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JPS63246855A - Hybrid integrated circuit device - Google Patents

Hybrid integrated circuit device

Info

Publication number
JPS63246855A
JPS63246855A JP8152787A JP8152787A JPS63246855A JP S63246855 A JPS63246855 A JP S63246855A JP 8152787 A JP8152787 A JP 8152787A JP 8152787 A JP8152787 A JP 8152787A JP S63246855 A JPS63246855 A JP S63246855A
Authority
JP
Japan
Prior art keywords
terminal
receiving part
coupler receiving
integrated circuit
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8152787A
Other languages
Japanese (ja)
Inventor
Toshio Hiroe
廣江 敏夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP8152787A priority Critical patent/JPS63246855A/en
Publication of JPS63246855A publication Critical patent/JPS63246855A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To simplify a manufacturing process and to implement a compact configuration, by forming a lead terminal and an outer connecting terminal as a unitary body, and constituting a coupler receiving part for connection with an outer signal line, which is formed as a unitary body together with a cap member in the vicinity of the outer connecting terminal. CONSTITUTION:A deflection is provided for a lead terminal 6 that is fixed to a substrate 7, on which an electronic part 8 is mounted, in a soft resin part 4 such as silicone. The terminal 6 is completely fixed with a hard resin part 5 such as epoxy and becomes the terminal of a coupler receiving part 1a. The outer configuration is constituted by a heat sink 3 that fixes the substrate 7, on which the part is mounted, with a bonding resin and the like, a plastic case 2 and a cap 1. The coupler receiving part 1a is constituted by molding a part of the cap itself. When the lead terminal 6 from the substrate 7 is intactly used as the terminal of the coupler receiving part 1a, and furthermore when the coupler receiving part 1a is provided at the cap 1; manufacturing of the product can be simplified, and the miniaturization thereof can be achieved.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、混成集積回路装置の構造に関するものである
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the structure of a hybrid integrated circuit device.

〔従来の技術〕[Conventional technology]

従来この種の混成集積回路装置は、牛導体素子を固着し
た回路基板に接続されたリード参を回路基板を封入した
容器の枠に固定しである外部接続用リードに溶接、rt
んだ付は等で接続し、この外部接続用リードに外部の信
号線と接続するためのカプラーの受入部を形成していた
Conventionally, in this type of hybrid integrated circuit device, a lead pin connected to a circuit board to which a conductive element is fixed is fixed to the frame of a container in which the circuit board is enclosed, and then welded to an external connection lead, which is RT.
The connection was made by soldering, etc., and a receiving part for a coupler for connecting to an external signal line was formed on this external connection lead.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上述した従来の構造は、回路基板からのリード線とカプ
ラーの受入部との間に外部接続リードがある為下記の欠
点がある。
The conventional structure described above has the following drawbacks because there is an external connection lead between the lead wire from the circuit board and the receiving part of the coupler.

1、外部接続リードを設ける為外形寸法が大きくなる。1. The external dimensions become larger due to the provision of external connection leads.

2、 外部接続リードと基板からのリード端子との接続
を要しコスト高となる。
2. It requires connection between external connection leads and lead terminals from the board, resulting in high costs.

特に外形寸法に厳しい制約がある場合、設計に無理が発
生する危険があり、高信頼性を要求される相合品質不良
の原因にもなりかねない。
In particular, if there are strict restrictions on external dimensions, there is a risk that the design will be unreasonable, and this may also cause defects in the quality of compatibility, which requires high reliability.

〔問題点を解決するための手段〕[Means for solving problems]

本発明の混成集積回路装置ri電子部品を搭載し九基板
と、該基板に設けられたリード端子と、前記基板が載置
きれた容器と、前記リード端子が電気的に接続された外
部接続端子を備えた前記容器の蓋部材とを有する混成集
積回路装置において、前記リード端子と前記外部接続端
子は一体に形成されており、前記外部接続端子の近傍は
蓋部材と一体に構°成された外部の信号線との接続のた
めのカプラーの受は入れ部を構成している。
A hybrid integrated circuit device RI of the present invention includes a board on which electronic components are mounted, a lead terminal provided on the board, a container in which the board is placed, and an external connection terminal to which the lead terminal is electrically connected. In the hybrid integrated circuit device, the lead terminal and the external connection terminal are integrally formed, and the vicinity of the external connection terminal is integrally formed with the lid member. A coupler receptacle for connection with an external signal line constitutes a receptacle.

回路基板からのリード端子を直接外部に出してカプラー
の受入部の一部としており%蓋部材の一部でカプラーの
受入部の外周部を形成しているので、製品全体の寸法は
小型に形成でき、製造コストも安くなる。更に、リード
端子ri蓋部材で外部に蕗出する場合機械的ストレスに
耐える様硬質のエポキシ系樹脂で固定し、さらに部品が
搭載されている回路基板及びリード端子たわみ部はシリ
コーン等の軟質樹脂で被うことにより、熱膨張係数の差
による熱歪はこのたわみ部により吸収できる。
The lead terminal from the circuit board is brought out directly to the outside and becomes part of the coupler receiving part, and a part of the lid member forms the outer periphery of the coupler receiving part, so the overall size of the product is small. possible, and the manufacturing cost will be lower. Furthermore, when the lead terminal RI cover member is to be exposed externally, it should be fixed with hard epoxy resin to withstand mechanical stress, and the circuit board on which components are mounted and the lead terminal's bending parts should be covered with soft resin such as silicone. By covering, thermal strain due to the difference in thermal expansion coefficients can be absorbed by this flexure.

〔実施例〕〔Example〕

次に、本発明の実施例を図面を参照して説明する。 Next, embodiments of the present invention will be described with reference to the drawings.

第1図に、本発明の一実施例の平面図である。FIG. 1 is a plan view of an embodiment of the present invention.

さらに第2図は、第1図のA−A’線断面図であり第3
図は、同じ(B−B’線断面図である。
Furthermore, FIG. 2 is a cross-sectional view taken along line A-A' in FIG.
The figure is the same (BB' line sectional view).

第2図及び第3図に示すように電子部品8を搭載した基
板7に固定されたリード端子6はシリコーン等の軟質樹
脂部4内でたわみを設けられさらにエポキシ等の硬質樹
脂部5により完全に固定される。これによりカプラーの
受入部1aの端子となる。
As shown in FIGS. 2 and 3, the lead terminals 6 fixed to the board 7 on which the electronic components 8 are mounted are bent in the soft resin part 4 such as silicone, and are further fixed in the hard resin part 5 such as epoxy. Fixed. This serves as a terminal for the receiving portion 1a of the coupler.

さらに外形の構成は1部品が搭載されている基板7を接
着樹脂等で固定するヒートシンク3.プラスチックケー
ス2及びMlでおるが、カプラ受入れ部1at:t、蓋
そのものの一部を成形して構成されている。
Furthermore, the external configuration consists of a heat sink 3, which fixes the board 7 on which one component is mounted with adhesive resin, etc. Although it is covered with a plastic case 2 and Ml, the coupler receiving part 1at:t is constructed by molding a part of the lid itself.

〔発明の効果〕〔Effect of the invention〕

以上説明した様に、本発明は、基板からのリード端子6
をそのままカプラー受は入れ部1aの端子として使用し
ていること、さらに蓋1にカプラー受は入れ部1aを設
けたことにより、製造工程が簡略化されるとともに、製
品の外形も小型化され、 1、製品使用側のスペースファクターの問題2、製品製
造側の量産性及びコストの問題などが解決される。
As explained above, the present invention provides lead terminals 6 from the board.
By using the coupler receiver as it is as a terminal of the insert part 1a, and by providing the coupler receiver insert part 1a in the lid 1, the manufacturing process is simplified and the external size of the product is also reduced. 1. Problems with space factors on the product user side, 2. Problems with mass productivity and cost on the product manufacturing side are solved.

置の平面図、第2図は第1図に示した本発明の一実施例
による混成集積回路装置のA−A’線断面図、第3図r
i第1図に示した本発明の一実施例による混成集積回路
装置のB−B’線断面図である。
FIG. 2 is a cross-sectional view taken along line A-A' of the hybrid integrated circuit device according to an embodiment of the present invention shown in FIG.
i is a sectional view taken along line BB' of the hybrid integrated circuit device according to an embodiment of the present invention shown in FIG. 1;

l・・・・・・蓋、1a・・・・・・蓋に設けたカプラ
ーの受は入れ部、2・・・・・・プラスチックケース、
3・・・・・・ヒートシンク、4・・・・・・シリコー
ン等の軟質樹脂、5・・・・・・エポキシ等の硬質樹脂
、6・・・・・・リード端子(カプラー受入側端子)、
7・・・・・・基板、8・・・・・・電子部品。
l...Lid, 1a...The coupler receptacle provided on the lid is the receptacle, 2...Plastic case,
3...Heat sink, 4...Soft resin such as silicone, 5...Hard resin such as epoxy, 6...Lead terminal (coupler receiving side terminal) ,
7... Board, 8... Electronic parts.

Claims (1)

【特許請求の範囲】[Claims] 電子部品を搭載した基板と、該基板に設けられたリード
端子と、前記基板が載置された容器と、前記リード端子
が電気的に接続された外部接続端子を備えた前記容器の
蓋部材とを有する混成集積回路装置において、前記リー
ド端子と前記外部接続端子は一体に形成されており、前
記外部接続端子の近傍は前記蓋部材と一体構成された外
部の信号線との接続のためのカプラーの受入れ部を構成
していることを特徴とする混成集積回路装置。
A lid member for the container includes a board on which an electronic component is mounted, a lead terminal provided on the board, a container on which the board is placed, and an external connection terminal to which the lead terminal is electrically connected. In the hybrid integrated circuit device, the lead terminal and the external connection terminal are integrally formed, and a coupler for connection with an external signal line is integrally formed with the lid member near the external connection terminal. 1. A hybrid integrated circuit device comprising a receiving section of a hybrid integrated circuit device.
JP8152787A 1987-04-01 1987-04-01 Hybrid integrated circuit device Pending JPS63246855A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8152787A JPS63246855A (en) 1987-04-01 1987-04-01 Hybrid integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8152787A JPS63246855A (en) 1987-04-01 1987-04-01 Hybrid integrated circuit device

Publications (1)

Publication Number Publication Date
JPS63246855A true JPS63246855A (en) 1988-10-13

Family

ID=13748796

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8152787A Pending JPS63246855A (en) 1987-04-01 1987-04-01 Hybrid integrated circuit device

Country Status (1)

Country Link
JP (1) JPS63246855A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6774465B2 (en) * 2001-10-05 2004-08-10 Fairchild Korea Semiconductor, Ltd. Semiconductor power package module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6774465B2 (en) * 2001-10-05 2004-08-10 Fairchild Korea Semiconductor, Ltd. Semiconductor power package module

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