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JPS63128733U - - Google Patents

Info

Publication number
JPS63128733U
JPS63128733U JP2163787U JP2163787U JPS63128733U JP S63128733 U JPS63128733 U JP S63128733U JP 2163787 U JP2163787 U JP 2163787U JP 2163787 U JP2163787 U JP 2163787U JP S63128733 U JPS63128733 U JP S63128733U
Authority
JP
Japan
Prior art keywords
wafer
wafers
counting
imaging
image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2163787U
Other languages
Japanese (ja)
Other versions
JPH0631721Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987021637U priority Critical patent/JPH0631721Y2/en
Publication of JPS63128733U publication Critical patent/JPS63128733U/ja
Application granted granted Critical
Publication of JPH0631721Y2 publication Critical patent/JPH0631721Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Length Measuring Devices By Optical Means (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Controlling Sheets Or Webs (AREA)
  • Image Processing (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本考案の実施例を示し、第１図は概略斜
視図、第２図は制御盤の概略構成図、第３図は処
理手順を示すフロー図であり、第４図Ａは撮像手
段で映像化された映像、第４図Ｂは二値化処理さ
れた映像、第４図Ｃは読出し信号をそれぞれ示す
示す図である。 ２……収納容器、５……撮像手段（イメージセ
ンサカメラ）、９……記憶手段、１０……二値化
手段、１１……計数手段、Ｗ……薄板状基板。 The drawings show an embodiment of the present invention; FIG. 1 is a schematic perspective view, FIG. 2 is a schematic configuration diagram of the control panel, FIG. FIG. 4B shows a visualized video, FIG. 4B shows a binarized video, and FIG. 4C shows a readout signal. 2... Storage container, 5... Imaging means (image sensor camera), 9... Storage means, 10... Binarization means, 11... Counting means, W... Thin plate-shaped substrate.

Claims (1)

【実用新案登録請求の範囲】 １ 収納容器内に収納されている複数枚のウエハ
を映像化し画像信号に変換する撮像手段と、画像
信号を適宜しきい値レベルと比較しウエハの端部
と主平面部に二値化する二値化手段と、二値化手
段によつて形成された二値化信号によりウエハ枚
数を計数する計数手段とからなるウエハの枚数読
取り装置。 ２ 撮像手段は、画像を二次元で映像化して画像
信号に変換処理するように構成され、計数手段は
、ウエハの配列方向に対して定められる少なくと
も一つの方向で二値化信号を読出してウエハ枚数
を計数するように構成されている実用新案登録請
求の範囲第１項に記載したウエハの枚数読取り装
置。[Claims for Utility Model Registration] 1. Imaging means for imaging a plurality of wafers stored in a storage container and converting them into image signals; A wafer number reading device comprising a binarization means for binarizing a plane part, and a counting means for counting the number of wafers based on a binarized signal formed by the binarization means. 2. The imaging means is configured to visualize the image two-dimensionally and convert it into an image signal, and the counting means reads out the binarized signal in at least one direction determined with respect to the wafer arrangement direction and displays the wafer. A wafer number reading device according to claim 1, which is configured to count the number of wafers.
JP1987021637U 1987-02-16 1987-02-16 Wafer number reading device Expired - Lifetime JPH0631721Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987021637U JPH0631721Y2 (en) 1987-02-16 1987-02-16 Wafer number reading device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987021637U JPH0631721Y2 (en) 1987-02-16 1987-02-16 Wafer number reading device

Publications (2)

Publication Number Publication Date
JPS63128733U true JPS63128733U (en) 1988-08-23
JPH0631721Y2 JPH0631721Y2 (en) 1994-08-22

Family

ID=30818259

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987021637U Expired - Lifetime JPH0631721Y2 (en) 1987-02-16 1987-02-16 Wafer number reading device

Country Status (1)

Country Link
JP (1) JPH0631721Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009032829A (en) * 2007-07-25 2009-02-12 Dainippon Screen Mfg Co Ltd Substrate detection device and substrate processing apparatus
JP2009270984A (en) * 2008-05-09 2009-11-19 Fujitsu Ltd Position detecting device, position detecting program, and position detecting method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7119970B2 (en) * 2018-12-12 2022-08-17 トヨタ自動車株式会社 POSITION DETECTION METHOD AND POSITION DETECTION DEVICE

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61286708A (en) * 1985-06-12 1986-12-17 Hokuyo Automatic Co Measuring device for measuring number of laminated plate materials

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61286708A (en) * 1985-06-12 1986-12-17 Hokuyo Automatic Co Measuring device for measuring number of laminated plate materials

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009032829A (en) * 2007-07-25 2009-02-12 Dainippon Screen Mfg Co Ltd Substrate detection device and substrate processing apparatus
JP2009270984A (en) * 2008-05-09 2009-11-19 Fujitsu Ltd Position detecting device, position detecting program, and position detecting method

Also Published As

Publication number Publication date
JPH0631721Y2 (en) 1994-08-22

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