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JPS6230367U - - Google Patents

Info

Publication number
JPS6230367U
JPS6230367U JP1985120259U JP12025985U JPS6230367U JP S6230367 U JPS6230367 U JP S6230367U JP 1985120259 U JP1985120259 U JP 1985120259U JP 12025985 U JP12025985 U JP 12025985U JP S6230367 U JPS6230367 U JP S6230367U
Authority
JP
Japan
Prior art keywords
power supply
wiring board
power
contact pads
pins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985120259U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985120259U priority Critical patent/JPS6230367U/ja
Priority to US06/893,209 priority patent/US4742385A/en
Priority to FR868611450A priority patent/FR2586140B1/fr
Publication of JPS6230367U publication Critical patent/JPS6230367U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の一実施例を適用した高密度
集積回路パツケージの給電構造を示す縦断面図、
第２図は同上集積回路パツケージを取出して示す
一部切欠斜視図であり、また第３図は従来例によ
る高密度集積回路パツケージの給電構造を示す縦
断面図である。 １…集積回路パツケージ、２…セラミツク配線
基板、３…回路素子、４…カバー、５…ヒートシ
ンク、６…コンタクトパツド、７…プリント基板
、９…コネクタピン、１１…パワーピン、１４…
パワーソケツト。

Claims (1)

    【実用新案登録請求の範囲】
  1. 一方の面に複数の回路素子を実装し、他方の面
    にヒートシンクを設けた配線基板を有し、この配
    線基板上には、回路素子側での中央部にあつて、
    少なくとも１個以上の電源供給用のパワーピンを
    突出させ、かつ周辺部にあつて、電源供給および
    信号伝達用の各コンタクトパツドを配し、また前
    記配線基板を搭載して装置させるプリント基板上
    には、前記各コンタクトパツドを接続させる各コ
    ネクタピン、および前記パワーピンを接続させる
    パワーソケツトを設けたことを特徴とする高密度
    集積回路パツケージの給電構造。
JP1985120259U 1985-08-07 1985-08-07 Pending JPS6230367U (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP1985120259U JPS6230367U (ja) 1985-08-07 1985-08-07
US06/893,209 US4742385A (en) 1985-08-07 1986-08-05 Multichip package having outer and inner power supply means
FR868611450A FR2586140B1 (fr) 1985-08-07 1986-08-07 Boitier multi-puces comportant un moyen d'alimentation interieur et exterieur

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985120259U JPS6230367U (ja) 1985-08-07 1985-08-07

Publications (1)

Publication Number Publication Date
JPS6230367U true JPS6230367U (ja) 1987-02-24

Family

ID=14781773

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985120259U Pending JPS6230367U (ja) 1985-08-07 1985-08-07

Country Status (3)

Country Link
US (1) US4742385A (ja)
JP (1) JPS6230367U (ja)
FR (1) FR2586140B1 (ja)

Families Citing this family (40)

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US4816896A (en) * 1988-02-01 1989-03-28 Motorola Inc. Compliant standoff for semiconductor packages
US5184211A (en) * 1988-03-01 1993-02-02 Digital Equipment Corporation Apparatus for packaging and cooling integrated circuit chips
EP0332560B1 (en) * 1988-03-11 1994-03-02 International Business Machines Corporation Elastomeric connectors for electronic packaging and testing
JP2509285B2 (ja) * 1988-03-18 1996-06-19 富士通株式会社 半導体装置の試験方法
US5159433A (en) * 1989-04-20 1992-10-27 Sanyo Electric Co., Ltd. Hybrid integrated circuit device having a particular casing structure
US5053920A (en) * 1989-06-09 1991-10-01 Digital Equipment Corporation Integrated power conversion
US5045921A (en) * 1989-12-26 1991-09-03 Motorola, Inc. Pad array carrier IC device using flexible tape
JPH0777258B2 (ja) * 1990-03-16 1995-08-16 株式会社東芝 半導体装置
JP2657429B2 (ja) * 1990-04-09 1997-09-24 株式会社ミクロ技術研究所 基板の回路実装方法及びその方法に使用する回路基板
JP3082323B2 (ja) * 1991-07-30 2000-08-28 ソニー株式会社 メモリモジュール
US5212406A (en) * 1992-01-06 1993-05-18 Eastman Kodak Company High density packaging of solid state devices
US5808357A (en) 1992-06-02 1998-09-15 Fujitsu Limited Semiconductor device having resin encapsulated package structure
JP2541487B2 (ja) * 1993-11-29 1996-10-09 日本電気株式会社 半導体装置パッケ―ジ
US5519201A (en) * 1994-04-29 1996-05-21 Us3, Inc. Electrical interconnection for structure including electronic and/or electromagnetic devices
JP2920066B2 (ja) * 1994-05-19 1999-07-19 株式会社東芝 半導体装置及びその製造方法
KR100206893B1 (ko) * 1996-03-11 1999-07-01 구본준 반도체 패키지 및 그 제조방법
US6750527B1 (en) * 1996-05-30 2004-06-15 Kabushiki Kaisha Toshiba Semiconductor integrated circuit device having a plurality of wells, test method of testing the semiconductor integrated circuit device, and test device which executes the test method
JPH1070243A (ja) * 1996-05-30 1998-03-10 Toshiba Corp 半導体集積回路装置およびその検査方法およびその検査装置
FR2754390A1 (fr) * 1996-10-07 1998-04-10 Gec Alsthom Transport Sa Module de puissance a composants electroniques semi-conducteurs de puissance et interrupteur de forte puissance comportant au moins un tel module de puissance
US6181008B1 (en) * 1998-11-12 2001-01-30 Sarnoff Corporation Integrated circuit power supply
US6947293B2 (en) * 1999-07-15 2005-09-20 Incep Technologies Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management
US20030214800A1 (en) * 1999-07-15 2003-11-20 Dibene Joseph Ted System and method for processor power delivery and thermal management
US6623279B2 (en) 1999-07-15 2003-09-23 Incep Technologies, Inc. Separable power delivery connector
US6801431B2 (en) * 1999-07-15 2004-10-05 Incep Technologies, Inc. Integrated power delivery and cooling system for high power microprocessors
US6556455B2 (en) 1999-07-15 2003-04-29 Incep Technologies, Inc. Ultra-low impedance power interconnection system for electronic packages
US6847529B2 (en) * 1999-07-15 2005-01-25 Incep Technologies, Inc. Ultra-low impedance power interconnection system for electronic packages
US20030156400A1 (en) * 1999-07-15 2003-08-21 Dibene Joseph Ted Method and apparatus for providing power to a microprocessor with intergrated thermal and EMI management
US6452113B2 (en) * 1999-07-15 2002-09-17 Incep Technologies, Inc. Apparatus for providing power to a microprocessor with integrated thermal and EMI management
US7138708B2 (en) * 1999-09-24 2006-11-21 Robert Bosch Gmbh Electronic system for fixing power and signal semiconductor chips
CA2400568A1 (en) * 2000-02-18 2001-09-07 David Hartke Method and apparatus for providing power to a microprocessor with integrated thermal and emi management
US7167379B2 (en) * 2001-02-16 2007-01-23 Dibene Ii Joseph T Micro-spring interconnect systems for low impedance high power applications
US20020117748A1 (en) * 2001-02-28 2002-08-29 Avery Leslie Ronald Integrated circuit power supply
US6580613B2 (en) * 2001-07-17 2003-06-17 Infineon Technologies Ag Solder-free PCB assembly
DE10142971A1 (de) * 2001-09-01 2003-03-27 Eupec Gmbh & Co Kg Leistungshalbleitermodul
US6845013B2 (en) * 2002-03-04 2005-01-18 Incep Technologies, Inc. Right-angle power interconnect electronic packaging assembly
US7258552B2 (en) * 2005-07-05 2007-08-21 Hewlett-Packard Development Company, L.P. Socket for holding a circuit board module
DE102006022107A1 (de) * 2006-05-11 2007-11-15 Siemens Ag Österreich Anordnung einer Leiterplatte und einem dazu in einem festen Abstand gehaltenen Kontaktträger
US8796842B2 (en) * 2010-08-20 2014-08-05 Ati Technologies Ulc Stacked semiconductor chip device with thermal management circuit board
US8737080B2 (en) * 2011-01-14 2014-05-27 Qualcomm Incorporated Modular surface mount package for a system on a chip
US8636535B1 (en) * 2012-07-11 2014-01-28 Hon Hai Precision Industry Co., Ltd. Electrical connector having metallic shields to avoid EMI for CPU

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4082394A (en) * 1977-01-03 1978-04-04 International Business Machines Corporation Metallized ceramic and printed circuit module
US4127830A (en) * 1977-05-26 1978-11-28 Raytheon Company Microstrip switch wherein diodes are formed in single semiconductor body
JPS54132166A (en) * 1978-04-05 1979-10-13 Nec Corp Socket for semiconductor device
DE2940593A1 (de) * 1979-10-06 1981-04-16 Ibm Deutschland Gmbh, 7000 Stuttgart Mehrlagen-modul mit konstantem wellenwiderstand
DE3235839A1 (de) * 1982-09-28 1984-03-29 Siemens AG, 1000 Berlin und 8000 München Halbleiterschaltung
JPS5984455A (ja) * 1982-11-05 1984-05-16 Nec Corp 高密度メモリパツケ−ジ
US4583111A (en) * 1983-09-09 1986-04-15 Fairchild Semiconductor Corporation Integrated circuit chip wiring arrangement providing reduced circuit inductance and controlled voltage gradients

Also Published As

Publication number Publication date
US4742385A (en) 1988-05-03
FR2586140A1 (fr) 1987-02-13
FR2586140B1 (fr) 1990-06-29

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