JPS6228245A - Manufacture of laminated board - Google Patents
Manufacture of laminated boardInfo
- Publication number
- JPS6228245A JPS6228245A JP60167959A JP16795985A JPS6228245A JP S6228245 A JPS6228245 A JP S6228245A JP 60167959 A JP60167959 A JP 60167959A JP 16795985 A JP16795985 A JP 16795985A JP S6228245 A JPS6228245 A JP S6228245A
- Authority
- JP
- Japan
- Prior art keywords
- laminate
- pressure
- shrinkage
- manufacture
- laminated board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
- B29K2105/08—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts of continuous length, e.g. cords, rovings, mats, fabrics, strands or yarns
- B29K2105/0854—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts of continuous length, e.g. cords, rovings, mats, fabrics, strands or yarns in the form of a non-woven mat
Landscapes
- Laminated Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、プリント回路板製造等の加工工程において寸
法収縮の少ない積層板の製造法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for manufacturing a laminate with little dimensional shrinkage during processing steps such as manufacturing printed circuit boards.
従来の技術
積層板は、周知のごとく熱硬化性樹脂を、紙、ガラスク
ロス、布等の基材に含浸乾燥−させＢステージ化したプ
リプレグを必要枚数重ね、これを加熱加圧し樹脂を硬化
させた後加圧状態のまま冷却して製造される。Conventional technology laminates are made by stacking the necessary number of prepregs made by impregnating and drying thermosetting resin into a base material such as paper, glass cloth, cloth, etc. to form a B stage, and then applying heat and pressure to harden the resin. After that, it is manufactured by cooling while still under pressure.
発明が解決しようとする問題点
しかしながら、高温高圧で成形されている積層板が高圧
下で冷却されると、積層板の冷却過木友
程での熱収縮が抑制されるため、プリント回本製造等の
加工工程においで寸法収縮が生じ、回路加工工程では回
路の位置ずれが生じていた。Problems to be Solved by the Invention However, when a laminate that has been molded at high temperature and pressure is cooled under high pressure, thermal shrinkage of the laminate as it cools is suppressed, making it difficult to produce printed sheets. Dimensional shrinkage occurred during the processing steps such as the above, and positional displacement of the circuit occurred during the circuit processing step.
本発明は、上記のような加工工程における寸法収縮を抑
制した積層板の製造法を提供するものでちる。The present invention provides a method for manufacturing a laminate in which dimensional shrinkage during the processing steps as described above is suppressed.
問題を解決するための手段
本発明は、かかる問題点を解決するために詳細な検討を
行なった結果、積層板の成形硬化終了後１Ｏｋｙ／ｃｒ
ｔｔ以下の圧力で５分間以上さらに加熱を続け、その後
冷却を行なう事により、寸法収縮の小さい積層板を提供
できろことを見い出した。Means for Solving the Problems As a result of detailed studies to solve these problems, the present invention has developed
It has been found that a laminate with small dimensional shrinkage can be provided by continuing heating for 5 minutes or more at a pressure of tt or less and then cooling.
作用
熱硬化性樹脂の硬化終了後、１Ｑｋｆ／ｍ以下の圧力で
さらに加熱を行なう事により、圧力による束縛が少ガい
状態で硬化収縮及び熱収縮を行ｒｘう事ができ、プリン
ト回路板製造等積層板の加工工程における寸法収縮を小
さくできると考えられる。Function After curing of the thermosetting resin is completed, by further heating at a pressure of 1Qkf/m or less, curing shrinkage and heat shrinkage can be performed with less constraint due to pressure, which is useful for printed circuit board production. It is thought that dimensional shrinkage in the processing process of equal laminates can be reduced.
硬化終了後の圧力がｒＯｋｐ／ｃｍ以上であると、硬化
収縮及び熱収縮が圧力によって束縛され、プリント回路
板製造等の加工時、寸法収縮がおこる。また、積層板の
硬化終了後ＬＱ ｋｇ ／ｃｒｄ以下の圧力で加熱する
時間が５分より短いと硬化収縮及び熱収縮が十分に行な
われず、プリント回路板製造等の加工時の寸法収縮を抑
える事ができζい。一方、長く加熱することは差しつか
え直いが、６０分を越えて加熱したものは、６０分間加
熱したものと同程度の寸法収縮でちり、成形加熱時間が
長くμるだ・け生産効率が低下する。If the pressure after curing is rOkp/cm or more, curing shrinkage and thermal shrinkage are restricted by the pressure, and dimensional shrinkage occurs during processing such as manufacturing printed circuit boards. In addition, if the time of heating the laminate at a pressure below LQ kg/crd after curing is shorter than 5 minutes, curing shrinkage and heat shrinkage will not occur sufficiently, making it difficult to suppress dimensional shrinkage during processing such as manufacturing printed circuit boards. I can do it. On the other hand, it is okay to heat for a long time, but if the product is heated for more than 60 minutes, the size shrinks to the same extent as the product heated for 60 minutes and the production efficiency decreases as the molding heating time increases. descend.
一般に、成形工程中の積層板は、樹脂の硬化が進むにつ
れて誘電率が低下してくる。本発明における硬化終了時
点は誘電率の低下が５幅以下にＢっだ時点を基準とした
。Generally, the dielectric constant of a laminate during the molding process decreases as the resin hardens. In the present invention, the curing completion point is defined as the point in time when the dielectric constant decreases to 5 or less.
実施例
本発明に用いる積層板用基材は、紙、天然繊維、有機合
成繊維、無機繊維等の織布、不織布やマットでちり、特
に限定しない。また、使用する樹脂は、エポキシ樹脂、
フェノールｍ ＩＩＷ、ボ１７エステル樹脂、メラミン
樹脂、ポリイミド樹脂等の熱硬化性樹脂でちって、限定
されるものではない。Examples The base material for the laminate used in the present invention may be paper, woven fabrics such as natural fibers, organic synthetic fibers, inorganic fibers, nonwoven fabrics, matte dust, etc., and is not particularly limited. In addition, the resins used are epoxy resin,
It is not limited to thermosetting resins such as phenol m IIW, bo-17 ester resin, melamine resin, polyimide resin, etc.
また用途により銅箔を積層板の表面に一体化する場合と
しない場合がちるが、これによっても限定はされない。Furthermore, depending on the application, the copper foil may or may not be integrated into the surface of the laminate, but this is not a limitation either.
実施例１〜４Examples 1-4
Claims (1)
リプレグを必要枚数重ね、これを加熱加圧する工程にお
いて、積層板の成形硬化終了後１０ｋｇ／ｃｍ＾２以下
の圧力で５分間以上さらに加熱を続け、その後冷却を行
なうことを特徴とする積層板の製造法。In the process of impregnating and drying a thermosetting resin into a base material, stacking the necessary number of B-staged prepregs, and heating and pressing them, after the laminate is molded and cured, it is further heated for 5 minutes or more at a pressure of 10 kg/cm^2 or less. A method for producing a laminate, characterized by continuous heating and subsequent cooling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60167959A JPS6228245A (en) | 1985-07-30 | 1985-07-30 | Manufacture of laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60167959A JPS6228245A (en) | 1985-07-30 | 1985-07-30 | Manufacture of laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6228245A true JPS6228245A (en) | 1987-02-06 |
Family
ID=15859212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60167959A Pending JPS6228245A (en) | 1985-07-30 | 1985-07-30 | Manufacture of laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6228245A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08218401A (en) * | 1994-12-14 | 1996-08-27 | Masu Kouzou Kikaku:Kk | Block for lean type retaining wall and construction method of lean type retaining wall in which the block is used |
| JP2008124312A (en) * | 2006-11-14 | 2008-05-29 | Hitachi Chem Co Ltd | Manufacturing methods of double-sided substrate, and multilayer substrate |
| WO2008117711A1 (en) * | 2007-03-27 | 2008-10-02 | Panasonic Electric Works Co., Ltd. | Metal-plated laminated board, multilayer laminated board and method for manufacturing the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57203548A (en) * | 1981-06-09 | 1982-12-13 | Matsushita Electric Works Ltd | Manufacture of laminated board |
| JPS58199151A (en) * | 1982-05-18 | 1983-11-19 | 東芝ケミカル株式会社 | Manufacture of laminated board for chemical plating |
-
1985
- 1985-07-30 JP JP60167959A patent/JPS6228245A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57203548A (en) * | 1981-06-09 | 1982-12-13 | Matsushita Electric Works Ltd | Manufacture of laminated board |
| JPS58199151A (en) * | 1982-05-18 | 1983-11-19 | 東芝ケミカル株式会社 | Manufacture of laminated board for chemical plating |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08218401A (en) * | 1994-12-14 | 1996-08-27 | Masu Kouzou Kikaku:Kk | Block for lean type retaining wall and construction method of lean type retaining wall in which the block is used |
| JP2008124312A (en) * | 2006-11-14 | 2008-05-29 | Hitachi Chem Co Ltd | Manufacturing methods of double-sided substrate, and multilayer substrate |
| WO2008117711A1 (en) * | 2007-03-27 | 2008-10-02 | Panasonic Electric Works Co., Ltd. | Metal-plated laminated board, multilayer laminated board and method for manufacturing the same |
| JP2008307886A (en) * | 2007-03-27 | 2008-12-25 | Panasonic Electric Works Co Ltd | Metal-clad laminated board, multilayer laminated board and method for manufacturing the same |
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