JPS63174477U - - Google Patents
Info
- Publication number
- JPS63174477U JPS63174477U JP598487U JP598487U JPS63174477U JP S63174477 U JPS63174477 U JP S63174477U JP 598487 U JP598487 U JP 598487U JP 598487 U JP598487 U JP 598487U JP S63174477 U JPS63174477 U JP S63174477U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- component
- bias
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 5
Landscapes
- Structure Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図は本考案の印刷配線板の第１の実施例を
示す図、第２図は従来の低耐電圧回路用の印刷配
線板の一例を示す図、第３図は従来の高耐電圧回
路用の印刷配線板の一例を示す図、第４図は本考
案の第２の実施例を示す図である。
４１〜４４，７１〜７４……部品スルホール、
４５〜４８……バイヤスルホール、４９〜５９，
７５〜７７……配線パターン、４１ａ〜４４ａ，
４１ｂ〜４４ｂ，７１ａ〜７４ａ……部品スルホ
ールのランド部、４５ａ〜４８ａ，４５ｂ〜４８
ｂ……バイヤスルホールのランド部、６０〜６３
，７９〜８２……部品スルホールの下穴、６４〜
６７……バイヤスルホールの下穴。
Fig. 1 is a diagram showing a first embodiment of the printed wiring board of the present invention, Fig. 2 is a diagram showing an example of a conventional printed wiring board for a low withstand voltage circuit, and Fig. 3 is a diagram showing a conventional printed wiring board for a high withstand voltage circuit. FIG. 4 is a diagram showing an example of a printed wiring board for circuits, and is a diagram showing a second embodiment of the present invention. 41-44, 71-74... parts through hole,
45-48... bias through hole, 49-59,
75-77...Wiring pattern, 41a-44a,
41b to 44b, 71a to 74a... land portion of component through hole, 45a to 48a, 45b to 48
b...Land part of bias through hole, 60-63
, 79~82... Pilot hole for component through hole, 64~
67... Pilot hole for bias through hole.
Claims (1)
パターンを有する印刷配線板において、 他の部品スルホールあるいは他のバイヤスルホ
ールもしくは配線パターンに対向する部位の幅を
その下穴径に近付け且つ他の部位の幅をより広く
したランド部を有する部品スルホール又はバイヤ
スルホールを設けた ことを特徴とする印刷配線板。[Scope of Claim for Utility Model Registration] In a printed wiring board having a component through-hole, a via-through hole, and a wiring pattern, the width of the portion facing the other component through-hole or other bias-through hole or wiring pattern is made close to the diameter of the prepared hole, and A printed wiring board characterized by having a component through hole or a bias through hole having a land portion with a wider width.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP598487U JPS63174477U (en) | 1987-01-21 | 1987-01-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP598487U JPS63174477U (en) | 1987-01-21 | 1987-01-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63174477U true JPS63174477U (en) | 1988-11-11 |
Family
ID=30788074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP598487U Pending JPS63174477U (en) | 1987-01-21 | 1987-01-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63174477U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52110472A (en) * | 1976-03-11 | 1977-09-16 | Takatsugu Komatsu | Printed circuit substrate |
| JPS57169292A (en) * | 1981-04-10 | 1982-10-18 | Fujitsu Ltd | Land for printed circuit board |
| JPS5918457B2 (en) * | 1974-12-30 | 1984-04-27 | マグネシウム エレクトロン リミテイド | Magnesium-based alloy with high mechanical strength and low corrosion tendency |
-
1987
- 1987-01-21 JP JP598487U patent/JPS63174477U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5918457B2 (en) * | 1974-12-30 | 1984-04-27 | マグネシウム エレクトロン リミテイド | Magnesium-based alloy with high mechanical strength and low corrosion tendency |
| JPS52110472A (en) * | 1976-03-11 | 1977-09-16 | Takatsugu Komatsu | Printed circuit substrate |
| JPS57169292A (en) * | 1981-04-10 | 1982-10-18 | Fujitsu Ltd | Land for printed circuit board |