[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

JPS63151058A - Resin packaged type semiconductor device - Google Patents

Resin packaged type semiconductor device

Info

Publication number
JPS63151058A
JPS63151058A JP29953786A JP29953786A JPS63151058A JP S63151058 A JPS63151058 A JP S63151058A JP 29953786 A JP29953786 A JP 29953786A JP 29953786 A JP29953786 A JP 29953786A JP S63151058 A JPS63151058 A JP S63151058A
Authority
JP
Japan
Prior art keywords
piece
lead piece
lead
resin
resin packaged
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP29953786A
Other languages
Japanese (ja)
Inventor
Hitoshi Ito
仁 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP29953786A priority Critical patent/JPS63151058A/en
Publication of JPS63151058A publication Critical patent/JPS63151058A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To eliminate trouble accompanied by the deformation of a lead piece, by extending the lead piece from the vicinity of a metal piece for mounting a semiconductor element to the side of the lower surface (or upper surface) of a resin packaged body, and extruding the lead piece to the outside of the resin packaged body along the lower surface (or upper surface). CONSTITUTION:A semiconductor element 1 is fixed on a semiconductor mounting metal piece 2. A lead piece 10, whose one end part is located in the vicinity of the metal piece 2, is bent in a resin packaged body 5, extended toward a lower surface 11, again bent at the lower surface 11 and protruded approximately horizontally along the lower surface 11. The metal piece 2 for mounting the semiconductor element and the lead piece 10 are cut out of a common lead frame. The lead piece 10 is bent before cutting. The protruding part of the lead piece to the outside of the resin packaged body can be made short. Since the bent part is not provided at the outside of the resin packaged body, the generation of the deformation of the lead piece can be largely alleviated.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、半導体素子と、同素子を積載した金属片と、
同金属片の近傍に一端を置くリード片の一部分とを樹脂
成形体内に埋設してなる樹脂封止型半導体素子、とくに
電子回路基板の表面上に実装される樹脂封止型半導体装
置に関するものである。[Detailed Description of the Invention] Industrial Application Field The present invention is directed to a semiconductor element, a metal piece loaded with the element,
This relates to a resin-sealed semiconductor element in which a portion of a lead piece, one end of which is placed near the same metal piece, is embedded in a resin molded body, and in particular, a resin-sealed semiconductor device mounted on the surface of an electronic circuit board. be.

従来の技術 近年、電子機器の小型・薄型化に伴い、いわゆる表面実
装形式の樹脂封止型半導体装置が多（使われるようにな
ってきた。BACKGROUND OF THE INVENTION In recent years, as electronic devices have become smaller and thinner, so-called surface-mounted resin-sealed semiconductor devices have come into use.

従来の樹脂封止型半導体装置は、通常、第２図に示すよ
うに構成され、半導体素子１はリードフレームから切り
はなされた半導体素子積載用金属片２上に固定され、同
じくリードフレームから切りはなされた多数のリード片
３は金属片２の近傍に一端部を置き、この一端部に半導
体素子１の電極端子が金属細線４によって接続されてい
る。そして、これらを被覆する樹脂成形体５の側面から
リード片３の他端部が引き出されている。A conventional resin-sealed semiconductor device is usually constructed as shown in FIG. One end of the many released lead pieces 3 is placed near the metal piece 2, and the electrode terminal of the semiconductor element 1 is connected to this one end by a thin metal wire 4. The other end of the lead piece 3 is drawn out from the side surface of the resin molded body 5 covering these parts.

第３図はかかる樹脂封止型半導体装置６を電子回路基板
７の表面上に実装した状態を示す図であり、リード片３
は電子回路基板７の表面金属層８に、半田９により接続
されている。FIG. 3 is a diagram showing a state in which such a resin-sealed semiconductor device 6 is mounted on the surface of an electronic circuit board 7, in which lead pieces 3
is connected to the surface metal layer 8 of the electronic circuit board 7 by solder 9.

発明が解決しようとする問題点 ところで、かかる樹脂封止型半導体装置のリード片３は
、樹脂成形体５の側面から出たのち第２図図示のように
折り曲げ加工されているので、検査工程や搬送中などに
変形しやすい。そして、リード片３に変形を生じると、
第４図図示のように電子回路基板７の表面金属層８から
浮き上がってしまい、電気的接触不良を起こす。また、
第５図図示のように隣接リード片との間で短絡不良を起
こす危険もある。Problems to be Solved by the Invention By the way, the lead pieces 3 of such a resin-sealed semiconductor device are bent as shown in FIG. Easily deformed during transportation. Then, when the lead piece 3 is deformed,
As shown in FIG. 4, it floats up from the surface metal layer 8 of the electronic circuit board 7, causing poor electrical contact. Also,
As shown in FIG. 5, there is also the risk of short-circuiting between adjacent lead pieces.

問題点を解決するための手段 本発明は、前述のような従来の不都合を除去すべくなさ
れたもので、本発明によると、半導体素子積載用金属片
の近傍から出発したリード片を、樹脂成形体の下面（ま
たは上面）側へ延在させたのち、前記下面（または上面
）に沿って樹脂成形体外へ突出させる。Means for Solving the Problems The present invention has been made to eliminate the above-mentioned conventional inconveniences. After extending toward the lower surface (or upper surface) of the body, it is projected out of the resin molded body along the lower surface (or upper surface).

作用 このように構成すると、樹脂成形体外へ突出するリード
片部分を短小化できるのみならず、該部分に折り曲げ部
を有しないので、リード片の変形発生を大幅に軽減させ
ることができる。Function: With this structure, not only can the lead piece portion that protrudes outside the resin molded body be shortened, but also the occurrence of deformation of the lead piece can be significantly reduced since the lead piece portion does not have a bent portion.

実施例 つぎに、本発明を図面に示した実施例とともにさらに詳
しく説明する。Embodiments Next, the present invention will be explained in more detail with reference to embodiments shown in the drawings.

第１図に示すように、半導体素子１は半導体積載用金属
片２上に固定されており、金属片２の近傍に一端部を置
くリード片１０は、樹脂成形体５内で折り曲げられて、
下面１１に向って延在し、下面１１においてふたたび折
り曲げられて、下面１１に沿いほぼ水平に突出している
。ただし、半導体素子積載用金属片２およびリード片１
０は共通のリードフレームから切りはなされたものであ
り、リード片１０の前記折り曲げは、前記切りはなしの
前に施された折り曲げ加工で得たものである。また、下
面１１として示したものは上面と読み代え得るのは勿論
である。As shown in FIG. 1, a semiconductor element 1 is fixed on a semiconductor loading metal piece 2, and a lead piece 10, which has one end near the metal piece 2, is bent inside a resin molded body 5.
It extends toward the lower surface 11, is bent again at the lower surface 11, and protrudes substantially horizontally along the lower surface 11. However, the metal piece 2 for mounting semiconductor elements and the lead piece 1
0 is cut from a common lead frame, and the bending of the lead piece 10 is obtained by the bending process performed before the cutting. Moreover, it goes without saying that what is shown as the lower surface 11 can be read as the upper surface.

発明の効果 本発明は前述のように構成されるので、電子回路基板の
表面上に実装するのに必要なリード片の突出長を従来構
造のものよりも短小にでき、しかも、この突出部に折り
曲げを必要としないので、検査工程時や搬送中などにリ
ード片に変形を生じることが大幅に緩和され、リード片
の変形に伴う種々の不都合をとり除くことができる。Effects of the Invention Since the present invention is configured as described above, the protruding length of the lead piece required for mounting on the surface of an electronic circuit board can be made shorter than that of a conventional structure. Since bending is not required, deformation of the lead piece during the inspection process or during transportation is greatly reduced, and various inconveniences associated with deformation of the lead piece can be eliminated.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明を実施した樹脂封止型半導体装置の側断
面図、第２図は従来の樹脂封止型半導体装置の側断面図
、第３図は同装置の実装状態を示す側断面図、第４図お
よび第５図はそれぞれ同装置のリード片の変形状態を例
示する斜視図である。 １・・・・・・半導体素子、２・・・・・・金属片、５
・・・・・・樹脂成形体、１０・・・・・・リード片。 代理人の氏名　弁理士　中尾敏男　ほか１名／−−−半
導体系子 ？ 箔２図FIG. 1 is a side sectional view of a resin-sealed semiconductor device embodying the present invention, FIG. 2 is a side sectional view of a conventional resin-sealed semiconductor device, and FIG. 3 is a side sectional view showing the device in a mounted state. 4 and 5 are perspective views each illustrating a deformed state of the lead piece of the device. 1...Semiconductor element, 2...Metal piece, 5
... Resin molded body, 10 ... Lead piece. Name of agent: Patent attorney Toshio Nakao and 1 other person/---Semiconductor person? Foil figure 2

Claims (1)

【特許請求の範囲】[Claims] 半導体素子と、同素子を積載した金属片と、同金属片の
近傍に一端部を置くリード片の一部分とを樹脂成形体内
に埋設してなり、前記リード片は前記樹脂成形体の下面
（または上面）に向って延在したのち、前記下面（また
は上面）に沿って樹脂成形体外へ突出していることを特
徴とする樹脂封止型半導体装置。A semiconductor element, a metal piece loaded with the element, and a part of a lead piece whose one end is placed near the metal piece are embedded in a resin molded body, and the lead piece is buried on the lower surface (or 1. A resin-sealed semiconductor device characterized in that the resin-molded semiconductor device extends toward the upper surface and then projects out of the resin molded body along the lower surface (or the upper surface).
JP29953786A 1986-12-16 1986-12-16 Resin packaged type semiconductor device Pending JPS63151058A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29953786A JPS63151058A (en) 1986-12-16 1986-12-16 Resin packaged type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29953786A JPS63151058A (en) 1986-12-16 1986-12-16 Resin packaged type semiconductor device

Publications (1)

Publication Number Publication Date
JPS63151058A true JPS63151058A (en) 1988-06-23

Family

ID=17873889

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29953786A Pending JPS63151058A (en) 1986-12-16 1986-12-16 Resin packaged type semiconductor device

Country Status (1)

Country Link
JP (1) JPS63151058A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02170456A (en) * 1988-12-22 1990-07-02 Canon Electron Inc Mounting of integrated circuit structure body
JPH0349U (en) * 1989-05-19 1991-01-07
DE4238646A1 (en) * 1991-11-14 1993-06-03 Gold Star Electronics New encapsulated semiconductor memory chip - has chips with bonding pads on central region, lead frame with leads connected to bonding parts, insulating adhesive, metal wire for electrical connection etc.
US5917241A (en) * 1996-05-23 1999-06-29 Mitsubishi Denki Kabushiki Kaisha High frequency semiconductor device having source, drain, and gate leads

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57176751A (en) * 1981-04-22 1982-10-30 Toshiba Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57176751A (en) * 1981-04-22 1982-10-30 Toshiba Corp Semiconductor device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02170456A (en) * 1988-12-22 1990-07-02 Canon Electron Inc Mounting of integrated circuit structure body
JPH0349U (en) * 1989-05-19 1991-01-07
DE4238646A1 (en) * 1991-11-14 1993-06-03 Gold Star Electronics New encapsulated semiconductor memory chip - has chips with bonding pads on central region, lead frame with leads connected to bonding parts, insulating adhesive, metal wire for electrical connection etc.
US5363279A (en) * 1991-11-14 1994-11-08 Goldstar Electron Co., Ltd. Semiconductor package for a semiconductor chip having centrally located bottom bond pads
USRE36097E (en) * 1991-11-14 1999-02-16 Lg Semicon, Ltd. Semiconductor package for a semiconductor chip having centrally located bottom bond pads
USRE37413E1 (en) * 1991-11-14 2001-10-16 Hyundai Electronics Industries Co., Ltd. Semiconductor package for a semiconductor chip having centrally located bottom bond pads
DE4238646B4 (en) * 1991-11-14 2006-11-16 Goldstar Electron Co., Ltd., Cheongju Semiconductor device with special connection configuration
US5917241A (en) * 1996-05-23 1999-06-29 Mitsubishi Denki Kabushiki Kaisha High frequency semiconductor device having source, drain, and gate leads

Similar Documents

Publication Publication Date Title
JPS63151058A (en) Resin packaged type semiconductor device
JPS63258050A (en) Semiconductor device
JP2902919B2 (en) Surface mount type semiconductor device
JP2902918B2 (en) Surface mount type semiconductor device
JPH04134852A (en) Lead frame
JP2890621B2 (en) Hybrid integrated circuit device
JPS6097654A (en) Sealed type semiconductor device
JPS62235763A (en) Lead frame for semiconductor device
JP2001267484A (en) Semiconductor device and manufacturing method thereof
JP3153185B2 (en) Semiconductor device
JPH0212861A (en) Resin-sealed semiconductor device
JPH0199245A (en) Ic package
KR0167288B1 (en) Chip scale package and method of making the same
JP2981309B2 (en) Semiconductor device
KR970008508A (en) Semiconductor package and manufacturing method
JPH04199564A (en) Package structure of electronic parts
JP2000260908A (en) Surface mount semiconductor device and manufacture thereof
JPS5989447A (en) Semiconductor device
JPH04146659A (en) Semiconductor device and manufacture thereof
JPS5947749A (en) Resin package type semiconductor device
JPH0720924Y2 (en) Semiconductor device
JPS62122253A (en) Semiconductor device
JPS61148853A (en) Semiconductor device
JPH02268459A (en) Semiconductor package
JPS5893336A (en) Semiconductor device