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JPS6232558U - - Google Patents

Info

Publication number
JPS6232558U
JPS6232558U JP12260585U JP12260585U JPS6232558U JP S6232558 U JPS6232558 U JP S6232558U JP 12260585 U JP12260585 U JP 12260585U JP 12260585 U JP12260585 U JP 12260585U JP S6232558 U JPS6232558 U JP S6232558U
Authority
JP
Japan
Prior art keywords
molded
light
step surface
chip
optical element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12260585U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12260585U priority Critical patent/JPS6232558U/ja
Publication of JPS6232558U publication Critical patent/JPS6232558U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図および第２図は本考案の一実施例の光素
子の上面図および側面図、第３図および第４図は
第１図、第２図に示した光素子を回路基板に搭載
し光コネクタと接続させた状態の断面図、第５図
は、従来の樹脂モールドタイプ光素子の一例を示
す上面図および側面図、第６図は第５図に示した
光素子を回路基板に搭載した断面図である。 １……光素子、６……段差部、７……リード端
子、２……樹脂モールド、９……回路パターン、
３……光フアイバー、４……回路基板。 1 and 2 are top and side views of an optical device according to an embodiment of the present invention, and FIGS. 3 and 4 show the optical device shown in FIGS. 1 and 2 mounted on a circuit board. 5 is a top view and side view showing an example of a conventional resin mold type optical device; FIG. 6 is a cross-sectional view of the optical device connected to an optical connector; FIG. 6 is a diagram showing the optical device shown in FIG. 5 mounted on a circuit board. FIG. 1... Optical element, 6... Step portion, 7... Lead terminal, 2... Resin mold, 9... Circuit pattern,
3...Optical fiber, 4...Circuit board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 発光素子および受光素子を透明な樹脂でモール
ドすることにより光を透過し、かつ気密封止され
る樹脂モールドタイプの光素子において、チツプ
部のモールドをチツプの軸中心と一致するようほ
円柱形にモールドし、光素子を実装するための回
路基板に加工された円柱部のガイド穴に所定の寸
法だけ挿入できるように段差を設け、段差面と同
じ位置に段差面と平行にリード線を取り出すこと
を特徴とした光素子。 In a resin-molded optical device in which the light-emitting element and the light-receiving element are molded with a transparent resin to transmit light and are hermetically sealed, the mold of the chip part is made into a nearly cylindrical shape so that it coincides with the axial center of the chip. A step is provided so that a predetermined dimension can be inserted into a guide hole of a cylindrical part that is molded and processed into a circuit board for mounting an optical element, and a lead wire is taken out in parallel to the step surface at the same position as the step surface. An optical element featuring
JP12260585U 1985-08-12 1985-08-12 Pending JPS6232558U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12260585U JPS6232558U (en) 1985-08-12 1985-08-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12260585U JPS6232558U (en) 1985-08-12 1985-08-12

Publications (1)

Publication Number Publication Date
JPS6232558U true JPS6232558U (en) 1987-02-26

Family

ID=31012950

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12260585U Pending JPS6232558U (en) 1985-08-12 1985-08-12

Country Status (1)

Country Link
JP (1) JPS6232558U (en)

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