JPS6276575A - Mis type light emitting element - Google Patents
Mis type light emitting elementInfo
- Publication number
- JPS6276575A JPS6276575A JP60214558A JP21455885A JPS6276575A JP S6276575 A JPS6276575 A JP S6276575A JP 60214558 A JP60214558 A JP 60214558A JP 21455885 A JP21455885 A JP 21455885A JP S6276575 A JPS6276575 A JP S6276575A
- Authority
- JP
- Japan
- Prior art keywords
- film
- light emitting
- addition polymerization
- type light
- polymerization polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920000642 polymer Polymers 0.000 claims abstract description 17
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract description 8
- 239000010408 film Substances 0.000 claims description 37
- 239000004065 semiconductor Substances 0.000 claims description 12
- 239000012212 insulator Substances 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 12
- 238000012644 addition polymerization Methods 0.000 abstract description 7
- 239000000126 substance Substances 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- 238000007259 addition reaction Methods 0.000 abstract description 2
- 239000008346 aqueous phase Substances 0.000 abstract description 2
- 239000012298 atmosphere Substances 0.000 abstract description 2
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 abstract description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 abstract description 2
- 239000011261 inert gas Substances 0.000 abstract description 2
- 150000003839 salts Chemical class 0.000 abstract description 2
- 238000001704 evaporation Methods 0.000 abstract 1
- 239000012071 phase Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 9
- 235000021355 Stearic acid Nutrition 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 4
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 4
- 239000008117 stearic acid Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 3
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical class N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 235000021357 Behenic acid Nutrition 0.000 description 1
- -1 GaASP is used Substances 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 229940116226 behenic acid Drugs 0.000 description 1
- 150000001661 cadmium Chemical class 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- AFSIMBWBBOJPJG-UHFFFAOYSA-N ethenyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OC=C AFSIMBWBBOJPJG-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 229920003227 poly(N-vinyl carbazole) Polymers 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 230000007847 structural defect Effects 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/0004—Devices characterised by their operation
- H01L33/0037—Devices characterised by their operation having a MIS barrier layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Abstract
Description
【発明の詳細な説明】
(発明の技(イi分野)
本発明は、金属(M)/′絶縁体(+ ) −’半導体
(S)接合構造を有するMfS型発光発光素子り、特に
絶縁体として有機簿膜を用いたM I S型発光素子に
関する。Detailed Description of the Invention (Techniques of the Invention (Field ii)) The present invention relates to an MfS type light emitting device having a metal (M)/'insulator (+)-'semiconductor (S) junction structure, particularly an insulating The present invention relates to an MIS type light emitting device using an organic film as a body.
〔発明の技((i的背日とその問題点)電気発光素子、
とりわけ可視発光ダイオード(LED)は、あらゆる分
野においてu1能表示素子として多用されている。最近
では、プリンタ。[Techniques of invention ((i) backstory and its problems) Electroluminescent device,
In particular, visible light emitting diodes (LEDs) are widely used as U1 display elements in all fields. Recently, printers.
ミニファックスなどへの応用も検討されており、その普
及度は今後益々増大する傾向にある。Applications such as mini-fax machines are also being considered, and their popularity is likely to increase in the future.
現在、赤色、黄色、緑色等のLEDは、半導体基板とし
てGaP、GaAs、AffiGaAs。Currently, red, yellow, green, etc. LEDs use GaP, GaAs, AffiGaAs as semiconductor substrates.
GaASPなどの■−V族化合物半導体が使用され、こ
の基板に例えばZn、○、Nのような不純物を適宜添加
してpr+接合を形成して、このpn接合界面にあける
再結合発光を利用している。これらのLEDでは、発光
効率0.2〜数%という高い(直が1qられでいる。A ■-V group compound semiconductor such as GaASP is used, and impurities such as Zn, ○, and N are appropriately added to this substrate to form a pr+ junction, and the recombination light emission created at the pn junction interface is utilized. ing. These LEDs have a high luminous efficiency of 0.2 to several percent (direction is less than 1q).
一方、青色のLED基板としては、禁制帯幅の大きい3
i C,ZnS、 Zn5cなどの化合物半導体が用
いられる。しかしながら、SiCでは良質の結晶を15
ることが回能であり、zns、Zn3cではρn接合を
形成することが困難である。On the other hand, as a blue LED board, 3
Compound semiconductors such as iC, ZnS, and Zn5c are used. However, in SiC, high quality crystals are
It is difficult to form a ρn junction with Zns and Zn3c.
このため、これらについてはpn接合に代えて1〜11
3接合を構成することにより発光素子を1141戊する
試、7メが精力的に進められている。現状では未だこの
tvl l S型発光素子は、前述のρn接合型の赤色
、黄色等のLEDに比べてその発光効率が−3しく低く
、また安定性も著しく悪い。その理由の一つは、上記の
如き半導(4基板に、現在の81・IsIで用いられて
いるようなシリコン酸化膜のような優れた絶縁膜を形成
することが極めて困難であることにある。Therefore, for these, 1 to 11
Seven attempts are being made to create 1,141 light-emitting devices by configuring three junctions. At present, this tvl l S type light emitting element still has a luminous efficiency as low as -3 compared to the above-mentioned ρn junction type red, yellow, etc. LEDs, and is also extremely unstable. One of the reasons for this is that it is extremely difficult to form an excellent insulating film such as the silicon oxide film used in the current 81 IsI on the semiconductor (4) substrates mentioned above. be.
発光素子を〜IIS接合で構成する場合、中間の絶縁膜
には例えば次のような条件が必須となる。When a light emitting element is constructed with a ~IIS junction, the following conditions are essential for the intermediate insulating film, for example.
第1に、電子または正孔がトンネリングできる程度に膜
厚が薄くでき、しかち高精度の摸厚制罪ができること、
第2に、ピンホールなどの組織欠陥のない均質かつ均一
な厚みを有すること、第3に、絶縁膜と金属の界面ある
いは絶縁膜と半導体の界面に電子や正孔を捕獲するトラ
ップ準位が存在しないこと、第4に、発光に伴う発熱や
電圧印加による劣化がないこと、等である。First, the film thickness can be made thin enough to allow tunneling of electrons or holes, and high-precision sampling can be performed.
Second, it has a homogeneous and uniform thickness with no structural defects such as pinholes. Third, there is a trap level that traps electrons and holes at the interface between the insulating film and the metal or the interface between the insulating film and the semiconductor. Fourthly, there is no heat generation associated with light emission or deterioration due to voltage application.
この様な事情を考慮して、近年、各種半導体単板にラン
グミュア・ブロジエッ1〜法(以下、LB法)により有
機分子の累積摸を形成し、これを絶縁膜として利用する
試みがなされている。この方法により形成した摸(以下
、LB膜)は、用いる成膜分子を選ぶことにより、上記
M I S接合を(構成づる際の絶縁膜に要求される条
件をかなりの程度満足する可能性があるため、多くの関
心を集めている。Taking these circumstances into consideration, in recent years, attempts have been made to form cumulative imprints of organic molecules on various semiconductor single plates by the Langmuir-Blogier method (hereinafter referred to as the LB method) and use this as an insulating film. . The sample formed by this method (hereinafter referred to as LB film) has the possibility of satisfying the conditions required for an insulating film when forming the above-mentioned MIS junction (by selecting the film-forming molecules used). Because of this, it is attracting a lot of interest.
このLBIをMIS接合の絶縁膜として用いたMIS型
発光素子の事例は、2例知られている。There are two known examples of MIS type light emitting devices using this LBI as an insulating film for MIS junctions.
一つは、n型GaP基板にステアリン酵カドミウムのL
B Muを累積形成した発光素子である(スイン・ソ
リッド・フィルム(Thin SolidFilms
) 99.283頁(1984年))。脂肪酸は一般
に橢械的強度、熱的耐性が乏しく、また印加耐電圧は必
ずしも高くはないため、絶縁膜として満足すべきもので
はないが、しかしLB膜化が容易であり、膜厚もその分
子長(ステアリン酸の場合一層が約25人)レベルで制
御可能である。One is L of stearinic cadmium on an n-type GaP substrate.
It is a light-emitting element in which B Mu is cumulatively formed (Thin Solid Films).
) 99.283 pages (1984)). Fatty acids generally have poor mechanical strength and thermal resistance, and the applied withstand voltage is not necessarily high, so they are not satisfactory as insulating films. However, they are easy to form into LB films, and the film thickness depends on the molecular length. (more than about 25 in the case of stearic acid).
上記発光素子はこの脂肪酸のLB膜を用いたものであり
、その発光効率は膜厚の増大と共に上昇し、200〜2
50人の膜厚で極大となる。しかしながらこの発光素子
は特性が不安定であり、耐久性に乏しく、短時間の動作
で発光強度が大きく減衰してしまうという欠点がある。The above-mentioned light emitting device uses the LB film of this fatty acid, and its luminous efficiency increases as the film thickness increases, reaching 200 to 2
The film thickness reaches its maximum at 50 people. However, this light-emitting element has unstable characteristics, poor durability, and has drawbacks in that the luminous intensity is greatly attenuated after short-term operation.
らう一つの例は、n型GaP基板にフタロシアニン誘導
体のL B膜を累積形成してMIS型発光素子を構成し
たものである(エレクトロニクス・レターズ(E 1e
ctronics L etters) 20
。One example is a MIS type light emitting device constructed by cumulatively forming an LB film of a phthalocyanine derivative on an n-type GaP substrate (Electronics Letters (E 1e)).
ctronics L etters) 20
.
\0.12.489頁(1984年))、この素子にJ
5いては、L B K!の、すさ57人で発光効率が8
.6X10−3%と最大値を示す。この値はpn接合素
子と比肩しくりるものである。またこれは、1グざ40
人のシリコン醇化模をGaP基板上に形成した場合と同
等であり、MIS構造を有する注入型素子として十分間
化動作しくりる。LB膜として用いたフタロシアニンは
各種有機物質の中でも特異な熱的安定性を有している。\0.12.489 page (1984)), J
5 then L B K! The luminous efficiency is 8 with a height of 57 people.
.. The maximum value is 6X10-3%. This value is comparable to that of a pn junction element. Also, this is 40 pieces per piece.
This is equivalent to forming a human silicon molten model on a GaP substrate, and it operates quickly as an injection type device having an MIS structure. The phthalocyanine used as the LB film has unique thermal stability among various organic substances.
しかし1qられたMIS型発光素子は、ステアリン酸の
LB膜を用いたものより若干改善されているとはいえ、
その発光効率の経時変化、動1.′f性の不安定性が観
3111され、実用化のために1よなJ3多くの解決課
題がある。However, although the MIS type light emitting device developed by 1q is slightly improved over the one using the stearic acid LB film,
Changes in luminous efficiency over time; 1. The instability of the 'f property has been observed, and there are many problems to be solved for practical use.
以上のようなことから、トラップW位が少なく、経時安
定性にも浸れたMIS型発光素子の絶縁R’Aの開発が
強く要請されている。For the above reasons, there is a strong demand for the development of an insulation R'A for MIS type light emitting devices that has a small number of traps W and is stable over time.
本発明は上記した点に鑑みなされたもので、有機:4膜
を絶縁膜としてMIS接合を構成し、発光効率や特性の
安定性向上を図ったM I S型発光素子(2捉供する
ことを目的とする。The present invention has been made in view of the above-mentioned points, and is an MIS type light-emitting element (2-layer organic light-emitting element) in which an MIS junction is constructed using four organic films as insulating films, and the stability of luminous efficiency and characteristics is improved. purpose.
(発明の慨要)
本発明者等は、MIS型発光素子の絶縁膜としてのLB
膜、とりわけLB膜を形成し得る有機物質について鋭意
研究を重ねた結果、非局在系π電子を側鎖に有する付加
重合ポリマーを含有する右BM物質を用いると、(ワら
れた発光素子の発光効率、8特性の安定性および経時安
定性が顕著に改善されることを見出した。(Summary of the Invention) The present inventors have discovered that LB as an insulating film of a MIS type light emitting element.
As a result of extensive research into organic materials that can form films, especially LB films, we have found that when a BM material containing an addition polymer with delocalized π electrons in its side chain is used, It has been found that luminous efficiency, stability of eight characteristics, and stability over time are significantly improved.
即ら本発明は、fvl I S型発光素子の絶縁膜とし
て非局在系π電子を側鎖に有する付加重合ポリマーを含
む有機物質のl−B膜を用いることを1)徴とづる。That is, the present invention is characterized in that 1) an 1-B film of an organic material containing an addition polymer having delocalized π electrons in its side chain is used as an insulating film of an fvl IS type light emitting device;
ここで本光明で用いる付加重合ポリマ〜とは、炭素−炭
素不飽和結合が付加反応して生成するポリマーの総称で
あり、非局在系π電子を有する置換基を側鎖に持つもの
である。付加重合ポリマーがMIS構造の特性安定化に
寄与し、まI;非局在系π電子の存在が有機薄膜のイオ
ン化ポテンシャルを小さくして、〜4IS構造の金属側
から半導体への正孔注入効率を向上させ、もって発光効
率の向上に寄与するのである。The addition polymerization polymer used in this Komei is a general term for polymers produced by addition reactions of carbon-carbon unsaturated bonds, and polymers that have substituents with delocalized π electrons in their side chains. . The addition polymerization polymer contributes to stabilizing the characteristics of the MIS structure, and the presence of delocalized π electrons reduces the ionization potential of the organic thin film, increasing the hole injection efficiency from the metal side of the 4IS structure to the semiconductor. This contributes to an improvement in luminous efficiency.
ここで、非局在系π電子を有する買換基としては例えば
、以下に列挙げるようなものが挙げられる。Here, examples of the redeemable group having delocalized π electrons include those listed below.
「
H2
CI、 C=0
本ずl fll]tこおいて付+)[1層合ポリマーが
イれ自身としてIB膜化が困難な+A合、他の成腸分子
を併用することにより累積可能として使用することかて
゛さる。この様な曲の成り9分子としては例えば、ス丁
アリン配、アラキシン酸、ベヘン酸、ステアリン酸ビニ
ル等がある。これらの成膜分子のLB摸中にお(〕るυ
1合い(ユ、0〜70重M%にすることが好:1しく、
より好jニジ<は50重11%以下とする。``H2 CI, C = 0 flll]t +) [In cases where it is difficult to form an IB film as a single-layer polymer by itself, it can be accumulated by using other adult molecules in combination. Examples of the nine molecules that make up such a song include stearic acid, araxic acid, behenic acid, and vinyl stearate. 〕ruυ
1 go (yu, preferably 0 to 70 weight M%: 1 go,
More preferably, the weight should be less than 50% by weight and 11%.
本発明の〜11 S ’l’1発光素子に用いる金属は
、仕°n函1jl カ小6 イもの例えば、Au、Ni
、Cu。Metals used in the ~11S'l'1 light emitting device of the present invention include Au, Ni, etc.
, Cu.
Crなどが好ましい。特にAuは好適である。Cr etc. are preferable. Au is particularly suitable.
また本発明のM I S型発光素子の半導体として1、
′1、ブリッジマン法、気相成長法、液相成長法等、公
用の方?人により育成されたGaP、GaN。Further, as a semiconductor of the MIS type light emitting device of the present invention, 1,
'1. Are you using Bridgman method, vapor phase growth method, liquid phase growth method, etc. for public use? GaP and GaN grown by humans.
SIC,ZnS、Zn5eなどの化合物半導体を用いる
ことかでさる。This can be achieved by using compound semiconductors such as SIC, ZnS, and Zn5e.
本発明のM I S望ツtyf、索子は例えば次のよう
にして製造することができろ。The MIS device of the present invention can be manufactured, for example, as follows.
尤ず半導体1<ルに通常の方法で表面清浄化α埋〈SH
込理)を施した後、これをしB摸形成装踵内に設置する
。サブフェイス水相内を、所定のD I−1、温度、金
属塩讃度に調製維持し、その水面上に付加重合ポリマー
を含有する有機物質の、ル開溶液を滴下して単分子膜層
を展開する。その後、その単分子膜を凝縮膜となる所定
の表面圧に保持しながら、垂直引上げ法または水平付着
法を複数回適用して、基板上に所定摸厚のLB膜を累積
化する。次いで例えば、N2.Arなどの不活性ガス雰
囲気中で十分に乾燥して萎看装置内にこの基板を設置し
、適当なパターンを有する蒸着マスクを介してLB股上
に所定金属を蒸着して電極を形成する。Surface cleaning α filling (SH) of the semiconductor 1<
After applying this treatment, it is placed inside the B-shaped heel. The subface aqueous phase is maintained at a predetermined DI, temperature, and metal salt concentration, and a monomolecular film layer is formed by dropping an open solution of an organic substance containing an addition polymer onto the water surface. Expand. Thereafter, while maintaining the monomolecular film at a predetermined surface pressure to form a condensed film, a vertical pulling method or a horizontal deposition method is applied multiple times to accumulate an LB film of a predetermined thickness on the substrate. Then, for example, N2. After sufficiently drying the substrate in an inert gas atmosphere such as Ar, the substrate is placed in a cooling device, and a predetermined metal is vapor deposited on the LB crotch through a vapor deposition mask having an appropriate pattern to form an electrode.
(発明の効果)
本発明によれば、非局在系7′c電子を側鎖に有する付
加重合ポリマーを含むLB、9賛を絶縁摸として用いる
ことにより、発光効率の向上および動特性の安定化を図
ったMIS型発光発光素子与ることができる。(Effects of the Invention) According to the present invention, the luminous efficiency is improved and the dynamic characteristics are stabilized by using LB, 9, containing an addition polymer having delocalized 7'c electrons in the side chain as an insulating model. It is possible to provide a MIS type light-emitting device with improved performance.
実障例1
下記式
%式%(2
で示される付加重合ポリマー、即ちポリビニルカルバゾ
ールをステアリン酸と1:1の重量比で氾合し、これを
クロロホルム溶媒に濃度
1 tn g・mλとなるように溶解して、LB膜、展
開溶液を′jA¥Uした。Practical Problem Example 1 An addition polymer represented by the following formula % (2), i.e., polyvinylcarbazole, was flooded with stearic acid at a weight ratio of 1:1, and this was added to a chloroform solvent at a concentration of 1 tn g mλ. LB membrane and developing solution were prepared.
市販のLSI’lJH置を用い、1〜ラフの条件をpl
−1=6.0、水温15℃、211IIiカドミウム塩
よ度0.05mMに設定した後、n型GaPウェーハを
賃冒内にセラ1へした。n型GaPウェーハは、N ’
Q I X 10 ” c、m 3 ドープし、裏面
に1n−Geオーミック電(少を付与したちのを用いた
。そして上記展開溶液300 u Qを水面上に展開し
、表面圧20dνre/’Cmに柑橘して単分子膜を安
定さぜた。その後GaPウェーハを、引上げ速度0.5
m/分で引上げ、5苦のL B 1mを累積形成した。Using a commercially available LSI'lJH device, set the conditions from 1 to rough.
After setting -1=6.0, water temperature of 15° C., and 211IIi cadmium salt concentration of 0.05 mM, the n-type GaP wafer was placed in Cera 1 in the chamber. The n-type GaP wafer is N'
Doped with Q I After that, the GaP wafer was pulled at a pulling rate of 0.5.
It was pulled up at a rate of 5 m/min, and 1 m of LB was accumulated.
このGaPウェーハを乾燥N2雰囲気中で乾燥させた後
、通常の真空蒸着装置によりLB膜上に約200人のへ
U電極を形成した。After drying this GaP wafer in a dry N2 atmosphere, about 200 U electrodes were formed on the LB film using a conventional vacuum evaporation apparatus.
第1図は、こうして得られたM I S型発光素子を示
す。11はGaPウェーハ、12はIn−Ge電極、1
3 ハL B B9.111 ハA LI I tlで
ある。FIG. 1 shows the MIS type light emitting device thus obtained. 11 is a GaP wafer, 12 is an In-Ge electrode, 1
3 HaL B B9.111 HaA LI I tl.
この発光素子は、565nmの発光ピークが硯311さ
れ、電流−電圧特性も唖めて安定であった。印加電圧5
V(7B流値25mA)における発光効率は約0.3%
であった。また約1か月にわたり初期発光効率は維持さ
れ、経時安定性に優れていることが確認された。This light emitting element had an emission peak of 565 nm and was stable with good current-voltage characteristics. Applied voltage 5
Luminous efficiency at V (7B current value 25mA) is approximately 0.3%
Met. In addition, the initial luminous efficiency was maintained for about one month, and it was confirmed that the product had excellent stability over time.
見り九り
基板が△りを約50ppamドープしたZn5eつニー
ハを用いた他、実施例1と同様にして5層のLB膜を形
成してMIS型発光発光素子造した。A MIS type light-emitting device was fabricated by using a Zn5e double-layered substrate having a rounded substrate doped with about 50 ppam of Δ, and by forming a five-layer LB film in the same manner as in Example 1.
第2図はこのMIS型発光発光素子す。21はZ n
S e ウx−ハ、22は1n−Qe電極、23はLB
摸、24はA IJ主電極ある。FIG. 2 shows this MIS type light emitting device. 21 is Z n
S e Ux-ha, 22 is 1n-Qe electrode, 23 is LB
24 is the AIJ main electrode.
この発光素子は、465 nlの発光ピークが観測され
、電流−電圧特性も安定であった。印加電圧5V(電流
値40mA )における発光効率は約0.35%であり
、この初期発光効率は約1か月にわたり維持されること
が確認された。In this light emitting element, an emission peak of 465 nl was observed, and the current-voltage characteristics were also stable. The luminous efficiency at an applied voltage of 5 V (current value 40 mA) was approximately 0.35%, and it was confirmed that this initial luminous efficiency was maintained for approximately one month.
【111
付加重合ポリマーとしてr2式
%式%
で示される化合物を用いた他、実施例1と同様の条件で
MIS型発光発光素子造した。[111] An MIS type light emitting device was manufactured under the same conditions as in Example 1 except that a compound represented by r2 formula % formula % was used as the addition polymerization polymer.
この発光素子は、印加電圧5V(電流50mA)におけ
る発光効率が約0.35%であり、この発光効率は約1
か月維持された。This light emitting element has a luminous efficiency of approximately 0.35% at an applied voltage of 5 V (current of 50 mA), and this luminous efficiency is approximately 1.
Maintained for months.
第1図は本発明の一実施例のMIS型発光発光素子す図
、第2図は伯の実施例の〜IIS型発光型子光素子図で
ある。
11 ・G a Pウェーハ、12−In−Ge電極、
13−L B膜、14−Au電極、21−Z n S
eウェーハ、22−1 n −G e 714極、23
−L B III、24・・・A(J電極。FIG. 1 is a diagram of an MIS type light emitting device according to an embodiment of the present invention, and FIG. 2 is a diagram of an IIS type light emitting device according to an embodiment of the present invention. 11 ・GaP wafer, 12-In-Ge electrode,
13-LB film, 14-Au electrode, 21-ZnS
e wafer, 22-1 n-G e 714 poles, 23
-L B III, 24...A (J electrode.
Claims (1)
し、前記絶縁体として有機薄膜を用いたMIS型発光素
子において、前記有機薄膜として、非局在系π電子を側
鎖に有する付加重合ポリマーを含有するラングミュア・
プロジェット膜を用いることを特徴とするMIS型発光
素子。In an MIS type light emitting device having a metal (M)/insulator (I)/semiconductor (S) junction structure and using an organic thin film as the insulator, the organic thin film has delocalized π electrons in side chains. Langmuir containing an addition polymer with
An MIS type light emitting device characterized by using a projector film.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60214558A JPS6276575A (en) | 1985-09-30 | 1985-09-30 | Mis type light emitting element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60214558A JPS6276575A (en) | 1985-09-30 | 1985-09-30 | Mis type light emitting element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6276575A true JPS6276575A (en) | 1987-04-08 |
Family
ID=16657711
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60214558A Pending JPS6276575A (en) | 1985-09-30 | 1985-09-30 | Mis type light emitting element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6276575A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0397889A1 (en) * | 1988-11-21 | 1990-11-22 | MITSUI TOATSU CHEMICALS, Inc. | Light-emitting element |
-
1985
- 1985-09-30 JP JP60214558A patent/JPS6276575A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0397889A1 (en) * | 1988-11-21 | 1990-11-22 | MITSUI TOATSU CHEMICALS, Inc. | Light-emitting element |
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