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JPS63172151U - - Google Patents

Info

Publication number
JPS63172151U
JPS63172151U JP6555187U JP6555187U JPS63172151U JP S63172151 U JPS63172151 U JP S63172151U JP 6555187 U JP6555187 U JP 6555187U JP 6555187 U JP6555187 U JP 6555187U JP S63172151 U JPS63172151 U JP S63172151U
Authority
JP
Japan
Prior art keywords
trimming
protective film
area
trimming part
resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6555187U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6555187U priority Critical patent/JPS63172151U/ja
Publication of JPS63172151U publication Critical patent/JPS63172151U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案のハイブリツドICの実施例の
外観平面図、第2図は第1図におけるトリミング
抵抗部のトリミング領域外を保護膜で覆つた部分
平面図、第3図は第1図におけるトリミング抵抗
部のトリミング位置を保護膜にて覆つた部分平面
図、第4図は従来のハイブリツドICのトリミン
グ抵抗の拡大部分平面図である。 なお、1:ホール素子、2:電子回路レジスト
部、3:リードフレーム、4:トリミング抵抗、
5:保護膜、6:電極、7:回路基板、8:トリ
ミング部。
FIG. 1 is an external plan view of an embodiment of the hybrid IC of the present invention, FIG. 2 is a partial plan view of the trimming resistor section shown in FIG. 1, with the outside of the trimming area covered with a protective film, and FIG. FIG. 4 is a partial plan view showing the trimming position of the trimming resistor portion covered with a protective film, and FIG. 4 is an enlarged partial plan view of the trimming resistor of the conventional hybrid IC. In addition, 1: Hall element, 2: Electronic circuit resist part, 3: Lead frame, 4: Trimming resistor,
5: Protective film, 6: Electrode, 7: Circuit board, 8: Trimming part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 回路基板7にプリントされたトリミング抵抗4
上に抵抗値調整用トリミング部8を除いた領域外
、または前記トリミング部8上の領域を保護膜5
にて覆つてなるハイブリツド集積回路。
Trimming resistor 4 printed on circuit board 7
A protective film 5 is applied to the area other than the trimming part 8 for adjusting the resistance value or the area above the trimming part 8.
A hybrid integrated circuit covered with
JP6555187U 1987-04-30 1987-04-30 Pending JPS63172151U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6555187U JPS63172151U (en) 1987-04-30 1987-04-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6555187U JPS63172151U (en) 1987-04-30 1987-04-30

Publications (1)

Publication Number Publication Date
JPS63172151U true JPS63172151U (en) 1988-11-09

Family

ID=30902730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6555187U Pending JPS63172151U (en) 1987-04-30 1987-04-30

Country Status (1)

Country Link
JP (1) JPS63172151U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6041073B2 (en) * 1981-05-26 1985-09-13 ザ・ハルコン・エス・デイ−・グル−プ・インコ−ポレ−テツド Method for producing alkylene carbonate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6041073B2 (en) * 1981-05-26 1985-09-13 ザ・ハルコン・エス・デイ−・グル−プ・インコ−ポレ−テツド Method for producing alkylene carbonate

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