JPS6317225B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electrical property testing device for electronic components that is connected in series to a strip-shaped lead frame via some leads.

When testing the electrical characteristics of electronic components such as ICs, the electrical characteristics are measured by inserting the individual products into a testing socket, or by advancing measurement terminals from both sides of the electronic component and bringing them into contact. ing. In this case, an automatic measurement and inspection device called an autohandler is generally used.

By the way, the present applicant has recently adopted a system in which electronic components 3 are supported in series on a lead frame 1 via some leads 2 and shipped to users in this state, as shown in FIGS. 1a and 1b. (In addition,
Figure b shows a single item state. ). In this electronic component 3, the thickness of the package 4 is approximately 1.5 mm, the length and width are approximately 6 mm, which are extremely small, and the protruding length of the leads 2 from the surface of the package 4 is extremely short, 2 mm. For this reason, when they are individualized, their handling becomes complicated. Therefore, each electronic component 3 is attached to a lead frame 1.
We have adopted a system in which the products are shipped without being separated.

However, there is no inspection device (autohandler) that inspects electronic components connected in series using such lead frames. For this reason, inspection must be performed manually, which is extremely inefficient.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an electrical property testing device that can automatically test the electrical properties of electronic components connected in series to a strip-shaped lead frame via some leads. The purpose is to improve work efficiency.

In order to achieve such an object, the present invention provides an electrical characteristic testing device for a group of electronic components that are connected in series to a strip-shaped lead frame via some leads, in which the lead frames are sequentially moved over a testing socket. At the same time, the lead frame is bent downward on the test socket, and the lowered electronic component is further pushed down by the push-down mechanism to engage the leads of the electronic component with the test socket, thereby testing the electrical characteristics. The present invention will now be explained with reference to Examples.

FIG. 2 is a schematic diagram showing an outline of an electrical characteristic testing device for electronic components according to an embodiment of the present invention. This device has a measuring section 5 in the center, a loader section 6 on the left side, and an unloader section 7 on the right side. Cartridges 10 mounted on the loader stage 8 and unloader stage 9, which are movable up and down in the loader section 6 and unloader section 7, respectively, house electronic components 3 connected in series by lead frames 1 in a stacked state. It's summery. The cartridge 10 consists of a pair of side plates, a top plate, and a bottom plate, and both ends are open. Then, storage grooves are provided in the inner side of the side plate at regular intervals in the horizontal direction, and the side edge of the lead frame 1 is slidably inserted into the storage grooves. Loader stage 8 has electronic components 3
An empty cartridge 10 is attached to the unloader stage 9.

On the other hand, a pusher 11 is disposed at the upper left of the loader section 6, and a rod 12 of the pusher 11 moves forward and enters the cartridge 10 on the loader stage 8, thereby moving the lead frame 1 into the cartridge 1.
0 and sends out the lead frame 1 onto a guide chute 13 extending to the measuring section 5. In addition,
The lead frames 1 in the cartridge are automatically fed out one after another from above, and when the cartridge 10 becomes empty, it is replaced with a new cartridge 10 containing an electronic component 3.

On the other hand, the guide chute 13 connected to the measurement section 5 is gently curved downward at a portion approaching the measurement position. Further, in this curved conveyance portion, curved guides 14 are provided to guide both sides of the lead frame 1 and move the lead frame 1 along the curve. A test socket 15 connected to the electrical property test control section is arranged adjacent to the lowest position of the curve. In addition, the inspection socket 15
A push-down mechanism 16 is disposed directly above. Note that a moving shaft 17 is disposed above one side of the guide chute 13 along the guide chute 13. This moving shaft 17 swings and repeatedly moves back and forth along the axial direction. Furthermore, transfer pins 18 are attached to the moving shaft 17 at several locations.
The transfer pin 18 moves in a rectangular manner as shown by arrows 19 to 22 due to the swinging and back-and-forth movement of the moving shaft 17, and moves the lead frame 1 intermittently one pitch at a time on the guide chute 13. There is.

In such a device, the electronic component 3 is connected to the loader section 6.
After being delivered from the cartridge 10 onto the guide chute 13, the cartridge moves intermittently on the guide chute 13, and is moved while being curved by the curved guide 14. When the electronic component 3 stops directly above the inspection socket 15, the rod 23 of the push-down mechanism 16 descends and pushes down the package 4 of the electronic component 3 slightly, inspecting the leads 2 protruding from the package 4. The electrical characteristics of the electronic component 3 are tested by contacting (inserting) the electronic component 3 with the socket 15.
The electronic component 3 that has been inspected advances again on the flat guide chute 13 and is housed in the cartridge 10 attached to the unloader stage 9. This cartridge has electronic components 3 connected to the lead frame 1 sequentially from above or below.
When the cartridge 10 is full, it is replaced with an empty cartridge 10. In addition, by curving the lead frame 1 at the measurement part, a single electronic component is made to protrude lower than the others, and deformation of the lead 2 due to subsequent pushing down by the push-down mechanism 16 is made smaller. is taken into consideration.

According to such a device, the electrical characteristics of the electronic components 3 connected in series by the lead frame 1 can be automatically tested without separating them from the lead frame 1. Therefore, work efficiency is also improved.

Note that the present invention is not limited to the above embodiments.

As described above, according to the present invention, the characteristics of connected electronic components can be automatically inspected, so that the number of man-hours can be reduced.

[Brief explanation of the drawing]

Figures 1a and b are a plan view of an electronic component developed by the present applicant in a connected state with a lead frame and a front view of a single component, and Figure 2 is an electrical property testing device for electronic components according to an embodiment of the present invention. FIG. 1...Lead frame, 2...Lead, 3...
Electronic component, 4...Package, 5...Measuring part, 1
0... Cartridge, 14... Curved guide, 15
...Inspection socket, 16...Pushing mechanism.

Claims (1)

[Claims] 1. In an electrical property testing device for a group of electronic components that are connected in series to a strip-shaped lead frame via some leads, the lead frame is sequentially moved over the testing socket, and the lead frame is moved over the testing socket. An electrical property testing device for electronic parts, characterized in that the electronic parts are curved and lowered by a curved guide, and the lowered electronic parts are further pushed down by a push-down mechanism to engage the leads of the electronic parts with testing sockets to perform electrical property tests. .