JPS63202628A - Production of thermosetting resin - Google Patents
Production of thermosetting resinInfo
- Publication number
- JPS63202628A JPS63202628A JP3348787A JP3348787A JPS63202628A JP S63202628 A JPS63202628 A JP S63202628A JP 3348787 A JP3348787 A JP 3348787A JP 3348787 A JP3348787 A JP 3348787A JP S63202628 A JPS63202628 A JP S63202628A
- Authority
- JP
- Japan
- Prior art keywords
- oxazoline
- pka
- polyol compound
- acid
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 28
- 239000011347 resin Substances 0.000 title claims abstract description 28
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 12
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- -1 polyol compound Chemical class 0.000 claims abstract description 23
- 229920005862 polyol Polymers 0.000 claims abstract description 18
- 239000002253 acid Substances 0.000 claims abstract description 16
- 238000006243 chemical reaction Methods 0.000 claims abstract description 16
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000003054 catalyst Substances 0.000 claims abstract description 15
- 125000001931 aliphatic group Chemical group 0.000 claims abstract description 8
- 150000002148 esters Chemical class 0.000 claims abstract description 6
- 239000002841 Lewis acid Substances 0.000 claims abstract description 5
- 150000001350 alkyl halides Chemical class 0.000 claims abstract description 5
- 238000010438 heat treatment Methods 0.000 claims abstract description 5
- 150000007517 lewis acids Chemical class 0.000 claims abstract description 5
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052740 iodine Inorganic materials 0.000 claims abstract description 4
- 239000011630 iodine Substances 0.000 claims abstract description 4
- 239000000126 substance Substances 0.000 claims abstract description 4
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 claims abstract 2
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 claims description 6
- 125000004432 carbon atom Chemical group C* 0.000 claims description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 5
- 238000009833 condensation Methods 0.000 claims description 4
- 230000005494 condensation Effects 0.000 claims description 4
- 125000002723 alicyclic group Chemical group 0.000 claims description 3
- 125000003504 2-oxazolinyl group Chemical class O1C(=NCC1)* 0.000 claims description 2
- IMSODMZESSGVBE-UHFFFAOYSA-N 2-Oxazoline Chemical compound C1CN=CO1 IMSODMZESSGVBE-UHFFFAOYSA-N 0.000 abstract description 12
- 150000002918 oxazolines Chemical class 0.000 abstract description 11
- 239000000203 mixture Substances 0.000 abstract description 6
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 abstract description 4
- 150000001875 compounds Chemical class 0.000 abstract description 4
- 229920003986 novolac Polymers 0.000 abstract description 4
- 239000002904 solvent Substances 0.000 abstract description 3
- 229940098779 methanesulfonic acid Drugs 0.000 abstract description 2
- CZXGXYBOQYQXQD-UHFFFAOYSA-N methyl benzenesulfonate Chemical compound COS(=O)(=O)C1=CC=CC=C1 CZXGXYBOQYQXQD-UHFFFAOYSA-N 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 7
- 150000001299 aldehydes Chemical class 0.000 description 6
- 150000007513 acids Chemical class 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 150000002989 phenols Chemical class 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 229960001019 oxacillin Drugs 0.000 description 3
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 2
- FOCSWKJNNDKQBA-UHFFFAOYSA-N 2-(2-methylphenyl)-4,5-dihydro-1,3-oxazole Chemical compound CC1=CC=CC=C1C1=NCCO1 FOCSWKJNNDKQBA-UHFFFAOYSA-N 0.000 description 2
- GUXJXWKCUUWCLX-UHFFFAOYSA-N 2-methyl-2-oxazoline Chemical compound CC1=NCCO1 GUXJXWKCUUWCLX-UHFFFAOYSA-N 0.000 description 2
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 2
- ZXTHWIZHGLNEPG-UHFFFAOYSA-N 2-phenyl-4,5-dihydro-1,3-oxazole Chemical compound O1CCN=C1C1=CC=CC=C1 ZXTHWIZHGLNEPG-UHFFFAOYSA-N 0.000 description 2
- IAVREABSGIHHMO-UHFFFAOYSA-N 3-hydroxybenzaldehyde Chemical compound OC1=CC=CC(C=O)=C1 IAVREABSGIHHMO-UHFFFAOYSA-N 0.000 description 2
- RGHHSNMVTDWUBI-UHFFFAOYSA-N 4-hydroxybenzaldehyde Chemical compound OC1=CC=C(C=O)C=C1 RGHHSNMVTDWUBI-UHFFFAOYSA-N 0.000 description 2
- IFIUFEBEPGGBIJ-UHFFFAOYSA-N 4-methyl-4,5-dihydro-1,3-oxazole Chemical compound CC1COC=N1 IFIUFEBEPGGBIJ-UHFFFAOYSA-N 0.000 description 2
- CIIILUMBZOGKDF-UHFFFAOYSA-N 5-methyl-4,5-dihydro-1,3-oxazole Chemical compound CC1CN=CO1 CIIILUMBZOGKDF-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 150000003460 sulfonic acids Chemical class 0.000 description 2
- 229920006337 unsaturated polyester resin Polymers 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- BEQDKWKSUMQVMX-UHFFFAOYSA-N 2,4-dimethyl-4,5-dihydro-1,3-oxazole Chemical compound CC1COC(C)=N1 BEQDKWKSUMQVMX-UHFFFAOYSA-N 0.000 description 1
- DXPIUHXKXUKZDK-UHFFFAOYSA-N 2,5-dimethyl-4,5-dihydro-1,3-oxazole Chemical compound CC1CN=C(C)O1 DXPIUHXKXUKZDK-UHFFFAOYSA-N 0.000 description 1
- ZDNUPMSZKVCETJ-UHFFFAOYSA-N 2-[4-(4,5-dihydro-1,3-oxazol-2-yl)phenyl]-4,5-dihydro-1,3-oxazole Chemical compound O1CCN=C1C1=CC=C(C=2OCCN=2)C=C1 ZDNUPMSZKVCETJ-UHFFFAOYSA-N 0.000 description 1
- NYEZZYQZRQDLEH-UHFFFAOYSA-N 2-ethyl-4,5-dihydro-1,3-oxazole Chemical compound CCC1=NCCO1 NYEZZYQZRQDLEH-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- NHKJNWKLSOOMTQ-UHFFFAOYSA-N 2-prop-1-enyl-4,5-dihydro-1,3-oxazole Chemical compound CC=CC1=NCCO1 NHKJNWKLSOOMTQ-UHFFFAOYSA-N 0.000 description 1
- RSCVPGQKACSLBP-UHFFFAOYSA-N 4-methyl-2-[3-(4-methyl-4,5-dihydro-1,3-oxazol-2-yl)phenyl]-4,5-dihydro-1,3-oxazole Chemical compound CC1COC(C=2C=C(C=CC=2)C=2OCC(C)N=2)=N1 RSCVPGQKACSLBP-UHFFFAOYSA-N 0.000 description 1
- LDESTFIGYTYDHH-UHFFFAOYSA-N 4-methyl-2-phenyl-4,5-dihydro-1,3-oxazole Chemical compound CC1COC(C=2C=CC=CC=2)=N1 LDESTFIGYTYDHH-UHFFFAOYSA-N 0.000 description 1
- UWHWRJUMACAJPY-UHFFFAOYSA-N 5-methyl-2-phenyl-4,5-dihydro-1,3-oxazole Chemical compound O1C(C)CN=C1C1=CC=CC=C1 UWHWRJUMACAJPY-UHFFFAOYSA-N 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- KZMGYPLQYOPHEL-UHFFFAOYSA-N Boron trifluoride etherate Chemical compound FB(F)F.CCOCC KZMGYPLQYOPHEL-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229920003261 Durez Polymers 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- SXRSQZLOMIGNAQ-UHFFFAOYSA-N Glutaraldehyde Chemical compound O=CCCCC=O SXRSQZLOMIGNAQ-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- 229920002396 Polyurea Polymers 0.000 description 1
- 229910021627 Tin(IV) chloride Inorganic materials 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 1
- 229940092714 benzenesulfonic acid Drugs 0.000 description 1
- AGEZXYOZHKGVCM-UHFFFAOYSA-N benzyl bromide Chemical compound BrCC1=CC=CC=C1 AGEZXYOZHKGVCM-UHFFFAOYSA-N 0.000 description 1
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 1
- KMGBZBJJOKUPIA-UHFFFAOYSA-N butyl iodide Chemical compound CCCCI KMGBZBJJOKUPIA-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- VAYGXNSJCAHWJZ-UHFFFAOYSA-N dimethyl sulfate Chemical compound COS(=O)(=O)OC VAYGXNSJCAHWJZ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- CCIVGXIOQKPBKL-UHFFFAOYSA-M ethanesulfonate Chemical compound CCS([O-])(=O)=O CCIVGXIOQKPBKL-UHFFFAOYSA-M 0.000 description 1
- VRZVPALEJCLXPR-UHFFFAOYSA-N ethyl 4-methylbenzenesulfonate Chemical compound CCOS(=O)(=O)C1=CC=C(C)C=C1 VRZVPALEJCLXPR-UHFFFAOYSA-N 0.000 description 1
- XDRMBCMMABGNMM-UHFFFAOYSA-N ethyl benzenesulfonate Chemical compound CCOS(=O)(=O)C1=CC=CC=C1 XDRMBCMMABGNMM-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229940015043 glyoxal Drugs 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- HVTICUPFWKNHNG-UHFFFAOYSA-N iodoethane Chemical compound CCI HVTICUPFWKNHNG-UHFFFAOYSA-N 0.000 description 1
- INQOMBQAUSQDDS-UHFFFAOYSA-N iodomethane Chemical compound IC INQOMBQAUSQDDS-UHFFFAOYSA-N 0.000 description 1
- XJTQJERLRPWUGL-UHFFFAOYSA-N iodomethylbenzene Chemical compound ICC1=CC=CC=C1 XJTQJERLRPWUGL-UHFFFAOYSA-N 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- VUQUOGPMUUJORT-UHFFFAOYSA-N methyl 4-methylbenzenesulfonate Chemical compound COS(=O)(=O)C1=CC=C(C)C=C1 VUQUOGPMUUJORT-UHFFFAOYSA-N 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- PVWOIHVRPOBWPI-UHFFFAOYSA-N n-propyl iodide Chemical compound CCCI PVWOIHVRPOBWPI-UHFFFAOYSA-N 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000765 poly(2-oxazolines) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 150000003459 sulfonic acid esters Chemical class 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- KUCOHFSKRZZVRO-UHFFFAOYSA-N terephthalaldehyde Chemical compound O=CC1=CC=C(C=O)C=C1 KUCOHFSKRZZVRO-UHFFFAOYSA-N 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
Landscapes
- Polyethers (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は熱硬化樹脂の製造方法に関するものであり、更
に詳しくは、耐熱性、耐薬品性、R械的特性等に優れた
熱硬化樹脂を、速硬化性でかつ優れた成形性で製造する
方法に関するものである。[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to a method for producing a thermosetting resin, and more specifically, a thermosetting resin having excellent heat resistance, chemical resistance, R mechanical properties, etc. The present invention relates to a method for producing a fast-curing and excellent moldability.
〈従来技術〉
近年、技術の進歩に伴ない、耐熱性9機械的性質に優れ
、かつ成形性の優れた樹脂が要求されている。これらの
樹脂の中・でも特に反応性モノマーあるいはオリゴマー
を用いた反応成形型樹脂、すなわち、比教的低粘度の原
料を用いて成形と重合とを同時に行う樹脂が注目されて
いる。かかる樹脂としてはポリウレタン樹脂、ポリウレ
ア樹脂。<Prior Art> In recent years, with the advancement of technology, there has been a demand for resins with excellent heat resistance, mechanical properties, and moldability. Among these resins, reaction-molding resins using reactive monomers or oligomers, that is, resins in which molding and polymerization are simultaneously performed using low-viscosity raw materials, are attracting particular attention. Such resins include polyurethane resin and polyurea resin.
ナイロン樹脂、エポキシ樹脂、不飽和ボリエステル樹脂
等が知られており、一部は商品化されている。Nylon resins, epoxy resins, unsaturated polyester resins, etc. are known, and some are commercialized.
しかしながら、これらの樹脂には夫々一長一短があり、
例えばポリウレタン樹脂では耐熱性が低く、不飽和ポリ
エステル樹脂では反応すなわち成形に時間がかかる等の
欠点があり、必ずしも十分な性能および成形性を有して
いるとはいえない。However, each of these resins has its advantages and disadvantages.
For example, polyurethane resins have low heat resistance, and unsaturated polyester resins have drawbacks such as a long reaction time, that is, molding, and therefore cannot necessarily be said to have sufficient performance and moldability.
また、オキサゾリンとカルボン酸との反応は公知であり
、それを利用した熱硬化樹脂も提案されている(特公昭
59−226021号)、シかしながら、オキサゾリン
とポリオール化合物との反応を利用した樹脂は知られて
おらず、実際無触媒ではほとんど反応しない。Furthermore, the reaction between oxazoline and carboxylic acid is well known, and thermosetting resins using it have also been proposed (Japanese Patent Publication No. 59-226021). There are no known resins, and in fact, there is almost no reaction without a catalyst.
〈発明の目的〉
本発明者らは、新規な熱硬化樹脂を開発すべく鋭意研究
した結果、オキサゾリンと、特定のポリオール化合物、
すなわちフェノール類とアルデヒド類の縮合により得ら
れるポリオール化合物との反応が特定の触媒の存在下、
極めて速やかに進み、強靭な熱硬化樹脂となること、更
にこの樹脂は反応過程において、揮発成分が出す、また
溶媒を必要としないことから、反応成形、例えは二液混
合型の反応成形で極めて有用に製造できることを見出し
、本発明に到達しな。<Object of the Invention> As a result of intensive research to develop a new thermosetting resin, the present inventors discovered that oxazoline and a specific polyol compound,
In other words, the reaction between phenols and polyol compounds obtained by condensation of aldehydes occurs in the presence of a specific catalyst.
It progresses extremely quickly and becomes a tough thermosetting resin, and because this resin releases volatile components during the reaction process and does not require a solvent, it is extremely suitable for reaction molding, such as a two-component mixture type reaction molding. It has been discovered that it can be usefully manufactured, and the present invention has been achieved.
従って、本発明の目的は耐熱性、耐薬品1機械的特性等
に優れた熱硬化樹脂を速硬化性でかつ優れた成形性で製
造する方法を提供することにある。Therefore, an object of the present invention is to provide a method for producing a thermosetting resin having excellent heat resistance, chemical resistance, mechanical properties, etc., which is fast-curing and has excellent moldability.
〈発明の構成・効果〉
本発明の目的は、本発明によれば、下記式(I)1でも
夫々異な−ていてもよい、)
で示されるオキサゾリン誘導体と、フェノール類及びア
ルデヒド類の縮合により得られるポリオール化合物とを
、PKaが2.5以下のプロトン酸、Pにaが1.0以
下のプロトン酸エステル、ルイス酸およびその錯体、ア
ルキルハライド並びにヨウ素より選ばれた触媒の存在下
に加熱反応させることを特徴とする熱硬化樹脂の製造方
法よって達成される。<Structure/Effects of the Invention> According to the present invention, an object of the present invention is to provide an oxazoline derivative represented by the following formula (I) (which may have different formulas) and a phenol and an aldehyde. The resulting polyol compound is heated in the presence of a catalyst selected from protic acids with a PKa of 2.5 or less, protic acid esters with P and a of 1.0 or less, Lewis acids and their complexes, alkyl halides, and iodine. This is achieved by a method for producing a thermosetting resin characterized by a reaction.
以下、本発明について詳述する
本発明で用いられるオキサゾリン誘導体は下記式(I)
で示される化合物である ;−記式中、nは2〜4の整
数を示ずが、−れらのうち2が好ましい。The oxazoline derivative used in the present invention, which will be described in detail below, is a compound represented by the following formula (I); 2 is preferred.
Rはn価F rm肪族、脂環族および芳香族の炭化水素
基を示し、n=2の場合、Rは直接結合であってもよい
、Rとしては、具体的には、n=2の場合エチレン1ト
リメチレン、プロピレン、テトラメチレン、ヘキサメチ
レン、ネオベンヂレン。R represents an n-valent Frm aliphatic, alicyclic, or aromatic hydrocarbon group, and when n=2, R may be a direct bond. Specifically, R is n=2 In the case of ethylene 1 trimethylene, propylene, tetramethylene, hexamethylene, neobendylene.
10以下の脂肪族、炭素数10以下の脂環族、炭素数1
2以下の芳香族炭化水素基が好ましい。Aliphatic with 10 or less carbon atoms, alicyclic group with 10 or less carbon atoms, 1 carbon number
Two or less aromatic hydrocarbon groups are preferred.
Ra、 Rb、 RCおよびRdは水素原子、炭素数3
以下の脂肪族および炭素数7以下の芳香族炭化水素基を
示し、これらは同じでも夫々異なってもよい。炭素数3
以下の脂肪炭化水素基としては具体的にはメチル、エチ
ル等を例示でき、炭素数7以下の芳香族炭化水素基とし
ては、フェニル、トリル等ご例示できる。Ra、 Rb
、 RcおよびRdはそのすべてが水素原子、あるいは
そのうち任意の1つがメチルであり他が水素原子である
ことが好ましく、すべてが水素原子であることが特に好
ましい。Ra, Rb, RC and Rd are hydrogen atoms, carbon number 3
The following aliphatic and aromatic hydrocarbon groups having 7 or less carbon atoms are shown, and these may be the same or different. Carbon number 3
Specific examples of the following aliphatic hydrocarbon groups include methyl and ethyl, and examples of aromatic hydrocarbon groups having 7 or less carbon atoms include phenyl and tolyl. Ra, Rb
, Rc and Rd are preferably all hydrogen atoms, or any one of them is methyl and the others are hydrogen atoms, and it is particularly preferable that all of them are hydrogen atoms.
本発明で用いられるオキサゾリン誘導体としては、具体
的には、2,2°−ビス(2−オキサゾリン)、 2.
2’−エチレンビス(2−オキサゾリン)。Specifically, the oxazoline derivatives used in the present invention include 2,2°-bis(2-oxazoline), 2.
2'-Ethylenebis(2-oxazoline).
2.2°−テトラメチレンビス(2−オキサゾリン)。2.2°-tetramethylenebis(2-oxazoline).
2.2°−へキサメチレンビス(2−オキサゾリン)。2.2°-hexamethylenebis(2-oxazoline).
2.2°−オクタメチレンビス(2−オキサゾリン)。2.2°-octamethylenebis(2-oxazoline).
2.2°−1,4−シクロヘキシレンビス(2−オキサ
ゾリン) 、 2,2°−ビス(4−メチル−2−オキ
サゾリン) 、 2,2°−ビス(5−メチル−2−オ
キサゾリン) 、 2,2°−m−フェニレンビス(2
−オキサシリン) 、 2,2°−p−フェニレンビス
(2−オキサゾリン)、2.2’−m−フェニレンビス
(4−メチル−2−オキサゾリン) 、 2,2°−m
−フェニレンビス(5−メチル−2−オキサゾリン)、
2゜2°−p−フェニレンビス(4−メチル−2−オキ
サゾリン) 、 2,2°−p−フェニレンビス(5−
メチル−2−オキサゾリン) 、 1,3.5− トリ
ス(2−オキサゾリニル−2)ベンゼン等を例示するこ
とができる。これらのうち2.2°−ビス(2−オキサ
シリン) 、 2,2°−テトラメチレンビス(2−オ
キサゾリン) 、 2,2°−m−フェニレンビス(2
−オキサシン) 、 2.2’−p−フェニレンビス(
2−オキサゾリン)が好ましい、これらは一種または二
種以上の混合物として使用される。2.2°-1,4-cyclohexylenebis(2-oxazoline), 2,2°-bis(4-methyl-2-oxazoline), 2,2°-bis(5-methyl-2-oxazoline), 2,2°-m-phenylenebis(2
-oxacillin), 2,2°-p-phenylenebis(2-oxazoline), 2,2'-m-phenylenebis(4-methyl-2-oxazoline), 2,2°-m
-phenylenebis(5-methyl-2-oxazoline),
2゜2゜-p-phenylenebis(4-methyl-2-oxazoline), 2,2゜-p-phenylenebis(5-
Examples include methyl-2-oxazoline), 1,3.5-tris(2-oxazolinyl-2)benzene, and the like. Among these, 2.2°-bis(2-oxacillin), 2,2°-tetramethylenebis(2-oxazoline), 2,2°-m-phenylenebis(2
-oxacin), 2,2'-p-phenylenebis(
2-oxazoline) are preferred, and these are used singly or as a mixture of two or more.
本発明に用いられるオキサゾリン誘導体は、その一部を
下記式(I[)
で示されるモノオキサゾリン化合物に置き換えて使用す
ることも可能であり、反応制御、架橋密度の調整等に有
効である0式(If)で示されるモノオキサゾリン化合
物としては、具体的には、2−メチル−2−オキサゾリ
ン、2−エチル−2−オキサゾリン、2−プロペニル−
2−オキサゾリン。The oxazoline derivative used in the present invention can also be used by replacing a part of it with a monooxazoline compound represented by the following formula (I[). Specifically, the monooxazoline compound represented by (If) includes 2-methyl-2-oxazoline, 2-ethyl-2-oxazoline, 2-propenyl-
2-oxazoline.
2−フェニル−2−オキサゾリン、2−トリル−2−オ
キサゾリン、2.5−ジメチル−2−オキサゾリン、2
,4−ジメチル−2−オキサゾリン、2−フェニル−4
−メチル−2−オキサゾリン、2−フェニル−5−メチ
ル−2−オキサゾリン等を挙げることができる。これら
のうち、2−フェニル−2−オキサゾリン、2−トリル
−2−オキサゾリンが好ましい、上記モノオキサゾリン
化合物の使用割合は式(I)で示されるポリオキサゾリ
ン化合物に対し、好ましくは30モル%以下、より好ま
しくは25モル%以下、特に好ましくは20モル%以下
である。2-phenyl-2-oxazoline, 2-tolyl-2-oxazoline, 2,5-dimethyl-2-oxazoline, 2
, 4-dimethyl-2-oxazoline, 2-phenyl-4
-Methyl-2-oxazoline, 2-phenyl-5-methyl-2-oxazoline, and the like. Among these, 2-phenyl-2-oxazoline and 2-tolyl-2-oxazoline are preferable, and the proportion of the monooxazoline compound used is preferably 30 mol% or less with respect to the polyoxazoline compound represented by formula (I), It is more preferably 25 mol% or less, particularly preferably 20 mol% or less.
本発明においてオキサゾリン誘導体と反応させるポリオ
ール化合物は、フェノール類とアルデヒド類との縮合に
より得られるポリオール化合物である。このフェノール
票は芳香族ヒドロキシル基含有化合物を指し、具体的に
はフェノール、クレゾール、ハイドロキノン、レゾルシ
ン、キシレノール、α−ナフトール、β−ナフトール、
ジヒドロキシナフタレン等を例示することができる。こ
れらのうちフェノールが好ましい。またアルデヒド類と
しては、具体的にはホルムアルデヒド、アセトアルデヒ
ド、グリオキサール、グルタルアルデヒド、ベンズアル
デヒド、P−ヒドロキシベンズアルデヒド、m−ヒドロ
キシベンズアルデヒド。The polyol compound reacted with the oxazoline derivative in the present invention is a polyol compound obtained by condensation of phenols and aldehydes. This phenol label refers to aromatic hydroxyl group-containing compounds, specifically phenol, cresol, hydroquinone, resorcinol, xylenol, α-naphthol, β-naphthol,
Examples include dihydroxynaphthalene. Among these, phenol is preferred. Examples of aldehydes include formaldehyde, acetaldehyde, glyoxal, glutaraldehyde, benzaldehyde, p-hydroxybenzaldehyde, and m-hydroxybenzaldehyde.
テレフタルアルデヒド等を例示することができる。Examples include terephthalaldehyde.
これらのうちホルムアルデヒドが好ましい。Among these, formaldehyde is preferred.
フェノール類とアルデヒド類との縮合は公知の方法で行
うことができる0例えばフェノール類とアルデヒド類と
を酸あるいはアルカリ触媒の存在下脱水縮合させる従来
公知の製造方法により、ポリオール化合物を得ることが
できる。また、ポリオール化合物として工業的に製造、
市販されている各種のフェノールレジンをそのまま用い
ることもできる。ポリオール化合物としては、これらの
うち、フェノールノボラックが特に好ましい。The condensation of phenols and aldehydes can be carried out by a known method. For example, a polyol compound can be obtained by a conventionally known production method in which phenols and aldehydes are dehydrated and condensed in the presence of an acid or alkali catalyst. . In addition, it is industrially produced as a polyol compound,
Various commercially available phenol resins can also be used as they are. Among these, phenol novolak is particularly preferred as the polyol compound.
オキサゾリン誘導体とポリオール化合物との使用割合は
、全オキサゾリン当量に対して、ポリオール化合物のO
H当量が10〜120%となる割合が好ましく、30〜
110%となる割合がより好ましく、50〜100%と
なる割合が特に好ましい。The usage ratio of the oxazoline derivative and the polyol compound is as follows:
The ratio of H equivalent is preferably 10 to 120%, and 30 to 120%.
A ratio of 110% is more preferred, and a ratio of 50 to 100% is particularly preferred.
本発明の熱硬化樹脂は上述したオキサゾリン誘導体と上
述したポリオール化合物とを、PKaが2.5以下のプ
ロトン酸、Pkaか1.0以下のプロトン酸エステル、
ルイス酸およびその錯体、アルキルハライド並びにヨウ
素より選ばれた触媒の存在下に加熱反応させることによ
って得られる。The thermosetting resin of the present invention combines the above-mentioned oxazoline derivative and the above-mentioned polyol compound into a protonic acid having a PKa of 2.5 or less, a protonic acid ester having a Pka of 1.0 or less,
It is obtained by a heating reaction in the presence of a catalyst selected from Lewis acids and their complexes, alkyl halides, and iodine.
ここで、PKaは水溶液中における値であり、また解離
し得るプロトンが2個以上ある場合には、1個目のプロ
トンについての値を表わす。Here, PKa is the value in an aqueous solution, and when there are two or more dissociable protons, it represents the value for the first proton.
上記触媒としては、Pkaが2.5以下のプロトン酸と
しては、例えばスルホン酸類、無機プロトン酸類等が、
該スルホン酸類としては例えばメタンスルホン酸、エタ
ンスルホン酸、ベンゼンスルホン酸、p−トルエンスル
ホン酸等が、無機プロトン酸としては例えば硫酸、リン
酸、亜すン酸、ホスフィン酸、ホスホン酸、過塩素酸等
が挙げられる。PKaが1.0以下のプロトン酸エステ
ルとしては、例えばベンゼンスルホン酸メチル、ベンゼ
ンスルホン酸エチル、P−トルエンスルポン酸メチル、
p−トルエンスルホン酸エチル等の如きスルホン酸エス
テル類、硫酸ジメチル等の如き無機プロトン酸エステル
類等が挙げられる。ルイス酸およびその錯体としては、
例えば四塩化チタン、四塩化スズ、塩化亜鉛、塩化アル
ミニウム、トリフロロフボラン、トリフロロボランエー
テル錯体等が挙げられる。アルキルハライドとしては、
例えばヨウ化メチル、ヨウ化エチル、ヨウ化プロピル。Examples of the above-mentioned catalyst include sulfonic acids, inorganic protonic acids, etc. as protonic acids having a Pka of 2.5 or less.
Examples of the sulfonic acids include methanesulfonic acid, ethanesulfonic acid, benzenesulfonic acid, p-toluenesulfonic acid, etc., and examples of the inorganic protonic acids include sulfuric acid, phosphoric acid, stannous acid, phosphinic acid, phosphonic acid, and perchloric acid. Examples include acids. Examples of protonic acid esters having a PKa of 1.0 or less include methyl benzenesulfonate, ethyl benzenesulfonate, methyl P-toluenesulfonate,
Examples include sulfonic acid esters such as ethyl p-toluenesulfonate, and inorganic protonic acid esters such as dimethyl sulfate. Lewis acids and their complexes include:
Examples include titanium tetrachloride, tin tetrachloride, zinc chloride, aluminum chloride, trifluoroborane, trifluoroborane ether complex, and the like. As an alkyl halide,
For example, methyl iodide, ethyl iodide, propyl iodide.
ヨウ化ブチル、ヨウ化ベンジル、臭化ベンジル等が挙げ
られる。これらの触媒は一種または二種以上を併用する
こともできる。これらの触媒の使用量は特に制限はない
か、用いるオキサゾリン誘導体に対して好ましくは0.
01〜20モル%、より好ましくは0.05〜15モル
%、特に好ましくは0.1〜10モル%程度の量である
。Examples include butyl iodide, benzyl iodide, benzyl bromide, and the like. These catalysts can be used alone or in combination of two or more. There is no particular restriction on the amount of these catalysts to be used, and it is preferably 0.0000% relative to the oxazoline derivative used.
The amount is about 0.01 to 20 mol%, more preferably 0.05 to 15 mol%, particularly preferably about 0.1 to 10 mol%.
反応方法としては、例えばオキサゾリン誘導体。As a reaction method, for example, oxazoline derivatives.
ポリオール化合物及び触媒の夫々固体および/または液
体を物理的に均密に混合し、該混合物を加熱溶融し、所
望形状の金型に充填して、該金型中で加熱反応せしめる
方法(−液法)、オキサゾリン誘導体とポリオール化合
物を夫々別に溶融せしめ、これをミキシングヘッド等の
混合手段により混合後、予め反応温度に加熱した所望の
形状の金型に直接注入して反応せしめる方法(二液混合
法)等を挙げることができる。二液混合法の場合には、
触媒はポリオール化合物あるいはこれを主とする成分の
方に含有せしめるのが好ましい。A method in which a solid and/or liquid polyol compound and a catalyst are physically mixed homogeneously, the mixture is melted by heating, the mixture is filled into a mold having a desired shape, and the mixture is heated and reacted in the mold. method), a method in which the oxazoline derivative and the polyol compound are melted separately, mixed using a mixing means such as a mixing head, and then directly injected into a mold of the desired shape preheated to the reaction temperature to react (two-liquid mixing method). law), etc. In the case of two-component mixing method,
It is preferable that the catalyst is contained in the polyol compound or a component mainly composed of the polyol compound.
反応温度は、用いるオキサゾリン誘導体、ポリオール化
合物および触媒の種類、その使用割合等により異なるが
、好ましくは60〜340℃、より好ましくは70〜3
00℃、特に好ましくは80〜260℃程度である。The reaction temperature varies depending on the type of oxazoline derivative, polyol compound and catalyst used, their usage ratio, etc., but is preferably 60 to 340°C, more preferably 70 to 340°C.
00°C, particularly preferably about 80 to 260°C.
反応時間は、目的とする樹脂が十分に硬化するに足る時
間であればよく、またこの時間は用いる原料の種類、使
用割合1反応温度等によっても異なるが、好ましくは1
0秒〜・60分、より好ましくは20秒〜30分、特に
好ましくは30秒〜15分程度である。The reaction time may be sufficient as long as it is sufficient to harden the target resin, and this time varies depending on the type of raw materials used, the ratio used, the reaction temperature, etc., but is preferably 1.
The time is about 0 seconds to 60 minutes, more preferably 20 seconds to 30 minutes, particularly preferably about 30 seconds to 15 minutes.
反応は常圧〜加圧で行うことができるが、この際大気中
の水や樹脂の酸化劣化を防ぐ為、窒素。The reaction can be carried out at normal pressure to increased pressure, but at this time nitrogen is used to prevent water in the atmosphere and oxidative deterioration of the resin.
アルゴン等の不活性ガス雰囲気下で実施することが好ま
しい。It is preferable to carry out under an inert gas atmosphere such as argon.
尚、本発明の熱硬化樹脂には必要に応じて、炭素繊維、
ガラス繊維等の補強材、各種フィラー。Note that the thermosetting resin of the present invention may contain carbon fibers,
Reinforcing materials such as glass fiber, various fillers.
充填材、顔料1着色剤、酸化安定剤、紫外線吸収剤、鍵
形剤等の添加剤を適宜配合してもよい。Additives such as fillers, pigment 1 colorants, oxidation stabilizers, ultraviolet absorbers, and keying agents may be blended as appropriate.
く実施例〉
以下、実施例を挙げて本発明を詳述するが、実施例は説
明のためであって、本発明はこれに限定されるものでは
ない。Examples> Hereinafter, the present invention will be described in detail with reference to Examples, but the Examples are for illustrative purposes and the present invention is not limited thereto.
尚、実施例中「部」は「重量部」を意味し、熱変形温度
DMA (動的熱機械特性測定装置)により10℃/分
の昇温速度で測定した。In the examples, "part" means "part by weight", and the heat distortion temperature was measured using a DMA (dynamic thermomechanical property measuring device) at a heating rate of 10° C./min.
実施例1〜4
2.2’−m−フェニレンビス(2−オキサシリン)1
00部と、平均分子量約600のフェノールノボラツク
及び触媒の表1に示す量とをガラス製反応器に仕込み、
窒素置換した後表1に示した温度に加熱した0反応混合
物は、その後表1に示す時間後に最高到達温度まで発熱
して、硬化した。得られた樹脂はいずれも黄色透明で強
靭であり、トリクレン、アセトン、キシレンまたは酢酸
エチル中でも溶解、膨潤することなく耐溶剤性に優れて
いた。Examples 1-4 2.2'-m-phenylenebis(2-oxacillin) 1
00 parts and the amounts shown in Table 1 of a phenol novolac having an average molecular weight of about 600 and a catalyst in a glass reactor,
The reaction mixture, which was purged with nitrogen and heated to the temperature shown in Table 1, generated heat to reach the maximum temperature after the time shown in Table 1 and was cured. All of the obtained resins were transparent yellow and tough, and had excellent solvent resistance without dissolving or swelling even in trichlene, acetone, xylene, or ethyl acetate.
また表1には得られた樹脂の熱変形温度を示すが、いず
れも耐熱性に優れていることがわかる。Furthermore, Table 1 shows the heat distortion temperatures of the obtained resins, and it can be seen that all of them have excellent heat resistance.
表 1
実施例5
2.2°−m−フェニレンビス(2−オキサゾリン)1
00部、フェノールノボラック(スミライトレジンPR
−50731、住友デュレズ社製)100部及びp−ト
ルエンスルホン酸3部を反応容器に仕込み、よく混合後
、窒素置換した0次いで180℃に加熱したところ30
秒後に240°Cまで発熱して硬化した。Table 1 Example 5 2.2°-m-phenylenebis(2-oxazoline) 1
00 parts, phenol novolak (Sumilight Resin PR
-50731, manufactured by Sumitomo Durez Co., Ltd.) and 3 parts of p-toluenesulfonic acid were charged into a reaction vessel, mixed well, and then heated to 180°C under nitrogen atmosphere.
After a few seconds, it generated heat to 240°C and was cured.
得られた樹脂は淡橙色透明で気泡もなく、強靭であり、
熱変形温度は166°Cであった。The obtained resin is light orange and transparent, has no bubbles, and is strong.
The heat distortion temperature was 166°C.
Claims (1)
脂環族、芳香族の炭化水素基を示す。 但し、n=2の場合、Rは直接結合でもよい。 Ra、Rb、RcおよびRdは水素原子、炭素数3以下
の脂肪族炭化水素基および炭素数7以下の芳香族炭化水
素基を示し、これらは同じでも夫々異なっていてもよい
。〕 で示されるオキサゾリン誘導体と、フェノール類及びア
ルデヒド類の縮合により得られるポリオール化合物とを
、PKaが2.5以下のプロトン酸、PKaが1.0以
下のプロトン酸エステル、ルイス酸およびその錯体、ア
ルキルハライド並びにヨウ素より選ばれた触媒の存在下
に加熱反応させることを特徴とする熱硬化樹脂の製造方
法。[Claims] The following formula (I) ▲There are mathematical formulas, chemical formulas, tables, etc.▼... (I) [In the formula, n represents an integer of 2 to 4, R represents an n-valent aliphatic group,
Indicates an alicyclic or aromatic hydrocarbon group. However, when n=2, R may be a direct bond. Ra, Rb, Rc and Rd represent a hydrogen atom, an aliphatic hydrocarbon group having 3 or less carbon atoms, and an aromatic hydrocarbon group having 7 or less carbon atoms, and these may be the same or different. ] The polyol compound obtained by condensation of the oxazoline derivative represented by phenol and aldehyde is combined with a protonic acid having a PKa of 2.5 or less, a protonic acid ester having a PKa of 1.0 or less, a Lewis acid and its complex, A method for producing a thermosetting resin, which comprises carrying out a heating reaction in the presence of a catalyst selected from an alkyl halide and iodine.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3348787A JPS63202628A (en) | 1987-02-18 | 1987-02-18 | Production of thermosetting resin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3348787A JPS63202628A (en) | 1987-02-18 | 1987-02-18 | Production of thermosetting resin |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63202628A true JPS63202628A (en) | 1988-08-22 |
Family
ID=12387911
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3348787A Pending JPS63202628A (en) | 1987-02-18 | 1987-02-18 | Production of thermosetting resin |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63202628A (en) |
-
1987
- 1987-02-18 JP JP3348787A patent/JPS63202628A/en active Pending
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