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JPS6268266U - - Google Patents

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Publication number
JPS6268266U
JPS6268266U JP15864585U JP15864585U JPS6268266U JP S6268266 U JPS6268266 U JP S6268266U JP 15864585 U JP15864585 U JP 15864585U JP 15864585 U JP15864585 U JP 15864585U JP S6268266 U JPS6268266 U JP S6268266U
Authority
JP
Japan
Prior art keywords
printed circuit
board
circuit board
heat
heat radiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15864585U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15864585U priority Critical patent/JPS6268266U/ja
Publication of JPS6268266U publication Critical patent/JPS6268266U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例の斜視図、第2図は
その要部の断面図、第3図は従来構造の斜視図で
ある。 1,11……基板、12……プリント回路、3
,13……放熱パターン、4,14……電子部品
、5……(第2の)放熱パターン、6……スルー
ホール、7……導電体。
FIG. 1 is a perspective view of an embodiment of the present invention, FIG. 2 is a cross-sectional view of its essential parts, and FIG. 3 is a perspective view of a conventional structure. 1, 11... Board, 12... Printed circuit, 3
, 13... heat radiation pattern, 4, 14... electronic component, 5... (second) heat radiation pattern, 6... through hole, 7... conductor.

Claims (1)

【実用新案登録請求の範囲】 1 発熱性の電子部品を取着するプリント回路板
であつて、プリント回路を形成する基板の表面及
び裏面の夫々に放熱パターンを形成し、これら両
放熱パターンを前記基板を貫通するスルーホール
を通して相互に接続したことを特徴とするプリン
ト回路板。 2 放熱パターンはプリント回路を構成する導電
膜の一部を用いて構成してなる実用新案登録請求
の範囲第1項記載のプリント回路板。
[Claims for Utility Model Registration] 1. A printed circuit board on which a heat-generating electronic component is attached, in which a heat radiation pattern is formed on each of the front and back surfaces of the board on which the printed circuit is formed, and both of these heat radiation patterns are A printed circuit board characterized by being interconnected through through holes that penetrate the board. 2. The printed circuit board according to claim 1, wherein the heat dissipation pattern is formed using a part of a conductive film constituting the printed circuit.
JP15864585U 1985-10-18 1985-10-18 Pending JPS6268266U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15864585U JPS6268266U (en) 1985-10-18 1985-10-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15864585U JPS6268266U (en) 1985-10-18 1985-10-18

Publications (1)

Publication Number Publication Date
JPS6268266U true JPS6268266U (en) 1987-04-28

Family

ID=31082330

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15864585U Pending JPS6268266U (en) 1985-10-18 1985-10-18

Country Status (1)

Country Link
JP (1) JPS6268266U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009095372A (en) * 2007-10-12 2009-05-07 Sammy Corp Board for display and game machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009095372A (en) * 2007-10-12 2009-05-07 Sammy Corp Board for display and game machine

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