[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

JPS6260051U - - Google Patents

Info

Publication number
JPS6260051U
JPS6260051U JP15162285U JP15162285U JPS6260051U JP S6260051 U JPS6260051 U JP S6260051U JP 15162285 U JP15162285 U JP 15162285U JP 15162285 U JP15162285 U JP 15162285U JP S6260051 U JPS6260051 U JP S6260051U
Authority
JP
Japan
Prior art keywords
light receiving
receiving sensor
light
sealing structure
transparent resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15162285U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15162285U priority Critical patent/JPS6260051U/ja
Publication of JPS6260051U publication Critical patent/JPS6260051U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を示した断面説明図
、第２図は本考案の他の実施例を示した断面説明
図、第３図は従来例の説明図である。 １：基板、２：受光センサ、２ａ：受光面、３
：透明樹脂、４：光源、７：不透明樹脂、９：開
口穴、１０：遮光膜、１１：ホルダ。 FIG. 1 is an explanatory cross-sectional view showing one embodiment of the present invention, FIG. 2 is an explanatory cross-sectional view showing another embodiment of the present invention, and FIG. 3 is an explanatory view of a conventional example. 1: Board, 2: Light receiving sensor, 2a: Light receiving surface, 3
: transparent resin, 4: light source, 7: opaque resin, 9: opening hole, 10: light shielding film, 11: holder.

Claims (1)

【実用新案登録請求の範囲】 基板上に配置した受光センサを透明樹脂により
封止した受光センサの封止構造に於いて、 前記受光センサの受光面に相対した透明樹脂の
光入射経路を除いて不透明な樹脂層又は遮光膜を
形成したことを特徴とする受光センサの封止構造
。[Scope of Claim for Utility Model Registration] In the sealing structure of a light receiving sensor in which a light receiving sensor arranged on a substrate is sealed with a transparent resin, except for the light incident path of the transparent resin facing the light receiving surface of the light receiving sensor. A sealing structure for a light receiving sensor characterized by forming an opaque resin layer or a light shielding film.
JP15162285U 1985-10-02 1985-10-02 Pending JPS6260051U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15162285U JPS6260051U (en) 1985-10-02 1985-10-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15162285U JPS6260051U (en) 1985-10-02 1985-10-02

Publications (1)

Publication Number Publication Date
JPS6260051U true JPS6260051U (en) 1987-04-14

Family

ID=31068859

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15162285U Pending JPS6260051U (en) 1985-10-02 1985-10-02

Country Status (1)

Country Link
JP (1) JPS6260051U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006051726A1 (en) * 2004-11-09 2006-05-18 Kyushu University, National University Corporation Sensor part and biological sensor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006051726A1 (en) * 2004-11-09 2006-05-18 Kyushu University, National University Corporation Sensor part and biological sensor
JP2006130208A (en) * 2004-11-09 2006-05-25 Kyushu Univ Sensor unit and biosensor

Similar Documents

Publication Publication Date Title
JPS6260051U (en)
JPH0328759U (en)
JPS62193628U (en)
JPS61162893U (en)
JPS6346000U (en)
JPS59144984U (en) Luminous horn speaker
JPS5982285U (en) display board
JPS5812280U (en) Structure of quartz glass flange
JPS62184418U (en)
JPS63128084U (en)
JPS62188155U (en)
JPS6096852U (en) Photocoupler
JPS62184760U (en)
JPH01125565U (en)
JPS6352360U (en)
JPH01141428U (en)
JPH01126099U (en)
JPH01139460U (en)
JPS6197865U (en)
JPS58113086U (en) Transmitted illumination display device
JPS6079736U (en) mask
JPS5954962U (en) light sensor
JPH0227749U (en)
JPS6123294U (en) Electroluminescent light emitting device
JPS6413159U (en)