JPS6312379B2 - - Google Patents

Description

[Detailed Description of the Invention] In the diffusion treatment step in the semiconductor device manufacturing process, a thin silicon wafer is taken out from a wafer carrier jig (a jig made of Teflon or the like that accommodates 25 wafers), and more than 100 wafers are removed. The wafer is placed upright in the groove of a wafer processing table, guided into a heating furnace, subjected to desired processing, and the processed wafer is transferred to a wafer carrier jig outside the furnace. This process is repeated. The present invention thus relates to a wafer transfer apparatus used in the manufacture of thin plate-shaped articles, such as semiconductor devices.

Conventionally, the above-mentioned wafer transfer work has been carried out by suctioning the wafers one by one using a vacuum chuck or the like, or by transferring all 25 wafers in a wafer carrier jig at the same time. The former method is often used. However, much of the work was done manually by workers, and automation had not yet been achieved. In the method of transferring wafers one by one, the wafers are picked up by a vacuum chuck in a wafer carrier jig, transported to a wafer processing table, and placed in the groove of the wafer processing table. The suction force can cause cracks, scratches, etc. on the surface of the wafer, and it can cause defects such as contamination due to manual work by workers, increasing the manufacturing cost of semiconductor devices and causing serious problems such as lowering production yields. It was hot.

The present invention eliminates the above drawbacks, is highly versatile, and
The present invention provides a novel wafer transfer device that can reliably process a large number of wafers in a single hour and can improve the work efficiency of workers more than ever before.

In order to achieve such an object, the semiconductor wafer transfer apparatus of the present invention includes a transfer table having an array of gas jet holes for transferring the wafer forward and backward, and a transfer table arranged parallel to and adjacent to the transfer table. a wafer processing table with grooves of equal pitch;
A humbadong means that handles an upright wafer with two fingers and moves it between the transfer table and the wafer processing table, and moves the wafer processing table by the groove pitch, and moves the wafer from the horizontal dead center to approximately 90 degrees upward. The wafer mounting plate moves back and forth between the
The present invention is characterized by comprising a wafer posture changing means that transfers the wafer to a wafer processing table using a handling means when it is in an upright state, and places it on a transfer table and transfers it when it is in a horizontal state.

DESCRIPTION OF THE PREFERRED EMBODIMENTS A wafer transfer apparatus according to an embodiment of the present invention will be described in detail below with reference to the drawings.

FIG. 1 is an overall perspective view of a wafer transfer apparatus which is an embodiment of the present invention. As shown in the figure, this device is roughly divided into a plurality of wafer carrier jigs 1a, 1b, (1) for storing wafers.
c and 1d are a wafer carrier jig transfer/exchange means 2 for transferring and exchanging wafers (see FIG. The wafer is placed horizontally on a wafer transfer means 4 that can be stored inside or discharged and transferred to the outside, and a transfer device 5 for horizontally reciprocating the wafer.
wafer posture changing means 6 for making the wafer stand upright at 90°;
It is composed of a wafer processing table 7 arranged parallel to and adjacent to the transfer device 5, and a handling means 8 for handling the lower side surface of the wafer to the wafer attitude changing means 6 and transferring the wafer. The wafer carrier jig transfer/exchange means 2 are wafer carrier jigs 1a, 1b, 1c, and 1d (1c is shown in FIG. 2a).
lift pieces 9a, 9b, 9 for placing the
c, 9d, 9e (see FIG. 2a for 9b to 9e), a wafer carrier jig transfer table 10, and a discharge cylinder 11 for the wafer carrier jig. The wafer transfer means 4 includes a main body member 1 that reciprocates horizontally.
2. It has a fork body 14 which is cantilever-supported by a vertically moving shaft 13 disposed on the member 12 and has a recessed portion for placing a wafer. The transfer device 5 includes elongated plate-shaped transfer tables 15a, 15b made of Teflon or the like to transfer the wafer by fluid levitation, guide side plates 16a, 16b, and end support columns 17a, 17b, 1 on the side surfaces of the transfer tables 15a, 15b, respectively.
The transport tables 15a and 15b are supported by rails 7c and 17d (see FIG. 5 for 17c and 17d) and are elevated. The support columns 17a to 17d are fixed to the substrate 18. Wafer processing table 7
has a narrow groove (not shown) as thick as the wafer 23, is processed so that the wafer 23 stands upright, and is placed on positioning blocks 24a and 24b. 25 and 26 are detection devices for detecting the presence or absence of the wafer 23 placed on the wafer processing table. The handling means 8 is connected to the transfer device 5, the wafer processing table 7, and the arrow
A cylinder 19 that reciprocates between BB', a cylinder 20 supported at the end of the cylinder 19 that moves up and down between arrows CC' and DD', and fingers 21a and 21b for handling wafers (21b is shown in FIG. 7). (see a)) and a cylinder 22 for opening and closing.

28a, 28b, 28c, 28d are a group of switches attached to the operation control section 27; 29 is a group of switches attached to the motor 1;
a digital switch 30 for presetting the amount of movement of the wafer posture converting means 6 and the handling means 8 driven by the wafer position converting means 6 and the handling means 8 to the distance between the grooves of the wafer processing table 7, that is, the pitch amount;
is a keyboard switch for presetting the number of wafers 23 on the wafer processing table 7 to be stored in each of the wafer carrier jigs 1a to 1d.
Reference numeral 31 denotes an operation control unit incorporating an operation control device (not shown). Reference numeral 32 denotes a built-in part containing parts such as valves for controlling each cylinder.

Next, the wafer transfer apparatus having such a configuration will be explained in more detail. FIG. 2a is a plan view of the carrier jig transfer and exchange means 2 and the elevator section which functions as a part of the transfer and exchange means. 2B is a sectional view taken along the line AA in FIG. 2A, and FIG. 2C is a perspective view of the elevator section 3. In FIG. 2a, wafer carrier jigs 1a, 1b, 1c are placed on lift pieces 9a, 9b, 9c, 9d,
The wafer carrier jig 1d is shown transferred to the elevator section 3. Reference numeral 11c is an ejecting piece of a wafer carrier jig made of Teflon or the like and attached to the shaft 11b of the ejection cylinder 11a which is driven by fluid pressure (not shown) and reciprocates in the direction of arrow EE'. The embankments 33a and 33b are attached to the wafer carrier jig transfer table 10,
It is provided to guide the carrier jig projected by the piece 11c. Reference numeral 34 denotes a motor attached to the ejection belt 35 of the wafer carrier jig for reciprocating ejection pins 37a and 37b disposed within the long windows 36a and 36b of the transfer table 10 in the direction of arrow FF'. The wafer carrier jig, which has been ejected in the direction of arrow F' while being engaged with the ejection pins 37a and 37b, is further transferred in the direction of arrow E' by the piece 11c.

In FIG. 2b, the aforementioned lift pieces 9a, 9
b, 9c, 9d, 9e are slope portions 9a-1, 9b-
1,9b-2,9c-1,9c-2,9d-1,
9d-2 and 9e-1, and position the wafer carrier jigs 1a, 1b, 1c, and 1d. The piece 9
a, 9b, 9c, 9d are pillars 38a, 3, respectively.
It is attached to the plate 39 via 8b, 38c, 38d, and 38e.

A column 41 is fixed to the base 40, a bracket 42 is provided at the upper end of the column 41, a cylinder 43 and guide shafts 44a, 44b are provided on the bracket 42, and the upper ends of the guide shafts 44a, 44b are provided with a cylinder 43 and guide shafts 44a, 44b. The plate 39 is fixed using nuts 45a and 45b. Arrow GG' indicates the reciprocating vertical movement of the cylinder 43, and a micro switch 46 is provided at the top dead center and a micro switch 47 is provided at the bottom dead center. Micro-switches 48a, 48b, 48c, which operate at the top dead center and detect the presence or absence of the wafer carrier jigs 1a, 1b, 1c, 1d.
48d is arranged on the plate 39.

Next, the transfer operation of the wafer carrier jig performed by the horizontal reciprocating movement of the wafer carrier jig transfer table 10 in the direction of arrow AA' and the vertical reciprocating movement of the cylinder 43 will be explained. The pieces 9a to 9d are brought into contact with the slope portions 9a-1 to 9d-1 at position P1,
Wafer carrier jig 1a positioned at P2P3,
1b and 1c are the carrier jig transfer tables 10;
moves in the direction of arrow A' → lowers the pieces 9a to 9e → moves the table 10 in the direction of arrow A → pieces 9a to 9
The wafer carrier jigs 1a to 1c are moved to positions P2, P3, and P4, respectively, by the sequence of lifting e and placing the wafer carrier jigs 1a to 1c on the pieces 9d to 9e.

Figure 2c shows wafer carrier jig transfer and exchange means 2.
FIG. 2 is a perspective view showing the elevator section 3 having the function of forming the part shown in FIG. The wafer carrier jig 1d placed on the pieces 9d and 9e at the position P4 is configured to be able to rotate forward and backward between the state and the position P4 as shown in the figure by driving a motor 50 attached to the rotation support member 49a. has been done. That is, the shaft of the motor 50 (as shown)
and a bearing 51 disposed on the swing support member 49b.
A substantially L-shaped wafer carrier jig platform 53, which is integral with a shaft 52 which is loosely fitted in the wafer carrier jig, is supported by the swing support members 49a and 49b, and its posture is changed by forward and reverse rotation of the motor. The rotation support members 49a and 49b are provided with a motor 54, a pulley 55,
56, a belt 57, a feed screw 58, etc., it is integrated with a vertically moving member 59 that reciprocates vertically in the direction of arrow JJ'. Wafer carrier jig 1
When d is returned to position P4 by the reverse rotation of the wafer carrier jig platform 53, pieces 9d and 9e
is lowered by the cylinder 43, and the carrier jig 1d (same as the wafer carrier jig present on the pieces 9a to 9c) is placed on the wafer carrier jig transfer table 10, and then only the wafer carrier jig 1d is placed on the wafer carrier jig transfer table 10. The wafer carrier jig is engaged with ejection pins 37a and 37b and transferred in the direction of arrow F'.

FIG. 3 is a front view of essential parts of a transfer means for storing the wafer in the wafer carrier jig or ejecting and transferring the wafer to the outside of the wafer carrier jig. 60a,
60b is a main body member that is integrated with a screw (not shown), and 61a and 61b are main body members 60.
A roller 63, which is disposed on the main body member 60b and rolls on a horizontal guide shaft 62, has one end fixed to the main body member 60b with a screw (not shown), and the other end fixed to an L-shaped connecting fitting 64 with a pin 65. connecting rod, 66
69 is a cylinder whose one end is arranged to be swingable by a pin 68 of a support block 67; 69 is a cylinder shaft fixed to the L-shaped connecting fitting 64 by a pin 70; and the main body members 60a, 60b. has a shaft 71 that is driven in the vertical direction by fluid pressure (not shown), is attached to the upper end of the shaft 71 with a screw 72, and has a recess 73 for placing a wafer.
A fork body 73 having a shape is supported in a cantilever manner. 74 is a photoelectric detector for detecting the presence or absence of a wafer; the photoelectric detector 74 is attached to the lower part of the fork body 73;
5a, and detects the wafer 23 in the wafer carrier jig 1d. A lamp 76 detects a wafer (not shown) on the transfer tables 15a, 15b, and a beam (not shown) of the lamp 76 detects a wafer (not shown) on the transfer table 15a, 15b when the fork body 73 is transferred onto the transfer table 15a, 15b by the cylinder 66. In this state, the light is received by the photoelectric detector 74. Reference numeral 77 denotes a mounting plate for mounting the holders 78a and 78b of the lamps 75 and 76, and the mounting plate 77 is disposed above the transport tables 15a and 15b.
7c and 17d (see Figure 5).

The wafer in the wafer carrier jig 1d is discharged and transferred onto the transfer table as follows. When the fork body 73 enters the wafer carrier jig 1d, the wafer carrier jig 1d on the wafer carrier jig platform 53 in FIG. The wafer 23 is placed on. The wafer 23 placed in the recess 73a of the fork body 73 is transferred to the wafer transfer table 15, which is a transfer device using fluid levitation or the like, by means of a cylinder 66.
a, 15b (details will be described later), the shafts 71 of the main body members 60a, 60b are lowered by fluid pressure (not shown), and the main body members 60a, 60b are placed on the transport tables 15a, 15b. . The same procedure is repeated below, and when the wafer in the wafer carrier jig 1d is discharged and transferred to the outside of the wafer carrier jig,
The process is performed sequentially starting from the bottom layer of the wafer.

The wafers on the transfer tables 15a, 15b are stored in the wafer carrier jig as follows. The shafts 71 of the main body members 60a and 60b are raised by fluid pressure (not shown), and the wafer is placed in the recess 73a of the fork body 73, and then the fork body 73 is moved by the cylinder 66 to the wafer carrier jig. Enter the desired position within 1d. Next, the wafer carrier jig 1d is raised by driving the motor 54 or the like until the wafer is placed in a groove (not shown) for placing the wafer in the wafer carrier jig 1d. Similarly, when wafers are stored in the wafer carrier jig, the process is performed sequentially starting from the top layer.

4a and 4b show an embodiment of a transfer device capable of horizontally reciprocating a wafer, in which elongated plate-shaped transfer tables 15a and 15b made of Teflon or the like are arranged parallel and horizontally, and each table 15a, 15
A guide side plate 16 made of Teflon or the like is provided on the side of b.
a and 16b, and is configured to accommodate changes in wafer size. Note that the guide side plate 16
The inner distance W between a and 16b is set to be 1 to 3 mm wider than the diameter d of the wafer 23. The transfer table 15a has a first fluid injection hole array 151a formed from the lower surface of the wafer in the forward transfer direction +X and inward (the jet flow is in the _direction of arrow -X and inwardly formed second fluid jet hole row 152a (jet flow is indicated by arrow -X ₁
The transfer table 15b has a first fluid injection hole array 15 formed from the lower surface of the wafer in the positive transfer direction +X and inward.
2a (the jet flow is in the _two directions of arrow X), and a second
The fluid injection hole array 152b (jet flow is in the direction of arrow -X ₂ ) is provided.

FIG. 4b shows a cross-sectional view of FIG. 4a. The hollow portions 79 inside the transfer tables 15a, 15b do not have the function of floating the wafer 23. The splint plate 80 is an elongated member that includes a groove 81 for communicating the injection hole row 151a, a passage 83 that conducts with the switching valve 82 and is connected to the groove 81, and the injection hole row 152a.
It communicates with a groove 84 and a switching valve 85 to form a passage 86. The splint plate 87 is an elongated member that communicates with a groove 88 for communicating the injection hole row 152b, a switching valve 89, and a groove 91 for communicating the passage 90 connected to the groove 88 and the injection hole row 151b, and a switching valve. communicates with the valve 92;
A passage 93 etc. are formed. Note that the transport table 15a, the plate 80, and the transport table 15b
and splice plate 87 are fixed by respective screws (not shown).

FIG. 5 is a perspective view of the wafer transfer device and the wafer attitude changing means. Transport table 15a, 1
Wafer 2 is transported by arrow 5b in the +X direction.
3 is the stop that comes into contact with a stop surface 95a forming an R surface of a stop member 95 made of Teflon or the like attached to a rotating member 94 disposed in a space 79 between the transport tables 15a and 15b. Part 9
5 is provided with a detector (not shown) for detecting the presence or absence of a wafer, and detects when the wafer 23 has reached the stop member 95. As shown in FIG.
The stop member 95 and the wafer mounting plate 99 made of Teflon or the like are mounted on a rotating bracket 98 mounted on the movable table 96 with the shaft 100 of the rotating bracket 98 as the pivot axis. Gears 102, 103 by 101
The wafer mounting plate 99 can be reciprocated (arrow KK') from the horizontal dead center to approximately 90° upward from the dead center. The moving table 96 is configured to rotate a feed screw 105 in the forward and reverse directions by a pulse motor, and to move forward and backward in the longitudinal direction by a constant pitch, that is, by the groove pitch of the wafer processing table 7, so that positioning can be performed.

FIG. 6 is a side view of the wafer posture changing means, showing a state in which the wafer placement plate 99 has a wafer 23 placed on it and has been pivoted upward from the horizontal dead center to approximately 90 degrees to the dead center. A micro switch 106 and a stopper screw 107 are disposed at the 90° dead center, and the micro switch 106 is operated by an L-shaped operating plate 108. The wafer 23 is pressed against the wafer mounting plate 99 by a jet stream 111 of clean air 110 connected to the nozzle 109, and is maintained in an upright position at approximately 90 degrees. A micro switch 11 is installed at the horizontal dead center.
2 and a stopper screw 113 are provided, and the micro switch 112 is actuated by the rotating member.

FIG. 7a is a front view of the wafer chuck mechanism forming a part of the handling means. cylinder 2
2 housings 120a, 120b are plate 1
21 to the chuck mechanism main body 122 by a screw (not shown). Furthermore, a rack 124 is formed at the tip of the rod 123 of the cylinder 22, and this rod 123 is attached to the housing 120.
vertical movement (arrow LL') due to the pressure of the fluid 126 connected to the hose connection port 125 attached to a.
do. A stopper screw 1 of the upper end stroke of the rod 123 is provided at the end of the housing 120b.
27 is provided and fixed with a lock nut 127a. Two small gears 128a, 128b, which engage with the rack 124 in a pinching manner, are fixed to their respective central shafts 129a, 129b, and the fingers 21a, 21b are rotated as shown by arrows M _L and M _R to rotate the fingers 21a, 21b. The fingers 21a and 21b have pieces 130 and 131 made of Teflon or the like that have substantially concave shapes 130a and 131a formed on the inside of their tips, and are placed upright in the groove 7a of the wafer processing table 7. It is configured to handle the lower side surface of the outer periphery of the wafer 23 placed thereon.

FIG. 7b shows the cross section NN of FIG. 7a. The interior of the housings 120a, 120b is divided into two chambers 133, 134 by a diaphragm 132 supporting the rod 123 of the cylinder, one chamber 133 communicating with the opening of the hose connection port 125, and the other chamber 134 communicating with the opening of the hose connection port 125. It communicates with an atmospheric opening 135, and a spring 136 is disposed therein. The center of the diaphragm is held between retainers 137 and 138, and a nut 139 is attached to the end of the rod 123 of the cylinder.
Moreover, the rod 123 of the cylinder is statically engaged with bearings 140, 141 disposed in the housing 120a, and is moved up and down and reciprocated by the pressure of the spring 136 and the fluid 126. A gas discharge port 142 is provided in the chuck mechanism main body 122 so that the surface of the wafer 23 can be cleaned with a gas 143 such as clean air.

As mentioned above, the wafer transfer device of the present invention has been described for semiconductor wafers, but it is not limited to this and can be applied to other wafers (thin plate-shaped articles), and is versatile and can be used in many applications. It is possible to realize a wafer transfer device that can reliably transfer 100 wafers in a single hour and can greatly improve the operating efficiency of the operator compared to the past.

[Brief explanation of the drawing]

The drawings show one embodiment of the present invention, and FIG. 1 is a perspective view of the entire wafer transfer device, and FIG. , Figure 2b
2A is a cross-sectional view of FIG. 2A, FIG. 2C is a perspective view of the elevator section, and FIG. 3 is a wafer transfer means for storing the wafer in the wafer carrier jig or ejecting and transferring the wafer to the outside of the wafer carrier jig. FIG. 4a is a partial plan view of a transfer device capable of horizontally transferring a wafer, FIG. 4b is a sectional view of FIG. 4a,
5 is a perspective view of a wafer transport device on which a wafer attitude changing means is mounted, FIG. 6 is a side view of the wafer attitude changing means, FIG. 7a is a front view of a wafer chuck mechanism forming a part of the handling means, FIG. 7b is a sectional view taken along line N--N in FIG. 7a. 1a, 1b, 1c, 1d... wafer carrier jig, 2... wafer carrier jig transfer exchange section, 3
...Elevator section, 4...Wafer transfer means, 5...
...Transfer device, 6...Wafer posture changing means, 7...
Wafer processing table, 8...handling means, 2
3...Wafer.

Claims (1)

[Claims] 1. A wafer transfer device that levitates and feeds a wafer using a gas jet, which has first and second gas jet hole arrays, changes the transfer direction by switching the flow path, and can be used in forward and reverse directions. A transfer table formed to allow transfer; a wafer processing table disposed parallel to and adjacent to the transfer table and having equally pitched grooves; a handling means for handling a lower side surface of an upright wafer using two fingers having pieces formed thereon, and for moving between the transfer table and the wafer processing table; arranged,
The wafer processing table has a wafer placement plate that moves in groove pitch increments and reciprocates between a horizontal dead center and an upward dead center of about 90 degrees, and this wafer placement plate allows the wafer to be held in an upright position. A wafer transfer apparatus comprising: a wafer posture changing means for transferring the wafer to the wafer processing table using the handling means, and for transferring the wafer by placing it on the transfer table in a horizontal state.