JPS6316830A - Resin covered sand for shell mold - Google Patents
Resin covered sand for shell moldInfo
- Publication number
- JPS6316830A JPS6316830A JP15986686A JP15986686A JPS6316830A JP S6316830 A JPS6316830 A JP S6316830A JP 15986686 A JP15986686 A JP 15986686A JP 15986686 A JP15986686 A JP 15986686A JP S6316830 A JPS6316830 A JP S6316830A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- phenol
- sand
- formaldehyde
- low temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 41
- 239000011347 resin Substances 0.000 title claims abstract description 41
- 239000004576 sand Substances 0.000 title claims abstract description 25
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims abstract description 34
- 150000002894 organic compounds Chemical class 0.000 claims abstract description 11
- 239000003054 catalyst Substances 0.000 claims abstract description 8
- 230000002378 acidificating effect Effects 0.000 claims abstract description 6
- 238000005979 thermal decomposition reaction Methods 0.000 claims description 13
- 150000002989 phenols Chemical class 0.000 claims description 12
- 230000001747 exhibiting effect Effects 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000005011 phenolic resin Substances 0.000 abstract description 26
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 abstract description 25
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract description 13
- 239000004677 Nylon Substances 0.000 abstract description 9
- 229920001778 nylon Polymers 0.000 abstract description 9
- -1 etc. Chemical compound 0.000 abstract description 7
- 239000000203 mixture Substances 0.000 abstract description 7
- 239000011118 polyvinyl acetate Substances 0.000 abstract description 6
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 abstract description 4
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 abstract description 4
- 229920000642 polymer Polymers 0.000 abstract description 4
- BGJSXRVXTHVRSN-UHFFFAOYSA-N 1,3,5-trioxane Chemical compound C1OCOCO1 BGJSXRVXTHVRSN-UHFFFAOYSA-N 0.000 abstract description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052799 carbon Inorganic materials 0.000 abstract description 2
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 abstract 3
- 238000004227 thermal cracking Methods 0.000 abstract 3
- 229940075065 polyvinyl acetate Drugs 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 21
- 229920001568 phenolic resin Polymers 0.000 description 10
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 9
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 238000010992 reflux Methods 0.000 description 7
- 235000019256 formaldehyde Nutrition 0.000 description 6
- WDENQIQQYWYTPO-IBGZPJMESA-N acalabrutinib Chemical compound CC#CC(=O)N1CCC[C@H]1C1=NC(C=2C=CC(=CC=2)C(=O)NC=2N=CC=CC=2)=C2N1C=CN=C2N WDENQIQQYWYTPO-IBGZPJMESA-N 0.000 description 5
- 238000005266 casting Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 229920002689 polyvinyl acetate Polymers 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000004645 polyester resin Substances 0.000 description 4
- 229920001225 polyester resin Polymers 0.000 description 4
- 229920003987 resole Polymers 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 229910052794 bromium Inorganic materials 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910001234 light alloy Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 235000006408 oxalic acid Nutrition 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 238000010112 shell-mould casting Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 2
- 239000004312 hexamethylene tetramine Substances 0.000 description 2
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 235000019645 odor Nutrition 0.000 description 2
- BIIBYWQGRFWQKM-JVVROLKMSA-N (2S)-N-[4-(cyclopropylamino)-3,4-dioxo-1-[(3S)-2-oxopyrrolidin-3-yl]butan-2-yl]-2-[[(E)-3-(2,4-dichlorophenyl)prop-2-enoyl]amino]-4,4-dimethylpentanamide Chemical compound CC(C)(C)C[C@@H](C(NC(C[C@H](CCN1)C1=O)C(C(NC1CC1)=O)=O)=O)NC(/C=C/C(C=CC(Cl)=C1)=C1Cl)=O BIIBYWQGRFWQKM-JVVROLKMSA-N 0.000 description 1
- QIVUCLWGARAQIO-OLIXTKCUSA-N (3s)-n-[(3s,5s,6r)-6-methyl-2-oxo-1-(2,2,2-trifluoroethyl)-5-(2,3,6-trifluorophenyl)piperidin-3-yl]-2-oxospiro[1h-pyrrolo[2,3-b]pyridine-3,6'-5,7-dihydrocyclopenta[b]pyridine]-3'-carboxamide Chemical compound C1([C@H]2[C@H](N(C(=O)[C@@H](NC(=O)C=3C=C4C[C@]5(CC4=NC=3)C3=CC=CN=C3NC5=O)C2)CC(F)(F)F)C)=C(F)C=CC(F)=C1F QIVUCLWGARAQIO-OLIXTKCUSA-N 0.000 description 1
- DWKNOLCXIFYNFV-HSZRJFAPSA-N 2-[[(2r)-1-[1-[(4-chloro-3-methylphenyl)methyl]piperidin-4-yl]-5-oxopyrrolidine-2-carbonyl]amino]-n,n,6-trimethylpyridine-4-carboxamide Chemical compound CN(C)C(=O)C1=CC(C)=NC(NC(=O)[C@@H]2N(C(=O)CC2)C2CCN(CC=3C=C(C)C(Cl)=CC=3)CC2)=C1 DWKNOLCXIFYNFV-HSZRJFAPSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 241000218645 Cedrus Species 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000004945 emulsification Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000003110 molding sand Substances 0.000 description 1
- VOVZXURTCKPRDQ-CQSZACIVSA-N n-[4-[chloro(difluoro)methoxy]phenyl]-6-[(3r)-3-hydroxypyrrolidin-1-yl]-5-(1h-pyrazol-5-yl)pyridine-3-carboxamide Chemical compound C1[C@H](O)CCN1C1=NC=C(C(=O)NC=2C=CC(OC(F)(F)Cl)=CC=2)C=C1C1=CC=NN1 VOVZXURTCKPRDQ-CQSZACIVSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- XULSCZPZVQIMFM-IPZQJPLYSA-N odevixibat Chemical compound C12=CC(SC)=C(OCC(=O)N[C@@H](C(=O)N[C@@H](CC)C(O)=O)C=3C=CC(O)=CC=3)C=C2S(=O)(=O)NC(CCCC)(CCCC)CN1C1=CC=CC=C1 XULSCZPZVQIMFM-IPZQJPLYSA-N 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Landscapes
- Mold Materials And Core Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はシェルモールド用樹脂被覆砂に関し、特にアル
ミニウム合金鋳物又は軽合金鋳物など注湯温度が700
〜800℃で比較的低い材質の鋳物に用いられ、鋳造後
の鋳型の崩壊性を改善したシェルモールド用樹脂被覆砂
に係る。Detailed Description of the Invention [Field of Industrial Application] The present invention relates to resin-coated sand for shell molding, particularly for aluminum alloy castings or light alloy castings with a pouring temperature of 700°C.
The present invention relates to resin-coated sand for shell molds that is used for castings of relatively low quality materials at ~800°C and improves the collapsibility of molds after casting.
一般に大量生産の鋳型中子の造型には鋳物砂にフェノー
ル樹脂を被浄した被咎砂を用いるシェルモールド法が主
流である。しかしながら、フェノール樹脂をアルミニウ
ム合金のような注湯温度が700〜800℃、と鉄の1
300〜1400℃、に比較して゛低い材質では、注湯
後に於ける鋳型中子の崩壊性が高温に処理されていない
ため悪く、砂落しが非常に困難であるので、砂落し工程
を別にもうけ多大な費用と労力を費やし、砂落しを行っ
ているのが現状である。Generally, the mainstream method for molding mold cores for mass production is the shell molding method, which uses foundry sand that has been purified with phenolic resin. However, the pouring temperature for phenolic resin, like aluminum alloy, is 700 to 800℃, which is 100℃ for iron.
If the material is lower than 300 to 1400℃, the mold core will have poor collapsibility after pouring because it is not treated at high temperature, and it will be very difficult to remove sand, so a separate sand removal process will be provided. The current situation is that a great deal of cost and effort is expended in removing the sand.
自動車の軽量化と共に軽合金の使用量が増加する傾向に
あり、シェル鋳型に必要な物性を具備し。As automobiles become lighter, the amount of light alloys used tends to increase, and light alloys have the physical properties necessary for shell molds.
従来のフェノール樹脂に比べ、低温で熱分解する易崩壊
性樹脂への改善が強く要望されている。Compared to conventional phenolic resins, there is a strong demand for improvements to easily disintegrating resins that thermally decompose at low temperatures.
崩壊性を改善する第1の方法としては低温で熱分解反応
をし・易い結合をもつ樹脂があげられるが。The first method to improve disintegration properties is to use resins that have bonds that easily undergo thermal decomposition reactions at low temperatures.
特開昭57−187142号、特開昭56−10913
6号、特開昭55−165252号は、不飽和ポリエス
テル樹脂を結合剤とするものであり、フェノール樹脂に
比較し。JP-A-57-187142, JP-A-56-10913
No. 6, JP-A-55-165252 uses unsaturated polyester resin as a binder, compared to phenol resin.
本質的には低温で熱分解し易いエステル結合を有するこ
とに着目したもので、崩壊性は改善されるが、中子の強
度が低く、複雑な形状の中子には不向きである。史に低
温での崩壊性が優れている反面、中子の造型時及び注湯
時に結合剤の熱分解が促進するため、悪臭が発生し作業
環境が悪化するなど人体へも悪影響を与え産業公害上問
題であるみ崩壊性を改善する第2の方法きしては従来か
らのフェノール樹脂への熱分解促進剤の添加配合である
が、酸化分解反応を促進する物質として特開昭57−1
49043号は臭素含有有機化合物で加熱することによ
り、Br又はBr化合物が分裂し、フェノール樹脂を酸
化分解し鋳型の崩壊性を改善するものであるが、中子造
型時、及び注湯時作業上有害な臭気が発生し、金型及び
機機への腐食性が大きいので、現在、これらの条件を満
足する鋳型後の鋳型の崩壊性促進剤は未だ完成されてい
ない。Essentially, this method focuses on having ester bonds that are easily thermally decomposed at low temperatures, and although the disintegration property is improved, the strength of the core is low and it is not suitable for cores with complex shapes. Although it has historically had excellent disintegration properties at low temperatures, the thermal decomposition of the binder is accelerated during core molding and pouring, resulting in bad odors, deteriorating the working environment, and other negative effects on the human body, resulting in industrial pollution. The second method to improve the disintegration property due to the above problem is to add a thermal decomposition accelerator to the phenol resin, which is a conventional method.
No. 49043 splits Br or Br compound by heating with a bromine-containing organic compound, oxidizes and decomposes the phenolic resin, and improves the collapsibility of the mold. Since it generates a harmful odor and is highly corrosive to molds and machines, a disintegration promoter for post-molding molds that satisfies these conditions has not yet been developed.
崩壊性を改善する第3の方法として従来からのフェノー
ル樹脂に低温で熱分解性を示す高分子物質又は樹脂によ
る変性であるが従来から多くの方法が提案されている。A third method for improving disintegration properties is to modify conventional phenolic resins with polymeric substances or resins that are thermally decomposable at low temperatures, and many methods have been proposed in the past.
特開昭56−114546号はフェノール樹脂を製造す
る際フェノール類と合成有機質繊維類とホルムアルデヒ
ド類を酸性又はアルカリ性触媒下で反応させた樹脂が提
案されているが、崩壊性を改善すべく低温で熱分解をも
たらす繊維状高分子では分子量が高すぎて中子の形状で
、熱の伝わりにくい部分では熱分解が遅れ、十分な易崩
壊性をもたらすには、や\不満足となっている現状であ
る。JP-A-56-114546 proposes a resin in which phenol, synthetic organic fibers, and formaldehyde are reacted under an acidic or alkaline catalyst to produce phenolic resin, but in order to improve the disintegration property, it is necessary to react at low temperature. Fibrous polymers that cause thermal decomposition have too high a molecular weight and are shaped like cores, and thermal decomposition is delayed in areas where heat is difficult to conduct, making it somewhat unsatisfactory to provide sufficient disintegration. be.
本発明の目的は、上記した従来の技術の欠点を除き、多
大な費用と労力を要せず、しかも従来の被覆砂と、そん
しよくのない鋳型強度及び造型特性をそなえて注湯後の
崩壊性が優れた注湯温度が700〜800℃の低温材質
の鋳物に適するシェルモールド用樹脂被覆砂を提供する
にある。The object of the present invention is to eliminate the above-mentioned drawbacks of the conventional techniques, to eliminate the need for large costs and labor, and to provide mold strength and molding properties that are not as good as the conventional coated sand. It is an object of the present invention to provide resin-coated sand for shell molds, which has excellent collapsibility and is suitable for casting of low-temperature materials with a pouring temperature of 700 to 800°C.
〔問題点を解°決しようとするための手段〕本発明者等
は鋭意研究の結果、シェルモールド用フェノール樹脂の
製造に際し耐熱性の低い低温熱分解性を示す有機化合物
又は樹脂によるフェノール樹脂への変性又は混入反応さ
せて得られる樹脂で被検した被株砂を用いれは直鎖状高
分子の特色が生かされ硬化時の架橋密度も緩和されて熱
分解温度が低下し注湯後の崩壊性が著しく改善されるこ
とを見出し本発明を完成するに至った。[Means for solving the problem] As a result of intensive research, the present inventors have developed a method for producing phenolic resin for shell molds using organic compounds or resins that exhibit low heat resistance and low temperature thermal decomposition. By using the sand tested with a resin obtained by modifying or mixing the resin, the characteristics of the linear polymer are taken advantage of, and the crosslinking density during curing is relaxed, the thermal decomposition temperature is lowered, and it collapses after pouring. The present invention was completed based on the discovery that the properties are significantly improved.
本発明は、フェノール類と低温熱分解性を示す有機化合
物または樹脂及びホルムアルデヒド類を酸性触媒または
アルカリ性触媒下で反応させて得られる樹脂を砂に抜枠
してなることを特徴とするシェルモールド用樹脂被覆砂
、であるO本発明の実施は例えば、フェノール類とホル
ムアルデヒド類を酸性触媒、又はアルカリ性触媒下で反
応させ、まずフェノール樹脂の初期生成物を形成してお
き1次いで低温熱分解性を示す有機化合物または樹脂で
反応させて得られる樹脂を砂に被穆してシェルモールド
用樹脂被覆砂とすることができる。The present invention is for shell molds, characterized in that the resin obtained by reacting phenols with organic compounds or resins exhibiting low-temperature thermal decomposition and formaldehyde under an acidic or alkaline catalyst is molded into sand. The present invention can be carried out by, for example, reacting phenols and formaldehyde under an acidic or alkaline catalyst to form an initial product of phenolic resin, which is then treated with low-temperature thermal decomposition. Resin coated sand for shell molding can be obtained by coating sand with a resin obtained by reacting with the organic compound or resin shown below.
本発明に使用されるフェノール類はフェノールあるいは
m−クレゾール、p−クレゾール、3−4キシレノール
、3−5キシレノール、のヨウナメタ又はバラアルキル
フェノールならびにこれらフェノール類の混合物である
。The phenols used in the present invention are phenol or m-cresol, p-cresol, 3-4 xylenol, 3-5 xylenol, or paraalkylphenols, and mixtures of these phenols.
本発明に使用さ第1るホルムアルデヒド類としては、ホ
ルマリン、ヌはパラホルムアルデヒド、トリオキサン、
ポリオキシメチレン、テトラオキシメチレンならびにこ
れらのホルムアルデヒド重合体な゛どの混合物があけら
れる。The first formaldehydes used in the present invention include formalin, paraformaldehyde, trioxane,
Mixtures such as polyoxymethylene, tetraoxymethylene and formaldehyde polymers thereof are prepared.
それらホルムアルデヒドの使用量はフェノール類1モル
当りに対して0.5〜2.5モルの範囲が好ましい。The amount of formaldehyde used is preferably in the range of 0.5 to 2.5 moles per mole of phenol.
本発明に使用される低温熱分解性を示す有機化合物また
は樹脂としては、ε−カプロラクタム。The organic compound or resin exhibiting low-temperature thermal decomposition properties used in the present invention is ε-caprolactam.
ナイロンオリゴマー、ポリ酢酸ビニル樹脂、ポリエステ
ル樹脂、アクリル樹脂などの直鎖分子構造で特に炭素分
子の価力少ないものが好ましいものとしてあげられる。Preferred examples include nylon oligomers, polyvinyl acetate resins, polyester resins, acrylic resins, and other linear molecular structures with particularly low carbon molecules.
樹脂中に混入反応させる低温熱分解性を示す有機化合物
または樹脂の量は5〜40重量%の範囲が好ましく、5
重量%以下では効果が少なく40重量係以上では注湯後
の崩壊性は向上するが、中子造型時の硬化性が遅くなり
実用性が少なくなる。The amount of the organic compound or resin exhibiting low-temperature thermal decomposition properties mixed into the resin and reacted is preferably in the range of 5 to 40% by weight;
If it is less than 40% by weight, the effect will be small, and if it is more than 40% by weight, the disintegration property after pouring will be improved, but the curing property during core molding will be slow and the practicality will be reduced.
以下実施例を挙げ本発明を説明する。本発明のシェルモ
ールド用樹脂被覆砂は従来のフェノール樹脂杉覆砂と同
様にして被接されるので、低温熱分解性を示す有機化合
物または樹脂による変性フェノール樹脂について述べる
。係は重量に拠る。The present invention will be explained below with reference to Examples. Since the resin-coated sand for shell molds of the present invention is coated in the same manner as conventional phenolic resin cedar-coated sand, a modified phenolic resin with an organic compound or resin exhibiting low-temperature thermal decomposition will be described. The weight depends on the weight.
実施例−1
フェノール940 L?、ε−カプロラクタム100
r。Example-1 Phenol 940 L? , ε-caprolactam 100
r.
50%ホルマリン465 f 、蓚酸6.62を還流冷
却器を備えた反応容器に仕込み還流下に3.0時間反応
せしめ2次いで減圧下で脱水濃縮を行い、軟化点85℃
のε−カプロラクタム変性フェノール樹脂を得た。465 f of 50% formalin and 6.62 f of oxalic acid were charged into a reaction vessel equipped with a reflux condenser and allowed to react under reflux for 3.0 hours.2Then, dehydration and concentration were performed under reduced pressure until the softening point was 85°C.
An ε-caprolactam modified phenolic resin was obtained.
実施例−2
実施例−1のε−カプロラクタムに代えてナイロンオリ
ゴマーを用いた。それ以外は実施例−1と同様にして、
軟化点86℃のナイロンオリゴマー変性フェノール樹脂
を得た。Example-2 Nylon oligomer was used in place of ε-caprolactam in Example-1. Other than that, the same procedure as Example-1 was carried out.
A nylon oligomer-modified phenol resin with a softening point of 86°C was obtained.
実施例−3
実施例−1のε−カプロラクタムに代えてポリ酢酸ビニ
ル樹脂を用いた。それ以外は実施例−1と同様にして軟
化点84℃のポリ酢酸ビニル樹脂変性フェノール樹脂を
得た。Example-3 Polyvinyl acetate resin was used in place of ε-caprolactam in Example-1. Other than that, a polyvinyl acetate resin-modified phenol resin having a softening point of 84° C. was obtained in the same manner as in Example-1.
実施例−4
実施例−1のε−カプロラクタムに代えてポリエステル
樹脂を用いた。それ以外は実施例−1と同様にして軟化
点88℃のポリエステル樹脂変性フェノール樹脂を得た
。Example-4 Polyester resin was used in place of ε-caprolactam in Example-1. A polyester resin-modified phenol resin having a softening point of 88° C. was obtained in the same manner as in Example-1 except for the above.
実施例−5
実施例−1のε−カプロラクタムに代えてアクリル樹脂
を用いた。それ以外は実施例−1と同様にして軟化点8
5℃のアクリル樹脂変性フェノール樹脂を得た。Example-5 Acrylic resin was used in place of ε-caprolactam in Example-1. Other than that, the softening point was 8 as in Example-1.
An acrylic resin-modified phenol resin at 5°C was obtained.
実施例−6
フェノール940 ? 、 50%ホルマリン450
f 、蓚酸6.62を還流冷却器を備えた反応器に仕込
み還流下乳化するまで還流反応を行った後、ε−カプロ
ラクタムを3002を加え、その後退流下2.0時間還
流反応せしめ9次いで減圧下で脱水濃縮を行い、軟化点
85℃のε−カプロラクタム変性フェノール樹脂を得た
。Example-6 Phenol 940? , 50% formalin 450
f, 6.62 g of oxalic acid was charged into a reactor equipped with a reflux condenser and refluxed under reflux until emulsification was carried out, then ε-caprolactam 3002 was added and refluxed for 2.0 hours under backward flow. 9. Then, the pressure was reduced The resin was dehydrated and concentrated to obtain an ε-caprolactam-modified phenol resin with a softening point of 85°C.
実施例−7
実施例−6のε−カプロラクタムに代えてナイロンオリ
ゴマーを4002を用いた。それ以外は実施例−6と同
様にして軟化点80℃のナイロンオリゴマー変性フェノ
ール樹脂を得た。Example 7 Nylon oligomer 4002 was used in place of ε-caprolactam in Example 6. A nylon oligomer-modified phenol resin having a softening point of 80° C. was obtained in the same manner as in Example 6 except for the above.
実施例−8
実施例−6のε−カプロラクタムに代えてポリ酢酸ビニ
ル樹脂を35Of用いた。それ以外は実施例−6と同様
にして軟化点82℃のポリ酢酸ビニル樹脂変性のフェノ
ール樹脂を得た。Example 8 In place of ε-caprolactam in Example 6, 35Of polyvinyl acetate resin was used. A polyvinyl acetate resin-modified phenol resin having a softening point of 82° C. was obtained in the same manner as in Example 6 except for the above.
実施例−9
実施例−6のε−カプロラクタムに代えてポリエステル
樹脂を5002を用いた。それ以外は実施例−6と同様
にして軟化点80℃のポリエステル樹脂変性フェノール
樹脂を得た。Example-9 Polyester resin 5002 was used in place of ε-caprolactam in Example-6. A polyester resin-modified phenol resin having a softening point of 80° C. was obtained in the same manner as in Example-6 except for the above.
実施例−10
実施例−6のε−カプロラクタムに代えてアクリル樹脂
を6002を用いた。それ以外は実施例−6と同様にし
て軟化点80℃のアクリル樹脂変性フェノール樹脂を得
た。Example-10 Acrylic resin 6002 was used in place of ε-caprolactam in Example-6. Otherwise, an acrylic resin-modified phenol resin having a softening point of 80°C was obtained in the same manner as in Example-6.
実施例−11
フェノール940 r 、ナイロンオリゴマー1002
を還流冷却器を備えた反応容器に仕込み加熱溶解した後
、50チホルマリン1200 f 、 2591iアン
モニア水122 Fを仕込み80℃、1.5時間反応せ
しめ2次いで減圧下で含有水分を除去しながら、90℃
まで徐々に温度を上昇し95℃に達したときに、直ちに
反応器より取り出し急冷し軟化点80℃のナイロンオリ
ゴマー変性レゾール型固形フェノール樹脂を得た。Example-11 Phenol 940r, nylon oligomer 1002
was charged into a reaction vessel equipped with a reflux condenser and heated to dissolve, then 50% formalin 1200F and 2591I ammonia water 122F were charged and reacted at 80°C for 1.5 hours.2 Then, while removing the water content under reduced pressure, 90℃
When the temperature reached 95°C, the mixture was immediately taken out from the reactor and rapidly cooled to obtain a nylon oligomer-modified resol type solid phenol resin with a softening point of 80°C.
実施例−12
実施例−11のナイロンオリゴマーに代えてポリエステ
ル樹脂を100tを用いた。それ以外は実施例−11と
同様にして軟化点82℃のポリエステル変性レゾール卓
固形フェノール樹脂を得た。Example 12 In place of the nylon oligomer in Example 11, 100 tons of polyester resin was used. A polyester modified resol table solid phenol resin having a softening point of 82° C. was obtained in the same manner as in Example 11 except for the above.
比較例−1
フェノール940 f 、 50%ホルマリン450
f 、蓚酸6.62を還流冷却器を備えた反応器に仕込
み還流下3.0時間反応せしめ1次いで減圧下で脱水濃
縮を行い軟化点81℃のノボラック型フェノール樹脂を
得た。Comparative example-1 Phenol 940f, 50% formalin 450
f, 6.62 g of oxalic acid was charged into a reactor equipped with a reflux condenser and reacted under reflux for 3.0 hours. 1. The mixture was then dehydrated and concentrated under reduced pressure to obtain a novolak type phenol resin with a softening point of 81°C.
比較例−2
フェノ−ちし940 F 、 50チホルマリン108
0 f ’+ 35チアンモニア水1222を反応容器
に仕込み80℃1.0時間反応せしめ1次いで減圧下で
含有水分を除去しながら、90℃まで徐々に温度を上昇
し95℃に達したときに直ちに反応器より取り出し、軟
化点78℃のレゾール型固形フェノール樹脂を得た。Comparative example-2 Pheno-chishi 940 F, 50 thiformin 108
0 f '+ 35 1222 thiammonium water was charged into a reaction vessel and reacted at 80°C for 1.0 hour.1 Then, while removing the water content under reduced pressure, the temperature was gradually raised to 90°C, and when it reached 95°C. It was immediately taken out from the reactor to obtain a resol type solid phenol resin with a softening point of 78°C.
試験例
前記実施例及び比較例で得た樹脂を用いて鋳物砂を被覆
して得た本発明のシェルモールド用樹脂被株砂の性状を
試験した結果を第1表に示す。Test Example Table 1 shows the results of testing the properties of resin covering sand for shell molds of the present invention obtained by coating molding sand with the resins obtained in the Examples and Comparative Examples.
140℃に加熱した珪砂、10に2と樹脂0.2Krを
鋳物砂混練用スピードミキサーに入れ、60秒間混練し
1次いでヘキサミン0.03に9を水0.1に9に溶解
したヘキサ水を加え更に混練をつづけ、約60秒後にス
テアリン酸カルシウムを添加し更に20秒間混練し本発
明のシェルモールド用樹脂被徨砂を得た。Silica sand heated to 140°C, 10 to 2, and 0.2Kr of resin were placed in a speed mixer for kneading foundry sand, and kneaded for 60 seconds. 1. Next, hexa water containing 0.03 parts of hexamine and 9 parts of water dissolved in 0.1 parts was added. After about 60 seconds, calcium stearate was added and the mixture was further kneaded for 20 seconds to obtain the resin-containing sand for shell molds of the present invention.
この樹脂被検砂の特性を示す、但しレゾール型樹脂には
へキサミンは不用。The characteristics of this resin test sand are shown, however, hexamine is not required for resol type resin.
第 1 表
注−1曲げ強さはJIS K−6910シエルモールド
用粉状フエノール樹脂試験方法による。Table 1 Note 1 Bending strength is based on JIS K-6910 test method for powdered phenolic resin for shell molds.
注−2融着点は、 JA(yr試験方法、C−1融着点
試験方法による。Note-2 The fusion point is based on JA (yr test method, C-1 fusion point test method).
注−3崩壊性は300×501+1++l中子を500
℃還元性雰囲気中で1.0時間保持した後取り出し6m
θshの篩を用いロータツブ試験機で60秒振古うする
。Note-3 Disintegrability is 300×501+1++l core 500
6 m after being held in a reducing atmosphere for 1.0 hours
Shake for 60 seconds using a rotor tube tester using a θsh sieve.
実施例の表から明らかのように500℃で処理した中子
の崩壊性かられかるように著しく崩壊性が改善されるこ
とが認められた。As is clear from the table of Examples, it was observed that the disintegration properties of the cores treated at 500°C were significantly improved.
Claims (1)
はアルカリ性触媒下で反応させて得られる樹脂を砂に被
覆してなることを特徴とするシェルモールド用樹脂被覆
砂。[Claims] A shell mold characterized by coating sand with a resin obtained by reacting phenols with an organic compound or resin exhibiting low-temperature thermal decomposition and formaldehyde under an acidic or alkaline catalyst. resin coated sand.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15986686A JPS6316830A (en) | 1986-07-09 | 1986-07-09 | Resin covered sand for shell mold |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15986686A JPS6316830A (en) | 1986-07-09 | 1986-07-09 | Resin covered sand for shell mold |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6316830A true JPS6316830A (en) | 1988-01-23 |
JPH0337817B2 JPH0337817B2 (en) | 1991-06-06 |
Family
ID=15702926
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15986686A Granted JPS6316830A (en) | 1986-07-09 | 1986-07-09 | Resin covered sand for shell mold |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6316830A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5316234A (en) * | 1991-05-29 | 1994-05-31 | Matsushita Electric Industrial Co., Ltd. | Tape cassette for cassette recording/reproducing apparatus |
JP2009114463A (en) * | 2009-02-23 | 2009-05-28 | Panasonic Electric Works Co Ltd | Phenolic resin molding material and its molded product |
WO2010061793A1 (en) * | 2008-11-25 | 2010-06-03 | パナソニック電工株式会社 | Phenol resin molding material and phenol resin molded article |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56114546A (en) * | 1980-02-14 | 1981-09-09 | Gunei Kagaku Kogyo Kk | Resin coated sand for shell mold |
JPS574351A (en) * | 1980-06-11 | 1982-01-09 | Gunei Kagaku Kogyo Kk | Resin coated sand for shell mold |
JPS5855146A (en) * | 1981-09-30 | 1983-04-01 | Sumitomo Deyurezu Kk | Phenolic resin binder for shell mold and resin coated sand produced by using said binder |
JPS59147012A (en) * | 1983-02-10 | 1984-08-23 | Sumitomo Deyurezu Kk | Preparation of modified phenolic resin composition for shell mold |
JPS6012250A (en) * | 1983-07-04 | 1985-01-22 | Kao Corp | Production of binder for molding sand |
-
1986
- 1986-07-09 JP JP15986686A patent/JPS6316830A/en active Granted
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56114546A (en) * | 1980-02-14 | 1981-09-09 | Gunei Kagaku Kogyo Kk | Resin coated sand for shell mold |
JPS574351A (en) * | 1980-06-11 | 1982-01-09 | Gunei Kagaku Kogyo Kk | Resin coated sand for shell mold |
JPS5855146A (en) * | 1981-09-30 | 1983-04-01 | Sumitomo Deyurezu Kk | Phenolic resin binder for shell mold and resin coated sand produced by using said binder |
JPS59147012A (en) * | 1983-02-10 | 1984-08-23 | Sumitomo Deyurezu Kk | Preparation of modified phenolic resin composition for shell mold |
JPS6012250A (en) * | 1983-07-04 | 1985-01-22 | Kao Corp | Production of binder for molding sand |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5395064A (en) * | 1990-06-01 | 1995-03-07 | Matsushita Electric Industrial Co., Ltd. | Tape cassette having front and inner pivotal lids |
US5316234A (en) * | 1991-05-29 | 1994-05-31 | Matsushita Electric Industrial Co., Ltd. | Tape cassette for cassette recording/reproducing apparatus |
WO2010061793A1 (en) * | 2008-11-25 | 2010-06-03 | パナソニック電工株式会社 | Phenol resin molding material and phenol resin molded article |
JP2009114463A (en) * | 2009-02-23 | 2009-05-28 | Panasonic Electric Works Co Ltd | Phenolic resin molding material and its molded product |
Also Published As
Publication number | Publication date |
---|---|
JPH0337817B2 (en) | 1991-06-06 |
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