JPS624698B2 - - Google Patents
Info
- Publication number
- JPS624698B2 JPS624698B2 JP52160431A JP16043177A JPS624698B2 JP S624698 B2 JPS624698 B2 JP S624698B2 JP 52160431 A JP52160431 A JP 52160431A JP 16043177 A JP16043177 A JP 16043177A JP S624698 B2 JPS624698 B2 JP S624698B2
- Authority
- JP
- Japan
- Prior art keywords
- copolymer
- photosensitive
- weight
- photosensitive material
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920001577 copolymer Polymers 0.000 claims description 49
- 239000000463 material Substances 0.000 claims description 34
- 150000001875 compounds Chemical class 0.000 claims description 30
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 25
- 239000003431 cross linking reagent Substances 0.000 claims description 23
- 239000011241 protective layer Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 15
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 11
- 230000001681 protective effect Effects 0.000 claims description 10
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 9
- 239000011247 coating layer Substances 0.000 claims description 9
- 238000011161 development Methods 0.000 claims description 9
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 9
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 8
- 239000000906 photoactive agent Substances 0.000 claims description 7
- 239000011976 maleic acid Substances 0.000 claims description 6
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 5
- 150000002148 esters Chemical class 0.000 claims description 5
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 4
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 4
- 239000012670 alkaline solution Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 28
- 239000000243 solution Substances 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- 229920000642 polymer Polymers 0.000 description 12
- 239000007864 aqueous solution Substances 0.000 description 11
- 125000000524 functional group Chemical group 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 238000000576 coating method Methods 0.000 description 8
- -1 diaminobenzoyl Chemical group 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 239000003112 inhibitor Substances 0.000 description 7
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 239000003086 colorant Substances 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 6
- 125000005395 methacrylic acid group Chemical group 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 238000012719 thermal polymerization Methods 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 239000004094 surface-active agent Substances 0.000 description 5
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 4
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 4
- HCLJOFJIQIJXHS-UHFFFAOYSA-N 2-[2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOCCOC(=O)C=C HCLJOFJIQIJXHS-UHFFFAOYSA-N 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 229920001213 Polysorbate 20 Polymers 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 3
- 239000012965 benzophenone Substances 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 229920001002 functional polymer Polymers 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000000256 polyoxyethylene sorbitan monolaurate Substances 0.000 description 3
- 235000010486 polyoxyethylene sorbitan monolaurate Nutrition 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 229920003169 water-soluble polymer Polymers 0.000 description 3
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 2
- UAJRSHJHFRVGMG-UHFFFAOYSA-N 1-ethenyl-4-methoxybenzene Chemical compound COC1=CC=C(C=C)C=C1 UAJRSHJHFRVGMG-UHFFFAOYSA-N 0.000 description 2
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 2
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 2
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- ZGHFDIIVVIFNPS-UHFFFAOYSA-N 3-Methyl-3-buten-2-one Chemical compound CC(=C)C(C)=O ZGHFDIIVVIFNPS-UHFFFAOYSA-N 0.000 description 2
- UJOBWOGCFQCDNV-UHFFFAOYSA-N 9H-carbazole Chemical compound C1=CC=C2C3=CC=CC=C3NC2=C1 UJOBWOGCFQCDNV-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- 229920000147 Styrene maleic anhydride Polymers 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- TUOBEAZXHLTYLF-UHFFFAOYSA-N [2-(hydroxymethyl)-2-(prop-2-enoyloxymethyl)butyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(CC)COC(=O)C=C TUOBEAZXHLTYLF-UHFFFAOYSA-N 0.000 description 2
- AFPRJLBZLPBTPZ-UHFFFAOYSA-N acenaphthoquinone Chemical compound C1=CC(C(C2=O)=O)=C3C2=CC=CC3=C1 AFPRJLBZLPBTPZ-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 2
- 150000004056 anthraquinones Chemical class 0.000 description 2
- IVRMZWNICZWHMI-UHFFFAOYSA-N azide group Chemical group [N-]=[N+]=[N-] IVRMZWNICZWHMI-UHFFFAOYSA-N 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- FUSUHKVFWTUUBE-UHFFFAOYSA-N buten-2-one Chemical compound CC(=O)C=C FUSUHKVFWTUUBE-UHFFFAOYSA-N 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 239000013065 commercial product Substances 0.000 description 2
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cyclohexene Chemical compound C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 2
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000000706 filtrate Substances 0.000 description 2
- 239000003350 kerosene Substances 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 235000017550 sodium carbonate Nutrition 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000001308 synthesis method Methods 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- JNELGWHKGNBSMD-UHFFFAOYSA-N xanthone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3OC2=C1 JNELGWHKGNBSMD-UHFFFAOYSA-N 0.000 description 2
- YLCILCNDLBSOIO-UHFFFAOYSA-N (3-prop-2-enoyloxyphenyl) prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC(OC(=O)C=C)=C1 YLCILCNDLBSOIO-UHFFFAOYSA-N 0.000 description 1
- FWUIHQFQLSWYED-ARJAWSKDSA-N (z)-4-oxo-4-propan-2-yloxybut-2-enoic acid Chemical compound CC(C)OC(=O)\C=C/C(O)=O FWUIHQFQLSWYED-ARJAWSKDSA-N 0.000 description 1
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- KTZVZZJJVJQZHV-UHFFFAOYSA-N 1-chloro-4-ethenylbenzene Chemical compound ClC1=CC=C(C=C)C=C1 KTZVZZJJVJQZHV-UHFFFAOYSA-N 0.000 description 1
- GZBSIABKXVPBFY-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)CO GZBSIABKXVPBFY-UHFFFAOYSA-N 0.000 description 1
- AZUHIVLOSAPWDM-UHFFFAOYSA-N 2-(1h-imidazol-2-yl)-1h-imidazole Chemical class C1=CNC(C=2NC=CN=2)=N1 AZUHIVLOSAPWDM-UHFFFAOYSA-N 0.000 description 1
- RWXMAAYKJDQVTF-UHFFFAOYSA-N 2-(2-hydroxyethoxy)ethyl prop-2-enoate Chemical compound OCCOCCOC(=O)C=C RWXMAAYKJDQVTF-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- FYAWPPXBNNWJRK-UHFFFAOYSA-N 2-hydroxyhexyl prop-2-enoate Chemical compound CCCCC(O)COC(=O)C=C FYAWPPXBNNWJRK-UHFFFAOYSA-N 0.000 description 1
- YTPSFXZMJKMUJE-UHFFFAOYSA-N 2-tert-butylanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(C(C)(C)C)=CC=C3C(=O)C2=C1 YTPSFXZMJKMUJE-UHFFFAOYSA-N 0.000 description 1
- REEBWSYYNPPSKV-UHFFFAOYSA-N 3-[(4-formylphenoxy)methyl]thiophene-2-carbonitrile Chemical compound C1=CC(C=O)=CC=C1OCC1=C(C#N)SC=C1 REEBWSYYNPPSKV-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- LUWUTJWWCMXMSA-UHFFFAOYSA-N 9-methyl-3-nitrocarbazole Chemical compound [O-][N+](=O)C1=CC=C2N(C)C3=CC=CC=C3C2=C1 LUWUTJWWCMXMSA-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- ZNSMNVMLTJELDZ-UHFFFAOYSA-N Bis(2-chloroethyl)ether Chemical compound ClCCOCCCl ZNSMNVMLTJELDZ-UHFFFAOYSA-N 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 1
- YDIKCZBMBPOGFT-PWUSVEHZSA-N Malvidin 3-galactoside Chemical compound [Cl-].COC1=C(O)C(OC)=CC(C=2C(=CC=3C(O)=CC(O)=CC=3[O+]=2)O[C@H]2[C@@H]([C@@H](O)[C@@H](O)[C@@H](CO)O2)O)=C1 YDIKCZBMBPOGFT-PWUSVEHZSA-N 0.000 description 1
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- PXUQTDZNOHRWLI-QOPOCTTISA-O Primulin Natural products O(C)c1c(O)c(OC)cc(-c2c(O[C@H]3[C@H](O)[C@@H](O)[C@@H](O)[C@H](CO)O3)cc3c(O)cc(O)cc3[o+]2)c1 PXUQTDZNOHRWLI-QOPOCTTISA-O 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- WHTMVEKFWMRAJC-UHFFFAOYSA-N [Cu].[Cr].[Fe] Chemical compound [Cu].[Cr].[Fe] WHTMVEKFWMRAJC-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 150000001350 alkyl halides Chemical class 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- PVEOYINWKBTPIZ-UHFFFAOYSA-N but-3-enoic acid Chemical compound OC(=O)CC=C PVEOYINWKBTPIZ-UHFFFAOYSA-N 0.000 description 1
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 229920006217 cellulose acetate butyrate Polymers 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- FCSHDIVRCWTZOX-DVTGEIKXSA-N clobetasol Chemical compound C1CC2=CC(=O)C=C[C@]2(C)[C@]2(F)[C@@H]1[C@@H]1C[C@H](C)[C@@](C(=O)CCl)(O)[C@@]1(C)C[C@@H]2O FCSHDIVRCWTZOX-DVTGEIKXSA-N 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 150000004292 cyclic ethers Chemical class 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 239000000986 disperse dye Substances 0.000 description 1
- SVTDYSXXLJYUTM-UHFFFAOYSA-N disperse red 9 Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2NC SVTDYSXXLJYUTM-UHFFFAOYSA-N 0.000 description 1
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- NHOGGUYTANYCGQ-UHFFFAOYSA-N ethenoxybenzene Chemical compound C=COC1=CC=CC=C1 NHOGGUYTANYCGQ-UHFFFAOYSA-N 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 150000002391 heterocyclic compounds Chemical class 0.000 description 1
- 239000012456 homogeneous solution Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 150000007529 inorganic bases Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- LRDFRRGEGBBSRN-UHFFFAOYSA-N isobutyronitrile Chemical compound CC(C)C#N LRDFRRGEGBBSRN-UHFFFAOYSA-N 0.000 description 1
- 150000007966 ketoalkenes Chemical class 0.000 description 1
- 238000007759 kiss coating Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- IWVKTOUOPHGZRX-UHFFFAOYSA-N methyl 2-methylprop-2-enoate;2-methylprop-2-enoic acid Chemical compound CC(=C)C(O)=O.COC(=O)C(C)=C IWVKTOUOPHGZRX-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- ZIUHHBKFKCYYJD-UHFFFAOYSA-N n,n'-methylenebisacrylamide Chemical compound C=CC(=O)NCNC(=O)C=C ZIUHHBKFKCYYJD-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- CCCMONHAUSKTEQ-UHFFFAOYSA-N octadec-1-ene Chemical compound CCCCCCCCCCCCCCCCC=C CCCMONHAUSKTEQ-UHFFFAOYSA-N 0.000 description 1
- 150000007530 organic bases Chemical class 0.000 description 1
- ZNMATIXSWXFBPZ-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1.C=CC(=O)OCC1CO1 ZNMATIXSWXFBPZ-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- HJUGFYREWKUQJT-UHFFFAOYSA-N tetrabromomethane Chemical compound BrC(Br)(Br)Br HJUGFYREWKUQJT-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- ODHXBMXNKOYIBV-UHFFFAOYSA-N triphenylamine Chemical compound C1=CC=CC=C1N(C=1C=CC=CC=1)C1=CC=CC=C1 ODHXBMXNKOYIBV-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Polymerisation Methods In General (AREA)
Description
この発明は、特定成分の組み合せより構成され
る感光性材料、および、このものを使用する像形
成法に関する。
この発明にかかる感光性材料はネガ型のそれで
あつて、このものは、プリント基板作製時の金属
腐食メツキもしくはソルダー工程のマスクまたは
レジスト材料、その他金属のケミカルミリング用
レジスト材料として、さらに、平版、多重金属平
版、グラビア版等の刷版作製時の感光性材料とし
て好適に使用される。また、この発明にかかる像
形成法は、前記のプリント基板や刷版の作製に好
適に適用される。
従来、種々のネガ型感光性材料が公知であつ
て、これら従来技術は下記の〜の方式のもの
に類別される。高分子化合物自体に不飽和基、
アジド基等の官能性基を化学的に結合し、必要に
応じ光活性剤を共存させて官能性高分子化合物間
で直接光架橋をおこさせる方式、官能性基をも
たない高分子化合物と、常温において不揮発性で
あつて通常2個以上の不飽和基またはアジド基等
の官能性基をもつ低分子量化合物の架橋剤と、光
活性剤との混合物からなり、架橋剤によつて非官
能性高分子化合物を光架橋させる方式、前記の
とを折衷し、官能性高分子化合物と架橋剤を
併用する方式。
前記のまたはの方式では、官能性基を高分
子化合物に導入する反応、または2種類の異なる
官能性基をもつ単量体の一方の官能性基をもつて
高分子化し、他方の官能性基を生成高分子に保持
させる反応のいずれかが関与するので、製造上品
質再現性に特別な配慮が必要となる。さらに、官
能性基が高分子自体に内蔵されるため、貯蔵中暗
反応によりゲル化し易い傾向があり、また、使用
時にスカム(Scum)またはウイスカー
(Whisker)状の現像残渣が出易く像の切れに問
題を生ずる場合がある。これに対しの方式で
は、高分子化合物が非官能性であるため、精製等
取り扱い上の制約が少く、高分子化合物選定の範
囲も広い。架橋剤の選択も、高分子化合物との相
溶性の面だけ配慮すれば独立に行うことができ、
像の切れ、貯蔵性において優れた組成が得易いと
いう一般的な特徴をもつている。
の代表例は、メタクリル酸−メタクリル酸メ
チル(モル比1:9)共重合物、エチレン性不飽
和基を有する化合物(架橋剤)、およびアントラ
キノン(増感剤)、またはビスイミダゾール誘導
体とジアミノベンゾイル誘導体との混合物(増感
剤)を使用する方式のものである(特公昭46−
35687号、同48−38403号)。そのほか、セルロー
スアセテートブチレートまたはセルロースアセテ
ートと、エチレン性不飽和基をもつ化合物(架橋
剤)と光活性剤とからなるものもある(特公昭49
−11936号)。
しかしながら、の方式のものでは、平面状の
基体表面に形成された感光性材料の被覆層の上
に、非感光性であつて活性光に対し透明な、酸素
透過性の低い保護層または保護フイルムを設ける
必要がある。この種の保護層がないと実用上十分
な感度と解像性が得られない。これは、エチレン
性不飽和基のラジカル機構による光架橋が空気中
の酸素により著しい阻害作用を受けることと関係
があると推定される。この点、高分子化合物に直
接官能基を導入したの方式では、空気中の酸素
の影響は実用上無視し得るのである。
この種の保護層を設けるには、たとえばポリビ
ニルアルコール、ポリビニルピロリドン等の水溶
性高分子化合物の水溶液を感光層上に流延し、保
護層を造膜する方法がとられる。また、保護フイ
ルムを設けるには、たとえば厚さ25μ程度の薄い
ポリエチレンテレフタレートフイルムまたはポリ
プロピレンフイルム等の不溶性熱可塑性フイルム
で被覆する方法がとられる。前記の水溶性高分子
化合物を使用した保護層の場合は、弱アルカリ現
像に当たり保護層も同時に除かれ、また、保護フ
イルムの場合は、不溶性熱可塑性保護フイルムを
剥離して現像が行われる。
一方、エチレン性不飽和基を有する化合物(架
橋剤)としては、通常、室温で粘稠な液状の化合
物が使用されるが、望ましい感度を得るために、
従来法では感光層がかなり粘着性を示す程度に架
橋剤を添加する必要があり、この場合、感光層に
原図パターンを密着焼き付けするとき、保護層な
しでは粘着性が障害となり、原図を損傷する。こ
のためにも、保護層の存在が従来法では不可欠と
なる。
保護層を設ける場合は、通常、基体表面上に感
光性材料の低沸点有機溶剤溶液を流延し、加熱乾
燥により感光層を形成させ、この感光層上に水溶
性高分子化合物溶液を流延し、再び加熱乾燥して
水を除き保護層を造成するが、このようなこと
は、工程上煩雑である。また、保護フイルムを設
ける場合は、感光層にフイルムをラミネートする
工程が必要となり、加えて、保護フイルムをおく
系では、フイルムの厚さより小さい線幅のパター
ンを解像することは実際上困難であつて、さら
に、感光層と保護層の境界面における活性光の散
乱も像の切れの低下に結びつく。
このように、前記の方式は、これまで、保護
層の存在を不可欠とするため、使用上の不利益と
制約を伴うものであつた。
この発明は、従来技術の欠点を改善したもの
で、前記の系列に属する感光性材料であり、ま
た、このものを使用する像形成法である。
第1の発明は、下記の感光性材料である。
スチレンとマレイン酸モノアルキルエステルよ
りなる共重合体〔共重合体(a)〕、5〜35モル%の
メタクリル酸(またはアクリル酸)と95〜65モル
%のメタクリル酸アルキルエステル(またはアク
リル酸アルキルエステル)よりなる共重合体〔共
重合体(b)〕、窒素原子を含有しまたは含有しない
エチレン性不飽和基を有する化合物〔架橋剤〕、
および、光活性剤より構成される感光性材料。
第2の発明は、下記の像形成法である。
前記第1の発明の感光性材料を使用して、基体
表面上に厚さ1〜200μの感光性被覆層を造成
し、その際該感光性被覆層に保護層または保護フ
イルムを設けることなく造成を行い、そして、活
性光を透過するフイルム上に形成した原図を通し
て、感光性被覆層に活性光を露光した後、弱アル
カリ性溶液現像により基体表面上に光架橋像を形
成することを特徴とする像形成法。
以下、各発明を詳しく説明する。
第1の発明にかかる感光性材料は、下記の成分
から構成されるものである。
共重合体(a)は、官能性基を有する架橋剤に対し
バインダー(結合剤)の機能を示すと同時に、光
照射時に架橋剤によつて架橋されて現像液に対し
不溶化する機能を示す高分子化合物であつて、ス
チレンとマレイン酸モノアルキルエステルよりな
る共重合体である。
共重合体(b)は、共重合体(a)と、同様の機能を示
す高分子化合物であつて、5〜35モル%のメタク
リル酸(またはアクリル酸)と95〜65モル%のメ
タクリル酸アルキルエステル(またはアクリル酸
アルキルエステル)よりなる共重合体である。
この発明の感光性材料では、共重合体(a)および
(b)の2種類の実質的に官能性基をもたない高分子
化合物が同時に必須成分として含まれている。こ
の両成分は共に、弱アルカリ現像液によつて非露
光部が基体表面より除去され得るよう、遊離カル
ボキシル基を含有している。
共重合体(a)はスチレンとマレイン酸モノアルキ
ルエステルとの組み合わせになるものである。こ
の組み合わせは、下記(イ)の群の化合物と(ロ)の群の
化合物との組み合せになる多数の共重合体につい
て検討した結果、特に選定されたものである。
(イ) スチレン、α−メチルスチレン、ビニルトル
エン、p−クロルスチレン、p−メトキシスチ
レン等のスチレンまたはその誘導体、エチルビ
ニルエーテル、2−クロルエチルビニルエーテ
ル、フエニルビニルエーテル等のビニルエーテ
ル類、アクリルニトリル(またはメタクリルニ
トリル)等のニトリル類、シクロヘキセン、オ
クタデセン−1等のアルケン類、メチルビニル
ケトン、メチルイソプロペニルケトン等のケト
アルケン類。
(ロ) マレイン酸モノアルキルエステル、フマル酸
モノアルキルエステル、イタコン酸、ビニル酢
酸等の遊離カルボキシル基を有するビニル単量
体。
この発明においてスチレンとマレイン酸モノア
ルキルエステル(炭素原子数4個以下の低級アル
キルが好ましい。)の共重合体は、スチレン:マ
レイン酸モノアルキルエステルのモル比5〜
1::1の組成のものが好ましい。
共重合体(a)は、公知法によつて容易に合成し得
るし、また、市販品として入手可能であるが、合
成法の一例を参考として挙げる。
参考例 1
〔共重合体(a)〕
還流冷却器、窒素導入口、撹拌機つき反応器中
にベンゼン1と、スチレン62.4g、無水マレイ
ン酸58.8gを加え、窒素雰囲気下室温に保持して
均一な溶液とし、これに過酸化ベンゾイル0.6g
を添加し、還流下1時間反応させると、生成共重
合体が析出した。これを室温に放冷後、濾別乾燥
してポリ(スチレン−co−無水マレイン酸)91.5
gを得た。
次に、上記共重合体30gを270gのイソプロピ
ルアルコール270g中に分散させ、35%塩酸0.1ml
を添加した後、82〜83℃で28時間かきまぜた後、
4%水酸化ナトリウムメチルアルコール溶液1ml
を加え濾別した。濾液の容量が約2/3〜1/2になる
までイソプロピルアルコールを留去し濃縮した。
得られた濃縮液を溶剤(ISOPAR−米国エツソ製
アルカン系溶剤)中に撹拌下注加し、ポリ(スチ
レンco−マレイン酸モノイソプロピレート)39g
を得た。収率97.5%、〔η〕=0.140(25℃、エチ
レングリコールモノメチルエーテル)、酸価172
〔スチレン:マレイン酸モノイソプロピル≒1:
1(モル比)〕。
共重合体(b)は、5〜35モル%のメタクリル酸
(またはアクリル酸)と95〜35モル%のメタクリ
ル酸アルキルエステル(またはアクリル酸アルキ
ルエステル)よりなる共重合体である。特にメタ
クリル酸とメタクリル酸アルキルエステルの組み
合せが望ましく、かつ、下記の参考例にみられる
ようなメルカプタン等の重合抑制剤を添加し重合
度を低目に抑えた共重合体の使用が有利である。
ちなみに、共重合体(b)についても遊離カルボキシ
ル基をもつ単量体との共重合体多数について検討
したが、感光性材料の塗膜形成性のよい上記の組
み合せが選定された。
共重合体(b)もまた公知法によつて容易に合成し
得るし、また、市販品として入手可能であるが、
合成法の一例を参考として挙げる。
参考例 2
窒素導入口を備えた撹拌機つき反応器中に、無
水塩化カルシウムで処理した市販灯油540gを加
え、70℃で窒素パージし、窒素雰囲気下メチルメ
タクリレート72g、メタクリル酸15.5g、アゾビ
スイソブチロニトリル0.7g、およびn−ドデシ
ルメルカプタン1.8mlよりなる混合液を75℃にお
いて1時間で灯油中に滴下し、75℃において5時
間かきまぜ反応させて生成共重合体を析出せしめ
た。濾別後、減圧下85℃で乾燥し、ポリ(メタク
リル酸−co−メタクリル酸メチル)83gを得た。
収率95%、〔η〕=0.169(25℃、エチレングリコ
ールモノメチルエーテル)、酸価115〔メタクリル
酸:メタクリル酸メチル≒8:2(モル比%)〕。
この発明において共重合体(a)および(b)の併用は
必須不可欠であつて、いずれの一方を欠いてもこ
の発明の目的は達成されない。
共重合体(a)単独〔共重合体(b)不使用〕で、架橋
剤および光活性剤を加えて調製した感光性材料で
もつて、厚さ5〜30μの感光層を銅またはアルミ
基板上に形成させたところ、いずれも層にクラツ
ク(ひび割れ)が生じ、製品は実用性の全く乏し
いものであつた。次に、共重合体(b)単独(共重合
体(a)不使用)で同様な感光性材料を調製し、感光
層を形成させたところ、塗膜形成性は満足すべき
ものであつたが、実用上十分な感度を示さず、膜
は架橋剤によつてかなりの粘着性を示し使用上不
都合であつた。
しかし、共重合体(a)および(b)を共存させた系に
あつては、感光層は70〜80℃においても指触で粘
着性を示さず、感光速度も満足すべきものであつ
た。ここで意外な事実は、共重合体(a)および(b)を
共存させた感光性材料より造成された厚さ1〜
200μの感光層(感光性被覆層)にあつては、従
来技術の前記の方式で必要視されてきた保護層
または保護フイルムが不必要であつたことであ
る。このように、本発明にかかる感光性材料は、
従来技術の前記の方式の系列に属するにかかわ
らず、これまで必要視されてきた保護層等を必要
としないのである。
共重合体(a)および(b)の重量比は、(a):(b)=10:
1〜1:3の範囲内にあつて、(a)>(b)の関係を満
足することが望ましい。
この発明における架橋剤は、窒素原子を含有し
または含有しないエチレン性不飽和基を有する化
合物である。好ましくは常温における沸点が150
℃以上である2個以上のエチレン性不飽和基をも
つ化合物である。常温における沸点が150℃以上
である1個のエチレン性不飽和基を有する低粘度
の化合物は、低粘度であるため感光性材料溶液の
粘度調整の機能をも発揮する。
架橋剤の具体例を挙げると、フルフリルアクリ
レート、ジエチレングリコールジアクリレート、
テトラエチレングリコールジアクリレート、ヘキ
サメチレングリコールジアクリレート、ネオペン
チルグリコールジアクリレート、トリメチロール
プロパンジアクリレート、トリメチロールプロパ
ントリアクリレート、テトラメチロールメタンテ
トラアクリレート、レゾルシノールジアクリレー
ト、p・p′−ジヒドロキシジフエニルジアクリレ
ート、ビスフエノールAジグリシジルジアクリレ
ート、または、上記のアクリル基の代わりにメタ
クリル基を導入した同構体、ならびにジアリルフ
タレート、ジアリルアクリルアミド、メチレンビ
スアクリルアミド等である。
1個のエチレン性不飽和基を有する低粘度の化
合物としては、たとえば、2−エチレンヘキシル
アクリレート、ジエチレングリコールモノアクリ
レート、2−ヒドロキシエチルアクリレート、2
−ヒドロキシプロピルアクリレート、2−ヒドロ
キシヘキシルアクリレート、または、上記のアク
リル基の代りにメタクリル基を導入した同構体、
さらにはN−ビニルピロリドン等がある。
架橋剤は、上記例示のものの中より、感光速
度、共重合体混合物との相溶性、光架橋膜の耐食
性等を考慮して選定される。感光性材料中の架橋
剤の量は、通常、共重合体混合物に対し5〜150
重量%の範囲である。
この発明における光活性剤(光増感剤)は、既
知のものでよく、その具体例は、ケトン、その各
種誘導体またはキノイド化合物に属する、たとえ
ばベンゾフエノン、ベンジル、p・p′−ビス(ジ
メチルアミノ)ベンゾフエノン、p・p′−ビス
(ジエチルアミノ)ベンゾフエノン、ベンゾイン
エチルエーテル、ベンゾインイソプロピルエーテ
ル、アントラキノン、アセナフテンキノン、β−
tert−ブチルアントラキノン、フエナントレキノ
ン等、さらに、複素環化合物に属する、たとえば
プリムリン、カルバゾール、N−メチル−3−ニ
トロカルバゾール、キサントン、チオキサントン
等、および、ポリハロアルカンとその誘導体に属
する、たとえば四臭化炭素、ω・ω・ω−トリブ
ロムメチルフエニルスルホン、トリフエニルアミ
ン等である。
感光性材料中の光活性剤の量は、通常、共重合
体混合物および架橋剤の合計量に対し0.01〜20重
量%、好ましくは0.1〜10重量%の範囲である。
この発明の感光性材料には、所望により他の成
分を加えることができる。このような成分とし
て、貯蔵中の早期架橋を抑制するための、熱重合
禁止剤、たとえばヒドロキノン、p−メトキシフ
エノール、ピロガロール、2・6−ジ−tert−ブ
チル−p−クレゾール、キユフエロン等がある。
熱重合禁止剤の量は、通常、共重合体混合物およ
び架橋剤の合計量に対し0.001〜1重量%の範囲
である。
また、感光性材料の塗布膜および光架橋像の識
別を容易にするため、着色剤、たとえば油溶性染
料または微細化された顔料粒子を添加することが
できる。そのほか、塗膜のレベリング性や基体表
面への濡れ性を向上させるため、界面活性剤を添
加し得る。着色剤および界面活性剤の具体的な例
は実施例に示されている。
第2の発明にかかる像形成法と、それに付随し
た感光性材料の特徴について記述する。
感光性材料は熱溶融して射出しシート状ないし
はフイルム状にすることもできるが、通常は有機
溶剤に溶解させ、基体すなわち被加工物表面に流
延し、溶剤を蒸発させて感光層を形成させる。有
機溶剤としては、アセトン、メチルエチルケトン
等のケトン類、テトラヒドロフラン、ジオキサン
等の環状エーテル類、エチレングリコールモノメ
チルエーテル、エチレングリコールモノエチルエ
ーテル、エチレングリコールジメチルエーテル、
ジエチレングリコールジエチルエーテル等のグリ
コール類のモノまたはジエーテル類、さらに、メ
チルグリコールアセテート等のグリコールエステ
ル類を単独で用いるか、あるいは、ジクロルエ
タン等のハロアルカン類、またはクロルベンゼ
ン、トルエン等の芳香族化合物と混合して使用す
る。感光性材料溶液の濃度は、基体への塗布方
式、たとえばデツプコート、カーテンコート、ロ
ールコート、キスコート、ワイヤーバーコート、
スピナー(またはホエラー)コート等によつて決
められ、さらに所望の感光層の厚さに依存して決
められる。基体表面上に造成した1〜200μの感
光性被覆層(感光層)では従来技術のような非感
光性の保護層や保護フイルムを設ける必要がな
い。1μ未満の場合には、近接露光(プロキシミ
テイプロジエクシヨン)を行うと感光速度がかな
り遅くなり、感光性材料の特質は生かし得ない。
また、200μ超の場合には、それに見合つた効果
の増大が見込めず、しかも、経済的でもない。し
たがつて、この発明の感光性材料は、感光層の厚
さが1〜200μの範囲において密着露光により使
用されるべきである。
活性光を透過するフイルム上に形成した原図を
通して感光層を露光すれば、露光部において光架
橋がおきる。この活性光の光源としては、紫外
部・近紫外部に強く発生する低圧、高圧、超高圧
の水銀灯、メタルハライド水銀灯、カーボンアー
ク灯等が有利に使用される。
次に、露光済みの基体上の感光層を炭酸ナトリ
ウム、ケイ酸ナトリウム等の無機塩基、またはア
ンモニア、エタノールアミン等の有機塩基の濃度
数%程度の水溶液に浸漬すれば、非露光部は容易
に除去され、原図のネガ像が得られる。
光架橋剤を残した基体表面を使用目的に応じ、
腐食、メツキ等の工程にかけた後、光架橋部は濃
度5%程度の苛性アルカリ水溶液に浸漬すること
により容易に剥離することができる。
以下、この発明を実施例によつて説明する。
実施例 1
〔共重合体(a)〕
参考例1のポリ(スチレン−co−マレイン酸モノ
イソプロピル) 30重量部
〔共重合体(b)〕
参考例2のポリ(メタクリル酸−co−メタクリル
酸メチル) 40重量部
〔架橋剤〕
テトラエチレングリコールジアクリレート
41重量部
〔光活性剤〕
ベンゾインエチルエーテル 6重量部
〔熱重合禁止剤〕
p−メトキシフエノール 0.01重量部
〔着色剤〕
C.I.ソルベントレツドNo.109 0.5重量部
〔界面活性剤〕
ポリオキシエチレンソルビタンモノラウレート
0.5重量部
上記をエチレングリコールモノメチルエーテル
265重量部に溶解させ、30cps(25℃)の感光液
を得た。
この感光液をロールコーターで、1オンス銅箔
片面張りフエノール樹脂積層板に塗布し、80℃で
加熱乾燥し、厚さ10μの感光層を銅表面上につく
つた。なお、銅表面は、1・1・1−トリクロル
エタンで脱脂した後、5%HClで処理し水洗した
ものを使用した。
感光層にポリエチレンテレフタレートフイルム
ベースのテストパターンを真空窒着し、高圧水銀
灯(3kW)を1mの距離で60秒間照射した(強
度4.7mW/m2)。
露光済み積層板を0.5%Na2CO3水溶液に25℃で
2分間浸漬した後、水洗し、3%H3PO4でリンス
し再水洗して乾燥した。
次に、積層板を40゜BeのFeCl3水溶液に25℃で
5分間浸漬しエツチングしたのち、水洗し、5%
NaOH水溶液に25℃で2分間浸漬し光架橋部を剥
離した。
上記の処理によつて得られた銅パターンはエツ
ジの切れが極めて良好であつて、銅エツチング液
の廻り込みは認められず、20μ線幅を解像した。
実施例 2
〔共重合体(a)〕
ポリ(スチレン−co−マレイン酸モノエチル)
〔モル比1.5:1.1〕 35重量部
〔共重合体(b)〕
ポリ(メタクリル酸−co−メタクリル酸メチル)
〔モル比8.3:1.7〕 28重量部
〔架橋剤〕
トリメチロールプロパントリアクリレート
18重量部
ジエチレングリコールジアクリレート 17重量部
〔光活性剤〕
p・p′−ビス(ジエチルアミノ)ベンゾフエノン
0.35重量部
ベンジル 0.24重量部
〔熱重合禁止剤〕
キユフエロン 0.01重量部
〔着色剤〕
1−メチルアミノアントラキノン(赤色分散染
料) 0.7重量部
〔界面活性剤〕
ポリオキシエチレンソルビタンモノラウレート
0.4重量部
上記をエチレングリコールモノメチルエーテル
203重量部に溶解させ、38cps(25℃)の感光液
を得た。
鉄を基板とする鉄−銅−クロム(最上層)より
なる市販のトライタル版板の表面に、上詰感光液
を、ホアラーを60r.p.m.で回転させて塗布し、75
℃で乾燥し、乾燥膜厚約15μの感光層をつくつ
た。印刷用テストパターンを用い、実施例1と同
一条件で露光した後、1%エタノールアミン水溶
液に25℃で2分間浸漬し現像、水洗、乾燥した
後、CaCl230重量%、ZnCl225重量%、NH4Cl2重
量%、濃硝酸3重量%を含む水性クロム腐食液に
25℃で、非露光部の銅表面が出るまで浸漬しトラ
イメタル版を作製したところ、175線/インチを
解像し、5〜95%の網点再現性も良好であつた。
なお、この場合の剥膜は実施例1と同一条件で行
つた。
実施例 3
〔共重合体(a)〕
ポリ(スチレン−co−マレイン酸モノメチレー
ト) 35重量部
〔スチレン:無水マレイン酸=2:1(モル
比)の米国アルコケミカル社製SMA#2000をメ
チアルコールでモノエステル化したもの〕
〔共重合体(b)〕
ポリ(メタクリル酸−co−メタクリル酸メチル)
〔モル比:7.2:2.8〕 30重量部
〔架橋剤〕
トリメチロールプロパントリアクリレート
22重量部
トリメチロールプロパンジアクリレート19重量部
〔光活性剤〕
p・p′−ビス(ジメチルアミノ)ベンゾフエノン
0.4重量部
アセナフテンキノン 0.05重量部
〔熱重合禁止剤〕
p−メトキシフエノール 0.02重量部
〔着色剤〕
C.I.ピグメントブルー3 5重量部
上記をエチレングリコールモノメチルエーテル
200重量部、ジエチレングリコールジエチルエー
テル100重量部の混合溶剤に溶解し、26cps(25
℃)の感光液を得た。
この感光液をドクターブレードでもつて、乾燥
膜厚25μに、ポリイミドベースの1オンス銅箔つ
きフレキシブルプリント基板上に塗布、乾燥し
て、耐メツキ性、耐ハンダ性を試験した。
すなわち、銅表面を3%HClで処理した後、錫
−鉛ホウフツ化メツキ液(曙産業社製ハイスロ
ー)を使用し、陰極電流密度1.62A/dm2、陽極
対陰極比2:1、3分間で厚さ2.5μのメツキ層
が形成される条件下で試験を行つた。また、耐ハ
ンダ性については260℃に保つたハンダ浴に10秒
間浸漬することを3回繰り返えした。
試験の結果、上記の感光材料が十分な耐メツキ
および耐ハンダ性をもつものと判断された。
また、この感光液は18か月の間実験室中の冷暗
所に保存したが、感光速度、解像性に変化はな
く、ゲル化の徴候は認められなかつた。
以下に比較例を挙げる。
比較例 1〜3
〔架橋剤〕
トリエチレングリコールジアクリレート50重量部
〔光活性剤〕
ベンゾインイソプロピルエーテル 0.55重量部
〔熱重合禁止剤〕
p−メトキシフエノール 0.02重量部
〔着色剤〕
C.I.ソルベントブルー73 0.5重量部
〔界面活性剤〕
ポリオキシエチレンソルビタンモノラウレート
0.5重量部
上記の各成分を共通とし、比較例1〜3ではそ
れぞれ次の共重合体を使用した。
The present invention relates to a photosensitive material composed of a combination of specific components, and an image forming method using the same. The photosensitive material according to the present invention is a negative type, and can be used as a mask or resist material for metal corrosion plating or soldering process in the production of printed circuit boards, and as a resist material for chemical milling of other metals. It is suitably used as a photosensitive material in the production of printing plates such as multimetal planographic plates and gravure plates. Further, the image forming method according to the present invention is suitably applied to the production of the above-mentioned printed circuit boards and printing plates. Conventionally, various negative photosensitive materials have been known, and these conventional techniques are classified into the following types. Unsaturated groups in the polymer compound itself,
A method in which functional groups such as azide groups are chemically bonded, and if necessary a photoactive agent is present in the coexistence to cause direct photocrosslinking between functional polymer compounds. It consists of a crosslinking agent, which is a low molecular weight compound that is nonvolatile at room temperature and usually has two or more unsaturated groups or functional groups such as azide groups, and a photoactive agent. A method in which a functional polymer compound is photo-crosslinked, and a method that combines the above methods and uses a functional polymer compound and a crosslinking agent in combination. In the above methods, a reaction is carried out to introduce a functional group into a polymer compound, or a monomer having two different functional groups is polymerized with one functional group, and the other functional group is polymerized. Since it involves one of the reactions that causes the polymer to retain the produced polymer, special consideration must be given to quality reproducibility in manufacturing. Furthermore, since the functional groups are built into the polymer itself, it tends to gel due to dark reactions during storage, and when used, development residues in the form of scum or whiskers are likely to be produced, resulting in image breakage. may cause problems. In contrast, in this method, since the polymer compound is non-functional, there are fewer restrictions on handling such as purification, and the range of selection of the polymer compound is wide. The crosslinking agent can be selected independently by considering only its compatibility with the polymer compound.
It has the general characteristics that it is easy to obtain compositions with excellent image sharpness and storage stability. Typical examples include methacrylic acid-methyl methacrylate (molar ratio 1:9) copolymer, a compound having an ethylenically unsaturated group (crosslinking agent), and anthraquinone (sensitizer), or bisimidazole derivatives and diaminobenzoyl. This method uses a mixture with derivatives (sensitizers) (Special Publication No. 1973-
35687, 48-38403). In addition, there are also products consisting of cellulose acetate butyrate or cellulose acetate, a compound with an ethylenically unsaturated group (crosslinking agent), and a photoactive agent (Special Publication No. 49).
−11936). However, in the method described above, a protective layer or protective film with low oxygen permeability that is non-photosensitive and transparent to actinic light is placed on a coating layer of a photosensitive material formed on the surface of a planar substrate. It is necessary to provide Without this kind of protective layer, practically sufficient sensitivity and resolution cannot be obtained. This is presumed to be related to the fact that photocrosslinking by a radical mechanism of ethylenically unsaturated groups is significantly inhibited by oxygen in the air. In this respect, in the method of directly introducing functional groups into a polymer compound, the influence of oxygen in the air can be practically ignored. To provide this type of protective layer, a method is used in which, for example, an aqueous solution of a water-soluble polymer compound such as polyvinyl alcohol or polyvinylpyrrolidone is cast onto the photosensitive layer to form the protective layer. Further, in order to provide a protective film, a method of covering with an insoluble thermoplastic film such as a thin polyethylene terephthalate film or a polypropylene film having a thickness of about 25 μm is used. In the case of a protective layer using the water-soluble polymer compound described above, the protective layer is also removed at the same time during weak alkaline development, and in the case of a protective film, development is performed after peeling off the insoluble thermoplastic protective film. On the other hand, as a compound having an ethylenically unsaturated group (crosslinking agent), a compound that is viscous and liquid at room temperature is usually used, but in order to obtain the desired sensitivity,
In the conventional method, it is necessary to add a cross-linking agent to the extent that the photosensitive layer becomes quite sticky, and in this case, when the original pattern is closely printed on the photosensitive layer, the stickiness becomes an obstacle and damages the original without a protective layer. . For this reason as well, the presence of a protective layer is essential in the conventional method. When providing a protective layer, usually a solution of a photosensitive material in a low-boiling organic solvent is cast on the substrate surface, a photosensitive layer is formed by heating and drying, and a water-soluble polymer compound solution is cast on the photosensitive layer. Then, the protective layer is created by heating and drying again to remove water, but this process is complicated. In addition, when a protective film is provided, a process of laminating the film on the photosensitive layer is required, and in addition, in systems where a protective film is provided, it is actually difficult to resolve patterns with a line width smaller than the thickness of the film. Furthermore, scattering of active light at the interface between the photosensitive layer and the protective layer also leads to a reduction in image sharpness. As described above, the above-mentioned methods have hitherto been accompanied by disadvantages and restrictions in use since the presence of a protective layer is essential. The present invention improves upon the drawbacks of the prior art, and is a photosensitive material belonging to the above-mentioned series, as well as an imaging method using the same. The first invention is the following photosensitive material. Copolymer (a) consisting of styrene and monoalkyl maleate, 5 to 35 mol% methacrylic acid (or acrylic acid) and 95 to 65 mol% methacrylic acid alkyl ester (or alkyl acrylate) ester) [copolymer (b)], a compound having an ethylenically unsaturated group containing or not containing a nitrogen atom [crosslinking agent],
and a photosensitive material composed of a photoactive agent. The second invention is the following image forming method. A photosensitive coating layer having a thickness of 1 to 200 μm is formed on the surface of a substrate using the photosensitive material of the first invention, without providing a protective layer or a protective film on the photosensitive coating layer. The photosensitive coating layer is exposed to active light through an original image formed on a film that transmits active light, and then a photocrosslinked image is formed on the substrate surface by weak alkaline solution development. Image formation method. Each invention will be explained in detail below. The photosensitive material according to the first invention is composed of the following components. Copolymer (a) exhibits the function of a binder (binding agent) for a crosslinking agent having a functional group, and at the same time is a high polymer that exhibits the function of being crosslinked by the crosslinking agent upon irradiation with light and becoming insolubilized in a developer. It is a molecular compound and is a copolymer of styrene and maleic acid monoalkyl ester. Copolymer (b) is a polymer compound that exhibits the same function as copolymer (a), and contains 5 to 35 mol% methacrylic acid (or acrylic acid) and 95 to 65 mol% methacrylic acid. It is a copolymer made of alkyl ester (or acrylic acid alkyl ester). In the photosensitive material of this invention, copolymer (a) and
The two types of polymer compounds (b) that have substantially no functional groups are simultaneously contained as essential components. Both components contain free carboxyl groups so that the unexposed areas can be removed from the substrate surface by a weakly alkaline developer. Copolymer (a) is a combination of styrene and maleic acid monoalkyl ester. This combination was particularly selected after studying a large number of copolymers that are combinations of compounds of group (a) and group (b) below. (a) Styrene or its derivatives such as styrene, α-methylstyrene, vinyltoluene, p-chlorostyrene, p-methoxystyrene, vinyl ethers such as ethyl vinyl ether, 2-chloroethyl vinyl ether, phenyl vinyl ether, acrylonitrile (or nitriles such as (methacrylic nitrile), alkenes such as cyclohexene and octadecene-1, and ketoalkenes such as methyl vinyl ketone and methyl isopropenyl ketone. (b) Vinyl monomers having a free carboxyl group, such as monoalkyl maleate, monoalkyl fumarate, itaconic acid, and vinyl acetic acid. In this invention, the copolymer of styrene and monoalkyl maleate (preferably lower alkyl having 4 or less carbon atoms) has a molar ratio of styrene to monoalkyl maleate of 5 to 5.
A composition of 1::1 is preferred. Although the copolymer (a) can be easily synthesized by a known method and is also available as a commercial product, an example of the synthesis method will be given for reference. Reference Example 1 [Copolymer (a)] Benzene 1, 62.4 g of styrene, and 58.8 g of maleic anhydride were added to a reactor equipped with a reflux condenser, nitrogen inlet, and stirrer, and the mixture was kept at room temperature under a nitrogen atmosphere. Make a homogeneous solution and add 0.6g of benzoyl peroxide to this.
was added and reacted under reflux for 1 hour, resulting in the precipitation of a copolymer. After cooling this to room temperature, it was filtered and dried to produce poly(styrene-co-maleic anhydride) with a concentration of 91.5%.
I got g. Next, 30 g of the above copolymer was dispersed in 270 g of isopropyl alcohol, and 0.1 ml of 35% hydrochloric acid was added.
After stirring at 82-83℃ for 28 hours,
1 ml of 4% sodium hydroxide methyl alcohol solution
was added and filtered. Isopropyl alcohol was distilled off and the filtrate was concentrated until the volume of the filtrate became about 2/3 to 1/2.
The obtained concentrate was poured into a solvent (ISOPAR - alkane solvent manufactured by Etsuso, USA) under stirring, and 39 g of poly(styrene co-maleic acid monoisopropylate) was added.
I got it. Yield 97.5%, [η] = 0.140 (25°C, ethylene glycol monomethyl ether), acid value 172
[Styrene: Monoisopropyl maleate≒1:
1 (molar ratio)]. Copolymer (b) is a copolymer consisting of 5 to 35 mol% of methacrylic acid (or acrylic acid) and 95 to 35 mol% of methacrylic acid alkyl ester (or acrylic acid alkyl ester). The combination of methacrylic acid and methacrylic acid alkyl ester is particularly desirable, and it is advantageous to use a copolymer in which the degree of polymerization is kept low by adding a polymerization inhibitor such as mercaptan, as shown in the reference example below. .
Incidentally, regarding the copolymer (b), a number of copolymers with monomers having free carboxyl groups were investigated, and the above-mentioned combination was selected because it had good coating film formation properties for photosensitive materials. Copolymer (b) can also be easily synthesized by known methods and is also available as a commercial product;
An example of the synthesis method is given for reference. Reference Example 2 540 g of commercially available kerosene treated with anhydrous calcium chloride was added to a reactor equipped with a stirrer equipped with a nitrogen inlet, purged with nitrogen at 70°C, and 72 g of methyl methacrylate, 15.5 g of methacrylic acid, azobis A mixed solution consisting of 0.7 g of isobutyronitrile and 1.8 ml of n-dodecyl mercaptan was dropped into kerosene at 75°C for 1 hour, and stirred and reacted at 75°C for 5 hours to precipitate the resulting copolymer. After filtering, it was dried at 85°C under reduced pressure to obtain 83 g of poly(methacrylic acid-co-methyl methacrylate).
Yield 95%, [η] = 0.169 (25°C, ethylene glycol monomethyl ether), acid value 115 [methacrylic acid: methyl methacrylate ≒ 8:2 (mol ratio %)]. In this invention, the combination of copolymers (a) and (b) is essential, and the object of this invention cannot be achieved without either one. Even if a photosensitive material is prepared using copolymer (a) alone [copolymer (b) is not used] and a crosslinking agent and a photoactivator are added, a photosensitive layer with a thickness of 5 to 30 μm is formed on a copper or aluminum substrate. However, in both cases, cracks occurred in the layers, and the products were completely impractical. Next, when a similar photosensitive material was prepared using copolymer (b) alone (without copolymer (a)) and a photosensitive layer was formed, the film formation properties were satisfactory. However, the film did not exhibit sufficient sensitivity for practical use, and the film showed considerable stickiness due to the crosslinking agent, making it inconvenient for use. However, in the system in which copolymers (a) and (b) coexisted, the photosensitive layer did not exhibit stickiness to the touch even at 70 to 80°C, and the photosensitive speed was also satisfactory. The surprising fact here is that the thickness of the photosensitive material made from the photosensitive material containing copolymers (a) and (b)
In the case of the 200 μm photosensitive layer (photosensitive coating layer), the protective layer or protective film that was considered necessary in the above-mentioned method of the prior art is unnecessary. In this way, the photosensitive material according to the present invention is
Regardless of whether it belongs to the above-mentioned series of prior art systems, it does not require a protective layer, etc., which has been considered necessary up to now. The weight ratio of copolymers (a) and (b) is (a):(b)=10:
It is desirable that the ratio is within the range of 1 to 1:3 and that the relationship (a)>(b) is satisfied. The crosslinking agent in this invention is a compound having an ethylenically unsaturated group containing or not containing a nitrogen atom. Preferably the boiling point at room temperature is 150
It is a compound having two or more ethylenically unsaturated groups whose temperature is ℃ or higher. A low-viscosity compound having one ethylenically unsaturated group and having a boiling point of 150° C. or higher at room temperature has a low viscosity, and thus also exhibits the function of adjusting the viscosity of a photosensitive material solution. Specific examples of crosslinking agents include furfuryl acrylate, diethylene glycol diacrylate,
Tetraethylene glycol diacrylate, hexamethylene glycol diacrylate, neopentyl glycol diacrylate, trimethylolpropane diacrylate, trimethylolpropane triacrylate, tetramethylolmethane tetraacrylate, resorcinol diacrylate, p/p'-dihydroxydiphenyl diacrylate , bisphenol A diglycidyl diacrylate, or the same structure in which a methacrylic group is introduced in place of the acrylic group, as well as diallylphthalate, diallylacrylamide, methylenebisacrylamide, and the like. Examples of low-viscosity compounds having one ethylenically unsaturated group include 2-ethylenehexyl acrylate, diethylene glycol monoacrylate, 2-hydroxyethyl acrylate, and 2-hydroxyethyl acrylate.
-Hydroxypropyl acrylate, 2-hydroxyhexyl acrylate, or the same structure in which a methacrylic group is introduced in place of the above acrylic group,
Furthermore, there are N-vinylpyrrolidone and the like. The crosslinking agent is selected from among the above-mentioned examples in consideration of photosensitive speed, compatibility with the copolymer mixture, corrosion resistance of the photocrosslinked film, and the like. The amount of crosslinking agent in the photosensitive material is usually between 5 and 150% of the copolymer mixture.
% by weight. The photoactivator (photosensitizer) used in this invention may be a known one, and specific examples include benzophenone, benzyl, p.p'-bis(dimethylamino) belonging to ketones, various derivatives thereof, or quinoid compounds. ) benzophenone, p・p′-bis(diethylamino)benzophenone, benzoin ethyl ether, benzoin isopropyl ether, anthraquinone, acenaphthenequinone, β-
tert-butylanthraquinone, phenanthrequinone, etc.; furthermore, compounds belonging to heterocyclic compounds such as primulin, carbazole, N-methyl-3-nitrocarbazole, xanthone, thioxanthone, etc.; and compounds belonging to polyhaloalkane and its derivatives such as tetra Carbon bromide, ω・ω・ω-tribromomethylphenyl sulfone, triphenylamine, etc. The amount of photoactive agent in the photosensitive material usually ranges from 0.01 to 20% by weight, preferably from 0.1 to 10% by weight, based on the total amount of copolymer mixture and crosslinker. Other components can be added to the photosensitive material of this invention if desired. Such ingredients include thermal polymerization inhibitors such as hydroquinone, p-methoxyphenol, pyrogallol, 2,6-di-tert-butyl-p-cresol, Kyuferon, etc. to suppress premature crosslinking during storage. .
The amount of thermal polymerization inhibitor usually ranges from 0.001 to 1% by weight based on the total amount of copolymer mixture and crosslinking agent. Furthermore, in order to facilitate identification of the coated film of the photosensitive material and the photocrosslinked image, a coloring agent such as an oil-soluble dye or finely divided pigment particles can be added. In addition, a surfactant may be added to improve the leveling properties of the coating film and the wettability to the substrate surface. Specific examples of colorants and surfactants are given in the Examples. The image forming method according to the second invention and the characteristics of the photosensitive material associated therewith will be described. Although photosensitive materials can be thermally melted and made into injection sheet or film forms, they are usually dissolved in an organic solvent, cast onto a substrate, that is, the surface of the workpiece, and the solvent is evaporated to form a photosensitive layer. let Examples of organic solvents include ketones such as acetone and methyl ethyl ketone, cyclic ethers such as tetrahydrofuran and dioxane, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol dimethyl ether,
Glycol mono- or diethers such as diethylene glycol diethyl ether, and glycol esters such as methyl glycol acetate may be used alone, or dichloroethyl ether may be used alone.
It is used by mixing it with haloalkanes such as tan, or aromatic compounds such as chlorobenzene and toluene. The concentration of the photosensitive material solution depends on the coating method on the substrate, such as dip coating, curtain coating, roll coating, kiss coating, wire bar coating,
It is determined by the spinner (or whaler) coat, etc., and further determined by the desired thickness of the photosensitive layer. The photosensitive coating layer (photosensitive layer) with a thickness of 1 to 200 μm formed on the surface of the substrate does not require the provision of a non-photosensitive protective layer or protective film as in the prior art. If it is less than 1 μm, the photosensitive speed becomes considerably slow when proximity exposure is performed, and the characteristics of the photosensitive material cannot be utilized.
Further, if the thickness exceeds 200μ, a commensurate increase in effect cannot be expected, and furthermore, it is not economical. Therefore, the photosensitive material of the present invention should be used by contact exposure when the thickness of the photosensitive layer is in the range of 1 to 200 microns. When the photosensitive layer is exposed to light through an original image formed on a film that transmits active light, photocrosslinking occurs in the exposed areas. As a light source for this active light, low-pressure, high-pressure, or ultra-high-pressure mercury lamps, metal halide mercury lamps, carbon arc lamps, etc., which generate strongly in the ultraviolet and near ultraviolet regions, are advantageously used. Next, by immersing the exposed photosensitive layer on the substrate in an aqueous solution of an inorganic base such as sodium carbonate or sodium silicate, or an organic base such as ammonia or ethanolamine at a concentration of several percent, the unexposed areas can be easily removed. removed, yielding a negative image of the original. Depending on the purpose of use, the substrate surface on which the photocrosslinking agent remains is
After being subjected to processes such as corrosion and plating, the photocrosslinked portion can be easily peeled off by immersing it in a caustic alkali aqueous solution with a concentration of about 5%. The present invention will be explained below with reference to Examples. Example 1 [Copolymer (a)] 30 parts by weight of poly(styrene-co-monoisopropyl maleate) of Reference Example 1 [Copolymer (b)] Poly(methacrylic acid-co-methacrylic acid) of Reference Example 2 methyl) 40 parts by weight [Crosslinking agent] Tetraethylene glycol diacrylate
41 parts by weight [Photoactivator] Benzoin ethyl ether 6 parts by weight [Thermal polymerization inhibitor] p-methoxyphenol 0.01 parts by weight [Colorant] CI Solvent Red No. 109 0.5 parts by weight [Surfactant] Polyoxyethylene sorbitan monolaurate
0.5 parts by weight of the above as ethylene glycol monomethyl ether
It was dissolved in 265 parts by weight to obtain a photosensitive solution of 30 cps (25°C). This photosensitive solution was applied using a roll coater to a 1-ounce copper foil single-sided phenolic resin laminate and dried by heating at 80°C to form a 10 μm thick photosensitive layer on the copper surface. The copper surface was degreased with 1,1,1-trichloroethane, treated with 5% HCl, and washed with water. A polyethylene terephthalate film-based test pattern was vacuum-nitrified on the photosensitive layer, and irradiated with a high-pressure mercury lamp (3 kW) at a distance of 1 m for 60 seconds (intensity 4.7 mW/m 2 ). The exposed laminate was immersed in a 0.5% Na 2 CO 3 aqueous solution at 25° C. for 2 minutes, then washed with water, rinsed with 3% H 3 PO 4 , washed again with water, and dried. Next, the laminate was etched by immersing it in a 40°Be FeCl 3 aqueous solution for 5 minutes at 25°C, then washed with water, and etched with 5%
The photocrosslinked portion was peeled off by immersing it in a NaOH aqueous solution at 25°C for 2 minutes. The copper pattern obtained by the above treatment had very good edge cutting, no permeation of the copper etching solution was observed, and a line width of 20 μm was resolved. Example 2 [Copolymer (a)] Poly(styrene-co-monoethyl maleate)
[Mole ratio 1.5:1.1] 35 parts by weight [Copolymer (b)] Poly(methacrylic acid-co-methyl methacrylate)
[Mole ratio 8.3:1.7] 28 parts by weight [Crosslinking agent] Trimethylolpropane triacrylate
18 parts by weight diethylene glycol diacrylate 17 parts by weight [Photoactivator] p・p′-bis(diethylamino)benzophenone
0.35 parts by weight Benzyl 0.24 parts by weight [Thermal polymerization inhibitor] Kyuferon 0.01 parts by weight [Coloring agent] 1-methylaminoanthraquinone (red disperse dye) 0.7 parts by weight [Surfactant] Polyoxyethylene sorbitan monolaurate
0.4 parts by weight of the above as ethylene glycol monomethyl ether
It was dissolved in 203 parts by weight to obtain a photosensitive solution of 38 cps (25°C). On the surface of a commercially available trital plate made of iron-copper-chromium (top layer) with an iron substrate, a top-filling photosensitive liquid was applied by rotating a hoarer at 60 rpm.
It was dried at ℃ to form a photosensitive layer with a dry film thickness of about 15μ. Using a printing test pattern, it was exposed under the same conditions as in Example 1, then immersed in a 1% ethanolamine aqueous solution at 25°C for 2 minutes, developed, washed with water, and dried, containing 30% by weight of CaCl 2 and 25% by weight of ZnCl 2 , in an aqueous chromium corrosive solution containing 2 % by weight of NH 4 Cl and 3% by weight of concentrated nitric acid.
A tri-metal plate was prepared by immersing the plate at 25°C until the unexposed copper surface was exposed, and it resolved 175 lines/inch and had good halftone dot reproducibility of 5 to 95%.
In this case, the film was removed under the same conditions as in Example 1. Example 3 [Copolymer (a)] Poly(styrene-co-maleic acid monomethylate) 35 parts by weight [Styrene:maleic anhydride = 2:1 (mole ratio) SMA#2000 manufactured by Alco Chemical Co., Ltd. in the United States with methyl alcohol [Copolymer (b)] Poly(methacrylic acid-co-methyl methacrylate)
[Mole ratio: 7.2:2.8] 30 parts by weight [Crosslinking agent] Trimethylolpropane triacrylate
22 parts by weight Trimethylolpropane diacrylate 19 parts by weight [Photoactivator] p・p′-bis(dimethylamino)benzophenone
0.4 parts by weight Acenaphthenequinone 0.05 parts by weight [Thermal polymerization inhibitor] p-methoxyphenol 0.02 parts by weight [Coloring agent] 5 parts by weight CI Pigment Blue 3 The above was mixed with ethylene glycol monomethyl ether
Dissolved in a mixed solvent of 200 parts by weight and 100 parts by weight of diethylene glycol diethyl ether.
℃) was obtained. This photosensitive solution was applied with a doctor blade to a dry film thickness of 25 μm on a polyimide-based flexible printed circuit board with 1 oz copper foil, dried, and tested for plating resistance and solder resistance. That is, after treating the copper surface with 3% HCl, a tin-lead borosilicate plating solution (High Slow, manufactured by Akebono Sangyo Co., Ltd.) was used, cathode current density was 1.62 A/dm 2 , anode to cathode ratio was 2:1, for 3 minutes. The test was conducted under conditions in which a plating layer with a thickness of 2.5μ was formed. As for solder resistance, immersion in a solder bath kept at 260°C for 10 seconds was repeated three times. As a result of the test, it was determined that the above photosensitive material had sufficient plating resistance and soldering resistance. Furthermore, this photosensitive solution was stored in a cool, dark place in the laboratory for 18 months, but there was no change in photosensitive speed or resolution, and no signs of gelation were observed. Comparative examples are listed below. Comparative Examples 1 to 3 [Crosslinking agent] 50 parts by weight of triethylene glycol diacrylate [Photoactivator] 0.55 parts by weight of benzoin isopropyl ether [Thermal polymerization inhibitor] p-methoxyphenol 0.02 parts by weight [Coloring agent] CI Solvent Blue 73 0.5 Parts by weight [Surfactant] Polyoxyethylene sorbitan monolaurate
0.5 parts by weight The above components were common, and the following copolymers were used in Comparative Examples 1 to 3, respectively.
【表】
比較例1〜3につき各共重合体および共通成分
を、それぞれエチレングリコールモノエチルエー
テル250重量部、エチレングリコールモノエチル
エーテルアセテート80重量部の混合溶媒に溶解
し、3種類の感光液を調製した。
各感光液をそれぞれ回転塗布機により60r.p.m.
で1オンス銅箔片面張りフエノール樹脂積層板上
に塗布し、80℃で乾燥し、10〜15μ膜厚の感光層
をつくつた。なお、銅箔表面は1・1・1−トリ
クロルエタンで脱脂した後、5%HClで処理し水
洗したものを使用した。
3種類の感光層に、それぞれ、ボリエチレンテ
レフタレートフイルムベースのテストパターンを
真空密着し、超高圧水銀灯(3kW)を1mの距
離で60秒間照射した(強度4.7mW/cm2)。
露光後、各積層板を0.5%Na2CO3水溶液に25℃
で2分間浸漬し、水洗、3%H3PO4リンス、再水
洗を順に行つた後、加熱乾燥した。
上記3種類の感光液および感光層につき比較試
験を行い、下表の結果を得た。[Table] For Comparative Examples 1 to 3, each copolymer and common component were dissolved in a mixed solvent of 250 parts by weight of ethylene glycol monoethyl ether and 80 parts by weight of ethylene glycol monoethyl ether acetate, and three types of photosensitive liquids were mixed. Prepared. Apply each photosensitive liquid at 60r.pm using a rotary coating machine.
The photosensitive layer was coated on a phenolic resin laminate with one ounce of copper foil on one side and dried at 80°C to form a photosensitive layer with a thickness of 10 to 15 μm. The surface of the copper foil was degreased with 1.1.1-trichloroethane, treated with 5% HCl, and washed with water. Polyethylene terephthalate film-based test patterns were vacuum-adhered to each of the three types of photosensitive layers, and irradiated with an ultra-high pressure mercury lamp (3 kW) at a distance of 1 m for 60 seconds (intensity 4.7 mW/cm 2 ). After exposure, each laminate was placed in 0.5% Na2CO3 aqueous solution at 25℃ .
The sample was immersed in water for 2 minutes, washed with water, rinsed with 3% H 3 PO 4 and washed again with water in this order, and then heated and dried. Comparative tests were conducted on the above three types of photosensitive liquids and photosensitive layers, and the results shown in the table below were obtained.
【表】【table】
【表】
はそれぞれ優、良およ
び不可に対応する。
試験項目の評価方法は次の通りである。
塗膜性:塗膜形成を感光層表面の均一性によつて
評価する。
感光速度:/2ステツプタブレツト〔Kodak社
製)を露光現像した後、6段ベタになるまで焼
き付けるのに要する時間により評価する。
解像性:線幅100μの直線画像の解像とエツジの
切れによつて評価する。
粘着性:ベトツキの指触試験および銀塩画像をも
つ原図との密着露光後の原図付着の有無により
判定する。
現像性:0.5%Na2CO3水溶液現像の際の現像所要
時間と現線残渣の有無により評価する。
剥離性:5%NaOH水溶液による剥離の難易によ
り判定する。
耐食性:銅箔腐食用の40゜BeのFeCl3水溶液によ
る腐食像の切れ、および腐食液の廻り込みの有
無より判定する。[Table] indicates excellent, good, and
and not available.
The evaluation method for the test items is as follows. Coating property: Coating film formation is evaluated based on the uniformity of the surface of the photosensitive layer. Photosensitivity speed: /2 After exposure and development of a step tablet (manufactured by Kodak), evaluation is based on the time required to print until a 6-step solid image is obtained. Resolution: Evaluated by the resolution of a straight line image with a line width of 100μ and edge breakage. Adhesiveness: Judgment is made by the finger touch test for stickiness and the presence or absence of adhesion to the original after close exposure to the original with a silver salt image. Developability: Evaluated based on the development time required for development with a 0.5% Na 2 CO 3 aqueous solution and the presence or absence of development line residue. Peelability: Judged by the difficulty of peeling with a 5% NaOH aqueous solution. Corrosion resistance: Judging from the presence or absence of a cut in the corrosion image created by a 40°Be FeCl 3 aqueous solution for copper foil corrosion and the presence or absence of corrosive solution.
Claims (1)
よりなる共重合体〔共重合体(a)〕、5〜35モル%
のメタクリル酸(またはアクリル酸)と95〜65モ
ル%のメタクリル酸アルキルエステル(またはア
クリル酸アルキルエステル)よりなる共重合体
〔共重合体(b)〕、窒素原子を含有しまたは含有しな
いエチレン性不飽和基を有する化合物〔架橋
剤〕、および、光活性剤より構成される感光性材
料。 2 スチレンとマレイン酸モノアルキルエステル
よりなる共重合体〔共重合体(a)〕、5〜35モル%
のメタクリル酸(またはアクリル酸)と95〜65モ
ル%のメタクリル酸アルキルエステル(またはア
クリル酸アルキルエステル)よりなる共重合体
〔共重合体(b)〕、窒素原子を含有しまたは含有しな
いエチレン性不飽和基を有する化合物〔架橋
剤〕、および、光活性剤より構成される感光性材
料を使用して、基体表面上に厚さ1〜200μの感
光性被覆層を造成し、その際該感光性被覆層に保
護層または保護フイルムを設けることなく造成を
行い、そして、活性光を透過するフイルム上に形
成した原図を通して、感光性被覆層に活性光を露
光した後、弱アルカリ性溶液現像により基体表面
上に光架橋像を形成することを特徴とする像形成
法。[Claims] 1. Copolymer consisting of styrene and maleic acid monoalkyl ester [copolymer (a)], 5 to 35 mol%
methacrylic acid (or acrylic acid) and 95 to 65 mol% of methacrylic acid alkyl ester (or acrylic acid alkyl ester) [copolymer (b)], ethylenic with or without nitrogen atoms A photosensitive material composed of a compound having an unsaturated group [crosslinking agent] and a photoactive agent. 2 Copolymer consisting of styrene and maleic acid monoalkyl ester [copolymer (a)], 5 to 35 mol%
methacrylic acid (or acrylic acid) and 95 to 65 mol% of methacrylic acid alkyl ester (or acrylic acid alkyl ester) [copolymer (b)], ethylenic with or without nitrogen atoms A photosensitive material composed of a compound having an unsaturated group [crosslinking agent] and a photoactive agent is used to form a photosensitive coating layer with a thickness of 1 to 200 μm on the surface of the substrate, and at this time, the photosensitive material is The photosensitive coating layer is formed without a protective layer or protective film, and the photosensitive coating layer is exposed to active light through an original image formed on a film that transmits active light, and then the substrate is developed by weak alkaline solution development. An image forming method characterized by forming a photocrosslinked image on a surface.
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16043177A JPS5492723A (en) | 1977-12-30 | 1977-12-30 | Photosensitive material and use |
CA318,194A CA1127340A (en) | 1977-12-30 | 1978-12-19 | Photocurable light-sensitive composition and material |
AU42868/78A AU520630B2 (en) | 1977-12-30 | 1978-12-22 | Photocurable light sensitive composition |
FR7836926A FR2413689A1 (en) | 1977-12-30 | 1978-12-29 | COMPOSITIONS OF LIGHT-SENSITIVE, PHOTOCURABLE MATERIALS |
GB7850210A GB2011431B (en) | 1977-12-30 | 1978-12-29 | Photocurable composition |
DE19782856675 DE2856675A1 (en) | 1977-12-30 | 1978-12-29 | LIGHT-CURABLE MASS |
US05/974,458 US4284707A (en) | 1977-12-30 | 1978-12-29 | Photocurable light-sensitive composition |
NL7812639A NL7812639A (en) | 1977-12-30 | 1978-12-29 | PHOTO HARDENABLE SENSITIVE COMPOSITION. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16043177A JPS5492723A (en) | 1977-12-30 | 1977-12-30 | Photosensitive material and use |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5492723A JPS5492723A (en) | 1979-07-23 |
JPS624698B2 true JPS624698B2 (en) | 1987-01-31 |
Family
ID=15714777
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16043177A Granted JPS5492723A (en) | 1977-12-30 | 1977-12-30 | Photosensitive material and use |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5492723A (en) |
Families Citing this family (87)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59128536A (en) * | 1983-01-14 | 1984-07-24 | Nippon Shokubai Kagaku Kogyo Co Ltd | Ultraviolet hardenable composition |
US4539286A (en) * | 1983-06-06 | 1985-09-03 | Dynachem Corporation | Flexible, fast processing, photopolymerizable composition |
US4762747A (en) * | 1986-07-29 | 1988-08-09 | Industrial Technology Research Institute | Single component aqueous acrylic adhesive compositions for flexible printed circuits and laminates made therefrom |
JPH08101498A (en) | 1994-08-03 | 1996-04-16 | Fuji Photo Film Co Ltd | Photosensitive planographic printing plate |
JP3442176B2 (en) | 1995-02-10 | 2003-09-02 | 富士写真フイルム株式会社 | Photopolymerizable composition |
JP4130030B2 (en) | 1999-03-09 | 2008-08-06 | 富士フイルム株式会社 | Photosensitive composition and 1,3-dihydro-1-oxo-2H-indene derivative compound |
JP4137577B2 (en) | 2002-09-30 | 2008-08-20 | 富士フイルム株式会社 | Photosensitive composition |
JP2004126050A (en) | 2002-09-30 | 2004-04-22 | Fuji Photo Film Co Ltd | Lithographic printing original plate |
DE60327141D1 (en) | 2002-09-30 | 2009-05-28 | Fujifilm Corp | Polymerizable composition and planographic printing plate precursor |
CN100590525C (en) | 2002-12-18 | 2010-02-17 | 富士胶片株式会社 | Polymerizable composition and plated printed plate fore-body |
JP4150261B2 (en) | 2003-01-14 | 2008-09-17 | 富士フイルム株式会社 | Plate making method of lithographic printing plate precursor |
JP2004252285A (en) | 2003-02-21 | 2004-09-09 | Fuji Photo Film Co Ltd | Photosensitive composition and lithographic printing original plate using the same |
JP4291638B2 (en) | 2003-07-29 | 2009-07-08 | 富士フイルム株式会社 | Alkali-soluble polymer and planographic printing plate precursor using the same |
JP4384464B2 (en) | 2003-09-24 | 2009-12-16 | 富士フイルム株式会社 | Photosensitive composition and planographic printing plate precursor using the same |
JP2005099284A (en) | 2003-09-24 | 2005-04-14 | Fuji Photo Film Co Ltd | Photosensitive composition and planographic printing original plate |
JP2005227554A (en) | 2004-02-13 | 2005-08-25 | Fuji Photo Film Co Ltd | Photosensitive planographic printing plate |
JP4452572B2 (en) | 2004-07-06 | 2010-04-21 | 富士フイルム株式会社 | Photosensitive composition and image recording method using the same |
JP2006065074A (en) | 2004-08-27 | 2006-03-09 | Fuji Photo Film Co Ltd | Photosensitive lithographic printing plate |
EP1701213A3 (en) | 2005-03-08 | 2006-11-22 | Fuji Photo Film Co., Ltd. | Photosensitive composition |
JP4406617B2 (en) | 2005-03-18 | 2010-02-03 | 富士フイルム株式会社 | Photosensitive composition and planographic printing plate precursor |
JP4538350B2 (en) | 2005-03-18 | 2010-09-08 | 富士フイルム株式会社 | Photosensitive composition, image recording material, and image recording method |
US20060216646A1 (en) | 2005-03-22 | 2006-09-28 | Fuji Photo Film Co., Ltd. | Plate-making method of lithographic printing plate precursor |
JP4911455B2 (en) | 2006-09-27 | 2012-04-04 | 富士フイルム株式会社 | Photopolymerization type photosensitive lithographic printing plate precursor |
JP4777226B2 (en) | 2006-12-07 | 2011-09-21 | 富士フイルム株式会社 | Image recording materials and novel compounds |
JP4860525B2 (en) | 2007-03-27 | 2012-01-25 | 富士フイルム株式会社 | Curable composition and planographic printing plate precursor |
EP1975702B1 (en) | 2007-03-29 | 2013-07-24 | FUJIFILM Corporation | Colored photocurable composition for solid state image pick-up device, color filter and method for production thereof, and solid state image pick-up device |
JP5030638B2 (en) | 2007-03-29 | 2012-09-19 | 富士フイルム株式会社 | Color filter and manufacturing method thereof |
JP5075450B2 (en) | 2007-03-30 | 2012-11-21 | 富士フイルム株式会社 | Planographic printing plate precursor |
JP5213375B2 (en) | 2007-07-13 | 2013-06-19 | 富士フイルム株式会社 | Pigment dispersion, curable composition, color filter using the same, and solid-state imaging device |
KR101412719B1 (en) | 2007-07-17 | 2014-06-26 | 후지필름 가부시키가이샤 | Photosensitive compositions, curable compositions, novel compounds, photopolymerizable compositions, color filters, and planographic printing plate precursors |
JP2009091555A (en) | 2007-09-18 | 2009-04-30 | Fujifilm Corp | Curable composition, image forming material and planographic printing plate precursor |
JP2009083106A (en) | 2007-09-27 | 2009-04-23 | Fujifilm Corp | Lithographic printing plate surface protective agent and plate making method for lithographic printing plate |
DE602008001931D1 (en) | 2007-09-28 | 2010-09-09 | Fujifilm Corp | Negative photosensitive material and negative planographic printing plate precursor |
EP2055746B1 (en) | 2007-10-31 | 2011-09-28 | FUJIFILM Corporation | Colored curable composition, color filter, method of producing the same, and solid state image pickup device. |
CN101855026A (en) | 2007-11-14 | 2010-10-06 | 富士胶片株式会社 | Method of drying coating film and process for producing lithographic printing plate precursor |
JP5448352B2 (en) | 2008-03-10 | 2014-03-19 | 富士フイルム株式会社 | Colored curable composition, color filter, and solid-state imaging device |
KR20090100262A (en) | 2008-03-18 | 2009-09-23 | 후지필름 가부시키가이샤 | Photosensitive resin composition, light-shielding color filter, method of producing the same and solid-state image sensor |
JP5305704B2 (en) | 2008-03-24 | 2013-10-02 | 富士フイルム株式会社 | Novel compound, photopolymerizable composition, photopolymerizable composition for color filter, color filter and method for producing the same, solid-state imaging device, and lithographic printing plate precursor |
JP5020871B2 (en) | 2008-03-25 | 2012-09-05 | 富士フイルム株式会社 | Planographic printing plate manufacturing method |
JP5264427B2 (en) | 2008-03-25 | 2013-08-14 | 富士フイルム株式会社 | Preparation method of lithographic printing plate |
JP5422134B2 (en) | 2008-03-25 | 2014-02-19 | 富士フイルム株式会社 | Automatic development method for immersion lithographic printing plates |
JP2009236355A (en) | 2008-03-26 | 2009-10-15 | Fujifilm Corp | Drying method and device |
JP5535444B2 (en) | 2008-03-28 | 2014-07-02 | 富士フイルム株式会社 | Green curable composition for solid-state image sensor, color filter for solid-state image sensor, and method for producing the same |
JP5507054B2 (en) | 2008-03-28 | 2014-05-28 | 富士フイルム株式会社 | Polymerizable composition, color filter, method for producing color filter, and solid-state imaging device |
JP5173528B2 (en) | 2008-03-28 | 2013-04-03 | 富士フイルム株式会社 | Photosensitive resin composition, light-shielding color filter, method for producing the same, and solid-state imaging device |
JP5137662B2 (en) | 2008-03-31 | 2013-02-06 | 富士フイルム株式会社 | Curable composition, color filter and method for producing the same, and solid-state imaging device |
JP5528677B2 (en) | 2008-03-31 | 2014-06-25 | 富士フイルム株式会社 | Polymerizable composition, light-shielding color filter for solid-state image sensor, solid-state image sensor, and method for producing light-shielding color filter for solid-state image sensor |
KR101441998B1 (en) | 2008-04-25 | 2014-09-18 | 후지필름 가부시키가이샤 | Polymerizable composition, light shielding color filter, black curable composition, light shielding color filter for solid-state imaging device, method of manufacturing the same, and solid-state imaging device |
JP5222624B2 (en) | 2008-05-12 | 2013-06-26 | 富士フイルム株式会社 | Black photosensitive resin composition, color filter, and method for producing the same |
JP5228631B2 (en) | 2008-05-29 | 2013-07-03 | 富士フイルム株式会社 | Lithographic printing plate developing treatment solution and method for preparing a lithographic printing plate |
JP5248203B2 (en) | 2008-05-29 | 2013-07-31 | 富士フイルム株式会社 | Lithographic printing plate developing treatment solution and method for preparing a lithographic printing plate |
JP5171506B2 (en) | 2008-06-30 | 2013-03-27 | 富士フイルム株式会社 | NOVEL COMPOUND, POLYMERIZABLE COMPOSITION, COLOR FILTER, PROCESS FOR PRODUCING THE SAME, SOLID-STATE IMAGING ELEMENT, AND lithographic printing plate |
JP5405141B2 (en) | 2008-08-22 | 2014-02-05 | 富士フイルム株式会社 | Preparation method of lithographic printing plate |
US20110146516A1 (en) | 2008-08-22 | 2011-06-23 | Fujifilm Corporation | Method of preparing lithographic printing plate |
JP5171483B2 (en) | 2008-08-29 | 2013-03-27 | 富士フイルム株式会社 | Preparation method of lithographic printing plate |
JP2010097175A (en) | 2008-09-22 | 2010-04-30 | Fujifilm Corp | Method of preparing lithographic printing plate and lithographic printing plate precursor |
US8151705B2 (en) | 2008-09-24 | 2012-04-10 | Fujifilm Corporation | Method of preparing lithographic printing plate |
JP5127651B2 (en) | 2008-09-30 | 2013-01-23 | 富士フイルム株式会社 | Colored curable composition, color filter, method for producing the same, and solid-state imaging device |
JP5340102B2 (en) | 2008-10-03 | 2013-11-13 | 富士フイルム株式会社 | Dispersion composition, polymerizable composition, light-shielding color filter, solid-state imaging device, liquid crystal display device, wafer level lens, and imaging unit |
EP2204698B1 (en) | 2009-01-06 | 2018-08-08 | FUJIFILM Corporation | Plate surface treatment agent for lithographic printing plate and method for treating lithographic printing plate |
JP5669386B2 (en) | 2009-01-15 | 2015-02-12 | 富士フイルム株式会社 | NOVEL COMPOUND, POLYMERIZABLE COMPOSITION, COLOR FILTER, PROCESS FOR PRODUCING THE SAME, SOLID-STATE IMAGING ELEMENT, AND lithographic printing plate precursor |
US8808948B2 (en) | 2009-02-19 | 2014-08-19 | Fujifilm Corporation | Dispersion composition, photosensitive resin composition for light-shielding color filter, light-shielding color filter, method of producing the same, and solid-state image sensor having the color filter |
JP2010197620A (en) | 2009-02-24 | 2010-09-09 | Fujifilm Corp | Automatic developing apparatus and processing method for lithographic printing plate precursor |
JP5535814B2 (en) | 2009-09-14 | 2014-07-02 | 富士フイルム株式会社 | Photopolymerizable composition, color filter, and method for producing the same, solid-state imaging device, liquid crystal display device, planographic printing plate precursor, and novel compound |
JP5501175B2 (en) | 2009-09-28 | 2014-05-21 | 富士フイルム株式会社 | Dispersion composition and method for producing the same, photosensitive resin composition for light-shielding color filter and method for producing the same, light-shielding color filter and method for producing the same, and solid-state imaging device |
JP5535842B2 (en) | 2009-09-30 | 2014-07-02 | 富士フイルム株式会社 | Black curable composition for wafer level lens and wafer level lens |
JP5701576B2 (en) | 2009-11-20 | 2015-04-15 | 富士フイルム株式会社 | Dispersion composition, photosensitive resin composition, and solid-state imaging device |
JP5514781B2 (en) | 2011-08-31 | 2014-06-04 | 富士フイルム株式会社 | Planographic printing plate precursor and method for producing a lithographic printing plate using the same |
JP5714544B2 (en) | 2011-09-15 | 2015-05-07 | 富士フイルム株式会社 | Recycling process waste liquid |
BR112014010571A2 (en) | 2011-11-04 | 2017-06-13 | Fujifilm Corporation | METHOD FOR RECYCLING RESIDUAL LIQUID FROM A PLATE MANUFACTURING PROCESS FOR A PLANOGRAPHIC PRINTING PLATE PRECURSOR |
EP2818522B1 (en) | 2012-02-23 | 2018-11-21 | FUJIFILM Corporation | Chromogenic composition, chromogenic curable composition, lithographic printing plate precursor, platemaking method, and chromogenic compound |
JP5909468B2 (en) | 2012-08-31 | 2016-04-26 | 富士フイルム株式会社 | Dispersion composition, curable composition using the same, transparent film, microlens, and solid-state imaging device |
JP5934682B2 (en) | 2012-08-31 | 2016-06-15 | 富士フイルム株式会社 | Curable composition for forming microlenses or undercoat film for color filter, transparent film, microlens, solid-state imaging device, and method for producing curable composition |
JP5894943B2 (en) | 2012-08-31 | 2016-03-30 | 富士フイルム株式会社 | Dispersion composition, curable composition using the same, transparent film, microlens, method for producing microlens, and solid-state imaging device |
BR112015006206A2 (en) | 2012-09-20 | 2017-07-04 | Fujifilm Corp | lithographic printing plate precursor and method of plate preparation |
JP5828045B2 (en) | 2012-09-26 | 2015-12-02 | 富士フイルム株式会社 | Planographic printing plate precursor and plate making method |
CN104854699B (en) | 2012-12-03 | 2017-09-01 | 富士胶片株式会社 | Solid photographic element holding substrate and its manufacture method, solid-state image sensor |
KR101762756B1 (en) | 2012-12-03 | 2017-07-28 | 후지필름 가부시키가이샤 | Ir-cut filter and manufacturing method thereof, solid state image pickup device, and light blocking film formation method |
JP5899371B2 (en) | 2013-02-27 | 2016-04-06 | 富士フイルム株式会社 | Infrared photosensitive coloring composition, infrared curable coloring composition, lithographic printing plate precursor and plate making method |
JP6097128B2 (en) | 2013-04-12 | 2017-03-15 | 富士フイルム株式会社 | Far infrared light shielding layer forming composition |
JP6271594B2 (en) | 2014-01-31 | 2018-01-31 | 富士フイルム株式会社 | Infrared photosensitive coloring composition, lithographic printing plate precursor, lithographic printing plate making method, and infrared photosensitive coloring agent |
EP3431513B1 (en) | 2016-03-14 | 2020-12-23 | FUJIFILM Corporation | Composition, film, cured film, optical sensor and method for producing film |
WO2019176409A1 (en) | 2018-03-13 | 2019-09-19 | 富士フイルム株式会社 | Method for manufacturing cured film, and method for manufacturing solid-state imaging element |
TWI662069B (en) * | 2018-07-11 | 2019-06-11 | 新應材股份有限公司 | Photosensitive composition, color filter and method for preparing the color filter |
CN112601912A (en) | 2018-09-07 | 2021-04-02 | 富士胶片株式会社 | Vehicle headlamp unit, headlamp shading film, and method for manufacturing headlamp shading film |
WO2020203277A1 (en) | 2019-03-29 | 2020-10-08 | 富士フイルム株式会社 | Photosensitive resin composition, cured film, inductor and antenna |
WO2022059706A1 (en) | 2020-09-18 | 2022-03-24 | 富士フイルム株式会社 | Composition, magnetic-particle-containing film, and electronic component |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3458311A (en) * | 1966-06-27 | 1969-07-29 | Du Pont | Photopolymerizable elements with solvent removable protective layers |
-
1977
- 1977-12-30 JP JP16043177A patent/JPS5492723A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3458311A (en) * | 1966-06-27 | 1969-07-29 | Du Pont | Photopolymerizable elements with solvent removable protective layers |
Also Published As
Publication number | Publication date |
---|---|
JPS5492723A (en) | 1979-07-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS624698B2 (en) | ||
US4284707A (en) | Photocurable light-sensitive composition | |
TW424172B (en) | Photosensitive resin composition and photosensitive element using the same | |
EP0009832A2 (en) | Improved photopolymerisable recording materials | |
JPH11258797A (en) | Photosensitive resin composition and photoresist ink for production of printed circuit board | |
JP4645776B2 (en) | Photosensitive resin composition, photosensitive element using the same, resist pattern forming method, and printed wiring board manufacturing method | |
US6808865B1 (en) | Photosensitive resin composition of aqueous emulsion type | |
US3615630A (en) | Light-sensitive coating and recording material containing photopolymerizable compounds | |
EP0283990A2 (en) | A heat-resistant photosensitive resin composition | |
JP4240282B2 (en) | Photosensitive resin composition, photosensitive element using the same, resist pattern manufacturing method, and printed wiring board manufacturing method | |
JPH06236031A (en) | Photosensitive resin composition and photosensitive element using the same | |
KR920009904B1 (en) | Photosensitive resin composition and photosensitive element | |
JP3736654B2 (en) | Photosensitive resin composition and photosensitive element using the same | |
JPH01201652A (en) | Photocurable composition | |
JP3859934B2 (en) | Photosensitive resin composition, photosensitive element, method for producing resist pattern, and method for producing printed wiring board | |
JP3281307B2 (en) | Photosensitive resin composition, photosensitive element using the same, method of laminating layers of photosensitive resin composition, layered substrate of photosensitive resin composition layer, and method of curing layer of photosensitive resin composition | |
JP4000839B2 (en) | Photosensitive resin composition, photosensitive element using the same, resist pattern forming method, and printed wiring board manufacturing method | |
JPS6331482B2 (en) | ||
JP2004294553A (en) | Photosensitive resin composition, and photosensitive element, method for forming resist pattern and method for manufacturing printed wiring board using same | |
JP4529289B2 (en) | Photosensitive resin composition, photosensitive element using the same, resist pattern manufacturing method, and printed wiring board manufacturing method | |
JP4134574B2 (en) | Photosensitive resin composition, photosensitive element using the same, resist pattern forming method, and printed wiring board manufacturing method | |
JPH02178662A (en) | Photopolymerizable composition | |
JP2003035953A (en) | Photosensitive resin composition for high density and high resolution and its use | |
JPS62159140A (en) | Photosensitive resin composition and its pattern forming method | |
JPH02230154A (en) | Photopolymerizable composition |