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JPS63127130U - - Google Patents

Info

Publication number
JPS63127130U
JPS63127130U JP1969087U JP1969087U JPS63127130U JP S63127130 U JPS63127130 U JP S63127130U JP 1969087 U JP1969087 U JP 1969087U JP 1969087 U JP1969087 U JP 1969087U JP S63127130 U JPS63127130 U JP S63127130U
Authority
JP
Japan
Prior art keywords
conductive adhesive
drying
lead frame
stem
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1969087U
Other languages
English (en)
Other versions
JPH0635469Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987019690U priority Critical patent/JPH0635469Y2/ja
Publication of JPS63127130U publication Critical patent/JPS63127130U/ja
Application granted granted Critical
Publication of JPH0635469Y2 publication Critical patent/JPH0635469Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は、本考案の１実施例の断面図、第２図
は、実施例２の断面図、第３図は、従来の導電性
接着剤乾燥装置概略図、第４図は従来の乾燥方法
のリードフレーム状態図である。 １……リードフレーム、２……半導体素子、３
……電極、４……リードフレームアイランド、５
……導電性接着剤、６……有害ガス、７……リー
ドフレーム保持部、８……熱照射器、９……温度
調節器、１０……ガス排気部、１１……密閉カバ
ー、１２……熱風発生器、１３……装置本体、１
４……装置ドアー、１５……マガジンケース、１
６……トレー、１７……ステム。

Claims (1)

  1. 【実用新案登録請求の範囲】 導電性接着剤塗布及び半導体素子搭載後のリー
    ドフレームやステムを上下半転させた状態で保持
    する機構、 導電性接着剤を乾燥、固化させる為の局部加熱
    機構、および 導電性接着剤乾燥、固化時に発生する有害ガス
    を吸引し、装置外部に排気する機構を有する導電
    性接着剤乾燥装置。
JP1987019690U 1987-02-12 1987-02-12 導電性接着剤乾燥装置 Expired - Lifetime JPH0635469Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987019690U JPH0635469Y2 (ja) 1987-02-12 1987-02-12 導電性接着剤乾燥装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987019690U JPH0635469Y2 (ja) 1987-02-12 1987-02-12 導電性接着剤乾燥装置

Publications (2)

Publication Number Publication Date
JPS63127130U true JPS63127130U (ja) 1988-08-19
JPH0635469Y2 JPH0635469Y2 (ja) 1994-09-14

Family

ID=30814515

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987019690U Expired - Lifetime JPH0635469Y2 (ja) 1987-02-12 1987-02-12 導電性接着剤乾燥装置

Country Status (1)

Country Link
JP (1) JPH0635469Y2 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54113252A (en) * 1978-02-24 1979-09-04 Hitachi Ltd Pellet bonding unit
JPS57109344A (en) * 1980-12-26 1982-07-07 Hitachi Ltd Manufacture and its apparatus for semiconductor device
JPS57138335U (ja) * 1981-02-23 1982-08-30

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54113252A (en) * 1978-02-24 1979-09-04 Hitachi Ltd Pellet bonding unit
JPS57109344A (en) * 1980-12-26 1982-07-07 Hitachi Ltd Manufacture and its apparatus for semiconductor device
JPS57138335U (ja) * 1981-02-23 1982-08-30

Also Published As

Publication number Publication date
JPH0635469Y2 (ja) 1994-09-14

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