JPS63222274A - Socket apparatus for pin grid array type package - Google Patents

Abstract

PURPOSE:To enable the arranging of contacts at a narrow interval so as to be touchable with pins, by bringing a plurality of fine-width planar contacts erected on a socket body into contact with the side of pins of a carrier being elastically deflected with an inclined surface of a carrier. CONSTITUTION:Pins 16 of a package 11 are inserted into corresponding holes 22, a package body 27 is housed into a recess 21 to be fixed with a fastener 26 and the package 11 is mounted on a carrier 13. Then, the carrier 13 is housed into a recess 17 of a socket body 14 and fixed with a fastener 20. In the housing process, an inclined surface 24 abuts the tip 15a of contacts 15 is that they 15 are elastically deflected to approach pins 16 having the tip 15a thereof sliding over the inclined surface 24 to be pressed on the side 16a of the pins 16. This makes the pins 16 electrically connect to the corresponding contacts 15 and under such a condition, the burning-in or testing of the package 11 are performed.

Description

Detailed Description of the Invention (II Required) The present invention provides a socket device for a pin grid array type package, in which the contact is shaped like a narrow plate, the carrier is provided with an inclined surface portion for bending the contact, and the contact is bent. The side surfaces of the pins come into contact with each other, and are suitable for packages with narrow pin spacing and packages with short pin lengths.

[Industrial application field]

The present invention relates to a socket device for a pin grid array type package.

Pin grid array type packages tend to have narrower pin spacing, and socket devices are required to be able to accommodate narrower pin spacing.

[Conventional technology]

FIG. 8 shows a conventional socket device 1. As shown in FIG. In the figure, 2 is a socket and 4 is a pin grid array type package. Each pin 5 is connected to a corresponding contact 7 provided on the socket body 6.

[Problem that the invention seeks to solve]

The contact 7 has a three-dimensional shape having opposing spring parts curved so as to sandwich the pin 5, and there is a limit to how narrow the pins p1 of adjacent contacts can be. A problem has arisen in that it is difficult to cope with the narrowing of the pin spacing.

Furthermore, since the pin 5 is sandwiched in the structure, it is difficult to use a structure in which the pin 5 is short.

[Means for solving problems]

The present invention provides a pin grid array type package socket device comprising a carrier for accommodating a pin grid array type package and a socket to which the carrier is attached. is implanted in a configuration corresponding to each pin of the package, the carrier is configured to have a sloped surface portion corresponding to the above, and in the process of attaching the carrier to the socket, each of the contacts It is elastically deflected by each inclined surface part,
It is configured to come into contact with the side surface of the pin.

[Effect].

Since the contacts are in the form of elongated plates and are flat, the spacing between the contacts on the socket can be narrowed.

The means for bringing the contacts into contact with the pins is the sloped surface portion of the carrier, and the sloped surface portion is provided corresponding to each contactor.

These allow the contacts to be arranged at close intervals while hanging in contact with the pins.

〔Example〕

FIG. 1 shows a socket device 1 for a pin grid array type package according to an embodiment of the present invention in an exploded state together with a pin grid array type package 2 in which the socket device 1 is used.

The socket device 10 consists of a socket 12 and a carrier 13.

Contactors 15 shown in FIG. 2 are implanted in the socket body 14 in an arrangement corresponding to each pin 16 of the package 11, with the upper tips protruding into the carrier accommodating recess 17. .

As shown in FIG. 2, the contactor 15 is a narrow plate-shaped body whose width W is somewhat larger than the diameter d of the pin 16 (see FIG. 7).
It is made of palladium or BeCu, or plated if necessary, and can be elastically deflected in the direction of the arrow. Tip 15a of contactor 15.

It has a round shape, which improves the sliding on the inclined surface portion as will be described later. Further, each contactor 15 is arranged in such a direction that the contactor 15 bends in the same direction.

In addition, a recess 18 is formed in the socket body 14 on the bending direction side with respect to each contact 15, and the protrusion dimension a of the contact 15 from the socket body 14 is shortened, and the length b of the bendable portion is shortened. (See Figure 5).

Further, the socket body 14 is provided with a positioning pin 19 and a stopper 20.

The carrier 13 has a recess 21 for accommodating a package, and a number of pin accommodating holes 22 corresponding to the pins 16 are formed in the bottom surface thereof.

The bottom surface of the carrier 13 is formed with a vertical surface 23 extending downward from the eight holes 22, and a curved sloped surface portion 24 facing downward to the right.

This inclined surface portion 23 is formed between adjacent holes 22.

The carrier 13 also includes a positioning hole 25 and a stopper 2.
6 is a provision.

Further, the thickness t of the bottom plate portion of the carrier 13 is greater than the length 2 of the pin 16.

Next, the operation when mounting the package 11 on the socket assembly a10 and the contact operation between the pin 16 and the contactor 15 at this time will be explained.

First, as shown in FIG.
6 into the corresponding hole 22, the package body 27 is accommodated in the recess 21 and fixed with the stopper 26, and the package 1
1 to the carrier 13. Pin 16 is carrier 1
3, and is protected from unnecessary bending during handling. The pin 16 also lies along a vertical plane 23.

Next, as shown in FIG. 4, the carrier 13 is accommodated in the recess 17 of the socket body 14 and fixed with the stopper 20. Thereby, the pin 16 and the contactor 15 are connected as described later. The above work is performed with good work efficiency.

The carrier 13 is positioned with respect to the socket body 14 with the hole 25 fitting into the pin 19, and is moved in the direction of arrow B with each inclined portion 24 facing the contact 15, as shown in an enlarged view in FIG. and is housed in the four parts 17. Each contact 15 is offset with respect to the pin 19, so that the tip of the pin 19 does not collide with the contact 15, and the carrier 13 is normally accommodated within the four parts 17.

During this housing process, the inclined surface portion 24 comes into contact with the tip 15a of the contact 15, and the tip 15a of the contact 15 contacts the inclined surface portion 24.
4 and elastically bends in the direction of the arrow, that is, in the direction approaching the pin 16, as shown in FIG. 6, and finally, as shown in FIG. 7, the tip of the contact 15 is pin 16
, and each pin 16 and the corresponding contactor 15 are electrically connected.

I! j! In other words, the contact 15 is connected to the side surface 16 of the pin 16.
It enters deep into the tapered portion 28 formed by the pin side surface 16a and the sloped surface portion 24, is inserted between the pin side surface 16a and the sloped surface portion 24, and is brought into contact with and electrically connected to the pin side surface 16a. Ru.

Note that the pin 16 is along the vertical plane 23 and the contact 15
The vertical surface 23 stops receiving the pressing force applied by the pin 16, and the pin 16 does not deform.

Further, the contactor 15 is plate-shaped, and as shown in FIG. 7, since its flat portion presses, it does not come off laterally even if the pin side surface 16a is a curved surface.

Furthermore, since the contact 15 contacts the side surface of the pin 16 rather than the tip of the pin 16, even if there are variations in the lengths of the pin 16 and the contact 15, this does not have an effect and the contact is ensured.

In the above state, the package 11 is burn-in or tested.

After the test is completed, the carrier 13 is removed from the socket device 10 in the reverse order to the above. The contactor 15 is elastically restored.

Since each of the contacts 15 is not three-dimensional as described above but is planar, the pitch p2 of the contacts 15 can be made smaller than in the past. For this reason, the socket assembly @10 described above is particularly suitable for the package 11 in which the pitch of the pins 16 is small.

〔Effect of the invention〕

According to the present invention, since the contact is plate-shaped and flat, the pad of the contact can be narrowed, which is sufficient to narrow the pin spacing of the package. I can handle it.

[Brief explanation of drawings]

Fig. 1 is an exploded view of an embodiment of the socket device for a pin grid array type package according to the present invention, Fig. 2 is an exploded view of the contact shown in Fig. 1, and Fig. 3 is a view showing the package. Figure 4 shows the carrier holding the package held in the socket. Figure 5 shows the pins, inclined surfaces, and contacts when the carrier is housed in the socket. Figure 6 is an enlarged view showing the relative positional relationship between the contacts and pins in Figure 4. Figure 7 is a cross section taken along the line Vl-Vl in Figure 6. 8 are diagrams showing an example of a conventional socket device. In the figure, 10 is a socket device for a pin grid array type package, 11 is a pin grid array type package, 12 is a socket, 13 is a carrier, 14 is a socket body, 15 is a contact, 15a is a tip, 16 is a pin, 16a 17 is a recess for accommodating a carrier, 18 is a recess, 19 is a positioning pin, 21 is a recess for accommodating a package, 22 is a pin accommodating hole, 23 is a vertical surface, 24 is an inclined surface, 25 is a positioning hole, 27 2 is the package body, and 2 is the tapered part. Book 11! 111II; A prostitute who stretches out the fireworks 11 and lingers. Yaria 1st attack - Hisusuki Tasami, Denki O figure Thread 3 key number l - Sokuto = l Zet? 4 Tabuse B Onibu 1 O figure Be 4 figure? sG figure

Claims (1)

[Claims] A socket device for a pin grid array type package comprising a carrier for accommodating a pin grid array type package and a socket to which the carrier is attached, wherein a plurality of the sockets (12) are mounted on a socket body (14). The narrow plate-shaped contact (15) is attached to the package (11).
The carrier (13) is implanted in a configuration corresponding to each pin (16) of the inclined surface part (2).
4), and in the process of attaching the carrier (13) to the socket (12), each of the contacts (15) connects to each of the inclined surface portions (
24) A socket device for a pin grid array type package, characterized in that the socket device is configured to be elastically deflected by the pin (16) so as to come into contact with the side surface (16a) of the pin (16).