JPS6245133A - Pellet mounting method - Google Patents
Pellet mounting methodInfo
- Publication number
- JPS6245133A JPS6245133A JP60184126A JP18412685A JPS6245133A JP S6245133 A JPS6245133 A JP S6245133A JP 60184126 A JP60184126 A JP 60184126A JP 18412685 A JP18412685 A JP 18412685A JP S6245133 A JPS6245133 A JP S6245133A
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- collet
- tab
- adhesive
- attaching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
本発明は、ペレット付方法に関し、特に、半導体装置の
製造過程において、半導体ペレットをペレット付け面例
えばリードフレームのタブ上にボンディングする場合の
ペレット付方法の改良技術に関する。Detailed Description of the Invention [Technical Field] The present invention relates to a pellet attaching method, and in particular to a pellet attaching method for bonding semiconductor pellets onto a pellet attaching surface, such as a tab of a lead frame, in the process of manufacturing a semiconductor device. Regarding improved technology.
従来、半導体装置の製造過程において半導体ペレットを
ペレット付け面例えばリードフレームのタブ上にボンデ
ィングする場合の一処法として、当該タブ上にペースト
状の接着剤例えばＡｇペーストをボｌティングにより塗
布し、コレットによりペレットを真空吸着（７、コレッ
ト５でＡｇペースト上に押し付けて、ペレットを固着す
る方法がとられるが、単に、このように押し付けただけ
では、Ａｇペーストのぬれ広がりが不光分となり易い。Conventionally, in the process of manufacturing semiconductor devices, one method for bonding semiconductor pellets onto a pellet attachment surface, such as a tab of a lead frame, is to apply a paste-like adhesive, such as Ag paste, onto the tab by bolting. The pellet is vacuum-adsorbed by a collet (7) The pellet is pressed onto the Ag paste using the collet 5 to fix the pellet. However, simply pressing the pellet in this way tends to cause the Ag paste to spread and become opaque.
その為機械的な方法で、ペレットを動かし、ペレットを
ペレット付け面上にこ丁つつけるようにして、丁なわち
スクラブすることにより、Ａｇペーストのぬれ広がりを
確保するようにすることが行なわれる。For this reason, a mechanical method is used to move the pellets so that they stick onto the pellet attachment surface, and then scrubs the pellets to ensure wetting and spreading of the Ag paste. .
かかるペレット付においては、元来、困難な問題を伴な
い易く、接着剤の量が少な丁ざるとペレットとペレット
付け面とは部分的にしか接合されず、ペレットが剥離し
易くなり、ボンディングの信頼性が失われ、一方、接着
剤の量が多丁ぎると、ペビ、ットの押し付け、スクラブ
により接着剤がペレットの上線に廻り込んでペレットの
ポンディングパッド上に付着し、ショート不良を生じ、
歩留の低下を来たしたりする。Such pellet attaching is inherently prone to difficult problems; if the amount of adhesive is too small, the pellet and the pellet attaching surface will only be partially bonded, making it easy for the pellet to peel off, resulting in poor bonding. On the other hand, if the amount of adhesive is too large, the adhesive will get around to the upper line of the pellet due to pressure and scrubbing and adhere to the pellet's bonding pad, causing short circuits. arise,
This may cause a decrease in yield.
近時、ペレットサイズは増々大型化する傾向にあり、そ
うなると、ペーストのぬれが悪（なり、不均一になり易
いし、同時にペレットサイズに対するタブサイズの余裕
がなくなり、上記のごときスクラブをしようとしてもス
クラブが困難となってくる傾向にある。Recently, the pellet size has been increasing, and as a result, the paste tends to have poor wettability (unevenness), and at the same time, there is no margin for the tab size relative to the pellet size, making it difficult to perform the scrubbing described above. It tends to become difficult to scrub.
なお、導電性接着剤を用い１こダイボンディング方式に
ついて述べた文献の例とし、て、工業１４食会発行「電
子材料Ｊ １９８１年１１月ｐ３１〜３５がある。An example of a document describing a single die bonding method using a conductive adhesive is "Electronic Materials J, November 1981, pp. 31-35, published by Kogyo 14 Shokukai.
本発明の目的は、従来のかかるペレット付における問題
を解消し、接着剤を使用してペレット付するような場合
におけろ当該接着剤のぬれ広がりを良好にすることがで
き、これにより、好適なペレット付を行なうことかでき
る技術を提供することにある。An object of the present invention is to solve the problems in conventional pellet attaching, and to improve the wetting and spreading of the adhesive when attaching pellets using an adhesive. The purpose of this invention is to provide a technology that allows for pelletizing.
本発明の他の目的は、ペレットサイズが大型化しても良
好なペレット付けが可能で、スクラブが困難な場合にも
、良好にペレット付することのできる技術を提供するこ
とにある。Another object of the present invention is to provide a technique that allows good pellet attachment even when the pellet size increases and allows good pellet attachment even when scrubbing is difficult.
本発明の前記ならびにそのほかの目的と新規な特徴は、
本明細書の記述および添付図面からあきらかになるであ
ろう。The above and other objects and novel features of the present invention include:
It will become clear from the description of this specification and the accompanying drawings.
本願において開示される発明のうち代表的なものの概要
を簡単に説明子れば、下記のとおりである。A brief overview of typical inventions disclosed in this application is as follows.
丁なわち、本発明では、ペレット付に際し、超音波振動
を付与することにより、接着剤のぬれ広がりを良好にす
ることができ、これによりスクラブを必要としないので
ペレット付することができるし、スクラブと併用すると
より一層接着剤のぬれ広がりを良好にすることができ、
実用上非常に意義のあるペレット付方法に成功した。That is, in the present invention, by applying ultrasonic vibration when attaching pellets, it is possible to improve the wetting and spreading of the adhesive, and as a result, it is possible to attach pellets without the need for scrubbing. When used in conjunction with a scrub, the adhesive can spread even better.
We succeeded in developing a pellet attachment method that is of great practical significance.
次に、本発明の実施例を、図面に基づいて説明する。 Next, embodiments of the present invention will be described based on the drawings.
第１図〜第３図は、本発明によるペレットボンディング
の工程例を説明する説明図で、第１図に示すように、リ
ードフレームのタブ１の上面にディスペンサ２を用いて
、Ａｇペーストからなる接着剤３を滴下して、接着剤層
４を形成し、第２図に示すように、コレット５でペレッ
ト６を真空吸着し、コレット５でペレット６を接着剤層
４に押し付けてペレット６を取付け、第３図に示すよう
に、接着剤層４を例えば１５０〜２００℃で数十分加熱
処理してこの接着剤層４をベーキング（キュア）して硬
化させ、ペレット６をタブ１に固着きせる。FIGS. 1 to 3 are explanatory diagrams for explaining an example of the pellet bonding process according to the present invention. As shown in FIG. Adhesive 3 is dropped to form an adhesive layer 4, and as shown in FIG. Attachment, as shown in FIG. 3, the adhesive layer 4 is heated for several minutes at 150 to 200° C. to bake (cure) and harden the adhesive layer 4, thereby fixing the pellet 6 to the tab 1. I can make it.
その際に、本発明では、例えば第１図において、タブ１
に同図矢標で示す上下超音波振動を与えるか、あるいは
、タブ１に同図矢標で示す左右超音波振動を与えるか、
あるいは、第２図に示すように、コレット５に四図矢標
で示す超音波振動な与え、接着剤３に超音波エネルギー
を伝える。In this case, in the present invention, for example, in FIG.
Either apply vertical ultrasonic vibrations as indicated by the arrows in the figure to Tab 1, or apply horizontal ultrasonic vibrations as indicated by the arrows in the figure to tab 1.
Alternatively, as shown in FIG. 2, the collet 5 is given ultrasonic vibrations as indicated by the arrows in the figure, and the ultrasonic energy is transmitted to the adhesive 3.
かかるペレット付後に、ペレット６の電極部とリードフ
レーム７のインナーリード部８との間をワイヤ例えばＡ
ｕ線９のボンディングにより電気的に接続し、レジン例
えばエポキシ樹脂１０でモールドすることにより封止す
る、主要工程を経て、第４図に示すような、樹脂封止型
半導体装置を得る。After attaching the pellets, a wire such as A is connected between the electrode part of the pellet 6 and the inner lead part 8 of the lead frame 7.
Through the main steps of electrically connecting by bonding the U-wire 9 and sealing by molding with a resin, for example, an epoxy resin 10, a resin-sealed semiconductor device as shown in FIG. 4 is obtained.
（１１本発明によれば、スクラブに代わり、あるいはス
クラブと併用して超音波振動を付与することにより、こ
の超音波エネルギーでＡｇペーストよりなる導電性接着
剤のぬれ広がりを良（することができ、ペレット付が確
実となり、ペレット付の不均一化に起因するペレットク
ラックを防止することができた。(11 According to the present invention, by applying ultrasonic vibration instead of scrubbing or in combination with scrubbing, it is possible to improve the wetting and spreading of the conductive adhesive made of Ag paste with this ultrasonic energy. This made it possible to ensure pellet adhesion and prevent pellet cracks caused by uneven pellet adhesion.
（２）本発明によれば、接着剤の量を少なくしても、超
音波振動により、ぬれ広がりを良くすることができるの
で、かかる量が少ないことによろペレ・ソトとペレット
付け面との部分的接合やそれによるペレットの剥離が低
減し、ボンディングの信頼性を確保できた。(2) According to the present invention, even if the amount of adhesive is reduced, it is possible to improve wetting and spreading due to ultrasonic vibration. Partial bonding and resulting pellet peeling were reduced, ensuring bonding reliability.
また、スクラブに際し接着剤量が多いとペレットから当
該接着剤かはみ吊したりするが、本発明ではスクラブを
省略できるので、かかるはみ出し、それによるショート
不良などが低減できた。Furthermore, if a large amount of adhesive is used during scrubbing, the adhesive may bulge out from the pellet, but in the present invention, scrubbing can be omitted, so such bulge-out and resulting short-circuit defects can be reduced.
（３）本発明によれば、ペレットサイズが大となり、ペ
ーストのぬれが悪く、不均一になり易い場合にも有用な
技術として使用することかでき、ペレットサイズが大き
くなりスクラブすることか困難な場合にも著効がある。(3) According to the present invention, it can be used as a useful technique even when the pellet size is large and the paste has poor wettability and tends to become uneven. It is also effective in cases.
（４）本発明によれば、ぬれ性の向上により、ペレット
の熱抵抗を低減でき、高信頼度の半導体装置を提供する
ことができた。(4) According to the present invention, the thermal resistance of the pellet can be reduced due to the improved wettability, and a highly reliable semiconductor device can be provided.
以上本発明者によってなきれた発明を実施例にもとづき
具体的に説明したが、本発明は上記実施例に限定される
ものではな（、その要旨を逸脱しない範囲で種々変更可
能であることはいうまでもない。Although the invention achieved by the present inventor has been specifically explained above based on examples, the present invention is not limited to the above-mentioned examples (although various changes can be made without departing from the gist of the invention). Needless to say.
例えば前記実施例において、コレットへの超音波振動の
付与とタブへの超音波振動の付与とを併用しても差支え
ない。For example, in the embodiment described above, it is possible to apply ultrasonic vibration to the collet and to apply ultrasonic vibration to the tab together.
本発明は導電性接着剤によるペレーＩト付の他、Ａｕ−
８ｉ 共晶法によるペレット付や半田にょろペレット付
などあらゆるベレー・ト付方法に適用して有用である。In addition to attaching pellet I with a conductive adhesive, the present invention
8i It is useful for applying to all beret attaching methods such as pellet attaching using the eutectic method and solder pellet attaching.
第１図、第２図、及び第３図は本発明の一実施例による
ペレットポンディング方法な示す説明図、第４図は樹脂
封止型半導体装置の一例断面図である。
１・・・タブ、２・・・ディスペンサ、３・・・接着剤
、４・・・接着剤層、５・・・コレット、６・・・ペレ
ット、７・・・リードフレーム、８・・・インナーリー
ド部、９・・・ワイヤ、１０・・・レジン。
第 １ 図
第 ２ 図
第 ３ 図
ｉ、
第 ４ 図1, 2, and 3 are explanatory diagrams showing a pellet-ponding method according to an embodiment of the present invention, and FIG. 4 is a sectional view of an example of a resin-sealed semiconductor device. DESCRIPTION OF SYMBOLS 1...Tab, 2...Dispenser, 3...Adhesive, 4...Adhesive layer, 5...Collet, 6...Pellet, 7...Lead frame, 8... Inner lead part, 9...wire, 10...resin. Figure 1 Figure 2 Figure 3 Figure i, Figure 4
Claims (1)
レット付方法において、当該ペレット付に際し、超音波
振動を付与することを特徴とするペレット付方法。 ２、特許請求の範囲第１項記載のペレット付方法におい
て、リードフレームのタブ面上に銀ペーストを塗布し、
コレットで真空吸着したペレットを上記タブ面に押し付
けペレット付する際に、コレットまたはタブに超音波振
動を付与することを特徴とする、特許請求の範囲第１項
記載のペレット付方法。[Claims] 1. A pellet attaching method for fixing a semiconductor pellet onto a pellet attaching surface, the pellet attaching method comprising applying ultrasonic vibration during the pellet attaching. 2. In the pellet attaching method according to claim 1, applying silver paste on the tab surface of the lead frame,
2. The pellet attaching method according to claim 1, wherein ultrasonic vibrations are applied to the collet or the tab when the pellets vacuum-adsorbed by the collet are pressed against the tab surface to attach the pellets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60184126A JPS6245133A (en) | 1985-08-23 | 1985-08-23 | Pellet mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60184126A JPS6245133A (en) | 1985-08-23 | 1985-08-23 | Pellet mounting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6245133A true JPS6245133A (en) | 1987-02-27 |
Family
ID=16147829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60184126A Pending JPS6245133A (en) | 1985-08-23 | 1985-08-23 | Pellet mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6245133A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02177497A (en) * | 1988-12-28 | 1990-07-10 | Sumitomo Bakelite Co Ltd | Manufacture of flexible printed wiring board |
| JP2011249801A (en) * | 2010-05-27 | 2011-12-08 | Semikron Elektronik Gmbh & Co Kg | Low temperature compression sinter joining method of two junction devices and constitution body manufactured by the same |
-
1985
- 1985-08-23 JP JP60184126A patent/JPS6245133A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02177497A (en) * | 1988-12-28 | 1990-07-10 | Sumitomo Bakelite Co Ltd | Manufacture of flexible printed wiring board |
| JPH0542156B2 (en) * | 1988-12-28 | 1993-06-25 | Sumitomo Bakelite Co | |
| JP2011249801A (en) * | 2010-05-27 | 2011-12-08 | Semikron Elektronik Gmbh & Co Kg | Low temperature compression sinter joining method of two junction devices and constitution body manufactured by the same |
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