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JPS6278751U - - Google Patents

Info

Publication number
JPS6278751U
JPS6278751U JP17052585U JP17052585U JPS6278751U JP S6278751 U JPS6278751 U JP S6278751U JP 17052585 U JP17052585 U JP 17052585U JP 17052585 U JP17052585 U JP 17052585U JP S6278751 U JPS6278751 U JP S6278751U
Authority
JP
Japan
Prior art keywords
wire bonding
insulating plate
bonding part
circuit board
back side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17052585U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17052585U priority Critical patent/JPS6278751U/ja
Publication of JPS6278751U publication Critical patent/JPS6278751U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
図面はこの考案の１実施例を示し、第１図は第
２図のＡ―Ａ線における断面図、第２図は平面図
、第３図は封止樹脂を形成する前の状態の平面図
である。 回路板……１、ＩＣワイヤーボンデイング部…
…７、絶縁板……８。

Claims (1)

    【実用新案登録請求の範囲】
  1. 導電性金属によりパターン形成された回路板の
    ＩＣワイヤーボンデイング部の裏面に絶縁板を固
    着したことを特徴とする回路ブロツク。
JP17052585U 1985-11-06 1985-11-06 Pending JPS6278751U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17052585U JPS6278751U (ja) 1985-11-06 1985-11-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17052585U JPS6278751U (ja) 1985-11-06 1985-11-06

Publications (1)

Publication Number Publication Date
JPS6278751U true JPS6278751U (ja) 1987-05-20

Family

ID=31105334

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17052585U Pending JPS6278751U (ja) 1985-11-06 1985-11-06

Country Status (1)

Country Link
JP (1) JPS6278751U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04277636A (ja) * 1991-03-05 1992-10-02 Shinko Electric Ind Co Ltd 半導体装置とその製造方法及びこれに用いる接合体

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57192042A (en) * 1981-05-21 1982-11-26 Stanley Electric Co Ltd Fixing method for semiconductor element
JPS58161352A (ja) * 1982-03-19 1983-09-24 Yamagata Nippon Denki Kk 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57192042A (en) * 1981-05-21 1982-11-26 Stanley Electric Co Ltd Fixing method for semiconductor element
JPS58161352A (ja) * 1982-03-19 1983-09-24 Yamagata Nippon Denki Kk 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04277636A (ja) * 1991-03-05 1992-10-02 Shinko Electric Ind Co Ltd 半導体装置とその製造方法及びこれに用いる接合体

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