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JPS6253765A - Emitting nozzle - Google Patents

Emitting nozzle

Info

Publication number
JPS6253765A
JPS6253765A JP19350985A JP19350985A JPS6253765A JP S6253765 A JPS6253765 A JP S6253765A JP 19350985 A JP19350985 A JP 19350985A JP 19350985 A JP19350985 A JP 19350985A JP S6253765 A JPS6253765 A JP S6253765A
Authority
JP
Japan
Prior art keywords
viscous material
stylus
width
thick film
emitting port
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19350985A
Other languages
Japanese (ja)
Inventor
Takeo Ando
安藤 健男
Kurahei Tanaka
田中 倉平
Akira Kabeshita
朗 壁下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP19350985A priority Critical patent/JPS6253765A/en
Publication of JPS6253765A publication Critical patent/JPS6253765A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To stabilize a drawing width and a drawing position, by providing a stylus to one end of a viscous material emitting port in the same width as that of the emitting port. CONSTITUTION:Both of the viscous material emitting port 1 and stylus 2 of the leading end part of a nozzle have the same width (a) and the stylus 2 is contacted with one end of the viscous material emitting port 1 and engaged with an emitting nozzle main body 3 so as not to obstruct the emission of a viscous material. In thick film printing, while the nozzle main body 3 and a thick film substrate are held to a constant interval (b) by the stylus 2, the nozzle main body 3 is moved to the direction shown by an arrow and the viscous material is emitted from the viscous material emitting port 1. At this time, the viscous material is always contacted with the stylus 2 from the point of time when said viscous material is issued from the emitting port to the point of time of the printing on the thick film substrate and, because the adhesive strength thereof is constant according to the kind and temp. of the viscous material, the viscous material is applied to the substrate in such a state that the width or position of the viscous material adhered to the stylus 2 is stable.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、厚膜形成用粘性体の吐出ノズルに関するもの
である〇 従来の技術 第4図は、従来の吐出ノズル先端部の拡大図である。従
来の吐出ノズルは第4図の様に粘性体吐出ロアとスタイ
ラス6は分離した配置で、粘性体が厚膜基板に塗付され
た時点での粘性体の巾、すなわち描画巾は主に粘性体吐
出ロアの巾dでコントロールされ、また描画位置につい
ても、粘性体が粘性体吐出ロアから定常的に吐出されて
厚膜基板に塗付されるという仮定に基づいてコントロー
ルされていた。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a nozzle for discharging a viscous material for forming a thick film. Prior Art FIG. 4 is an enlarged view of the tip of a conventional discharging nozzle. In a conventional discharge nozzle, as shown in Fig. 4, the viscous material discharge lower and the stylus 6 are arranged separately, and the width of the viscous material at the time it is applied to the thick film substrate, that is, the drawing width, is mainly the viscous material. The viscous body is controlled by the width d of the body discharge lower, and the drawing position is also controlled based on the assumption that the viscous body is constantly discharged from the viscous body discharge lower and applied to the thick film substrate.

発明が解決しようとする問題点 しかしながら上記のような構成では、粘性体吐出ロアか
ら粘性体が吐出する時点でしか描画巾や描画位置をコン
トロールすることができないため、粘性体が厚膜基板に
塗付される間に粘性体の巾が変化しやすく、かつ粘性体
が惰行するだめ、必然的に描画巾や描画位置のばらつき
も大きいという問題点を有していた。
Problems to be Solved by the Invention However, with the above configuration, the drawing width and the drawing position can only be controlled at the time when the viscous material is discharged from the viscous material discharging lower. The width of the viscous body tends to change during application, and since the viscous body coasts, there are inevitably large variations in drawing width and drawing position.

本発明は上記問題点に鑑み、粘性体の巾や位置のコント
ロールを、粘性体が厚膜基板に塗付されるまで行い、描
画巾や描画位置の安定化を計るものである。
In view of the above problems, the present invention aims to stabilize the drawing width and drawing position by controlling the width and position of the viscous material until the viscous material is applied to the thick film substrate.

問題点を解決するための手段 本発明は上記問題点に対してスタイラスを粘性体吐出口
の一端に配置し、さらにスタイラスの巾を粘性体吐出口
の巾と同一寸法にした吐出ノズルに係るものである。
Means for Solving the Problems The present invention solves the above problems by providing a discharge nozzle in which a stylus is disposed at one end of the viscous material discharge port, and the width of the stylus is made the same as the width of the viscous material discharge port. It is.

作  用 本発明は上記構成によって、粘性体は粘性体吐出口から
吐出された後もスタイラスに接触している。接触すると
とてより粘性体はスタイラスとの間に粘着力が発生する
。その粘着力が粘性体の種類、温度等によって一定であ
るためスタイラスに付着した粘性体の巾や位置は安定し
た状態で厚膜基板に塗付される。よって描画巾や描画位
置の安定化が計れる。
Function: With the above configuration, the viscous body remains in contact with the stylus even after being discharged from the viscous body discharge port. When the viscous body comes into contact with the stylus, adhesive force is generated between the viscous body and the stylus. Since the adhesive force is constant depending on the type of viscous material, temperature, etc., the width and position of the viscous material attached to the stylus are stable when applied to the thick film substrate. Therefore, the drawing width and drawing position can be stabilized.

実施例 以下、本発明の実施例について第1図を参照にしながら
説明する。第1図は本発明の吐出ノズルの先端部の斜視
図、第2図は第1図の吐出ノズルの断面図、第3図は本
発明の吐出ノズルを用いた厚膜印刷の説明図である。
EXAMPLE Hereinafter, an example of the present invention will be described with reference to FIG. FIG. 1 is a perspective view of the tip of the discharge nozzle of the present invention, FIG. 2 is a sectional view of the discharge nozzle of FIG. 1, and FIG. 3 is an explanatory diagram of thick film printing using the discharge nozzle of the present invention. .

1は粘性体吐出口で、2がスタイラスであシ、両者とも
巾はaで同一である。スタイラス2は粘性体吐出口1の
一端に接し、粘性体4の吐出を妨害しない様に吐出ノズ
ル本体3にはめこまれている。ノズル本体3と厚膜基板
5はスタイラス2によって一定間隔すに保たれている。
1 is a viscous material discharge port, 2 is a stylus, and both have the same width a. The stylus 2 is in contact with one end of the viscous material discharge port 1 and is fitted into the discharge nozzle body 3 so as not to interfere with the discharge of the viscous material 4. The nozzle body 3 and the thick film substrate 5 are kept at a constant distance by a stylus 2.

ここで、厚膜印刷を行う場合は第3図においてノズル本
体3は厚膜基板5に対し第3図矢印の方向に相対移動し
ながら、粘性体吐出口1より粘性体4が吐出される。そ
の時粘性体4は粘性体吐出口1から出た時点から厚膜基
板6上に印刷されるまで常にスタイラス2に接触してい
る。よって粘性体4はスタイラス2に対して粘着力が発
生する。
Here, when thick film printing is performed, the viscous material 4 is discharged from the viscous material discharge port 1 while the nozzle main body 3 moves relative to the thick film substrate 5 in the direction of the arrow in FIG. 3 in FIG. At this time, the viscous material 4 is always in contact with the stylus 2 from the time it exits from the viscous material discharge port 1 until it is printed on the thick film substrate 6. Therefore, the viscous body 4 generates adhesive force against the stylus 2.

その粘着力は粘性体4の種類、温度等に対して一定であ
るので、粘性体4がスタイラス2に接触している間の粘
性体の巾Cは一定でかつスタイラス2の中心に対して振
分けられた状態になる。
Since the adhesive force is constant depending on the type of viscous body 4, temperature, etc., the width C of the viscous body while the viscous body 4 is in contact with the stylus 2 is constant and distributed to the center of the stylus 2. be in a state of being

以上の様に本実施例によれば、ノズル先端部の粘性体吐
出口の一端に吐出口と同一巾のスリット状の突起物を設
けることによシ粘性体の巾と位置を安定した状態にする
ことができ、しいては描画巾と描画位置のばらつきを小
さくすることができるO 発明の効果 以上の様に本発明は、ノズル先端部の粘性体吐出口の一
端に吐出口と同一巾のスリット状の突起物を設けること
によシ描画巾と描画位置を安定させ、高精度で高密度の
厚膜回路形成を行うことができる。
As described above, according to this embodiment, the width and position of the viscous material can be stabilized by providing a slit-shaped protrusion with the same width as the discharge port at one end of the viscous material discharge port at the tip of the nozzle. Therefore, it is possible to reduce variations in drawing width and drawing position. Effects of the Invention As described above, the present invention provides a viscous material outlet at one end of the nozzle tip with a width equal to that of the outlet. By providing the slit-shaped protrusions, the drawing width and drawing position can be stabilized, and thick film circuits can be formed with high precision and high density.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の吐出ノズルの先端部の斜視図、第2図
は第1図の吐出ノズルの断面図、第3図は本発明の吐出
ノズルを用いた厚膜印刷の説明斜視図、第4図は従来の
吐出ノズルの先端部の斜視図である。 1・・・・・・粘性体吐出口、2・・・・・・スタイラ
ス。 代理人の氏名 弁理士 中 尾 敏 男 ほか1名第1
FIG. 1 is a perspective view of the tip of the discharge nozzle of the present invention, FIG. 2 is a sectional view of the discharge nozzle of FIG. 1, and FIG. 3 is a perspective view illustrating thick film printing using the discharge nozzle of the present invention. FIG. 4 is a perspective view of the tip of a conventional discharge nozzle. 1... Viscous material discharge port, 2... Stylus. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
figure

Claims (1)

【特許請求の範囲】[Claims]  ノズル先端部の粘性体吐出口の一端に吐出口と同一巾
のスタイラスを設けたことを特徴とする吐出ノズル。
A discharge nozzle characterized in that a stylus having the same width as the discharge port is provided at one end of the viscous material discharge port at the tip of the nozzle.
JP19350985A 1985-09-02 1985-09-02 Emitting nozzle Pending JPS6253765A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19350985A JPS6253765A (en) 1985-09-02 1985-09-02 Emitting nozzle

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19350985A JPS6253765A (en) 1985-09-02 1985-09-02 Emitting nozzle

Publications (1)

Publication Number Publication Date
JPS6253765A true JPS6253765A (en) 1987-03-09

Family

ID=16309238

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19350985A Pending JPS6253765A (en) 1985-09-02 1985-09-02 Emitting nozzle

Country Status (1)

Country Link
JP (1) JPS6253765A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999062644A1 (en) * 1998-06-03 1999-12-09 Daiken Chemical Co., Ltd. Device for uniformly applying paste
US6843105B1 (en) 2003-06-30 2005-01-18 Robert Bosch Corporation Contact pin for exhaust gas sensor
JP2006159145A (en) * 2004-12-10 2006-06-22 Renesas Technology Corp Fluid discharge nozzle and substrate treatment apparatus using the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999062644A1 (en) * 1998-06-03 1999-12-09 Daiken Chemical Co., Ltd. Device for uniformly applying paste
US6843105B1 (en) 2003-06-30 2005-01-18 Robert Bosch Corporation Contact pin for exhaust gas sensor
JP2006159145A (en) * 2004-12-10 2006-06-22 Renesas Technology Corp Fluid discharge nozzle and substrate treatment apparatus using the same
JP4652040B2 (en) * 2004-12-10 2011-03-16 ルネサスエレクトロニクス株式会社 Fluid discharge nozzle and substrate processing apparatus using the same

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