JPS63144954A - Plane polishing device - Google Patents

Abstract

PURPOSE:To make applied force act on a work back uniformly so as to improve finished flatness by laying pressure fluid, as pressure fluid, between a pressure head and a work, in a plane polishing device such as semiconductor wafer, etc. CONSTITUTION:A work 12 engaged with the step part 16a of a work holder 16 is absorbed and held by vacuum suction through a suction hole 20 and a tube 24 and pressed against a surface board 10 which rotates and polished. Then, pressure fluid from a tube 27 and a port 14 is supplied and filled up in space 30 between a pressure head 11 and a work 12, pressing the work 12 against the surface board 10 with uniform surface pressure. This work holder 6 is never applied with biased, since so supported as to be free in rocking by the pressure head 11 through a diaphragm 17, and further the sealing effect of a seal member 18 is improved too, and flapping at the peripheral part of the work can be prevented. In this way, the work can be finished into high flatness and there is no fear of dirty and injury attaching to the back of the work.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a surface polishing equipment 2 used for single-sided polishing of a workpiece.
It is related to.

[Conventional technology] Conventionally, surface polishing! Semiconductor sea urchin by 1iZt!・When polishing one side of a workpiece such as a grinder or glass urchin:
As shown in Fig. F46, a pad 2 made of polyurethane or the like is pasted on the work mounting surface of the pressure do 1, and the work 3 is brought into close contact with this pad 2, or the pad 2 is
The workpiece was directly pressed against the surface plate 4 by applying pressure 3 to the workpiece mounting surface of the rad 1 without pasting it.

However, in this method of directly pressing the workpiece 3 onto the surface plate 4 with the pressure rod 1, the flatness of the work mounting surface of the pressure rod 1 and the back of the workpiece must be precisely uniform. If their flatness is 5, the zero surface pressure will not be uniform at each contact point between the workpiece 3 and the pressure hent 1, making it impossible to polish uniformly, which will have a negative impact on machining accuracy. .

This also applies when foreign matter such as dust is present between the pressurizing rod 1 and the workpiece 3.

In addition, since the pressure head 1 and the workpiece 3 are in contact with each other,
The work easily got dirty and scratched.

[Point m to be solved by the invention] The m aspect of the present invention is to provide a surface polishing device that can compress a workpiece to a uniform surface without causing scratches on the workpiece. It is about providing.

[Means for Solving the Problems] In order to solve the above-mentioned problems, one aspect of the present invention is to polish a workpiece by pressing it against a rotating surface plate using a pressure head, in which the pressure head and the workpiece are polished. This is characterized in that a pressure fluid is interposed as a pressurizing medium in between.

[Operation] The workpiece is pressed against the surface plate by the pressure head via pressure fluid, and the workpiece is processed. At this time, the pressurizing force from the pressure fluid acts equally on the back surface of the workpiece regardless of the flatness of the workpiece mounting surface of the pressurizing head and the backside of the workpiece, so the surface pressure on the workpiece becomes uniform, and the workpiece It will be finished with high flatness.

In addition, since the workpiece comes into direct contact with the pressure head through the pressure fluid, it is less likely to get dirty or scratched.

[Example] Hereinafter, an example of the present invention will be described in detail based on the drawings.

In FIG. 1, the reference numeral 10 indicates a rotatable surface plate, and the reference numeral 11 indicates a pressure head that presses a workpiece 121 against the surface plate.

The surface plate 10 is connected to a drive source such as a motor via a drive shaft (not shown), and the pressurizing rod 11 is attached to a cylinder (not shown) so as to be able to move up and down, and by the acting force of the cylinder, The workpiece 12 is pressed against the surface plate 10 via a pressure fluid as a pressurizing medium, and specifically, it is configured as follows.

That is, as shown in detail in FIGS. 2 and 3, a supply port 14 for supplying pressure fluid such as air or liquid is provided at the center of the lower surface of the pressure head 11, and The supply port! An annular groove 15 is formed to surround the work holder 1 made of synthetic resin.
B is displaceably mounted by a diaphragm 17, and a sealing member 18 with a slit 19 in the center is mounted on a stepped portion 16a formed on the inside of the lower surface of the work holder 16 for mounting the workpiece. A plurality of suction holes 20 are opened in the slit 13.

The suction hole 20 is connected to the vacuum pump 2G via a through hole 23 in the work holder 16, a tube 24 housed in the pressurizing head 11, and a rotary joint 25, while the supply port 14 is Another tube 27 housed within the pressure head 11. It is connected to a pressure fluid source 28 via the rotary joint 25, and the pickpocket 7) 19 is connected to the pressure fluid source 28 through the suction hole 20 when processing or transporting the workpiece 12.
By suctioning the air inside, the workpiece 12 is suctioned and held by the pad 11 under pressure.

During machining of the 7-ri 12, pressure fluid is supplied and filled from the supply port 14 into the space 30 defined between the pressurizing hand 11 and the workpiece 12, so that the workpiece is removed via the pressure fluid. 2 is pressed against constant 6+o.

Surface polishing of the present invention having the above configuration? , the workpiece 12 fitted into the stepped portion lea of the workholder 16 is suctioned by the vacuum pump 26 through the suction hole 20 and held by the workpiece holder 1B, and rotates in that state at a constant m10. The polishing process is performed by pressing the At this time, the air MI30 between the pressure head +1 and the 7-way I2 is connected to the supply port 1 from the pressure fluid source 28.
Pressure fluid is supplied and filled through 4, and the 7-ri 12 is pressed against the surface plate 10 using this pressure fluid as a pressurizing medium. Therefore, the pressurizing force from the pressurized fluid acts uniformly on the back surface of the workpiece 12, regardless of the workpiece mounting surface of the door 11 and the flatness of the backside of the workpiece, and the surface pressure on the workpiece 12 is uniformly applied. Therefore, the workpiece 12 is finished with high flatness.

Moreover, since the work holder 16 is supported by the diaphragm 17 with a degree of freedom in the grass, even if the work 12 and the pressure head 11 are not exactly parallel, their errors are absorbed by the displacement of the work holder 18. Therefore, a biased pressing force is not applied to the workpiece 12, and due to the synergistic effect of this and pressurizing with the pressure fluid, the workpiece is pressed against the surface plate with a uniform pressing force.

In addition, since the workpiece 12 is adsorbed by the air chuck during processing as described above, the sealing effect of the sealing member 18 is improved, and not only does the leakage of the pressure fluid in the space 30 occur, but also the outer circumference of the workpiece Fluttering is prevented and machining accuracy is improved. Moreover, the above diaphragm 17
This prevents abrasive grains from entering into the space 30 or groove 15 during processing.

Furthermore, since the pressure head 1 and the back surface of the workpiece 12 are not in contact with each other, the back surface of the workpiece 12 is not soiled or scratched.

When the machining is completed, the supply of pressure fluid to the space 30 is stopped, and the workpiece 12 is released from the workpiece holder 18 and taken out.

In the above embodiment, the workpiece 12 is adsorbed by the air chuck even during machining, but depending on the shape of the workpiece and the trajectory of its movement, uniform flat surface machining may be possible even without the air chuck during machining. Accuracy is obtained.

To explain this with reference to FIGS. 4a and 53b and 53a and 53b, when the workpiece 12 is processed by the pressure head! 1 by 4th
When the trajectory shown in Figures a and b is taken, the workpiece 12 rotates and grinds while overhanging from a constant a+o, so it is necessary to hold the workpiece 12 by suction with an air chuck during machining. , when taking a trajectory as shown in FIG.
The workpiece is being processed! 2 is not required to be suctioned and held by the Rad 11 under pressure using an air chuck.

Effects of the Invention As described above, according to the present invention, a pressure fluid is interposed as a pressurizing medium between the pressure head and the workpiece, and the workpiece is pressed against the surface plate via this pressure fluid. , unlike the case where the workpiece is directly attached to the pressure head, the pressure force can be applied evenly to the back surface of the workpiece regardless of the flatness of the workpiece mounting surface of the pressure head or the back surface of the workpiece. Since the surface pressure is uniform, the workpiece can be finished with high flatness.

Furthermore, since the pressure head and the back surface of the workpiece are not in contact with each other, there is no risk of dirt or scratches on the back surface of the workpiece.

[Brief explanation of the drawing]

Fig. 1 is a sectional view of a main part of an embodiment of the present invention, Fig. 2 is a partially enlarged sectional view, Fig. 3 is a bottom view, and Figs. About rattle T
<' is a plan view and a partial plan view. FIGS. 5a and 5b are a plan view and a partial plan view showing other types of motion loci, and FIG. 6 is a partial sectional view of a conventional example. 10...Surface plate, 11...Pressure header. 12. Work. Patent applicant Speedfam Co., Ltd. Figure 1, Section 6, Tobi Edict, Figure 4 (a) (b) Figure 5 (G) (b) Procedural formal document (spontaneous) January 14, 1982 Commissioner of the Japan Patent Office Black 1) Akio Tono 2, Name of the invention Surface polishing device 3, Relationship to the case of the person making the amendment Patent applicant address 4-30-3 Nishirokugo, Ota-ku, Tokyo Name
Speedfam Co., Ltd. Representative Director Hiroshi Ohara 4, Agent 160 Telephone (343) 875
5 Address: 1-9 Nishi-Shinjuku, Shinjuku-ku, Tokyo @ No. 12 (
1) Correct Figure 2 as shown in the attached sheet.

Claims (1)

[Claims] 1. A flat surface in which a workpiece is polished by being pressed against a rotating surface plate by a pressure head, characterized in that a pressure fluid is interposed as a pressure medium between the pressure head and the workpiece. Polishing equipment.