the time Ta from the application of the feeding drive pulse to the application of the penetration perforation pulse of the stencil base paper (base paper) at the timing of perforation by the thermal head is set to 5.83 msec or less and The time Tb from the end of the application of the perforation pulse to the application of the stencil paper feed driving pulse is set to 0.83n+sec or more. This reduces the adhesion of the molten resin of the stencil base paper to the thermal head, and therefore delays the deterioration of the thermal head.

Furthermore, the printing apparatus of the present invention includes means for independently setting the thermal head driving conditions for thermal printing and stencil plate making.

Thereby, the thermal head drive can be switched between thermal printing and stencil plate making, so that independent control can be performed during thermal printing and stencil plate making. Therefore, even if the ink donor films have different printing characteristics or the stencil base papers have different perforation characteristics, it is possible to always consistently obtain good thermal print quality and stencil perforation quality, that is, mid-stencil quality. can.

Example Embodiments of the present invention will be described based on the drawings.

Figure 1 shows an embodiment of a stencil plate-making device that can also be used as a thermal printer. When printing a small number of copies, a thermal print mechanism is activated to create a desired number of prints, and when a large number of copies are to be printed, a stencil plate-making mechanism is activated to create an original plate for stencil printing, and then a medium version of the desired number of copies is created.

First, the stencil making mechanism will be explained.

When a stencil base paper is inserted through the stencil base paper insertion slot 18 and the leading edge of the stencil base paper hits the timing roll 13, a signal from the stencil base paper sensor 19 activates a thermal head isolating means (not shown), and the thermal head 1 moves to the position shown in the figure. , and a slight gap is created between it and the platen roll 2. Eating imming roll 1 after t1 seconds
3 rotates and the stencil base paper is rotated at a predetermined time III (
t2 seconds) transport. After the predetermined time III (t2 seconds) has elapsed, the timing roll 13 stops rotating, the thermal head isolation means (not shown) stops operating, and the thermal head 1
moves downward in the figure, and a predetermined pressure is applied between it and the platen roll 2. At this point, click "" on the operation panel (not shown).
The plate making READYJ lamp (not shown) lights up. When you press the "Prepress" button (not shown), the "Prepress 1" button (not shown) lights up and starts receiving data signals from the host computer (not shown). At the same time, as the platen roll 2 rotates, the stencil base paper and the ink donor film 3 are overlapped and conveyed in the six directions of the arrows.

Incidentally, in synchronization with the rotation of the platen roll 2, the timing roll 13, the stencil base paper registration roll 14, and the ink donor supply roll 6 are driven so that slack or excessive tension does not occur in the stencil base paper and the ink donor film 3.

The stencil base paper is separated from the ink donor film 3 by a stencil base paper registration roll 14, and is discharged from a stencil base paper discharge tray 16 by a stencil base paper discharge roll 15. The ink donor film 3 is wound from the ink donor film take-up roll 7 to the ink donor film supply roll 6.

In addition, the stencil paper insertion slot 18 of the timing roll 13
The stencil base paper sensor 19 installed on the side detects the trailing edge of the stencil base paper, and after t3 seconds have elapsed, the output of the thermal head 1 stops, and furthermore, at t4 seconds, all drives stop, and the message "Pre-pressing" is displayed. ” lamp (not shown) goes out.

FIG. 3 shows a block diagram for switching the driving conditions of the thermal head 1. The switching circuit 31 includes a knob for setting the applied voltage to the thermal head for thermal printing and stencil plate making, and a dip switch for setting the applied pulse width. The applied voltage and the applied pulse width are set according to the resistance value of the thermal head 1, the thermal print characteristics of the ink donor film 3, and the perforation characteristics of the stencil base paper. On the other hand, when the "thermal print button" or "stencil plate making button" is pressed, a signal is emitted from the drive start signal generation circuit 30, the switching circuit 31 is activated, and the thermal head 1 is set to either thermal print or stencil plate making. A drive signal based on the drive condition is applied.

Next, the thermal (thermal transfer) printing mechanism will be explained based on Fig. 1.First, the operation panel (not shown)
When you press the "Print" button (not shown) on the top, the "Printing" lamp (not shown) lights up and the paper supply roll 8
rotates and conveys one sheet of paper 4 until the leading edge of the sheet 4 hits the paper registration roll 9 and a slight loop is formed in the sheet 4. 15 seconds after the paper sensor 20 in front of the paper registration roll 9 detects the leading edge of the paper 4, the paper supply roll stops rotating, and at the same time, the paper registration roll 9 and the paper transport roll 1o start rotating, and then the platen Roll 2 and ink donor film take-up roll 7 start rotating. After 16 seconds, the tip of the paper 114 reaches the printing area, starts receiving data signals from the host computer (not shown), starts printing from the thermal head 1, and the paper 4 is connected to the ink donor film 3. The sheets are overlapped and fed in the direction of arrow B, separated from the ink donor film 3 by the paper separation roll 17, passed through the paper ejection roll 11, and ejected to the paper ejection tray 12. The output of the thermal head 1 stops t1 seconds after the paper sensor 2o detects the trailing edge of the paper 4, and after another 18 seconds, all drives stop, the "Printing" lamp (not shown) goes out, and the "Printing" lamp (not shown) goes out.
The print READYJ lamp lights up.

Furthermore, when the stencil plate making mechanism is operating due to the plate making/printing switching circuit, the thermal transfer printing mechanism will not operate even if the "Print" button (not shown) is pressed, and the thermal transfer printing mechanism will not operate even if the "Print" button (not shown) is pressed. When the mechanism is in operation, the stencil plate-making mechanism does not operate even if a stencil base paper is inserted from the base paper insertion 018.

The images on the stencil original plate and the thermal transfer print must be mirror images of each other, but as shown in FIGS. 8(A) and 8(B), the running direction A of the stencil base paper 5 and the thermal transfer print A mirror image relationship can be obtained by making the running direction B of the paper 4 opposite.

FIG. 4 shows an enlarged conceptual diagram of the hole punched by the thermal head 1. Thermal head 1 has heat storage 111e (Sin□, 4) on glazed alumina (A), 03) of base 1f.
0u thickness), common electrode 1c and signal electrode 1d (4μ thickness) etched with Au film, heating resistor 1a (PbO'5i
RuO2 particles adhere to the surface of the 02-8203 series glass particles, the thickness is 15-25μ, and the wear resistance II l b (S
i 02 ・A].

03.4~10μ thick). Here, heat storage 111e, Au film, heating resistor 1a, and wear resistance ll!
1b is formed by screen printing, drying, and baking.

The stencil base paper 5 is made by laminating a stretched synthetic resin film (perforated layer>5a) to a porous base 115b.The stretched synthetic resin film 5a may be made of, for example, vinylidene chloride copolymer resin, polyvinyl chloride, or vinyl chloride based copolymer resin. Copolymer resins, polyethylene terephthalate, boria 0 pyrene, polystyrene, or synthetic resins such as polyethylene and ethylene vinyl acetate copolymers are stretched by the ink flecimin method or the two-wheel stretching method.
A thickness of μ is used. Examples of the porous base layer 5b include gauze made of fibers such as tetron, nylon, silk, rayon, and cotton, and nonwoven fabrics made of glass vA fiber, asbestos, natural or artificial lI fiber, and other materials with relatively melting points. A material with a high hardness, excellent printing durability, and good ink permeability is used. Stretched synthetic resin film 5a and porous base IW5
For bonding with b, thermoplastic synthetic resin solutions commonly used as adhesives, such as vinyl acetate copolymers, vinyl chloride copolymers, and vinylidene chloride copolymers, are used.

A partially enlarged view of the heating resistor is shown in FIG. When a perforation pulse is input to a specific signal electrode 1d, a current flows between the signal electrode 1d and each of the common electrodes 1c on both sides for a time equal to the perforation pulse width, and the heating resistor 1a generates heat (300 to 400
℃). The heat perforates the stencil base paper 5 ff5a
However, since the perforated layer 5a is made of a stretched resin film, the holes are further enlarged. Under optimal drilling conditions, the final hole size is 125-175μ in diameter (
However, in the case of a thermal head with 8 dots per shoe). The resin film around the hole has been in a high temperature and molten state for a while, and has a characteristic that it is very easy to adhere to the wear-resistant nib surface of the upper layer of the heating resistor 1a. After T b (msec) after the application of the punching pulse, a driving pulse is applied to the stepping motor, and the stencil base paper 5 is fed one line. At this time, the molten resin film around the perforation portion rubs against the surface of the wear-resistant layer. And new perforation FMS
The residual heat of the aifi heating resistor 1a preheats it and makes it easier to perforate. T a (msec) after the driving pulse is applied to the stepping motor, a drilling pulse is input to the specific signal electrode 1d. The above steps are repeated.

Even if the applied power does not cause deterioration of the heating resistor 1a in the case of thermal paper printing, deterioration occurs in the case of perforation of the stencil base paper 5, which is considered to be caused by the molten resin around the perforations.

In other words, one idea is that if Tb is short, the molten resin will rub and adhere to the surface of the wear-resistant layer 1b without being solidified, and this will act as an adhesive and the perforated layer 5a will stick to the surface of the wear-resistant layer 111b. Next, as the stencil base paper 5 is fed, the wear-resistant layer 1b and the heating resistor layer 1a are peeled off. At this time, T
If a is long, the perforated layer will be firmly fixed.

Another way of thinking is that when the perforated layer 5a rubs the surface of the abrasion resistant layer 1b, the molten resin of the adhesive of the perforated layer 5a and the paper base l115b1 perforated layer 5a is applied once to the surface of the abrasion resistant layer 1b, and then the abrasion resistant layer 111b Based on the premise that Tb penetrates into the heating resistor 1a through the pinhole, the longer Tb is, the greater the amount of penetration, and the shorter Tb is, the lower the viscosity of the molten resin, so the penetration speed is faster. be.

According to the experimental results, Ta≦0, 83 msec.

Under the condition of the perforation timing falling within the range of Tb≧0.83 ssec, the quality of the mid-year product using the original plate after plate making of 1,000 sheets (400 am+/sheet, 8 pulses/ttm) was good.

However, if Ta is made too short, preheating of the perforated layer 5a will be insufficient and the perforation quality will deteriorate. Ta≧0゜F33ms
ec seems to be appropriate from the perspective of perforation quality, but the perforation quality can be improved by increasing the pressing force of the platen roll 2 and by increasing the perforation layer 5.
Ta·1n cannot be determined unconditionally because it can be improved by reducing the all thickness. Also, the number of drive divisions of the thermal head 1 is 1! Although it depends on the source capacity, the maximum number of divisions is also determined from Ta-1aX. Once the maximum number of divisions is determined, Tb-1aX is also determined automatically. For example, the maximum number of divisions for a puncturing pulse width Tw = "11 sec is 6, and Tb - Iax -5,83 (
Tb ≦5.83), Tw = 2 m5cc, the maximum number of divisions is 3, Tb ・■ax -4,83 (Tb≦4
．． 83).

As shown in FIG. 7, the feeding of the stencil base paper 5 is actually carried out with a certain time delay from the application of the stepping motor drive pulse. This is stencil base paper 5.
The causes include slippage between the platen rolls 2, expansion and contraction of the stencil base paper 5, and mechanical alignment. Here, the area of the profile of the moving speed of the stencil base paper 5 is the moving amount of one step. In short, the time Ta' from when the stencil base paper 5 completely stops to the application of the perforation pulse, and the time T from the time the stencil base paper 5 starts moving after the perforation pulse is applied.
It is desirable if b' is limited. However, this delay m varies depending on the configuration of the driving device, the materials of the stencil base paper 5 and the platen roll, etc.

Generally △Ta −Ta −Ta′ ≧0ΔTb −
Tb - Tb' ≦0, and what is important here is that Δ7a and 1ΔT
Even if b l is large, if 1"a and Tb are within a specific range, deterioration of the heating resistor 1a can be prevented. Even if Ta and Tb are within a specific range, and the heating resistor 1a is If the drilling quality is poor even though the surface temperature is at the normal drilling temperature,
The cause of this is the large feeding delay of the stencil base paper 5, and ΔT
This is because a is large. Limiting Ta and Tb is practical as described above, and is also effective in taking appropriate measures when a problem occurs.

Figure 9 shows 7a, the number of plates made until the white streaks start, and the number 10.
The figure shows the relationship between Ta and the printing density for the 1,000th original plate, FIG. 11 shows the relationship between Tb and the number of plates made, and FIG. 12 shows the relationship between Tb and the printing density.

Figure 2 shows the configuration of the thermal head drive system.

FIG. 6 does not show an example of drilling timing. When the stepping motor drive pulse PM is input to the stencil paper feeding drive system 46, the stencil paper is fed by one line in the sub-scanning direction. On the other hand, data is sequentially taken into the shift register 44 at the timing of transfer L1 and shifted to the right. After the data transfer for one line is completed, the data are latched all at once by the latch circuit 45 in response to the LOAD signal. After that, recording pulse signals (Psi to PS4) are sequentially given, and the pulse width T
Each of the heating resistors 42a to 42d is driven according to the latched recording data for the time period w, and the stencil base paper is perforated. After punching one line, a stepping motor drive pulse PM is input and the stencil paper is fed one line in the sub-scanning direction. The above operations are repeated.

Note that some thermal heads 1 have the common electrode 1C divided into two parts, thereby doubling the actual printing density. In the case of perforation of the stencil base paper, the heating resistor 42 in which the adjacent heating resistor 42 is in the perforated state is subjected to the same degree of stress as in the perforated state even if the heating resistor 42 is not in the perforated state.

Now, with the thermal head drive system shown in Figure 2 and the printing timing shown in Figure 6, the print pulse width and applied power (applied voltage is 1L) are determined for each quality of thermal print and stencil plate making.
Let's see how ltl) affects this. Of course, the perforation quality of the stencil base paper is determined by the print quality obtained by applying it to a stencil printing machine. If the printing energy is insufficient, "line breaks" will occur, and if there is too much, RA will occur.
A gap between the two occurs. Experimental results are shown in FIGS. 13 and 14.

The experimental conditions are as follows.

1, 6 71SOC≦Ta −Tb≦4.
17isec experimental machine; Modified machine output cover turn for Xerox TC240; 250μ width ladder pattern ink donor film: Ink donor film for Xerox TC240 (manufactured by Dainippon Printing) Stencil base paper; RISOGRAPH MASTER H-1 (manufactured by Riso Kagaku) Stencil printing machine; Horii Rotary 1000 (manufactured by Horii Mutsushado) As shown in FIGS. 13 and 14, the optimum range of printing conditions is different between thermal printing and stencil plate making.

The problem here is that the resistance value of each heating resistor in the thermal head varies (usually ±30%), so even if the applied voltage is constant, the applied power varies, resulting in white spots on the printed image. That's true. Therefore, it is necessary to reduce the influence of this variation in applied power as much as possible. To do this, select the print quality and the pulse width and applied power that correspond to the center of the good print quality range.
The thermal head may be switched and driven with the optimum pulse width or applied power for each of thermal printing and stencil plate making. For example, if the applied pulse width is fixed at 1.01 sec, the applied power during thermal printing is 0.7
75±0.125W1 stencil plate making: 1.025±
On the other hand, for example, if the applied force is fixed at 0.9 W, the applied pulse width during thermal printing is approximately 0.5 to 1. Q msec, when making a stencil, it is approximately 1.0 to 2.0 ssec. Of course, it is also good to set both the applied power and the applied pulse width to υ1tl.

In addition to the thermal head drive conditions described above, commonly known thermal head drive parameters such as drilling timing and duty ratio must be adjusted in order to obtain good print quality and punching quality.
blJwJ may be used, or a combination of these parameters may be controlled.

Examples 1 and 2 and Comparative Examples 1.2 and 3 will be compared and explained below.

(Example 1) Experimental conditions are as follows: Thermal head: KH106-6 (R-340Ω, manufactured by Rohm) Ink donor film: FX, TC240 (manufactured by Dainippon Printing) Stencil base paper: RISOGRAPH MASTER (manufactured by Riso Kagaku) Print pattern: 250μ width ladder pattern and solid thermal head 4-division drive printing timing: 1, 57msec≦Ta≦4.17a+5ec
1, 67msec≦Tb≦4.17IIsec Printing pulse width: 0.83msec (Common to thermal print and stencil making) Applied voltage: Thermal print: 18.5V Stencil making: 20.9V Stencil middle: Horii Rotary 1000 (Horii Mimeshado !J).

Then, 1,000 sheets of thermal printing and 1,000 sheets of stencil printing were performed alternately, and the quality evaluation was 1.000.
This was done for the stencil of the 1st thermal print and 1,000th original plate.

As a result, both the thermal print and the stencil print were of good quality, with no broken lines or clogging between a's.

(Example 2)' Experimental conditions were as follows: Stencil plate making; Perforation timing: 2, □ msec≦Ta-Tb≦5.01 sec, Perforation pulse width: 1, 0 msec, Applied voltage: 20.4V.

Other conditions were the same as in the example.

As a result, both the thermal print and the stencil print had good quality, with no line breakage or line spacing.

(Comparative example 1) The experimental conditions were Stencil making; Applied voltage: 18.5V Other conditions were the same as in Example 1.

The stencil printing quality was extremely poor due to line breakage.

Thermal print quality was good.

(Comparative Example 2) The experimental conditions are: Printing timing: 2, □msec≦Tal-Tb≦5.0msec Printing pulse width: 1, 0ISeC Applied voltage: 20.4V (The above is common to thermal printing and stencil platemaking)Others are examples I did the same thing.

Although the stencil printing quality was good, the thermal printing quality was extremely poor due to clogging between lines.

(Comparative Example 3) The experimental conditions were as follows: Stencil printing; Punching timing: Q, 5a+sec≦Ta-Tb≦5.5130C Other conditions were the same as in Example 2.

In both thermal printing and stencil printing, line thinning and white streaks, which are thought to be due to deterioration of the heating resistor of the thermal head, occurred significantly.

Effects of the Invention According to the present invention, the deterioration of the thermal head during stencil plate making is significantly reduced, and furthermore, the thermal head can be driven under optimal printing conditions for the ink donor film and the stencil base paper. Good thermal print quality and stencil perforation quality! ? It will be done.

In addition, you can switch between thermal printing for small numbers of copies and stencil printing for large numbers of copies at the touch of a button, making it possible to build a printing system with low running costs for small to large numbers of copies. It becomes possible.

[Brief explanation of drawings]

Fig. 1 is a schematic configuration diagram showing an embodiment of a thermal printer/stencil plate-making device to which the present invention is applied, Fig. 2 is a circuit configuration diagram showing the configuration of the drive system of the thermal head, and Fig. 3 is a circuit diagram showing the configuration of the thermal head drive system. Fig. 4 is an enlarged block diagram of the main parts showing the state of drilling by the thermal head, Fig. 5 is an enlarged view of a part of the heating resistor, Fig. 6 is a block diagram showing the means for switching the driving conditions. The figure is a time chart showing the printing timing of the thermal head. Figure 7 is a time chart showing the relationship between stepping motor drive pulses, stencil base paper movement speed, and printing pulses. Figures 8 (A) and 8 (B) is an explanatory diagram to explain that the images of the original stencil and the thermal transfer print are mirror images of each other, and Figures 9, 10, 11, and 12 illustrate the relationship between perforation timing and stencil printing quality. Figures 13 and 14 are graphs showing the relationship between thermal head printing conditions and print quality. DESCRIPTION OF SYMBOLS 1... Thermal head, 2... Platen roll, 3... Ink donor film, 4... Paper, 5...
...Stencil base paper (base paper), 12: Paper output tray, 16: Stencil base paper output tray, 18: Stencil base paper insertion slot, 41: Thermal head, 43: Thermal head drive Circuit, 46... Original paper feeding drive system.

Claims (2)

[Claims] (1) Equipped with a base paper plate-making mechanism that perforates base paper for mimeograph using a thermal head, and at least during base paper plate-making, the time from applying a drive pulse to the driving means for feeding the base paper to applying the perforation pulse to the thermal head. 5.8
3 msec or less, and the time from the end of the application of the perforation pulse to the application of the base paper transport driving pulse is set to 0.83 msec or more. (2) Equipped with a base paper plate-making mechanism that perforates the base paper for mimeograph using a thermal head, and at least during base paper plate-making, the time from applying a drive pulse to the driving means for feeding the base paper to applying the perforation pulse to the thermal head. 5.8
3 msec or less, and the time from the end of the application of the perforation pulse to the application of the base paper feed drive pulse is set to 0.83 msec or more, and a thermal print mechanism is provided for thermal printing with a thermal head, and the time is A printing apparatus characterized by comprising means for independently setting thermal head drive conditions.