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JPS63258110A - Impedance matching device for high frequency plasma generator - Google Patents

Impedance matching device for high frequency plasma generator

Info

Publication number
JPS63258110A
JPS63258110A JP9242387A JP9242387A JPS63258110A JP S63258110 A JPS63258110 A JP S63258110A JP 9242387 A JP9242387 A JP 9242387A JP 9242387 A JP9242387 A JP 9242387A JP S63258110 A JPS63258110 A JP S63258110A
Authority
JP
Japan
Prior art keywords
impedance matching
high frequency
load
frequency plasma
plasma generator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9242387A
Other languages
Japanese (ja)
Inventor
Yoshiaki Mori
義明 森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP9242387A priority Critical patent/JPS63258110A/en
Publication of JPS63258110A publication Critical patent/JPS63258110A/en
Pending legal-status Critical Current

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  • Plasma Technology (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は高周波プラズマ発生装置のインピーダンス整合
器に関する。
DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an impedance matching device for a high frequency plasma generator.

〔従来の技術〕[Conventional technology]

従来の高周波プラズマ発生装置のインピーダンス整合器
は、第2図に示すようにL型インピーダンス整合回路8
方式が一般に知られていて、わずかな負荷変動に対して
はパリコア3及びバリコン6で整合をとり、またバリコ
ン3の容量可変幅を越すような大幅な負荷変動の場合に
は、固定コンデ/す9をその都度バリコン3と並列に取
付けていた。
The impedance matching device of the conventional high frequency plasma generator is an L-type impedance matching circuit 8 as shown in FIG.
This method is generally known, in which slight load fluctuations are matched by the Paricore 3 and the variable capacitor 6, and in the case of large load fluctuations that exceed the variable capacitance range of the variable capacitor 3, a fixed capacitor/all the capacitors are used. 9 was installed in parallel with variable capacitor 3 each time.

なお、バリコン3及びバリコン5の最大容量はその大き
さ、価格等より500PFの物が使用されている。
Note that the maximum capacity of the variable capacitors 3 and 5 used is 500 PF due to their size, price, etc.

(発明が解決しようとする問題点) しかし、前述のインピーダンス整合回路8では2個以上
の負荷を切換えて使用する場合、たとえバリコン3の調
整範囲で整合がとれても、負荷切換え時に整合をとるた
めのバリコン3のv4整時間はムダとなり、また放電自
体も不安定になっていた。
(Problem to be Solved by the Invention) However, in the impedance matching circuit 8 described above, when two or more loads are switched and used, even if matching is achieved within the adjustment range of the variable capacitor 3, matching is performed at the time of load switching. The V4 adjustment time of the variable capacitor 3 was wasted, and the discharge itself became unstable.

加えて、バリコン3の調整範囲である500PF内に収
まらない場合は、その都度、整合回路用ボックスを開は
固定コンデンサ9を取りはずししていたため非常にめん
どうで自動化には不向であった。
In addition, each time the variable capacitor 3 does not fall within the adjustment range of 500PF, the matching circuit box has to be opened and the fixed capacitor 9 removed, which is extremely troublesome and unsuitable for automation.

そこで本発明はこのような問題点を解決するもので、そ
の目的とするところは、負荷の大幅な変動及び複数の負
荷の切換等にも容易にかつ高速にインピーダンス整合が
とれる回路を提供することにある。
The present invention is intended to solve these problems, and its purpose is to provide a circuit that can easily and quickly perform impedance matching even when there is a large change in load or switching between multiple loads. It is in.

〔問題点を解決するための手段〕[Means for solving problems]

本発明の高周波プラズマ発生装置のインピーダンス整合
器は、高周波電源と高周波プラズマ発生容器との間のイ
ンピーダンス整合回路において、前記高周波電源からイ
ンピーダンス、整合回路ヘノ入力ポートとアース間に、
1個以上の固定コンデンサとこれらを2段あるいは多段
で切換え得る切換え器とを備えることを特徴とする。
The impedance matching device of the high frequency plasma generation device of the present invention includes, in an impedance matching circuit between a high frequency power source and a high frequency plasma generation container, an impedance matching circuit from the high frequency power source to an input port of the matching circuit and ground.
It is characterized by comprising one or more fixed capacitors and a switch capable of switching these in two stages or in multiple stages.

〔作用〕[Effect]

本発明の上記の構成によれば、負荷の大幅な変動及び負
荷の切換等により、負荷のインピーダンスが大幅に変化
した場合でも、インピーダンス整合回路の高周波電源側
入力ポートとアース間のあらかじめ用意しておいた固定
コンデンサを多段で切換えるだけで、大幅なかつ高速に
容量変化ができるため容易にインピーダンス整合をとる
事が可能となる。
According to the above configuration of the present invention, even if the impedance of the load changes significantly due to large fluctuations in the load, switching of the load, etc., even if the impedance of the load changes significantly due to large fluctuations in the load, load switching, etc. By simply switching the installed fixed capacitors in multiple stages, the capacitance can be changed significantly and quickly, making it possible to easily match impedance.

〔実施例〕〔Example〕

以下に本発明の実施例を第1図にもとすいて説明する。 An embodiment of the present invention will be described below with reference to FIG.

第1図において、高周波電源しよりインピーダンス整合
回路80入カポート2へ同軸ケーブルで接続する。入力
ポート2とアース間にはバリコン3及び切換え器10を
介して固定コンデンサ91.92.93が設けである。
In FIG. 1, a high frequency power source is connected to an impedance matching circuit 80 input port 2 by a coaxial cable. Fixed capacitors 91, 92, and 93 are provided between the input port 2 and the ground via the variable capacitor 3 and the switch 10.

またインピーダンス整合回路8の入力ポート2と出力ポ
ートロ間にはコイル4とバリコン5を直列に配し、出力
ポートロから負荷切換え器11を介してそれぞれ負IV
a71.負荷b72.負荷c73へ高周波電力を供給す
る。この間の配線は銅板を使用している。
Further, a coil 4 and a variable capacitor 5 are arranged in series between the input port 2 and the output port of the impedance matching circuit 8, and a negative IV voltage is connected from the output port through the load switcher 11.
a71. Load b72. High frequency power is supplied to the load c73. The wiring between these uses copper plates.

ここで、高周波電源しの出力インピーダンスをRoとし
、負荷のインピーダンスを純抵抗RLと容fit CL
との直列と考え、負荷に最大電力を供給するつまりは整
合をとるには、インピーダンス整合回路8の入力ポート
より負荷側をみたインピーダンスがRoとならなければ
ならない。そのためのバリコン3の容量C悶、およびバ
リコン5の容量G1コイチ4のリアクタンスしは、 の式で求まる。(り式のwL−1/wCTはプラズマ発
生容器の形状等でほぼ決まり、その後の負荷変動はバリ
コン5で調整吸収できる。■式の1/ w CMは上記
容器形状、負荷変動に対して大幅にずれがバリコン3の
調整範囲を越える場合がある。
Here, the output impedance of the high-frequency power source is Ro, and the load impedance is the pure resistance RL and the capacity CL.
In order to supply maximum power to the load, that is, to achieve matching, the impedance seen from the input port of the impedance matching circuit 8 toward the load side must be Ro. For this purpose, the capacitance C of the variable capacitor 3 and the reactance of the capacitance G1 of the variable capacitor 5 and the reactance of the capacitor 4 are determined by the following formula. (The wL-1/wCT of the formula is almost determined by the shape of the plasma generation container, etc., and subsequent load fluctuations can be adjusted and absorbed by the variable capacitor 5.) The 1/wCM of the formula is largely determined by the shape of the container and the load fluctuations mentioned above. The deviation may exceed the adjustment range of the variable capacitor 3.

本実施例では上記回路をスパッタ装置に用い、負荷a7
Jは金属マグネトロンカソード、負荷b72はセラミッ
クマグネトロンカソード、負荷C73はスパッタエッチ
つまり基板ホルダに高周波を印加するものである。ここ
で負荷切換え器6を負荷a71につないだ時は、コンデ
ンサ切換え器lOを固定コンデンサ91 (300PF
)に接続し、同様に負荷b72.負荷c73につないだ
時は、コンデンサ切換え器も固定コンデンサ02(70
0PF)、93 (100OPF)に切り換える。
In this embodiment, the above circuit is used in a sputtering apparatus, and the load a7
J is a metal magnetron cathode, load b72 is a ceramic magnetron cathode, and load C73 is for sputter etching, that is, applying high frequency to the substrate holder. Here, when the load switcher 6 is connected to the load a71, the capacitor switcher lO is connected to the fixed capacitor 91 (300PF
) and similarly load b72. When connected to load c73, the capacitor switch also switches to fixed capacitor 02 (70
0PF), 93 (100OPF).

こうすることにより、バリコン3もさほど動かすことも
なく、さらにはバリコンの最大容量を越えて整合をとる
時も簡単にかつ高速にできる。
By doing this, the variable capacitor 3 does not have to be moved much, and furthermore, matching can be easily and quickly performed even when the maximum capacity of the variable capacitor is exceeded.

(発明の効果) 以上述べたように、本発明によれば、インピーダンス整
合回路の高周波電源側入力ポートとアース間にあらかじ
め固定プンデ/すを配し、これを切換えて使用すること
により、複数の負荷の切換え、負荷の大幅な変動等があ
っても、簡単にかつ速くインピーダンス整合がとれると
いう効果を何する。
(Effects of the Invention) As described above, according to the present invention, a fixed hole is arranged in advance between the high frequency power supply side input port of the impedance matching circuit and the ground, and by switching and using this, a plurality of To achieve the effect of easily and quickly achieving impedance matching even when there is load switching, large load fluctuation, etc.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明のインピーダンス整合器の構成図。第2
図は従来のインピーダンス整合器の構成回路図。 ■・・・高周波電源 2・・・インピーダンス整合回路入力ポート3.5・・
・バリコン 4・・・コイル 6・・・インピーダンス整合回路出力ポードア・・・負
荷71,72.73・・・負荷a、b、c8・・・イン
ピーダンス整合回路部 91.92.03・・・固定コンデンサ10・・・コン
デンサ切換え器 11・・・負荷切換え器 以  上 出願人 セイコーエプソン株式会社 関両の蜂!FC内容に変更なし) 第1図 第2図 手続補正書 く方式) %式% 高周波プラズマ発生装置のインピーダンス整合器3、補
正をする者 代表取締役  中 村  恒 也 4、代理人 5、補正指令の日付 7、補正の対象 別紙の通り
FIG. 1 is a configuration diagram of an impedance matching device according to the present invention. Second
The figure is a configuration circuit diagram of a conventional impedance matching device. ■...High frequency power supply 2...Impedance matching circuit input port 3.5...
・Varicon 4...Coil 6...Impedance matching circuit output port door...Load 71, 72.73...Loads a, b, c8...Impedance matching circuit section 91.92.03...Fixed Capacitor 10...Capacitor switching device 11...Load switching device and above Applicant: Seiko Epson Corporation Kanryo no Bee! (No change to FC contents) Figure 1 Figure 2 Procedural amendment form) % formula % Impedance matching device 3 of high frequency plasma generator, person making the correction Representative director Tsuneya Nakamura 4, agent 5, person making the correction order Date 7, subject to amendment as per attached sheet

Claims (1)

【特許請求の範囲】[Claims] (1)高周波電源と高周波プラズマ発生容器との間のイ
ンピーダンス整合回路において、前記高周波電源からイ
ンピーダンス整合回路への入力ポートとアース間に、1
個以上の固定コンデンサとこれらを2段あるいは多段で
切換え得る切換え器とを備えることを特徴とする高周波
プラズマ発生装置のインピーダンス整合器。
(1) In an impedance matching circuit between a high frequency power source and a high frequency plasma generation container, between the input port from the high frequency power source to the impedance matching circuit and ground,
1. An impedance matching device for a high-frequency plasma generator, comprising at least one fixed capacitor and a switch capable of switching these in two stages or in multiple stages.
JP9242387A 1987-04-15 1987-04-15 Impedance matching device for high frequency plasma generator Pending JPS63258110A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9242387A JPS63258110A (en) 1987-04-15 1987-04-15 Impedance matching device for high frequency plasma generator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9242387A JPS63258110A (en) 1987-04-15 1987-04-15 Impedance matching device for high frequency plasma generator

Publications (1)

Publication Number Publication Date
JPS63258110A true JPS63258110A (en) 1988-10-25

Family

ID=14054014

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9242387A Pending JPS63258110A (en) 1987-04-15 1987-04-15 Impedance matching device for high frequency plasma generator

Country Status (1)

Country Link
JP (1) JPS63258110A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5314603A (en) * 1991-07-24 1994-05-24 Tokyo Electron Yamanashi Limited Plasma processing apparatus capable of detecting and regulating actual RF power at electrode within chamber
JPH0778699A (en) * 1993-09-08 1995-03-20 Anelva Corp Plasma processing device
KR20020023891A (en) * 2001-12-27 2002-03-29 김성천 Wide range auto impedance matcher
KR100416689B1 (en) * 1999-03-09 2004-01-31 전자부품연구원 Voltage controlled oscillator having a multi-frequency band matching capability for use in a wireless mobil communication system
WO2006051744A1 (en) * 2004-11-10 2006-05-18 Sumifusa Ikenouchi Impedance matching network, and plasma processing apparatus using such impedance matching network
WO2012099774A1 (en) * 2011-01-20 2012-07-26 Advanced Energy Industries, Inc. Impedance-matching network using bjt switches in variable-reactance circuits
CN103151853A (en) * 2013-04-03 2013-06-12 天津工业大学 Wireless power transmission impedance automatic matching device
US9490353B2 (en) 2012-08-28 2016-11-08 Advanced Energy Industries, Inc. Three terminal PIN diode
WO2019073228A1 (en) * 2017-10-10 2019-04-18 Teledyne E2V (Uk) Limited Microwave generation

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59221020A (en) * 1983-05-30 1984-12-12 Ulvac Corp Impedance matching circuit in device utilizing plasma
JPS60134511A (en) * 1983-12-22 1985-07-17 Jeol Ltd High frequency device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59221020A (en) * 1983-05-30 1984-12-12 Ulvac Corp Impedance matching circuit in device utilizing plasma
JPS60134511A (en) * 1983-12-22 1985-07-17 Jeol Ltd High frequency device

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5314603A (en) * 1991-07-24 1994-05-24 Tokyo Electron Yamanashi Limited Plasma processing apparatus capable of detecting and regulating actual RF power at electrode within chamber
JPH0778699A (en) * 1993-09-08 1995-03-20 Anelva Corp Plasma processing device
JP2576026B2 (en) * 1993-09-08 1997-01-29 アネルバ株式会社 Plasma processing equipment
KR100416689B1 (en) * 1999-03-09 2004-01-31 전자부품연구원 Voltage controlled oscillator having a multi-frequency band matching capability for use in a wireless mobil communication system
KR20020023891A (en) * 2001-12-27 2002-03-29 김성천 Wide range auto impedance matcher
WO2006051744A1 (en) * 2004-11-10 2006-05-18 Sumifusa Ikenouchi Impedance matching network, and plasma processing apparatus using such impedance matching network
US9660613B2 (en) 2011-01-20 2017-05-23 Advanced Energy Industries, Inc. Impedance-matching network using BJT switches in variable-reactance circuits
US8416008B2 (en) 2011-01-20 2013-04-09 Advanced Energy Industries, Inc. Impedance-matching network using BJT switches in variable-reactance circuits
CN103444078A (en) * 2011-01-20 2013-12-11 先进能源工业公司 Impedance-matching network using BJT switches in variable-reactance circuits
US9124248B2 (en) 2011-01-20 2015-09-01 Advanced Energy Industries, Inc. Impedance-matching network using BJT switches in variable-reactance circuits
WO2012099774A1 (en) * 2011-01-20 2012-07-26 Advanced Energy Industries, Inc. Impedance-matching network using bjt switches in variable-reactance circuits
US9490353B2 (en) 2012-08-28 2016-11-08 Advanced Energy Industries, Inc. Three terminal PIN diode
CN103151853A (en) * 2013-04-03 2013-06-12 天津工业大学 Wireless power transmission impedance automatic matching device
WO2019073228A1 (en) * 2017-10-10 2019-04-18 Teledyne E2V (Uk) Limited Microwave generation
GB2567620A (en) * 2017-10-10 2019-04-24 Teledyne E2V Uk Ltd Microwave generation
CN111557123A (en) * 2017-10-10 2020-08-18 特励达英国有限公司 Microwave generation

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