JPS63260838A - Glass powder adhesive sheet and production of substrate glazed ceramic using said sheet - Google Patents
Glass powder adhesive sheet and production of substrate glazed ceramic using said sheetInfo
- Publication number
- JPS63260838A JPS63260838A JP9599887A JP9599887A JPS63260838A JP S63260838 A JPS63260838 A JP S63260838A JP 9599887 A JP9599887 A JP 9599887A JP 9599887 A JP9599887 A JP 9599887A JP S63260838 A JPS63260838 A JP S63260838A
- Authority
- JP
- Japan
- Prior art keywords
- glass powder
- sheet
- thermoplastic resin
- adhesive sheet
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 title claims abstract description 64
- 239000000843 powder Substances 0.000 title claims abstract description 40
- 239000000758 substrate Substances 0.000 title claims abstract description 39
- 239000000919 ceramic Substances 0.000 title claims abstract description 34
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 28
- 239000000853 adhesive Substances 0.000 title claims abstract description 25
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 229920005989 resin Polymers 0.000 claims abstract description 33
- 239000011347 resin Substances 0.000 claims abstract description 33
- 239000011230 binding agent Substances 0.000 claims abstract description 23
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 23
- 238000005979 thermal decomposition reaction Methods 0.000 claims abstract description 13
- 239000000203 mixture Substances 0.000 claims abstract description 7
- 239000000126 substance Substances 0.000 claims abstract description 6
- 238000002844 melting Methods 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 13
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 11
- 238000003825 pressing Methods 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 4
- 230000001747 exhibiting effect Effects 0.000 claims description 3
- 230000008018 melting Effects 0.000 abstract description 2
- 238000001354 calcination Methods 0.000 abstract 1
- 238000010304 firing Methods 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 8
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 239000002270 dispersing agent Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- 239000013032 Hydrocarbon resin Substances 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 229920006270 hydrocarbon resin Polymers 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000006060 molten glass Substances 0.000 description 2
- 239000003208 petroleum Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920001059 synthetic polymer Polymers 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- WTARULDDTDQWMU-RKDXNWHRSA-N (+)-β-pinene Chemical compound C1[C@H]2C(C)(C)[C@@H]1CCC2=C WTARULDDTDQWMU-RKDXNWHRSA-N 0.000 description 1
- WTARULDDTDQWMU-IUCAKERBSA-N (-)-Nopinene Natural products C1[C@@H]2C(C)(C)[C@H]1CCC2=C WTARULDDTDQWMU-IUCAKERBSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical group CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- WTARULDDTDQWMU-UHFFFAOYSA-N Pseudopinene Natural products C1C2C(C)(C)C1CCC2=C WTARULDDTDQWMU-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 239000011354 acetal resin Substances 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229920006271 aliphatic hydrocarbon resin Polymers 0.000 description 1
- XCPQUQHBVVXMRQ-UHFFFAOYSA-N alpha-Fenchene Natural products C1CC2C(=C)CC1C2(C)C XCPQUQHBVVXMRQ-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 229930006722 beta-pinene Natural products 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 229940013317 fish oils Drugs 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 229910052839 forsterite Inorganic materials 0.000 description 1
- LCWMKIHBLJLORW-UHFFFAOYSA-N gamma-carene Natural products C1CC(=C)CC2C(C)(C)C21 LCWMKIHBLJLORW-UHFFFAOYSA-N 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920001289 polyvinyl ether Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/4505—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements characterised by the method of application
- C04B41/4511—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements characterised by the method of application using temporarily supports, e.g. decalcomania transfers or mould surfaces
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Electronic Switches (AREA)
- Ceramic Products (AREA)
- Surface Treatment Of Glass (AREA)
- Glass Compositions (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業との利用分野〉
本発明はサーマルヘッドや電子回路基板などに使用され
るグレーズドセラミック基板の製造に有用なガラス粉末
接着シート及び該シートを用いてなるグレーズドセラミ
ック基板の製法に関するものである。[Detailed description of the invention] <Field of industrial application> The present invention relates to a glass powder adhesive sheet useful for manufacturing glazed ceramic substrates used for thermal heads, electronic circuit boards, etc., and a glazed ceramic substrate using the sheet. This relates to the manufacturing method.
〈従来技術とその問題点〉
グレーズドセラミック基板は、セラミック基板の表面に
溶融ガラス#を均一に且つ薄く形成され九ものであり、
サーマルヘッドやハイブリッドICなどに主8として用
いられている。<Prior art and its problems> A glazed ceramic substrate is one in which molten glass is uniformly and thinly formed on the surface of a ceramic substrate.
It is mainly used in thermal heads, hybrid ICs, etc.
グレーズドセラミック基板面に形成される薄膜回路は1
通常真空蓋着法、スパッタリング法などによって形成さ
れた薄膜をフォトリソグラフィーによってバターニング
されて形成される。The thin film circuit formed on the glazed ceramic substrate surface is 1
It is usually formed by patterning a thin film formed by a vacuum lidding method, sputtering method, etc. by photolithography.
従って、溶融ガラスノー(グレーズ層)は、厚み及び位
置の精度が重要であるが1回路の精度を向とさせるため
には、とりわけ表面平担度が重要である。Therefore, for the molten glass layer (glaze layer), the thickness and positional accuracy are important, but in order to improve the accuracy of one circuit, the surface flatness is especially important.
これまで、グレーズ層は、セラミック基板面にガラスフ
リットとビヒクルからなるペースト状物をスクリーン印
刷法によって塗布し、これを焼成することによって形成
されるのが一般的であった。Hitherto, the glaze layer has generally been formed by applying a paste-like material made of glass frit and a vehicle to the surface of a ceramic substrate by screen printing and firing the paste.
しかし乍ら、この方法においては、目的とする厚みを一
回の操作で形成するのが困雌なために。However, with this method, it is difficult to form the desired thickness in a single operation.
多数回の塗布作業を行わなければならないという煩雑性
を有し、しかも塗布厚の精度が充分でないという欠点と
、塗布時に気泡を抱き込んだり、スクリーンが目づ!!
シしたシするために表面欠陥が生じるという欠点があっ
た。It is complicated because it requires multiple coating operations, and the coating thickness is not accurate enough, and it also traps air bubbles during coating and makes the screen visible! !
The disadvantage is that surface defects occur due to the hardening.
そこで、近時、ガラスフリットと有機バインダーとを主
成分とするガラス粉末シートを、ローラーを用いてセラ
ミック基板面に圧着し1次いで焼成する方法が提案され
ている(特開昭61−22682号公報)。Therefore, a method has recently been proposed in which a glass powder sheet containing glass frit and an organic binder as main components is pressed onto a ceramic substrate surface using a roller and then fired (Japanese Unexamined Patent Publication No. 61-22682). ).
この提案された方法にあっては、セラミック基板とガラ
ス粉末成形シートとの密着力が不充分なために、焼成工
程における昇温時に、有機バインダーの消失前に密着力
が喪失し、そのためにグレーズj■の端部が収縮し、端
部の厚みが厚ぐなるという欠点がある。この欠点は、グ
レーズIIIを全面に形成し厚くなった端部を切断除去
する場合は然程問題はないが、グレーズ層をパターン状
に形成する場合は重大な問題となるものである。In this proposed method, due to insufficient adhesion between the ceramic substrate and the molded glass powder sheet, the adhesion is lost before the organic binder disappears when the temperature is increased during the firing process, and the glaze is therefore lost. There is a disadvantage that the end of j■ shrinks and the thickness of the end becomes thicker. This drawback is not so much of a problem when glaze III is formed over the entire surface and the thickened edges are cut off, but it becomes a serious problem when the glaze layer is formed in a pattern.
そこで2セラミツク基板との密着力を上昇させるために
、有機バインダーの添加fk多くする方法と、該バイン
ダーをガラス転移温度(T、!i’)が低い物質を使用
する方法が考えられるが、前者の方法は、ガラス粉末成
形シートにおけるガラスフリットの充填密度が低下する
ために、焼成時にピンホールが発生し易く、′また後者
の方法は前記成形シートの物理的強度が低下し、ハンド
リングし難いものとなるものであった。Therefore, in order to increase the adhesion with the two-ceramic substrate, there are two methods: increasing the amount of organic binder added, and using a substance with a low glass transition temperature (T, !i') as the binder. The latter method reduces the packing density of the glass frit in the glass powder molded sheet, which tends to cause pinholes during firing, and the latter method reduces the physical strength of the molded sheet, making it difficult to handle. It was.
〈発明の目的〉
この発明は、セラミック基板面に、均一厚みのグレーズ
ノーを高精度、高歩留りに形成でき、しかも自動化し得
るガラス粉末接着シート及び該シートを用いてなるグレ
ーズドセラミック基板の製法を提供することを目的とす
ると共に、更にパターン状にグレーズ1ilを形成して
も端部での収縮によるhみ増加のない上記シート及び製
法を提供することを目的とするものである。<Purpose of the Invention> The present invention provides a glass powder adhesive sheet that can form a glaze nodule of uniform thickness on the surface of a ceramic substrate with high accuracy and high yield, and that can be automated, and a method for manufacturing a glazed ceramic substrate using the sheet. In addition, it is an object of the present invention to provide the above-mentioned sheet and manufacturing method which does not cause an increase in hness due to shrinkage at the edges even when a glaze 1il is formed in a pattern.
く問題点を解決するための手段〉
本発明者達はかかる従来技術の問題点を解決するために
鋭意研究の結果、ガラス粉末成形シートの表面に、加熱
加圧により良好な接着性を発揮する熱可塑性樹脂層を積
層によシ形成し、この樹脂mt−介してセラミック基板
面に熱圧着して焼成することrCより、目的とするグレ
ーズドセラミック基板を得ることを知見し本発明を完成
するに至ったものである。Means for Solving the Problems In order to solve the problems of the prior art, the inventors of the present invention have conducted intensive research and found that a glass powder molded sheet exhibits good adhesion to the surface by heating and pressing. The inventors discovered that the desired glazed ceramic substrate could be obtained by forming a thermoplastic resin layer by laminating, thermo-compressing it to the ceramic substrate surface through the resin mt-layer, and firing it.This led to the completion of the present invention. This is what we have come to.
即ち2本発明は、ガラスフリットと有機バインダーとを
主成分とするガラス粉末成形シートの表面に、熱可塑性
樹脂層を積層されてなるガラス粉末接着シート、及び該
シートをセラミック基板の表面に該樹脂/ilを介して
重ね合せ、加熱加圧後。That is, two aspects of the present invention are a glass powder adhesive sheet in which a thermoplastic resin layer is laminated on the surface of a glass powder molded sheet containing glass frit and an organic binder as main components, and a glass powder adhesive sheet in which a thermoplastic resin layer is laminated on the surface of a ceramic substrate. After overlapping via /il and heating and pressurizing.
焼成するグレーズドセラミック基板の製法に係るもので
ある。The present invention relates to a method for manufacturing a glazed ceramic substrate to be fired.
本発明によれば、接着シートは、均一な厚みに成形され
たガラス粉末成形シートと、均一な厚みの熱可塑性樹脂
層とを積層して構成されているので、これをセラミック
基板面に重ね合せて焼成しても、焼成工程中における前
記シートの収縮がなく、目的とするパターンを高精度で
得ることができるものである。さらに、グレーズドセラ
ミック基板の製造にあっては、接着シートとセラミック
基板とを重ね合せて連続的に熱ロール間などの加熱加圧
条件下に導くことによって、シートと基板の複合体を得
ることができるので、生産ラインの自動化が可能となる
ものである。According to the present invention, since the adhesive sheet is constructed by laminating a glass powder molded sheet molded to a uniform thickness and a thermoplastic resin layer having a uniform thickness, the adhesive sheet is laminated on the ceramic substrate surface. Even when the sheet is fired, the sheet does not shrink during the firing process, and the desired pattern can be obtained with high precision. Furthermore, in the production of glazed ceramic substrates, it is possible to obtain a composite of the sheet and the substrate by overlapping the adhesive sheet and the ceramic substrate and continuously subjecting them to heating and pressing conditions such as between heated rolls. This makes it possible to automate production lines.
〈発明の構成及び作用〉
本発明のガラス粉末接着シートは、ガラスフリットと有
機バインダーを主成分とするガラス粉末成形シートと、
熱可塑性樹脂層とから構成される。<Structure and operation of the invention> The glass powder adhesive sheet of the present invention comprises a glass powder molded sheet containing glass frit and an organic binder as main components;
It is composed of a thermoplastic resin layer.
ガラスフリットとしては、コーティング用ガラス例えば
Pb0−BzOs−8to2系ガラス、 Na*0−8
20s−3tCh系ガラス、 BBaO−CaO−8t
oガラスなどが挙げられ、これらは一種又は二種以上を
用いることができ、必要に応じて耐熱性、熱膨張率など
のグレードの異なるものを使用することができる。As the glass frit, coating glass such as Pb0-BzOs-8to2 glass, Na*0-8
20s-3tCh glass, BBaO-CaO-8t
o glass, etc., and one or more types of these can be used, and if necessary, those having different grades in terms of heat resistance, coefficient of thermal expansion, etc. can be used.
有機バインダーは、適当量でガラスフリットをシート状
に保形するために使用されるものであって、ガラスフリ
ットの比重や粒度によっても異なるが1通常はガラスフ
リット100重量部に対して5〜40重量部、好ましく
は8〜30重量部の範囲とされる。バインダー量が5?
!を置部未満ではガラス粉末成形シートの物理的強度が
低下してハンドリングが悪くなるために好ましくなく、
40重量部を超えるとガス抜けが悪く、そのために発泡
したりすることがあるので好ましくないものである。The organic binder is used in an appropriate amount to maintain the shape of the glass frit in the form of a sheet, and although it varies depending on the specific gravity and particle size of the glass frit, it is usually 5 to 40 parts by weight per 100 parts by weight of the glass frit. Parts by weight, preferably in the range of 8 to 30 parts by weight. The amount of binder is 5?
! It is undesirable to use less than 100% because the physical strength of the glass powder molded sheet decreases and handling becomes poor.
If the amount exceeds 40 parts by weight, gas release may be poor and foaming may occur as a result, which is not preferable.
有機バインダーとしては、炭化水素系樹脂、ビニル系樹
脂、アセタール系樹脂、アクリル系樹脂。Examples of organic binders include hydrocarbon resins, vinyl resins, acetal resins, and acrylic resins.
スチロール系樹脂、ポリエステル系樹脂、ボ1jウレタ
ン系樹脂などの合成高分子や繊維素系樹脂などの半合成
高分子などが挙げられるが、アクリル系樹脂は特に良好
な熱分解性を有するので好ましいものである。Examples include synthetic polymers such as styrene resins, polyester resins, and polyurethane resins, and semi-synthetic polymers such as cellulose resins, but acrylic resins are preferred because they have particularly good thermal decomposition properties. It is.
ガラス粉末成形シートは、前記の如く、ガラスフリット
と有機バインダーとを主成分として構成されるが、有機
バインダーへのガラスフリットの分散性を高めるために
、界面活性剤、脂脂酸、脂脂Mエステル、魚油、アクリ
ル系オリゴマー(分子−1130000以下)などの分
散剤を、ガラスフリット100ii量部当り0.01〜
10重量部、好ましくは0.1〜2N量部の範囲で添加
することができる。As mentioned above, the glass powder molded sheet is mainly composed of glass frit and an organic binder, but in order to improve the dispersibility of the glass frit in the organic binder, surfactants, fatty acid, fatty acid M, etc. Dispersants such as esters, fish oils, acrylic oligomers (molecules -1,130,000 or less) are added in an amount of 0.01 to 100 parts per 100 parts of glass frit.
It can be added in an amount of 10 parts by weight, preferably 0.1 to 2 parts by weight.
と記載形シートは1例えば、ガラスフリット。The type of sheet described is 1, for example, glass frit.
有機バインダー、溶剤及び必要に応じて配合される分散
剤、消泡剤、離型剤などの添加剤とを配合してなる配合
物をボールミルで均一に混合し、ドクターブレードによ
りキャスティングすることにより、目的とする厚み精度
を有するシートが作られる。キャスティング前のスラリ
ー状配合物は。By uniformly mixing an organic binder, a solvent, and optionally additives such as a dispersant, antifoaming agent, and mold release agent using a ball mill and casting using a doctor blade, A sheet having the desired thickness accuracy is produced. Slurry formulation before casting.
常法により脱泡処理を加えておき、シート内部に気泡を
起生させないようにしておくのが望しいものである。It is desirable to apply a defoaming treatment using a conventional method to prevent air bubbles from forming inside the sheet.
本発明のガラス粉末接着シートは、上記の如く形成され
てなるガラス粉末成形シートの表面に。The glass powder adhesive sheet of the present invention is applied to the surface of the glass powder molded sheet formed as described above.
熱可塑性樹脂層が積層されて作製される。It is manufactured by laminating thermoplastic resin layers.
該樹脂層は、セラミック基板に対して加熱加圧すること
によって目的とする接着性を発現するものであって1通
常は1〜100μ渇、好しくは5〜50μmの範囲とさ
れる。1μ惰未満では目的とする接着性が得られに<<
、100μ常を超えると焼成時の熱分解ガス発生量が多
くなり、グレーズ層の外Bを阻害するので好II7〈な
いものである。The resin layer exhibits the desired adhesive property by heating and pressurizing the ceramic substrate, and usually has a thickness of 1 to 100 μm, preferably 5 to 50 μm. If it is less than 1μ, the desired adhesiveness cannot be obtained.
If it exceeds 100μ, the amount of pyrolysis gas generated during firing will increase and the outer B of the glaze layer will be inhibited.
該樹脂層は、予めフィルム又はシート状に常法より成形
した樹脂をガラス粉末成形シートに重ね合せ後加熱加圧
することVCよって形成するのが好ましいが1例えば樹
脂フィルム又はシートの接着界面側表面をバーナーなど
の熱llAt−用いて活性化してi*層したり、I¥1
融塗工したり、スプレー塗工したりして設けてもよいも
のである。The resin layer is preferably formed by VC, in which a resin previously formed into a film or sheet by a conventional method is superimposed on a glass powder molded sheet and then heated and pressed. Activate it using heat such as a burner and layer it with I\1
It may be provided by melt coating or spray coating.
また該樹脂jIJは、ガラス粉末接着シートを所望の形
状に打ち抜くなどして後セラミック基板表面に重ね合せ
、基板上にパターン状にグレーズ層を形成する用途に用
いるときは、有機バインダーよシも高い熱分解温度を有
する熱0JIi性樹脂で形成することが必要である。何
となれば樹脂層を有機バインダーより低い熱分解源8度
を有する熱可塑性樹脂で形成すると、パターン状グレー
ズ層の端部で収縮に起因する層厚部が起生じ、グレーズ
層の平坦度が阻害されるからである。しかして、グレー
ズ層を全面に形成し、端部を切断除去してよい場合は、
焼成時の接着状態さえ保持されれば、必ずしも熱分解温
度の高低のみが問題になることはない。もちろん、全面
にグレーズ層を形成する場合においても、パターン状グ
レーズ#を形成する場合と同様に熱分解温度の高低を選
択することは好ましいことである。In addition, the resin jIJ is more expensive than organic binders when used for purposes such as punching out a glass powder adhesive sheet into a desired shape and then stacking it on the surface of a ceramic substrate to form a patterned glaze layer on the substrate. It is necessary to use a thermal 0JIi resin having a thermal decomposition temperature. If the resin layer is formed of a thermoplastic resin with a thermal decomposition rate of 8 degrees lower than that of the organic binder, a thick layer due to shrinkage will occur at the end of the patterned glaze layer, which will impede the flatness of the glaze layer. This is because it will be done. However, if the glaze layer is formed on the entire surface and the edges can be cut and removed,
As long as the adhesive state during firing is maintained, the high or low thermal decomposition temperature is not necessarily the only problem. Of course, even in the case of forming a glaze layer on the entire surface, it is preferable to select the high or low thermal decomposition temperature as in the case of forming patterned glaze #.
熱可塑性樹脂層を構成する物質としては、単独で或いは
二種以上の混合又は反応系で加熱加圧によりセラミック
基板に対して目的とする接着力を発揮するものであれば
特に制限されることはないものである。その−例を示す
と、ポリエチレン。There are no particular restrictions on the materials constituting the thermoplastic resin layer, as long as they can exert the desired adhesion to the ceramic substrate when heated and pressurized, either alone or in a mixture or reaction system of two or more. It's something that doesn't exist. An example of this is polyethylene.
エチレン共重合体、エチレン−プロピレンゴム。Ethylene copolymer, ethylene-propylene rubber.
ポリイソブチレン、石油樹脂、テルペン樹脂等の炭化水
素系樹脂、ポリアクリル酸エステル、ポリメタクリル酸
エステル、ポリアクリルアミド等のアクリル系樹脂、プ
リブタジェン、ポリイソプレン等のジエン系樹脂、酢酸
ビニルおよびポリビニル7セタール系樹脂、ポリエーテ
ル系樹脂、ポリエステル系樹脂、−リウレタン系樹脂1
m維素系樹脂などが挙げられるが、(メタ)アクリlし
酸エステルと該エステルと共重合可能な官能基を有する
ビニル糸上ツマ−との共1合からなるアクリル系感圧性
接着剤、ポリビニルエーテル系感圧性接着剤などの樹脂
系感圧性接着剤、またはネオプレンゴム系感圧性接置剤
、イソ、ブレン系感圧性接着剤などのゴム系感圧性接着
剤の如き常温で感圧接着性を示す物質と熱溶融性樹脂と
の混合物が粘着感が少なく、貼り合せ時位置修正が容易
であるので特に好ましいものである。Hydrocarbon resins such as polyisobutylene, petroleum resins, and terpene resins; acrylic resins such as polyacrylic esters, polymethacrylic esters, and polyacrylamide; diene resins such as prbutadiene and polyisoprene; vinyl acetate and polyvinyl 7-cetal resins Resin, polyether resin, polyester resin, -urethane resin 1
Acrylic pressure-sensitive adhesives consisting of a (meth)acrylic acid ester and a vinyl thread binder having a functional group copolymerizable with the ester; Pressure-sensitive adhesives at room temperature such as resin-based pressure-sensitive adhesives such as polyvinyl ether-based pressure-sensitive adhesives, or rubber-based pressure-sensitive adhesives such as neoprene rubber-based pressure-sensitive adhesives, iso- and brene-based pressure-sensitive adhesives. A mixture of a substance exhibiting the above and a hot-melt resin is particularly preferable because it has less sticky feeling and can be easily adjusted in position during bonding.
熱溶融性樹脂としては、融点が50℃以J:(好まζし
くは200℃以下)のものであれば特に限定されず、例
えばロジン、変性ロジン及びこれらのエステル化物、フ
ェノール系樹脂、ロジン及びアルキルフェノール変性キ
シレン系樹脂、テルペン−フェノール系樹脂5エポキシ
系樹脂などの官能基を有する熱反応性タイプ、或いはα
又はβピネン重合体、脂肪族系炭化水素樹脂、クマロン
インデン樹脂、スチレン系樹脂、芳香族系石油樹脂、ア
クリル酸エステル共重合体などの非官能基タイプの何れ
でも使用することができる。The heat-melting resin is not particularly limited as long as it has a melting point of 50°C or higher (preferably 200°C or lower), and includes, for example, rosin, modified rosin, and esterified products thereof, phenolic resins, rosin, and Alkylphenol-modified xylene resins, terpene-phenol resins, thermoreactive types with functional groups such as 5-epoxy resins, or α
Alternatively, any non-functional type such as β-pinene polymer, aliphatic hydrocarbon resin, coumaron indene resin, styrene resin, aromatic petroleum resin, and acrylic acid ester copolymer can be used.
該熱溶融性樹脂は、前記常温で感圧接着性?示す物質1
00 f!重量部対して50〜200重量部の範囲で添
加することができ、50重量部未満では添加効果が期待
できず、200重量部を超えると熱可塑性樹脂mの可撓
性が低下し脆くなるので好ましくないものである。Is the thermofusible resin pressure-sensitive adhesive at room temperature? Substance shown 1
00f! It can be added in a range of 50 to 200 parts by weight, and if it is less than 50 parts by weight, no effect can be expected, and if it exceeds 200 parts by weight, the flexibility of the thermoplastic resin m will decrease and it will become brittle. It is undesirable.
常温で感圧接着性を示す物質と熱溶融性樹脂との好まし
い一つの組み合せは、前記アクリル系感圧性接着剤と前
記熱反応性タイプの樹脂とからなる構成されていること
であり、かかる構成とすることにより、加熱下で直接又
は架橋剤を介して付加反応し、それによって焼成時にお
ける熱分解温度が高くなり、クレーズ層の外観が良好な
ものが得られるものである。One preferred combination of a substance exhibiting pressure-sensitive adhesive properties at room temperature and a heat-melting resin is a composition comprising the acrylic pressure-sensitive adhesive and the heat-reactive type resin; By doing so, an addition reaction occurs under heating either directly or via a crosslinking agent, thereby increasing the thermal decomposition temperature during firing and producing a craze layer with a good appearance.
このように構成してなるガラス粉末接着シートは、アル
ミナ、ベリリア、ステアタイト、フォルステライト、ジ
ルコニアの如きセラミック基板の表面に、熱可塑性樹脂
m’e介して重ね合され、加熱加圧後、ガラスフリット
の軟化温度風との温度で焼成され、グレーズドセラミッ
ク基板が作られる。焼成時の温度は500〜1400℃
が一般的で。The glass powder adhesive sheet constructed in this way is superimposed on the surface of a ceramic substrate such as alumina, beryllia, steatite, forsterite, or zirconia via a thermoplastic resin m'e, and after heating and pressing, the glass powder adhesive sheet is The frit is fired at a temperature equal to the softening temperature of the air, creating a glazed ceramic substrate. The temperature during firing is 500-1400℃
is common.
この温度にて有機バインダー及び熱IJJffi性樹脂
層は消失しているう
く効果〉
本発明のガラス粉末接誉シートは以とのように予め成形
されているので均一な厚みに規定することができると共
に、脱泡操作も簡単にできるので信頼性の高いシートを
提供することができる。At this temperature, the organic binder and the thermal IJJffi resin layer disappear. Since the glass powder dressing sheet of the present invention is preformed as described below, it can be defined to have a uniform thickness. Since the defoaming operation can be easily performed, highly reliable sheets can be provided.
また、熱可塑性樹脂層を設けであるので、加熱加圧によ
りセラミック基板に対して強固な接着が得られ、焼成作
業が簡単で、良好なグレーズドセラミック基板か得られ
るという特徴を有する。Further, since the thermoplastic resin layer is provided, strong adhesion to the ceramic substrate can be obtained by heating and pressing, and the firing operation is easy, and a good glazed ceramic substrate can be obtained.
さらに、熱可塑性樹脂層の熱分解温度を有機バインダー
よりも高く設定しておくと、焼成過程において、さきに
バインダーのある程度の熱分解による消失によってガラ
ス粉末成形シートが通気状態となり、あとに熱分解する
熱可塑性樹脂層の分解ガスを簡単に通過させるために、
成形シートにふくれ等を起生させず、平担なグレーズI
llを形成できること、また熱可塑性樹脂層の熱分解に
よる消失が進行し、接着力が喪失する温度に2いては。Furthermore, if the thermal decomposition temperature of the thermoplastic resin layer is set higher than that of the organic binder, during the firing process, some of the binder disappears due to thermal decomposition and the glass powder molded sheet becomes ventilated, and later thermal decomposition occurs. In order to easily pass the decomposition gas of the thermoplastic resin layer,
A flat glaze I that does not cause blistering on the molded sheet.
11 can be formed, and the temperature at which the thermoplastic resin layer disappears due to thermal decomposition progresses and loses its adhesive strength.
もはや前記成形シートは粉末化状態にあり、その状態で
ガラスフリットの11M!itが開始されるのでクレー
ズ層の反りや収縮が起生じないこと、などの利点を有す
る。The molded sheet is now in a powdered state, and in that state, 11M of glass frit! It has the advantage that the craze layer does not warp or shrink because it starts.
〈実施例〉
以下本発明の実施例を示す。文中部とあるのは重量部?
意味する。<Examples> Examples of the present invention will be shown below. Is the part of the sentence the weight part?
means.
実施例
ガラスフリットとしてBaO−CaO−8iO2系ガラ
ス(軟化点850℃ 325メツシユアンダー)を用い
、ガラスフリット100部、第1表に示す有機バインダ
ー12部1分散剤としてのオレイン酸1部、トルエン2
4部及びメチルエチルケトン16部を常温でボールミル
で混合した後、ポリエステルフィルム上にドクターブレ
ードを用いてキャスティングし、乾燥後の厚みが130
μmのガラス粉末成形シートを得た。Examples BaO-CaO-8iO2 glass (softening point: 850°C, 325 mesh under) was used as the glass frit, 100 parts of the glass frit, 12 parts of the organic binder shown in Table 1, 1 part of oleic acid as a dispersant, and toluene. 2
After mixing 4 parts of methyl ethyl ketone and 16 parts of methyl ethyl ketone in a ball mill at room temperature, the mixture was cast onto a polyester film using a doctor blade, and the thickness after drying was 130 mm.
A glass powder molded sheet of μm size was obtained.
一方、第1表に示す熱0J塑性樹脂を常法により調整し
て厚さ20μ惰のフィルム状物を作成し、これを前記ガ
ラス粉末成形シートの表面に重ね合せて加圧又は加熱加
圧して貼り合せ1本発明のガラス粉末接着シートを得た
。On the other hand, a film-like material having a thickness of 20 μm was prepared by adjusting the thermal 0J plastic resin shown in Table 1 by a conventional method, and this was superimposed on the surface of the glass powder molded sheet and pressurized or heated. Lamination 1 A glass powder adhesive sheet of the present invention was obtained.
次に、セラミック基板として純度96.0%のアルミナ
基板を用意し、この基板の表面に前記ガラス粉末接着シ
ートを熱可塑性樹脂を介して重ね合せ100℃で加熱加
圧して貼り合せた。この貼り合せ品’1400℃で60
分間保持した後10℃/分の昇温速度で昇温し、127
0℃で120分間保持してグレーストセラミック基板を
得た。Next, an alumina substrate with a purity of 96.0% was prepared as a ceramic substrate, and the glass powder adhesive sheet was laminated on the surface of this substrate via a thermoplastic resin and bonded by heating and pressing at 100°C. This bonded product'60 at 1400℃
After holding for 1 minute, the temperature was increased at a rate of 10°C/min to 127°C.
A graze ceramic substrate was obtained by holding at 0° C. for 120 minutes.
第 1 表 ()の温度は熱分解終了温度を示す。Table 1 The temperature in parentheses indicates the end temperature of thermal decomposition.
と記実施例からも明らかな如く、本発明のガラス粉末接
着シー14−用いて作製してなるグレーズドセラミック
基板は、外観が良好で表面平担性を有するものである。As is clear from the examples described above, the glazed ceramic substrate produced using the glass powder adhesive sheet 14 of the present invention has a good appearance and a flat surface.
代表者鎌居五゛朗Representative Goro Kamai
Claims (1)
ラス粉末成形シートの表面に、熱可塑性樹脂層が積層さ
れてなるガラス粉末接着シート。 2)熱可塑性樹脂層が常温で感圧接着性を示す物質と熱
溶融性樹脂との混合物から構成されている特許請求の範
囲第1項記載のガラス粉末接着シート。 3)熱溶融性樹脂が熱反応性樹脂である特許請求の範囲
第2項記載のガラス粉末接着シート。 4)熱可塑性樹脂層の熱分解温度が有機バインダーの熱
分解温度よりも高いものである特許請求の範囲第1項記
載のガラス粉末接着シート。 5)セラミック基板の表面に、ガラスフリットと有機バ
インダーを主成分とするガラス粉末成形シートの表面に
熱可塑性樹脂層が積層されてなるガラス粉末接着シート
を前記樹脂層を介して重ね合せ、加熱加圧後焼成するグ
レーズドセラミック基板の製法。[Claims] 1) A glass powder adhesive sheet comprising a thermoplastic resin layer laminated on the surface of a glass powder molded sheet containing glass frit and an organic binder as main components. 2) The glass powder adhesive sheet according to claim 1, wherein the thermoplastic resin layer is composed of a mixture of a substance exhibiting pressure-sensitive adhesive properties at room temperature and a thermofusible resin. 3) The glass powder adhesive sheet according to claim 2, wherein the heat-melting resin is a heat-reactive resin. 4) The glass powder adhesive sheet according to claim 1, wherein the thermoplastic resin layer has a thermal decomposition temperature higher than that of the organic binder. 5) A glass powder adhesive sheet, which is made by laminating a thermoplastic resin layer on the surface of a glass powder molded sheet containing glass frit and an organic binder as main components, is superimposed on the surface of the ceramic substrate via the resin layer, and heated. A method for manufacturing glazed ceramic substrates that is fired after pressing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9599887A JPS63260838A (en) | 1987-04-17 | 1987-04-17 | Glass powder adhesive sheet and production of substrate glazed ceramic using said sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9599887A JPS63260838A (en) | 1987-04-17 | 1987-04-17 | Glass powder adhesive sheet and production of substrate glazed ceramic using said sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63260838A true JPS63260838A (en) | 1988-10-27 |
Family
ID=14152766
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9599887A Pending JPS63260838A (en) | 1987-04-17 | 1987-04-17 | Glass powder adhesive sheet and production of substrate glazed ceramic using said sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63260838A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02225343A (en) * | 1988-10-17 | 1990-09-07 | Corning Inc | Glass/glass-ceramic-plastic alloy object |
JP2005136396A (en) * | 2003-10-06 | 2005-05-26 | Ngk Spark Plug Co Ltd | Ceramic substrate for thin film electronic component, its manufacturing method, and thin film electronic component using this |
-
1987
- 1987-04-17 JP JP9599887A patent/JPS63260838A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02225343A (en) * | 1988-10-17 | 1990-09-07 | Corning Inc | Glass/glass-ceramic-plastic alloy object |
JP2005136396A (en) * | 2003-10-06 | 2005-05-26 | Ngk Spark Plug Co Ltd | Ceramic substrate for thin film electronic component, its manufacturing method, and thin film electronic component using this |
JP4668577B2 (en) * | 2003-10-06 | 2011-04-13 | 日本特殊陶業株式会社 | Ceramic substrate for thin film electronic component, manufacturing method thereof, and thin film electronic component using the same |
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