JPS6236217Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a metal bottom plate with four or more airtight terminals, and particularly to a metal bottom plate suitable for soldering using a solder dipping method.

FIG. 1 shows a state in which a container using a conventional metal bottom plate is soldered and connected to a predetermined printed circuit board. It is a part of a metal container 3 in which the internal airtightness is ensured by placing the flange portions of the two on each other by resistance welding or cold pressure welding, or by soldering the two together. Four airtight terminals 4, 5, 6, and 7 are implanted in this metal bottom plate 1, and among them, the airtight terminals 4, 5, and 6 are placed in a hole drilled in the metal bottom plate 1 with the metal terminal 8 in the center. , insulation is obtained from the metal bottom plate by interposing an insulating material 9 such as ceramic, and the airtight terminal 7 is obtained by interposing a conductive fixing agent 10 such as silver brazing or high melting point soldering to the metal terminal 8. They are electrically connected to the metal bottom plate 1 and fixed through the metal bottom plate 1, respectively. For example, in the case of an oscillator, these four airtight terminals 4 to 7 are
Airtight terminal 4 is power supply, 5 is output, 6 is disconnected and 7
is used as each terminal for grounding.

Such a metal container 3 has its respective airtight terminals 4 to
In recent years, this printed circuit board 11 has been soldered to a predetermined printed circuit board 11 through terminal insertion holes 12, 13, 14, and 15.
For m, the IC standard 0.1 inch (=2.54 mm) is 1
The unit length p is selected to be an integral multiple of 3 or more, such as l=5p and m=3p, for standardization. Although not shown, the printed circuit board 11 is provided with predetermined printed wiring as well as around the terminal insertion holes 12 to 15.

Then, this printed circuit board 11 is attached to the metal container 3
After each of the airtight terminals 4 to 7 is inserted into the terminal insertion holes 12 to 15, they are soldered to the surface opposite to the metal container 3 (top surface in the drawing) using a solder dipping method. This solder dipping method has been widely used recently because all connections are made at once and it is suitable for mass production.

However, according to this solder dipping method, although the metal terminals 8 are connected as specified by the soldering 17, the printed circuit board 11 has no insertion holes (first
Since a large number of holes 16 (indicated by dots in the figure) are scattered, solder 18 also infiltrates into these non-insertion holes 16, and the solder 18 and metal The bottom plate 1 tended to shoot out.
In this shot, since the solder 18 is connected to the printed wiring and the metal bottom plate 1 is connected to ground, the power supply line or the signal line is damaged or abnormal.

An object of the present invention is to provide a metal bottom plate with an airtight terminal without the above-mentioned shot, and the present invention will be described below with reference to the drawings of the embodiments.

3A and 3B are a bottom view and a side view of an embodiment of the present invention, showing a metal container 3 formed by sealing a metal cover 2 to a metal bottom plate 1;
The metal cover 2 and the airtight terminals 4 to 7 embedded in the metal bottom plate 1 are the same as those shown in FIG. Convex portions 20, 21, 22, and 23 made of insulating materials such as the above are attached to predetermined areas to be described later. These convex portions 20 to 23 are the third
As shown in FIG. 7, which is a right half sectional view taken along line A-A in FIG. The height h of this protrusion is from 0.4 to the hole diameter _φ1 .
In this example, h=0.8 mm and φ=1.8 mm. This height h is between the printed circuit board 11 and the metal bottom plate 1.
0.5mm or more is required because it provides a gap between the

The center positions of such convex portions 20 to 23 are located at the third
As shown in Figure A, the center lines of the airtight terminals 4 to 7 are set to be common, l' = 4p = 10.16 mm, and m' = 2p = 5.08 mm. These dimensions l' and m' are the mutual spacing dimensions of each airtight terminal 4 to 7 (l = 6p = 15.24 mm, m =
Right angle 4 drawn by connecting the 4 points of 3p=7.62mm)
For the lengths l and m of the four sides of the rectangle, l'/l=
It has a length of 4p/6p=2/3 and m'/m=2p/3p=2/3, and is located on the diagonal of the right quadrilateral.

Therefore, the convex portions 20 to 23 at such positions
can be stably installed on the printed circuit board 11, and in soldering by the solder dipping method described above, the metal bottom plate 1 and the printed circuit board 11 are connected to the protrusions 20 to 23 as shown in FIGS. 4 and 5. Since the soldering is performed with a distance of height h between the terminals 17 and 17, the soldering is performed not only on the solder soaked surface side but also on the metal bottom plate 1 side for each airtight terminal 4 to 7.
This can be carried out sufficiently, and it is possible to ensure that the solder 18 that has entered the non-insertion hole 16 does not come into contact with the metal bottom plate 1.

Regarding the installation range of the protrusions 20 to 23 according to the present invention, as shown in FIG.
Set the positional intervals l and m of 2 to 15 to the maximum l _nax and m _nax , and make the center line of each of the four sides of the right quadrilateral based on these positional intervals l and m common and 1/3 the length of each of the four sides. In other words, when l/3 and m/3 are set to the minimum values l _nio and m _nio , respectively, and lines are drawn parallel to each center line by the length of these minimum values, each of the insertion holes 12 to 15 Among the four small right-angled quadrilateral areas formed at the four corners of the right-angled quadrilateral formed by connecting wires at the center, the diameter of the hole through which the insulating material or silver brazing of the airtight terminals 4 to 7 is interposed is _φ2. In this example, since t=1.5 mm, the area is limited to an area separated by a distance Δl equal to or more than 0.75 mm from the metal bottom plate 1 by a distance Δl equal to or more than 1/2 of the thickness t of the metal bottom plate 1. The reason for separating this Δl is to satisfy the processing conditions of the holes in which the convex portions 20 to 23 are buried.

Therefore, the installation range of the protrusions 20 to 23 of the present invention is the shaded area in FIG. 6B on the printed circuit board 11. Since the solder 18 intrudes into the non-inserted hole portions of the hatched portions, it is preferable to leave them out if glass, which is weak in heat resistance, is used as the insulating material for the convex portions 20 to 23. Note that FIG. 6A shows the convex portion 20 according to the embodiment shown in FIGS. 3 to 5.
The position is indicated by a dotted line on the printed circuit board 11.

Incidentally, FIG. 7 shows a half-sectional view of the metal bottom plate of the present invention.

As described above, according to the present invention, it is possible to improve the soldering of hermetic terminals and to prevent shortening of the metal bottom plate, and therefore, the present invention has great practical value in the solder dipping method.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing a state in which a metal container using a conventional metal bottom plate with an airtight terminal is connected to a printed circuit board, Fig. 2 is a side view after soldering, and Fig. 3 is an embodiment of the present invention. 4 and 5 are side views after soldering, and FIG. 6 shows the position of the convex portion as seen from above the printed circuit board. B is a plan view of the embodiment and a plan view showing the installation range of the present invention, and FIG. 7 is a right half sectional view showing the metal bottom plate according to the embodiment of the present invention. 1... Metal bottom plate, 4, 5, 6, 7... Airtight terminal, 20, 21, 22, 23... Convex portion.

Claims (1)

[Scope of Claim for Utility Model Registration] (1) Four airtight terminals installed in four holes drilled in a metal bottom plate are located at four vertices of a right-angled quadrilateral, and the dimensions of the four sides are The four right-angled sides are divided into parallel lines with a common center line of 1/3 or more of the length of the four sides, with each unit length being an integer multiple of 3 or more. Among the four small right-angled quadrilateral areas formed at the four corners of the shape, an insulating material is placed in each area separated from the periphery of the hole of the airtight terminal by a distance of at least 1/2 of the thickness of the metal bottom plate. 1. A metal bottom plate with an airtight terminal, characterized in that a convex portion consisting of: is attached to the bottom surface of the metal bottom plate. (2) Claim 1 of the utility model registration claim is characterized in that the convex portion is embedded in four holes newly opened in the metal bottom plate and protrudes from the bottom surface of the metal bottom plate in a hemispherical shape. Metal bottom plate with airtight terminals. (3) In paragraph 1 or 2 of claims for utility model registration, the convex portion is 0.5 mm from the bottom surface of the metal bottom plate.
A metal bottom plate with an airtight terminal, characterized in that it protrudes from above. (4) The metal bottom plate with an airtight terminal according to claim 1, 2, or 3 of the utility model registration claim, characterized in that the convex portion is located on a diagonal of the right quadrilateral.