JPS63240056A - Semiconductor assembly unit - Google Patents

Abstract

Known designs containing at least two semiconductor components in a hybrid structure cannot be fabricated in any desired way for application purposes for structural reasons. They can also not be used universally and require a high expenditure on cooling measures and a high material and labour expenditure in the assembly of larger circuits. The new assembly is intended to make possible a high degree of integration, the electrical pretesting of all the components before assembly, and simpler mounting on, and connection to, carrier components. The assembly has at least two semiconductor components. Each semiconductor component comprises an electrically insulating baseplate and semiconductor chips mounted thereon with current conductor parts. The semiconductor components and the package are detachably mounted on a carrier body. The insulating housing has facilities for fitting current-connection components for connecting the semiconductor components and their conductor parts. The assembly is used in power electronics.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor assembly unit of modular assembly type having the features set forth in the preamble of claim 1.

[Prior Art] Semiconductor assembly in the form of a modular assembly, in which the uncovered strip-shaped current conductor portions of at least two semiconductor elements are fixed and electrically connected to a base of insulating material by brazing or spring pressure. unit is known.

Semiconductors of such structures in so-called hybrid form can comprise active and passive semiconductor components.

In the case of such component units, brazing may occur during the manufacturing process at the time of joining, due to the failure of one of the components, the entire structure must be scrapped, and the material of the insulating material base on the porcelain Due to the limitations of the fragility of the surface area necessary for circuit configuration of the desired operating conditions, known floating semiconductor modules cannot be used universally in a variety of electrical devices. The disadvantage is that it cannot be done. After all, the respective assembly, especially the combination, of several modules for a multiphase device requires a lot of material and labor, and furthermore, the heat treatment requires very high costs for the cooling medium part and the various structures. I need.

[Problem to be Solved by the Invention] The basic aim of the invention is to enable, on the one hand, an optimal utilization of thermal contact surfaces for heat dissipation and, on the other hand, to provide a space-saving design for the control circuit. and protection wiring, allowing for large-scale integration, in which all components, i.e. output circuit elements and/or control circuit elements and/or protection circuit elements, can be electrically tested and supported before assembly. It is an object of the present invention to provide a power semiconductor assembly unit in modular assembly form, such that fixing to and connection to a body and/or cooling components is possible in a simpler manner than with known assembly types.

[Means for solving the problem] This object is achieved in a semiconductor component of the type mentioned at the outset by the measures described in the characterizing part of claim 1. Preferred embodiments are set out in claims 2 to 21.

[Example] A semiconductor assembly unit according to the present invention is shown in FIGS. 1 to 7.
This will be explained by the embodiment shown in the figures.

As shown in FIG. 1, a semiconductor pellet 1 with a lower electrode is firmly attached, for example by brazing, to the metallized upper side 33 of a thermally conductive and electrically insulating plate 3, called the substrate, and to the other side. An upper electrode is connected via the current carrying part 2 to a separated part of the upper side 33 of the substrate 3 and via this part to the current terminal bolt 4. The lower electrode of the semiconductor pellet 1 is electrically fixedly connected by a similar bolt 4'. The semiconductor pellet 1, the current-carrying part 2, the current terminal bolt 4.4' and the substrate 3 together constitute, according to the invention, a semiconductor element 3, which, around its periphery, has the number shown schematically on the left edge of the figure. By using the curved fixing member 8, using screws along the dashed line,
It is fixed on the support body 9 so that it can be disassembled.

The substrate 3 is composed of contact metal layers 32 and 33 and an insulating layer 31. The substrate 3 comprises, in particular, a plate 31 of oxidized ceramic and a contact metal layer 32 coated on both sides thereof.
It consists of 33. As substrate it is possible to use a porcelain plate coated directly with steel, in particular using the so-called direct bonding method. The substrate 3 has a significantly wider surface area than the area for fixing the semiconductor pellet 1,
This allows a simple and structurally advantageous spatial arrangement and fastening of the circuit components 11 to the semiconductor pellet 1, which controls and protects the semiconductor component 1.

In order to electrically connect the semiconductor element to the conductor portion outside the housing, the inside of the housing is provided with a structure for guiding the conductor.

As shown in FIG. 1, the housing portion 5, which is formed in the shape of a frame and only a portion of which is shown, and which constitutes the housing of the semiconductor component unit together with the support 9 and the lid (not shown), has a socket-shaped projection 51. This protrusion is connected to the terminal bolt 4'
It is used as a support point for fixing a current conductor 6, called a current terminal element, between the housing part 5 and the housing part 5. This terminal element 6 is releasably fixed on both sides, in particular by screws 7.8. For fixed attachment to the support 9, the housing part 5 furthermore has a flange-like extension 52, by means of which a screw connection is effected along the line II+.

The semiconductor pellet 1 can have active and passive functional elements, ie diodes, transistors or thyristors, as well as resistances and/or capacitances on the semiconductor substrate.

Semiconductor elements! can be fixed on the support 9 by means of a screw connection.

A preferred embodiment for flatly coating the substrate 3 onto the support 9 is such that the contact metal layer 32 facing towards the support 9
This is achieved by being made of a material with a suitably large coefficient of thermal expansion which causes the substrate 3 to curve convexly relative to the support 9, or by providing at least one partial layer of such a material. For this purpose, metal coating 3
The inner partial layer of 2 can be made of copper, for example, and the outer partial layer of lead or tin. The substrate 3 is fixed to a support 9 by means of several fixing devices 8, called curved fixing members.
Fixed.

The semiconductor pellet 1 can also be fixed to the substrate 3 with an adhesive.

The support 9 is preferably a metal assembly plate. Further, the support body 9 can also be formed as a plate-like or lump-like cooling body for forced cooling.

A preferred embodiment of the semiconductor component according to the invention is:
Each semiconductor element (1) is fixedly coupled to the support body 9 by pressure using a spring member acting on the substrate 3. 2 to 4 each show the arrangement of leaf springs as spring members. As shown in FIG. 2, the leaf spring 16 is formed in the form of a ladle, the elongated and perforated end being guided through a cylindrical projection of an insulating support point 12 fixed to the support 9. , resting on the shoulder of the support point 12, the insulating plate 13 and the clamp inserted through the hole 12a are fixed by a screw 14 with a disc 15, the curved end resting on the base plate 3.

According to FIG. 3a, a similar fixing of the substrate 3 is carried out by forming the housing 5 as shown as part 5 right and part 51 in FIG.

Fig. 3b shows a similar arrangement to Fig. 3a in terms of wood quality, but a conductive path 58 is provided inside the housing, and one side is guided to the underside of the end of the current terminal holder 16. The other side is guided to a through pin 59 as a terminal on the outside of the housing and is thus connected to the semiconductor component I via a current terminal element 16.

The spring element can at the same time be provided for current-carrying purposes and can be configured as a current terminal element for connection with a conductor section on the outside of the housing. Furthermore, as shown in FIG. 4, the end of the terminal element 16 is extended, bent along a portion 53 continuing to the socket-shaped protrusion 51 of the housing 5, and drawn out. This free end 16b can be provided with a hole for making a threaded connection with a conductor section outside the housing.

Another preferred embodiment of the object according to the present invention, as shown in FIG. 5, is constituted by an object 20 called a push frame, which is formed in the shape of a frame and fixes the semiconductor element (1) on a support 9. The push frame 20 projects over its entire circumference beyond the base plate 3 so that it can be connected to the support 9 by means of threaded bolts or bayonet bolts or fastening devices. In the figure, the through hole 2 of the push frame 20 is shown in order to be directly fixed to the support body 9.
2 and a spring member 25 are provided. Furthermore, the push frame 20 has each semiconductor element! In each case, one opening 21 is provided, the internal width of which accommodates the entire necessary current-carrying part on the substrate 3 between the semiconductor pellet 1 and the connecting bolt 4'4'. moreover,
The push frame 20 includes a penetration portion through which a current terminal element 26 passes;
The current terminal element 26 rests on the contact layer 33 of the substrate 3 by means of a bend 26a and has a free end 26. b extends outwardly through the insulating housing 5. The bent portion 26a is fixed onto the substrate 3 by pressure by the push frame 20. Between the push frame 20 and the current terminal portion 26a, insert a round cord material 27 into an appropriate recess (not shown) on the push frame side.
The desired pressure contact between the support 9, the substrate 3 and the current terminal element 26a is achieved by this engagement.

The push frame 20 can be configured for any number of semiconductor components 1 and makes it possible to reliably and releasably fix the respective number of semiconductor components at the same time in a particularly simple manner.

Furthermore, this press frame 20 can be provided with one opening 21 for several semiconductor elements.

Furthermore, the push frame 20 is suitable for guiding and fixing the control component for operating the semiconductor component according to the invention and the current conductor part 18 of the wiring component 11 inside the housing. As shown in FIG. 1, this component 11 consists of a semiconductor pellet 1 on a substrate 3.
, so that the push frame 20 is provided with a connection location 17 on its exposed surface, which
In addition to being used to connect the current conductor portion 18 with terminal elements, it can also be used as a branch point in a circuit.

This push frame 20 is particularly suitable for use when arranging the same number of semiconductor elements (1) in two rows on the support 9 and when electrically connecting them to each other in one semiconductor output circuit. Can be done. The one pole of all elements I of one row and the other pole of all elements I of the other row each form one common connection track, and the respective poles of all elements I of both rows If adjacent poles form further connection points, the push frame 20 makes it possible to achieve a consistent fixing and connection of all connection tracks and connection of all connection points in a very simple manner. In FIG. 5, the symbols A and B designate connecting rails of the same pole of elements arranged perpendicularly to the drawing, respectively;
Such a structure is indicated by the reference numeral C denoting a connection point which is arranged perpendicularly to the drawing and consists of adjacent poles of the respective elements of both columns.

The solid connection of the semiconductor component I with the support 9 by means of spring pressure is achieved by the reference numeral 19 on the left edge of the left substrate in FIG.
This can also be achieved by interposing a leaf spring-like spring member between the push frame 20 and the substrate 3, as shown in FIG. The insulating housing 5, which encloses the semiconductor component 1, which is mounted on the support 9, is made of plastic or pressable or moldable synthetic resin and can be firmly connected, in particular by screws or spring connections. However, adhesive bonding is also possible.

According to the invention, an insulating housing 5 is provided, in particular for a convenient arrangement for holding a spring element which is simultaneously used as a current terminal element. For this purpose, the insulating housing 5 has on its inside a structure 55 suitable in position and size to accommodate a current terminal element, for example a part 36c of a spring member. FIG. 6 shows a partially sectional view of an embodiment in this regard. A substrate 3 is provided on a support 9. In this case, semiconductor pellets! and current conductor section 2 can be ignored. A part of an insulating housing 5 is provided at a distance from the substrate 3, and this insulating housing 5 has a flange-like projection 52.
and simply using the through hole indicated by the dashed line 57.
It is firmly connected to the support 9. A lid 28 made of an insulating material is placed on the upper end surface of the insulating housing 5,
For example, it is screwed as shown by a dashed line 56.

The current terminal element 36 consists of a spring material. This current terminal element 36 is located at the bent end 3 inside the housing.
13a on the substrate 3, and the insulating housing 5
is guided upwardly towards the lid 28 in a groove-like cut 55 and extends through the lid to the outside of the housing and extends at its free end 36.
In b, on the termination of the push-in part 29 for attaching the conductor part outside the housing, the clamp is bent in such a way that the insertion hole (not shown) of the means is located. After the terminal element 36 is secured to the lid 28, the inner portion 36 thereof
a is formed in such a shape that it comes into contact with the substrate 3 by a spring force. Between the support 9, the housing part 5 and the lid 28, sealing moldings 54, 27 are provided in each case.

In the embodiment of FIG. 6, the housing lid 28 has a hole through which the terminal element portion passes to the outside. However, the insulating housing 5 can also be provided with such a hole,
In that case, the respective housing outer part of the housing 5 is configured to be suitable for fixing the current conductor and at the same time connecting it with the conductor part of the housing internal structure.

Finally, FIG. 7 schematically shows a structure in which current terminal elements fixed to the substrate 3 connect semiconductor components directly to connection points outside the housing. The current terminal element is therefore fixedly attached at one end 46a to the substrate 3, for example by brazing. The other bent end 46c is provided with a substantially cylindrical projection obtained by deformation without cutting. A hole 28a in the housing lid 28 is provided to fit this protrusion. When the lid is placed on the housing 5, the protrusion fits into the matching hole 28a, and the surface portion of the lid 28 adjacent to the hole is placed on the inclined portion 48c. By configuring the current terminal element 46 to pass through the housing lid 2B, it becomes possible to connect a conductor portion outside the housing. Furthermore, the lid exerts a desired pressing force on the substrate 3 by suitably sizing and shaping the current terminal element 46;
The required contact pressure against the substrate 3 is therefore exerted on the support 9.

A suitable device with a direct contact device of the semiconductor pellet 1 is constructed by fixing current terminal elements to the semiconductor pellet 1.

The current terminal position on the outside of the housing can be provided with a bayonet contact or a screw contact for connecting with the conductor part. The semiconductor pellet 1 can also be firmly connected to the substrate 3 by gluing.

The semiconductor assembly unit according to the invention comprises firstly providing a substrate 3 with at least one semiconductor pellet 1 and next to it a number of contact bolts 4 or suitably designed contact elements determined by the structure of the pellet; The semiconductor pellet is manufactured by electrically bonding the semiconductor pellet to the contact member, for example via a wire-like conducting wire portion. In this way, an intermediate product is obtained which can be inspected before processing as desired, which can be carried out after inspection either by fixing with a separate device or at the same time by placing a spring element on the substrate 3 which serves as an energizer. By placing it on the support 9, it is firmly coated. Furthermore, depending on the fixing type of the spring member 16°26,
It may be necessary to secure the insulating housing 5 to the support 9 before installing the spring member. Housing lid 2
Current terminal element 36 guided by 8 and exhibiting a spring action
In the case of a structure with , the current terminal element 36 is fixed to the lid 28 . Thereafter, the current terminal elements 36 are placed on the respective contact positions of the substrate 3 by simultaneously placing a lid on the insulating housing, and the lid is screwed onto the insulating housing 5 by means of a pressing device. By doing so, the contact between the support 9, the substrate 3 and the current terminal element is effected by spring force.

[Brief explanation of drawings]

FIG. 1 is a side sectional view showing one embodiment of the semiconductor assembly unit of the present invention, and FIGS. 2, 3, and 4 are partial views of different embodiments of the terminal connection portion of the device shown in FIG. 5 is a side sectional view showing an embodiment of the semiconductor element fixing device constituting the device shown in FIG. 1, and FIGS.
The figure is a side sectional view partially showing different embodiments of the terminal connection section of the device shown in FIG. 1. ■...Semiconductor element, l...Semiconductor pellet, 2
... Current conductor portion, 3... Substrate, 5... Insulating housing, 6... Current terminal element, 9... Support,! 0... Fixed curved member, 12... Insulating support point, 16... Current terminal element, 16b... Current terminal element free end, 20... Push frame, 26... Current terminal element, 28
...Housing lid, 28a...Housing hole, 31
...Insulating plate (insulating layer), 32.33...Contact metal coating layer, 36...Current terminal element, 36b...Current terminal element free end, 36c...Current terminal element portion, 46... Current terminal element, 58... Conductive path, 59...
・Through pin.

Claims (1)

Claims: 1) a) at least two semiconductor elements with current-conducting portions (2), b) each thermally conductive and electrically insulated, and c) placed flat; d) housed in a housing (5) of insulating material; e) current-conducting portion (2) provided on and electrically connected to the support (9) of the semiconductor component; f) each semiconductor element (I) is connected to at least one semiconductor pellet (1) and a current conductor connected thereto; part (2) is configured as a component fixedly attached to an electrically insulating and thermally conductive substrate (3), g) adding assembly and/or circuit components as the substrate (3); A structure is used consisting of a contact metal layer (32, 33) and an insulating layer (31), with a surface extent for arranging h) the semiconductor element (I) and the insulating housing (5) on the support. (9) is releasably fixed on the current terminal element (6, 18, 26, 3 , 46), and a structure for connecting this current terminal element to a current conductor portion (2). 2) Semiconductor assembly unit according to claim 1, wherein the semiconductor component (I) has at least one semiconductor pellet (1) with at least one functional element. 3) Semiconductor assembly unit according to claim 2, wherein the semiconductor pellet (1) comprises active and passive functional elements. 4) as substrate (3) a plate (33) made of porcelain with a coated contact metal layer (33) on at least one side;
A semiconductor assembly unit according to claim 1, wherein the semiconductor assembly unit is provided with: 5) on the side of the substrate (3) facing the support (9), a contact metallization layer consisting of a material which causes the substrate (3) to have a convex curvature with respect to the support (9) by bimetallic action; 5. A semiconductor assembly unit according to claim 4, which comprises at least one partial layer. 6) Contact metal layer (32) opposite the semiconductor pellet (1)
6. The semiconductor assembly unit according to claim 5, wherein the semiconductor assembly unit) comprises a base layer made of copper and a cover layer made of a contact metal having a coefficient of thermal expansion greater than that of copper. 7) Each semiconductor element (I) has a semiconductor pellet (
The pressure caused by the spring force acting on the support (1)
2. The semiconductor assembly unit according to claim 1, wherein the semiconductor assembly unit is removably firmly coupled to the semiconductor assembly unit. 8) Each semiconductor element (I) is supported by the support body (9) by the pressure exerted by the spring member (16) on the substrate (3).
2. The semiconductor assembly unit according to claim 1, wherein the semiconductor assembly unit is removably firmly coupled to the semiconductor assembly unit. 9) A leaf spring is provided as the spring element (16), in each case at one end of the insulating support point (12) of the support (9).
) The semiconductor assembly unit according to claim 8, which is fixed on the semiconductor assembly unit. 10) The semiconductor assembly unit according to claim 8, wherein a leaf spring is provided as the spring member (16) and is fixed to the insulating housing (5). 11) the spring member (16) is simultaneously designed for energization;
9. Semiconductor assembly unit according to claim 8, configured and mounted as a current terminal element. 12) A conductive path (58) is provided inside the housing (5), the semiconductor element (I) is connected to the conductive path (58) via the current terminal element (16), and the conductive path (58) is provided inside the housing. 9. A semiconductor assembly unit according to claim 8, which is connected to a through pin (59) for an external connection point. 13) A semiconductor assembly unit according to claim 1, wherein the semiconductor element (I) is removably attached to the support (9) by screwing the substrate (3). 14) The semiconductor element (I) is removably attached to the support (9) by means of a fixed curved member (10) acting on the substrate (3) and fixed to the support (9). The semiconductor assembly unit according to item 1. 15) The semiconductor assembly unit according to claim 1, wherein the semiconductor element (I) is removably fixed to the support (9) by a push frame (20) acting on the substrate (3). 16) Semiconductor pellets (
The push frame (20) for 1) has an opening (21) through which the circuit part and the current conductor part extend, and in each case the edge area adjacent to the opening (21) is pressed under pressure. Claim 1 in contact with the substrate (3)
The semiconductor assembly unit according to item 5. 17) Each press frame (of each semiconductor element (I)
20) and the substrate (3), a leaf spring-shaped spring member (1
9) is provided, the semiconductor assembly unit according to claim 15. 18) The push frame (20) presses the substrate (3) of the semiconductor element (I).
16. Semiconductor assembly unit according to claim 15, having conductive paths for electrical connections on the side facing ). 19) The insulating housing has a housing wall (
5) and a housing cover (28), the housing wall (5) being connected to a respective portion (3) of the current terminal element (36).
6c) Semiconductor assembly unit according to claim 1, having a structure (55) suitable in position and extent for inset. 20) The insulating housing has a current terminal element (16, 36)
Provided with a hole through which the free end (16b, 36b) of is passed to the outside,
Semiconductor according to claim 1, adapted to arrange the end (36b) of the current terminal element outside the housing and to connect (29) with a conductor section outside the housing. assembly unit. 21) The semiconductor component (I) is fitted in such a way that, during assembly, the components of the component unit fit into the holes (28a) configured to fit into the housing, thereby making a terminal contact external to the housing. 2. Semiconductor assembly unit according to claim 1, wherein the current terminal element (46) is constructed and mounted on the substrate (3).