JPS62268199A - Forced air cooling type electric equipment container - Google Patents
Forced air cooling type electric equipment containerInfo
- Publication number
- JPS62268199A JPS62268199A JP11300486A JP11300486A JPS62268199A JP S62268199 A JPS62268199 A JP S62268199A JP 11300486 A JP11300486 A JP 11300486A JP 11300486 A JP11300486 A JP 11300486A JP S62268199 A JPS62268199 A JP S62268199A
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- cooled
- wind tunnel
- cooling air
- forced air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims description 53
- 239000004065 semiconductor Substances 0.000 claims description 29
- 230000000694 effects Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Landscapes
- Power Conversion In General (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、半導体素子等３便用する強制風冷式の電気
機器の冷却装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a forced air cooling type electric equipment cooling device for three times semiconductor devices, etc.
サイリスター、トランジスター等の電力半導体素子を用
いた半導体装置においては、半導体素子を定格温度以下
で使用するため、強制風冷することが行なわれる。BACKGROUND ART In semiconductor devices using power semiconductor elements such as thyristors and transistors, forced air cooling is performed to use the semiconductor elements at a temperature below the rated temperature.
第２図、第８図は従来のこの種の冷：ｔｌ［ｌ装置を示
すもので、図において、１は収納盤、２は半導体スタッ
ク、３は半導体モジュール・４は冷却フィン、５は風洞
、６は強制冷却下るための冷却ファン、７は盤の前面に
配置された冷却風人口、８は上回の冷却風出口、９は制
御器具□、１０は半導体以外の被冷却体である。Figures 2 and 8 show this type of conventional cooling:tl[l device. In the figures, 1 is a storage board, 2 is a semiconductor stack, 3 is a semiconductor module, 4 is a cooling fin, and 5 is a wind tunnel. , 6 is a cooling fan for forced cooling, 7 is a cooling air outlet placed in front of the panel, 8 is an upper cooling air outlet, 9 is a control device □, and 10 is an object to be cooled other than a semiconductor.
次に動作について説明する。冷却ファン６によって冷却
風人ロアよっ矢印の如（吸入された冷却風は、風洞５、
冷却フィン４・半導体スタック２、半導体以外の被冷却
体１０の順で上昇し、これらを強制冷却する。Next, the operation will be explained. The cooling air is drawn in by the cooling fan 6 as shown by the arrow in the wind tunnel 5,
The cooling fins 4, the semiconductor stack 2, and the object to be cooled 10 other than the semiconductor are raised in this order to forcibly cool them.
従来の強制風冷形の半導体装置は以上のように構成され
ているため、冷却風は上部に上がるほど温度上昇し、こ
のため第２図において半導体８２ツク２は電流を低減し
て使用しなければならず、大きい容量のものが必要とな
っていた０又・風洞以外の部分に冷却風が流れないため
、制御器具９に温度管理が必要な工ａ等がある場合は盤
内温度上昇を抑えるため冷却ファンを別に追加する必要
がある等の欠点があった。Since the conventional forced air cooling type semiconductor device is configured as described above, the temperature of the cooling air rises as it rises to the top, so the semiconductor device 82 in FIG. 2 must be used with a reduced current. If the control equipment 9 has work such as a that requires temperature control, it is necessary to prevent the temperature inside the panel from rising. There were drawbacks such as the need to add a separate cooling fan to reduce the noise.
この発明は上記のような従来のものの欠点を除去下るた
めになされたもので、１台の冷却ファンで盤内の冷却風
を並列に流下ことにより、効率的に被冷却体を冷却でき
る装置を捷供するものである。This invention was made in order to eliminate the drawbacks of the conventional ones as described above, and it provides a device that can efficiently cool the object to be cooled by flowing cooling air inside the panel in parallel with one cooling fan. It is something to be offered.
この発明に係る収納装置は、半導体装置などの唄数の被
冷却体を盤内の上部と下部に配置するとともに、下部汲
冷却体の上部に風洞を接続し、この風洞の側面に吸入口
を介して上部彼冷却体を配置し、かつ風洞の上部に１台
のファンを接続したものである。In the storage device according to the present invention, objects to be cooled, such as semiconductor devices, are placed in the upper and lower parts of the board, and a wind tunnel is connected to the upper part of the lower cooling body, and an inlet is provided on the side of the wind tunnel. A cooling body is placed through the upper part of the wind tunnel, and one fan is connected to the upper part of the wind tunnel.
〔作用〕
この発明では、１台の冷却ファンで冷却風を並列に流下
ことにより、榎数の被冷却体を夫々温度上昇していない
新しい冷却風で冷却することができるので効率が良く、
しかも両方に流れる風量のバランスを調整できる。[Function] In this invention, by flowing cooling air in parallel with one cooling fan, it is possible to cool a number of objects to be cooled with new cooling air whose temperature has not increased, so it is efficient.
What's more, you can adjust the balance of air flow to both sides.
以下この発明の一実施例を図について説明下る〇第１図
において、１．３．４．７、訳９．１０の配置は上記従
来例のものと同様であるので説明を省略する。■は冷却
フィン４の上部に配置された風洞であり、この風洞の下
部に冷却風吸入口ツを介して半導体スタックじが配置さ
れ、かつ風洞上部にはファン１４が接続されている。An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, the arrangement of 1.3.4.7 and 9.10 is the same as that of the conventional example, so the explanation will be omitted. 3 is a wind tunnel placed above the cooling fins 4; a semiconductor stack is placed at the bottom of this wind tunnel via a cooling air intake port; and a fan 14 is connected to the top of the wind tunnel.
次ニその動作について説明する。冷却ファン１４により
盤内に取入れられた冷却風Ａは半導体モジュール３を冷
却するための冷却風Ｂと、半導体スタック１３を冷却す
るための冷却風Ｃとに並列に流れる。このため半導体ス
タック１３に流れる冷却風０は温度上昇しておらず、半
導体スタック１３シこは従来装置に比べ電流を多く流下
ことができる。又制御器具９に温度管理が必要な工Ｃ等
がある場合も、冷却風Ｃの吸入口辺が盤上邪にあるため
制御器具９等にも冷却風Ｃが流れ、盤内の温度上昇を抑
えることができる。なお、冷却風Ｂと冷却風０の風量の
バランス調整は、冷却風吸入Ｃ１１２の調整によって可
能である。Next, its operation will be explained. Cooling air A taken into the board by the cooling fan 14 flows in parallel with cooling air B for cooling the semiconductor module 3 and cooling air C for cooling the semiconductor stack 13. Therefore, the temperature of the cooling air flowing through the semiconductor stack 13 does not rise, and a larger amount of current can flow through the semiconductor stack 13 than in the conventional device. In addition, if the control equipment 9 has equipment C that requires temperature control, the cooling air C will also flow to the control equipment 9, etc. because the intake port of the cooling air C is located above the panel, and the temperature inside the panel will rise. It can be suppressed. Note that the balance between the volumes of the cooling air B and the cooling air 0 can be adjusted by adjusting the cooling air intake C112.
なお上記実施例では、半導体素子の冷却について説明し
たが、これらの被冷却体が抵抗等値の発熱体であっても
よく、上記実施例と同様の効果がある。Note that in the above embodiments, cooling of semiconductor elements has been described, but these objects to be cooled may be heating elements having equal resistance, and the same effects as in the above embodiments can be obtained.
以上のようにこの発明によれば、２つの半導体を冷却す
る冷却風を並列に流下ようにしたもので上部の半導体を
冷却する冷却風の温度上昇が抑えられ、上部の半導体素
子の容量が従来の装置に比べて小さくできるため、半導
体装置としては小形で安価なものにできる効果がある。As described above, according to this invention, the cooling air that cools the two semiconductors is made to flow down in parallel, so that the temperature rise of the cooling air that cools the upper semiconductor is suppressed, and the capacity of the upper semiconductor element is lower than that of the previous one. Since the semiconductor device can be made smaller than the previous device, it has the effect of making the semiconductor device smaller and cheaper.
又、並列に流下冷却風の一方が盤の上部にあるため、別
に冷却ファンを追加せず、１台の冷却ファンで盤内に冷
却風が流れ、盤内の温度上昇も抑え得る効果がある０In addition, since one side of the cooling air flowing in parallel is located above the panel, there is no need to add a separate cooling fan, and the cooling air flows inside the panel with just one cooling fan, which has the effect of suppressing the temperature rise inside the panel. 0
嘉１図はこの発明の実施例を示す半導体装置の断面図、
第２図は従来の半導体装置を示す断面図、第３図は第２
図の■−ＩＩＩ線の断面図である。
図中、１は収納盤、３は半導体モジュール、４は冷却フ
ィン、７は冷却風吸入口、８は冷却風出口、９は制御機
器、１０は被冷却体、１１は風洞、臣は冷却風吸入口、
１３は半導体スタック、１４は冷却ファンである。
尚、図中同一符号は同一または相当部分を示す。Figure 1 is a cross-sectional view of a semiconductor device showing an embodiment of the present invention;
Figure 2 is a cross-sectional view of a conventional semiconductor device, and Figure 3 is a cross-sectional view of a conventional semiconductor device.
It is a sectional view taken along the line ■-III in the figure. In the figure, 1 is a storage board, 3 is a semiconductor module, 4 is a cooling fin, 7 is a cooling air inlet, 8 is a cooling air outlet, 9 is a control device, 10 is an object to be cooled, 11 is a wind tunnel, and holder is a cooling air inlet,
13 is a semiconductor stack, and 14 is a cooling fan. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (2)
収納盤内に半導体装置などの複数の被冷却体を収納配置
し、上記被冷却体をファンにより強制風冷するようにし
たものにおいて、盤内下部に配置された一方の被冷却体
の上部に風洞を接続し、この風洞の側面に吸入口を介し
て他方の被冷却体を突出して配置し、かつ上記風洞の上
部にファンを接続したことを特徴とする強制風冷形電気
機器収納装置。(1) A plurality of objects to be cooled, such as semiconductor devices, are housed in a storage cabinet that has a cooling air inlet at the bottom and an outlet at the top, and the objects to be cooled are cooled with forced air by a fan. A wind tunnel is connected to the upper part of one of the objects to be cooled located at the lower part of the panel, and the other object to be cooled is arranged to protrude from the side of this wind tunnel through an inlet, and the upper part of the wind tunnel is A forced air cooling type electrical equipment storage device characterized by a fan connected.
る特許請求の範囲第１項記載の強制風冷形電気機器収納
装置。(2) The forced air cooling type electric equipment storage device according to claim 1, wherein the cooling air intake port provided in the wind tunnel can adjust the air volume.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11300486A JPS62268199A (en) | 1986-05-15 | 1986-05-15 | Forced air cooling type electric equipment container |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11300486A JPS62268199A (en) | 1986-05-15 | 1986-05-15 | Forced air cooling type electric equipment container |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62268199A true JPS62268199A (en) | 1987-11-20 |
| JPH0577319B2 JPH0577319B2 (en) | 1993-10-26 |
Family
ID=14601029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11300486A Granted JPS62268199A (en) | 1986-05-15 | 1986-05-15 | Forced air cooling type electric equipment container |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62268199A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5499064U (en) * | 1977-12-26 | 1979-07-12 | ||
| JPS5887289U (en) * | 1981-12-08 | 1983-06-13 | 株式会社東芝 | electromagnetic heating cooker |
| JPS58140694U (en) * | 1982-03-18 | 1983-09-21 | 三洋電機株式会社 | circuit board cooling device |
-
1986
- 1986-05-15 JP JP11300486A patent/JPS62268199A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5499064U (en) * | 1977-12-26 | 1979-07-12 | ||
| JPS5887289U (en) * | 1981-12-08 | 1983-06-13 | 株式会社東芝 | electromagnetic heating cooker |
| JPS58140694U (en) * | 1982-03-18 | 1983-09-21 | 三洋電機株式会社 | circuit board cooling device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0577319B2 (en) | 1993-10-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |