JPS63183915A - High heat-emissive epoxy resin composition - Google Patents
High heat-emissive epoxy resin compositionInfo
- Publication number
- JPS63183915A JPS63183915A JP1558787A JP1558787A JPS63183915A JP S63183915 A JPS63183915 A JP S63183915A JP 1558787 A JP1558787 A JP 1558787A JP 1558787 A JP1558787 A JP 1558787A JP S63183915 A JPS63183915 A JP S63183915A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- alumina
- resin composition
- silica
- high heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 36
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 36
- 239000000203 mixture Substances 0.000 title claims abstract description 28
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 27
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000004065 semiconductor Substances 0.000 claims abstract description 13
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 11
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 7
- 239000011256 inorganic filler Substances 0.000 claims abstract description 7
- 238000005538 encapsulation Methods 0.000 claims description 10
- 230000006866 deterioration Effects 0.000 abstract description 5
- 238000007789 sealing Methods 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 7
- 239000003566 sealing material Substances 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- 229910002026 crystalline silica Inorganic materials 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 235000013869 carnauba wax Nutrition 0.000 description 3
- 239000004203 carnauba wax Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- -1 glycidyl ester Chemical class 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 3
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- QFRHTANKIYQYLO-UHFFFAOYSA-N 2-ethyl-2-methylimidazole Chemical compound CCC1(C)N=CC=N1 QFRHTANKIYQYLO-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 241000282994 Cervidae Species 0.000 description 1
- MXRIRQGCELJRSN-UHFFFAOYSA-N O.O.O.[Al] Chemical compound O.O.O.[Al] MXRIRQGCELJRSN-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229940106691 bisphenol a Drugs 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
（技術分野）
この発明は、半導体封止用の高熱放散性エポキシ樹脂組
成物に関するものである。さらに詳しくは、この発明は
、成形性が良く、パワートランジスタ、パワーＩＣなど
のパワーデバイスの定格出力の向上、素子の発熱による
劣化の防止に優れた、半導体封止用の高熱放散性のエポ
キシ樹脂組成物に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to a highly heat dissipating epoxy resin composition for semiconductor encapsulation. More specifically, this invention is a highly heat-dissipating epoxy resin for semiconductor encapsulation that has good moldability, improves the rated output of power devices such as power transistors and power ICs, and is excellent in preventing deterioration due to heat generation of elements. The present invention relates to a composition.
（技術背景）
近年、半導体装置は素子自体の高密度化が進むとともに
、成形品のバックージ構造も小形化、薄型化され、高信
頼性が要求されている。(Technical Background) In recent years, as semiconductor devices have become more dense, the backbone structures of molded products have become smaller and thinner, and higher reliability is required.
このような半導体装置の樹脂封止にはエポキシ樹脂が用
いられている場合が多い、封止用材料としてのエポキシ
樹脂の組成物は量産性、価格、性能において他の樹脂組
成物に比べて格段に優れたもので、封止材の性能として
特に重要な素子の発熱による熱疲労劣化を防止するため
の熱放散特性についても、すでにその熱伝導率（入）が
５０×１０−’ｃａｌ ／ ｃｍ−５ｅＣ・’Ｃ程度の
高熱放散性のものが開発されてきてもいる。Epoxy resin is often used for resin encapsulation of such semiconductor devices, and epoxy resin compositions as encapsulation materials are far superior to other resin compositions in terms of mass production, price, and performance. It has excellent heat dissipation properties to prevent thermal fatigue deterioration due to heat generation of elements, which is particularly important for the performance of sealing materials. Products with high heat dissipation of about -5eC·'C have been developed.
また、このようなエポキシ樹脂封止材には無機質充填材
として結晶性シリカが配合されてきている。In addition, crystalline silica has been added to such epoxy resin sealants as an inorganic filler.
しかしながら、半導体装置のパッケージの小型化、デバ
イスの高出力化への要求はさらに高まっており、これま
での封止材程度の熱放散性能ではもはや対応しきれなく
なっている。However, demands for smaller semiconductor device packages and higher device output are increasing, and the heat dissipation performance of conventional sealing materials is no longer sufficient to meet these demands.
このため、成形性が良好であることはもちろんのこと、
発熱によるクラック発生などの熱疲労劣化を効果的に防
止することのできる、これまでの封止材以上に高熱放散
性の半導体封止用のエポキシ樹脂組成物の実現が望まれ
ていた。For this reason, it not only has good moldability, but also
It has been desired to realize an epoxy resin composition for semiconductor encapsulation that can effectively prevent thermal fatigue deterioration such as cracking due to heat generation and has higher heat dissipation than conventional encapsulating materials.
（発明の目的）
この発明は、以上の通りの事情を鑑みてなされたもので
あり、従来の封止材以上に熱放散性に優れ、かつ成形性
も良好な半導体封止用のエポキシ樹脂組成物を提供する
ことを目的としている。(Object of the Invention) This invention was made in view of the above circumstances, and provides an epoxy resin composition for semiconductor encapsulation that has better heat dissipation than conventional encapsulation materials and has good moldability. The purpose is to provide something.
（発明の開示）
この発明の高熱放散性のエポキシ樹脂組成物は、上記の
目的を実現するために、エポキシ樹脂組成物に無機質充
填材としてアルミナ、またはアルミナおよびシカを配合
したことを特徴としている。(Disclosure of the Invention) In order to achieve the above object, the epoxy resin composition of the present invention with high heat dissipation properties is characterized in that alumina, or alumina and deer is blended as an inorganic filler into the epoxy resin composition. .
アルミナおよびシリカの配合は、そのｔｊｔ比が、アル
ミナ７重量％、シリカ１重量％として、χ〉０、ｙ≧０
、χ＋ｙ≧７５、χ／χ＋ｙ≧０．１とするのが好まし
い、この比率において、アルミナの配合量が少くなる程
熱伝導率は低下する。また、アルミナとシリカの合計量
が７５ｆｆｉ量％以下の場合にも熱伝導率は低下する。The combination of alumina and silica has a tjt ratio of 7% by weight of alumina and 1% by weight of silica, χ>0, y>0
, χ+y≧75, and χ/χ+y≧0.1. In this ratio, the smaller the amount of alumina mixed, the lower the thermal conductivity becomes. The thermal conductivity also decreases when the total amount of alumina and silica is less than 75ffi%.
この発明に使用するアルミナは、格別の限定はないが、
封止材としての性能、成形性の点からは、その形状が球
形であるが好ましい、またシリカについては結晶シリカ
を用いるのが好ましい。The alumina used in this invention is not particularly limited, but
From the viewpoint of performance as a sealing material and moldability, it is preferable that the shape is spherical, and as for silica, it is preferable to use crystalline silica.
アルミナとシリカの無機質充填材は、その平均粒径が、
約５〜５０ミクロン程度のもを用いることが好ましい、
５ミクロン以下では充填材の配合が難しくなり、分散性
が低下する。５０ミクロンを越えると、成形性が低下す
る。The average particle size of the inorganic fillers of alumina and silica is
It is preferable to use one with a diameter of about 5 to 50 microns.
If it is less than 5 microns, it becomes difficult to mix the filler and the dispersibility decreases. When it exceeds 50 microns, moldability decreases.
この発明に使用することのできるエポキシ樹脂について
は特に限定されるものではなく、公知のエポキシ樹脂が
広く用いられる。たとえば、フェノールノボラック型エ
ポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ビ
スフェノール−Ａ型エポキシ樹脂、グリシジルエーテル
型エポキシ樹脂、グリシジルエステル型エポキシ樹脂、
ハロゲン化エポキシ樹脂等の適宜なものが用いられる。The epoxy resin that can be used in this invention is not particularly limited, and known epoxy resins are widely used. For example, phenol novolac type epoxy resin, cresol novolac type epoxy resin, bisphenol-A type epoxy resin, glycidyl ether type epoxy resin, glycidyl ester type epoxy resin,
An appropriate material such as halogenated epoxy resin is used.
また配合成分としてアルミナおよびシリカ以外の、タク
ル、クレー、石英ガラス粉、炭酸カルシウム等′の無機
充填剤さらには着色剤、難燃料などを適宜に用いること
もできる。In addition to alumina and silica, inorganic fillers such as tackle, clay, quartz glass powder, and calcium carbonate, as well as coloring agents and refractory fuels, can also be used as appropriate.
硬化剤および効果促進剤についても適宜なものが用いら
れる。たとえば酸無水物系硬化剤、フェノール系硬化剤
、アミン、アミド系化合物、イミダゾール系化合物など
が使用できる。Appropriate curing agents and effect accelerators can also be used. For example, acid anhydride curing agents, phenol curing agents, amines, amide compounds, imidazole compounds, etc. can be used.
次に実施例を示し、さらに詳しくこの発明の半導体封止
用の高熱放散性エポキシ樹脂組成物について説明する。Next, Examples will be shown and the highly heat-dissipating epoxy resin composition for semiconductor encapsulation of the present invention will be explained in more detail.
もちろん、この発明は、以下の実施例によって限定され
るものではない。Of course, the invention is not limited to the following examples.
実施例 １
（重量部）
（１）ノボラック型エポキシ樹脂 ９（エポキシ
当量１７０）
（２）臭素化エポキシ樹脂 ２（エポキシ
当量２８０）
（３）２−エチル−２−メチルイミダゾール １（４）
カルナウバワックス １（５）球状アルミ
ナ ８７以上の組成の混合物をミキシ
ングロール機で６０〜８０℃、約１０分間混合し、エポ
キシ樹脂封止材組成物を製造した。Example 1 (Parts by weight) (1) Novolak epoxy resin 9 (epoxy equivalent: 170) (2) Brominated epoxy resin 2 (epoxy equivalent: 280) (3) 2-ethyl-2-methylimidazole 1 (4)
Carnauba wax 1 (5) Spherical alumina A mixture having a composition of 87 or more was mixed at 60 to 80°C for about 10 minutes using a mixing roll machine to produce an epoxy resin encapsulant composition.
この組成物について熱伝導率（λ）と、パワーＩＣの熱
疲労寿命について評価した。その結果は表−１に示した
通りであった。熱伝導率は、アルミナを配合しない場合
に比べてはるかに大きく（９２Ｘ１０−４Ｃａｌ／ａｓ
・ｓｅｃ Ｉ ’ｃ） 、Ｔ１９ＬｔＦ命も優れていた
。This composition was evaluated for thermal conductivity (λ) and thermal fatigue life of a power IC. The results were as shown in Table-1. Thermal conductivity is much higher than that without alumina (92X10-4 Cal/as
・sec I'c), T19LtF life was also excellent.
実施例 ２
実施例１について、球状アルミナに代えて、同量の無定
形アルミナを用い、同様にして封止材用エポキシ樹脂組
成物を製造した。Example 2 An epoxy resin composition for a sealing material was produced in the same manner as in Example 1, except that the same amount of amorphous alumina was used instead of the spherical alumina.
実施例１と同様に熱伝導度、パワーＩＣの熱疲労寿命に
ついて評価した。その結果を表−１に示した。The thermal conductivity and thermal fatigue life of the power IC were evaluated in the same manner as in Example 1. The results are shown in Table-1.
熱伝導率、疲労寿命ともに、実施例１と同様に後述のア
ルミナを用いない比教例に比べて良好であった。Similar to Example 1, both thermal conductivity and fatigue life were better than those of the later-described example that does not use alumina.
実施例 ３
（重量部）
（１）ノボラック型エポキシ樹脂 １０（エポキ
シ当量１７０）
（２）臭素化エポキシ樹脂 ２（エボ・キ
シ当Ｊｉ２８０）
（３）２−エチル−４−メチルイミダゾール １（４）
カルナウバワックス １（５）球状アルミ
ナ ４３（６）結晶シリカ
４３以上の組成からなる混合物から、実施例
１と同様にして封止材用エポキシ樹脂組成物を製造した
。Example 3 (parts by weight) (1) Novolac type epoxy resin 10 (epoxy equivalent: 170) (2) Brominated epoxy resin 2 (evo-xy equivalent Ji: 280) (3) 2-ethyl-4-methylimidazole 1 (4)
Carnauba wax 1 (5) Spherical alumina 43 (6) Crystalline silica
An epoxy resin composition for a sealing material was produced in the same manner as in Example 1 from a mixture having a composition of 43 or more.
実施例１と同様に、熱伝導度、パワーＩＣの熱疲労寿命
について評価した。その結果を表−１に示した。As in Example 1, the thermal conductivity and thermal fatigue life of the power IC were evaluated. The results are shown in Table-1.
熱伝導度、疲労寿命ともに、アルミナを用いない次の比
較例に比べて良好であった。Both thermal conductivity and fatigue life were better than the following comparative example which did not use alumina.
比較例
（重量部）
（１）ノボラック型エポキシ樹脂 １７（エポキシ
当１１７０）
（２）臭素化エポキシ樹脂 ３（エポキシ
当量２８ｏ）
（３）２−エチル−４−メチルイミダゾール １（４）
カルナウバワックス １（５）結晶シリカ
７８以上のアルミナを用いない組
成の混合物から、実施例１と同様にして封止材用エポキ
シ樹脂組成物を製造しな。Comparative example (parts by weight) (1) Novolac type epoxy resin 17 (epoxy equivalent: 1170) (2) Brominated epoxy resin 3 (epoxy equivalent: 28o) (3) 2-ethyl-4-methylimidazole 1 (4)
Carnauba wax 1 (5) Crystalline silica An epoxy resin composition for a sealing material was produced in the same manner as in Example 1 from a mixture having a composition of 78 or more without using alumina.
実施例１と同様に熱伝導度、パワーＩＣの熱疲労寿命に
ついて評価した。その結果を表−１に示した。The thermal conductivity and thermal fatigue life of the power IC were evaluated in the same manner as in Example 1. The results are shown in Table-1.
熱伝導度、疲労寿命ともに、アルミナを配合した実施例
１〜３のエポキシ樹脂組成物に比べてはるかに劣ってい
た。Both thermal conductivity and fatigue life were far inferior to the epoxy resin compositions of Examples 1 to 3 containing alumina.
（発明の効果）
この発明により、以上の通り、熱伝導率が高く、半導体
の熱疲労劣化の防止効果に優れた半導体封止用の高熱放
散性のエポキシ樹脂組成物が実現される。(Effects of the Invention) As described above, the present invention provides a highly heat-dissipating epoxy resin composition for semiconductor encapsulation that has high thermal conductivity and is excellent in preventing thermal fatigue deterioration of semiconductors.
パッケージの小型化、デバイスの高出力化の要求に対応
することのできる高熱放散性の封止材が提供される。A sealing material with high heat dissipation properties that can meet the demands for smaller packages and higher output devices is provided.
Claims (1)
ナ、またはアルミナおよびシリカを配合したことを特徴
とする半導体封止用の高熱放射性エポキシ樹脂組成物。(1) A highly thermally emissive epoxy resin composition for semiconductor encapsulation, characterized in that the epoxy resin composition contains alumina or alumina and silica as an inorganic filler.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1558787A JPS63183915A (en) | 1987-01-26 | 1987-01-26 | High heat-emissive epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1558787A JPS63183915A (en) | 1987-01-26 | 1987-01-26 | High heat-emissive epoxy resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63183915A true JPS63183915A (en) | 1988-07-29 |
Family
ID=11892860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1558787A Pending JPS63183915A (en) | 1987-01-26 | 1987-01-26 | High heat-emissive epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63183915A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03157447A (en) * | 1989-11-14 | 1991-07-05 | Shin Etsu Chem Co Ltd | Epoxy resin composition and cured product of epoxy resin |
| US5202753A (en) * | 1990-11-26 | 1993-04-13 | Nippondenso Co., Ltd. | Resin-sealed semiconductor device |
| JPH05222270A (en) * | 1992-02-07 | 1993-08-31 | Shin Etsu Chem Co Ltd | Fluid epoxy resin composition and its cured material |
| US5349240A (en) * | 1991-10-30 | 1994-09-20 | Nippondenso Co., Ltd. | Semiconductor device package having a sealing silicone gel with spherical fillers |
| WO1997003129A1 (en) * | 1995-07-10 | 1997-01-30 | Toray Industries, Inc. | Epoxy resin composition |
-
1987
- 1987-01-26 JP JP1558787A patent/JPS63183915A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03157447A (en) * | 1989-11-14 | 1991-07-05 | Shin Etsu Chem Co Ltd | Epoxy resin composition and cured product of epoxy resin |
| US5202753A (en) * | 1990-11-26 | 1993-04-13 | Nippondenso Co., Ltd. | Resin-sealed semiconductor device |
| DE4133623C2 (en) * | 1990-11-26 | 1998-10-29 | Denso Corp | Resin sealed semiconductor device |
| US5349240A (en) * | 1991-10-30 | 1994-09-20 | Nippondenso Co., Ltd. | Semiconductor device package having a sealing silicone gel with spherical fillers |
| JPH05222270A (en) * | 1992-02-07 | 1993-08-31 | Shin Etsu Chem Co Ltd | Fluid epoxy resin composition and its cured material |
| WO1997003129A1 (en) * | 1995-07-10 | 1997-01-30 | Toray Industries, Inc. | Epoxy resin composition |
| US5854316A (en) * | 1995-07-10 | 1998-12-29 | Toray Industries, Inc. | Epoxy resin composition |
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