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JPS6262858A - Polyamide resin composition - Google Patents

Polyamide resin composition

Info

Publication number
JPS6262858A
JPS6262858A JP20278385A JP20278385A JPS6262858A JP S6262858 A JPS6262858 A JP S6262858A JP 20278385 A JP20278385 A JP 20278385A JP 20278385 A JP20278385 A JP 20278385A JP S6262858 A JPS6262858 A JP S6262858A
Authority
JP
Japan
Prior art keywords
polyamide resin
thermoplastic
nylon
resin
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20278385A
Other languages
Japanese (ja)
Inventor
Koichi Fujimori
藤森 弘一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP20278385A priority Critical patent/JPS6262858A/en
Publication of JPS6262858A publication Critical patent/JPS6262858A/en
Pending legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE:A polyamide resin composition having extremely reduced occurrence of molding burr and extremely improved heat-resistant temperature, having a basic composition obtained by blending a thermoplastic noncrystalline polyamide resin with a thremoplastic crystalline polyamide resin. CONSTITUTION:A thermoplastic noncrystaline polyamide resin (any resin of nylon 6, 66, 11, 12 or 510, preferably nylon 6) is blended with 10-80wt% high- molecular weight thermoplastic crystalline polyamide resin (any of nylon 6, 66, 11, 12 or 510 preferably nylon 66) and kneaded well by a blender.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は基本組成が、6 、66、12 、11 、5
10ナイロンなどの熱可塑性非結晶ポリアミド樹脂と熱
可塑性結晶ポリアミド樹脂からなる熱可塑性ポリアミド
系樹脂組成物に関する。
[Detailed description of the invention] [Industrial application field] The present invention has basic compositions of 6, 66, 12, 11, 5
The present invention relates to a thermoplastic polyamide resin composition comprising a thermoplastic amorphous polyamide resin such as 10 nylon and a thermoplastic crystalline polyamide resin.

〔発明の概要〕[Summary of the invention]

本発明は基本組成が熱可塑性非結晶ポリアミド樹脂に熱
可塑性結晶ポリアミド樹脂を添加することにより耐熱性
と成形性(パリ)と大巾に向上させたものである。
The basic composition of the present invention is to add a thermoplastic crystalline polyamide resin to a thermoplastic amorphous polyamide resin, thereby greatly improving heat resistance and moldability.

〔従来の技術〕[Conventional technology]

従来基本組成がポリアミド系樹脂組成物は例えば特公昭
55−45576などに示されているように二硫化モリ
ブデン、グラファイト等の結晶促進剤、あるlAはガラ
ス繊維を添加し耐熱温度?改善している。
Conventionally, resin compositions whose basic composition is polyamide-based, for example, as shown in Japanese Patent Publication No. 55-45576, crystal accelerators such as molybdenum disulfide and graphite, and some lA, glass fibers are added to increase the heat resistance temperature. It's improving.

〔発明が解決しようとする問題点及び目的〕しかしなが
らこのようにして得られたポリアミド樹脂組我物は、底
形材料として利用する場合、欠点は底形時にパリの発生
を生じバレル加工等の二次加工を実施せざるを得ない。
[Problems and objects to be solved by the invention] However, when the polyamide resin composition obtained in this way is used as a material for forming the bottom, it has the disadvantage that it causes the formation of flakes when forming the bottom, and it is difficult to perform secondary processes such as barrel processing. Next processing has to be carried out.

そのためコストが非常に高く、かつ品質の安定性が得ら
れない。
Therefore, the cost is very high and the quality cannot be stabilized.

又成形パIJ ’に防止するため非結晶性のボリアミド
樹脂を用いるが耐熱@度が低くα形後の熱処理に耐えら
れず、変形してしまう間顆点を宵している。
In addition, amorphous polyamide resin is used to prevent molding from forming, but it has low heat resistance and cannot withstand heat treatment after α-forming, resulting in condyle points during deformation.

本発明は以上の問題点を解決するものでその目的とする
ところは、熱可塑性非結晶ポリアミド樹脂を用v−h+
i形性(α形バリ)の性質?損うことなく耐熱性を向上
させるポリアミド樹脂組成物を提供することを特徴とす
る。
The present invention solves the above problems, and its purpose is to use v-h+ thermoplastic amorphous polyamide resin.
What is the nature of i-formity (α-form burr)? The present invention is characterized by providing a polyamide resin composition that improves heat resistance without degrading it.

〔問題点を解決するための手段〕[Means for solving problems]

本発明のポリアミド樹脂組成物は基本組成が熱可塑性非
結晶樹脂へ高分子着の熱可塑性結晶ポリアミド樹脂?重
敵地でHl −80%添加したことを特徴とする。
The basic composition of the polyamide resin composition of the present invention is a thermoplastic crystalline polyamide resin with a polymer bonded to a thermoplastic amorphous resin. It is characterized by -80% Hl added in heavy enemy areas.

本発明に使用する非結晶ポリアミド樹脂は熱可塑性であ
ればなんでもよいが、特にナイロン6が望ましく結晶性
ポリアミド樹脂Fi熱町塑性であれば何でもよいが特に
成形パリの出方を押えるため高分子鎗のナイロン66が
望ましい。
The amorphous polyamide resin used in the present invention may be any thermoplastic material, but nylon 6 is particularly desirable, and any crystalline polyamide resin may be used as long as it is thermoplastic. Nylon 66 is preferred.

また結晶性ポリアミド系樹脂の添加軍は重嶽比で10%
未満では耐熱性が悪く変形をし逆に80%を越えると成
形バリが多く発生するため上述の範囲が望ましい。
In addition, the amount of crystalline polyamide resin added is 10% compared to the weight ratio.
If it is less than 80%, heat resistance will be poor and deformation will occur, and if it exceeds 80%, molding burrs will occur in large quantities, so the above range is desirable.

なお基本組成がポリアミド樹脂組成物としてガラス繊維
等無機フィラーを添加する場合があるが、本発明はどの
組成のものを用いても同じ様な効果が得られるものであ
り、特定の組成に限定されるものではなlA。
Although the basic composition is a polyamide resin composition and inorganic fillers such as glass fibers may be added, the present invention is not limited to a specific composition, as the same effect can be obtained no matter which composition is used. It's not something that works.

〔実施例−1〕 80℃3時間以上よく乾燥した非結晶性ナイロン6樹脂
67重琶チ、結晶性ナイロン66樹脂33重駄%を混合
機でよく混合しテストピースに射出成形し隈械的物性]
直(引張強度、曲げ強度IZ。
[Example-1] Amorphous nylon 6 resin 67% by weight and crystalline nylon 66 resin 33% by weight, which had been thoroughly dried at 80°C for 3 hours or more, were thoroughly mixed in a mixer, injection molded into a test piece, and machined. Physical properties]
Straight (tensile strength, bending strength IZ.

D衝撃瀘)を測定した。D impact filter) was measured.

又時計用外装部品のケースを射出成形しα形性(成形バ
リ)を評価、耐熱評価については成形した同ケースと、
オープンで当該温度2時間の耐熱評価を実施した結果を
第−表に示す。
In addition, we injection-molded a case for an exterior watch part and evaluated its α-shape (molding burr), and evaluated the heat resistance of the same molded case.
Table 1 shows the results of a heat resistance evaluation conducted at the temperature in the open for 2 hours.

其−畏 第一表からあきらかのごと〈実施F!AJ−1は非結晶
性ナイロン6樹脂に比較し若干強度は落ちるがパリの発
生fはほとんど変りなく耐熱温度は匝度に優れているこ
とがわかる。
It is clear from the first table <Implementation F! It can be seen that AJ-1 has a slightly lower strength than amorphous nylon 6 resin, but the occurrence of cracks (f) is almost unchanged and the heat resistance temperature is excellent in terms of toughness.

〔実施例−2〕 次の組成を実施例−1の方法により評価した結果を帆二
茂に示す。
[Example-2] The following composition was evaluated by the method of Example-1, and the results are shown in Shigeru Hoji.

第二表 嬉二表に示す通り混合比率f′i機械的物性並びに29
発生鮭、耐熱温度に関連があり、結晶性ナイロン66の
添力Ili率が、 80重量%を越すと機械的物性を損
ねると同時にパリの発生が多くなる逆に10重腋物を満
たないと隠匿に耐熱性が悪くなりいずれも実用性に欠け
るため好ましくない。
As shown in Table 2, Table 2, the mixing ratio f′i mechanical properties and 29
There is a relationship between the heat resistance temperature of the salmon and crystalline nylon 66.If the Ili ratio of crystalline nylon 66 exceeds 80% by weight, the mechanical properties will be impaired and at the same time the formation of flakes will increase. Both methods are undesirable because their heat resistance deteriorates due to concealment and they lack practicality.

好ましくは10重に%から80重渣チが望ましい。Preferably, the residue is 10% to 80%.

〔発明の効果〕〔Effect of the invention〕

以上述べたように本発明によれは熱可塑性非結晶ポリア
ミド樹脂に扁粘度の熱可塑性結晶ポリアミド樹脂を重獣
比で10〜80重量%添加したので従来に比べ成形パリ
の発生が大巾に減少し耐熱温度も大巾に向上した。
As mentioned above, according to the present invention, since 10 to 80% by weight of flat viscosity thermoplastic crystalline polyamide resin is added to the thermoplastic amorphous polyamide resin, the occurrence of molding cracks is greatly reduced compared to the conventional method. The heat resistance temperature has also been greatly improved.

又成形パリ成環二次加工が不要となりコストダウンが大
巾に可能になる効果を有する。
Further, there is no need for secondary processing for molding and ring forming, which has the effect of making it possible to significantly reduce costs.

当該組部物は電子機器分野、情報@器分野を始め一般成
形分野に於いて広く応用可能である。
The assembly can be widely applied in the field of electronic equipment, information@devices, and general molding fields.

以   上that's all

Claims (3)

【特許請求の範囲】[Claims] (1)基本組成が熱可塑性非結晶ポリアミド樹脂に熱可
塑性結晶ポリアミド樹脂を重量比10〜80%添加した
ことを特徴とするポリアミド系樹脂組成物。
(1) A polyamide resin composition whose basic composition is that a thermoplastic crystalline polyamide resin is added in a weight ratio of 10 to 80% to a thermoplastic amorphous polyamide resin.
(2)前記熱可塑性非結晶樹脂が6、66、11、12
、510ナイロンのいずれかの樹脂である特許請求の範
囲第1項記載のポリアミド系樹脂組成物。
(2) The thermoplastic amorphous resin is 6, 66, 11, 12
510 nylon.
(3)前記熱可塑性結晶樹脂が、6、66、11、12
、510ナイロンのいずれかの樹脂である特許請求の範
囲第1項記載のポリアミド系樹脂組成物。
(3) The thermoplastic crystal resin is 6, 66, 11, 12
510 nylon.
JP20278385A 1985-09-13 1985-09-13 Polyamide resin composition Pending JPS6262858A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20278385A JPS6262858A (en) 1985-09-13 1985-09-13 Polyamide resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20278385A JPS6262858A (en) 1985-09-13 1985-09-13 Polyamide resin composition

Publications (1)

Publication Number Publication Date
JPS6262858A true JPS6262858A (en) 1987-03-19

Family

ID=16463115

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20278385A Pending JPS6262858A (en) 1985-09-13 1985-09-13 Polyamide resin composition

Country Status (1)

Country Link
JP (1) JPS6262858A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01193359A (en) * 1988-01-28 1989-08-03 Ube Ind Ltd Polyamide resin composition
US5206691A (en) * 1991-02-01 1993-04-27 Minolta Camera Kabushiki Kaisha Developing apparatus
US5795931A (en) * 1995-03-31 1998-08-18 Ube Industries, Ltd. Injection welding material

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01193359A (en) * 1988-01-28 1989-08-03 Ube Ind Ltd Polyamide resin composition
US5206691A (en) * 1991-02-01 1993-04-27 Minolta Camera Kabushiki Kaisha Developing apparatus
US5795931A (en) * 1995-03-31 1998-08-18 Ube Industries, Ltd. Injection welding material

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