JPS63170964U - - Google Patents
Info
- Publication number
- JPS63170964U JPS63170964U JP6321387U JP6321387U JPS63170964U JP S63170964 U JPS63170964 U JP S63170964U JP 6321387 U JP6321387 U JP 6321387U JP 6321387 U JP6321387 U JP 6321387U JP S63170964 U JPS63170964 U JP S63170964U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- insulating film
- attach
- joined
- covered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
第１図は本考案の一実施例の斜視図である。
１……混成集積回路基板、２……端子、３……
半田、４……絶縁膜。
半田、４……絶縁膜。
Claims (1)
- 回路素子を実装する基板裏面に取付けられ半田
により接合された端子部が、半田のつかない絶縁
膜により被覆されたことを特徴とする混成集積回
路。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6321387U JPS63170964U (ja) | 1987-04-24 | 1987-04-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6321387U JPS63170964U (ja) | 1987-04-24 | 1987-04-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63170964U true JPS63170964U (ja) | 1988-11-07 |
Family
ID=30898232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6321387U Pending JPS63170964U (ja) | 1987-04-24 | 1987-04-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63170964U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02135764A (ja) * | 1988-11-16 | 1990-05-24 | Ibiden Co Ltd | 電子部品搭載用基板 |
-
1987
- 1987-04-24 JP JP6321387U patent/JPS63170964U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02135764A (ja) * | 1988-11-16 | 1990-05-24 | Ibiden Co Ltd | 電子部品搭載用基板 |