JPS62257795A - Laminated board for printed wiring board - Google Patents
Laminated board for printed wiring boardInfo
- Publication number
- JPS62257795A JPS62257795A JP10050986A JP10050986A JPS62257795A JP S62257795 A JPS62257795 A JP S62257795A JP 10050986 A JP10050986 A JP 10050986A JP 10050986 A JP10050986 A JP 10050986A JP S62257795 A JPS62257795 A JP S62257795A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- base material
- woven
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 239000004744 fabric Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 2
- 239000004745 nonwoven fabric Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明は、コンピュータ、ファクシミリ等の電子機器に
用いられる印刷配線板用積層板に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a laminate for printed wiring boards used in electronic equipment such as computers and facsimiles.
（従来の技術）
近年電子機器の発達およびそれに伴なう印刷配線板の１
へ密度化に対処して、印刷密度の向上とともに、印刷配
線板の多層化やマルチワイヤ化等の技術が開発されてい
る。(Prior art) Recent developments in electronic equipment and accompanying printed wiring boards
In order to cope with the increase in density, technologies such as increasing the printing density and increasing the number of layers and wires in printed wiring boards have been developed.
（発明が解決しようとする問題点）
しかしながら、このような方法は複雑で高度な技術や装
置を必要とするため、製品の歩留りの低下、コストの上
昇あるいは納期の長期化等を招くという問題があった。(Problems to be solved by the invention) However, since such methods require complex and advanced technology and equipment, there are problems such as lower product yields, higher costs, and longer delivery times. there were.
本発明は、このような従来の難点を解消すべくなされた
もので、複雑な技術を必要とせずに製造可能な高密度印
刷配線板用積層板を提供することを目的とする。The present invention was made to solve these conventional problems, and an object of the present invention is to provide a laminate for a high-density printed wiring board that can be manufactured without requiring complicated technology.
［発明の構成］
（問題点を解決するための手段）
ずなわら本発明の印刷配線板用積層板は、イ１ｊ基月あ
るいは不織了り基材に熱硬化性１か１脂を含浸、乾燥さ
せてなるプｉノブレグを所定枚数積層し、これらを一体
に加熱加圧成形してなる印刷配線板用積層板において、
前記プリプレグのＢ４ｇの一部として、導電性糸を織り
込んでなるイ５基材を用いたことを特徴としている。[Structure of the Invention] (Means for Solving the Problems) The laminate for printed wiring boards of the present invention consists of a base material or a non-woven base material impregnated with a thermosetting resin. In a laminate for a printed wiring board, which is formed by laminating a predetermined number of dried Pinoregs and integrally molding them under heat and pressure,
It is characterized in that a base material A5 in which conductive threads are woven is used as a part of B4g of the prepreg.
このような印刷配線板用積層板は、以下のようにして製
造される。Such a laminate for a printed wiring board is manufactured as follows.
まず導電性糸を織り込／υだ布基材に、例えばエポキシ
樹脂、フェノール樹脂、ポリイミド樹脂、不飽和ポリニ
スデル樹脂等の熱硬化性樹脂を含浸させ、乾燥してプリ
プレグを１７る。導電性糸としては例えば、銅線、銀線
、金線、アルミ線、カーボン糸等の単線または撚線があ
げられる。またこれらの導電性糸が織り込まれる（（１
％材としては、例えばカラス布、合成樹脂ｒ＋ｒ等の平
織り布基材等が適している。First, a conductive thread is woven into a fabric base material, impregnated with a thermosetting resin such as epoxy resin, phenol resin, polyimide resin, or unsaturated polynisder resin, and dried to form a prepreg. Examples of the conductive thread include single wires or twisted wires such as copper wire, silver wire, gold wire, aluminum wire, and carbon thread. In addition, these conductive threads are woven ((1
Suitable materials include, for example, plain weave cloth base materials such as crow cloth and synthetic resin r+r.
一方導電性糸を織り込まれていない布基材あるいは不織
布基材を使用したプリプレグは公知の方法により製造さ
れる。On the other hand, a prepreg using a cloth base material or a nonwoven base material in which conductive threads are not woven is manufactured by a known method.
そして本発明の印刷配線板用積層板は、導電性糸を織り
込んだプリプレグと導電性糸を織り込んでいないプリプ
レグを所定枚数積層し、必要に応じて更に外層銅箔を重
ね合せた後、一体に加熱加圧成形すすることにより得る
ことができる。なあ、導電性糸を織り込んだプリプレグ
を複数枚用いる場合には、これらのプリプレグの間に４
電性糸を織り込／νでいないプリプレグを介挿させるよ
うにする。The laminate for printed wiring boards of the present invention is produced by laminating a predetermined number of prepregs woven with conductive threads and prepregs not woven with conductive threads, and further overlaying an outer layer of copper foil as needed, and then integrally stacking them. It can be obtained by molding under heat and pressure. By the way, when using multiple sheets of prepreg woven with conductive thread, there should be 4 strips between these prepregs.
The conductive yarn is woven into it/prepreg which is not ν is inserted.
このようにして１７られた本発明の印刷配線板用積層板
には、以下のような手順で回路が形成される。A circuit is formed on the printed wiring board laminate of the present invention thus prepared in the following manner.
まずザグリ法により織り込まれた導電性糸を捜し出して
基γ％Ｌ穴を設定し、所定の位首にト刀ル穴開けを行う
。通常の印刷配線板用積層板においては、ドリル穴聞（
］は銅スルーホール穴聞けの形成あるいは部品穴形成の
目的で行われるが、本発明の印刷配線板用積層板におい
てはその他に導電性糸の不必要部分を切断する目的で下
リル穴聞（ブの方法がとられる。First, the conductive thread woven by the counterbore method is found, a base γ%L hole is set, and a total hole is drilled at a predetermined position. In ordinary printed wiring board laminates, the drill hole depth (
] is performed for the purpose of forming copper through-hole holes or component holes, but in the printed wiring board laminate of the present invention, the lower drill hole ( The following method is used.
この後スルーホール用の穴には、常法により例えば銅ス
ルーホールが形成され、導電性糸の不必要部分を切断す
る［目的であ（プたドリル穴には、熱硬化性樹脂が充填
される。After this, a copper through hole, for example, is formed by a conventional method in the hole for the through hole, and the unnecessary part of the conductive thread is cut off. Ru.
（作用）
このように構成された本発明の印刷配線板用積層板によ
れば、織りこまれた導電性糸を所定の箇所で接続・切断
することにより、この導電性糸を内層導体層として機能
させることができ、これによって多層印刷配線板と同等
の性能を有する両面印刷配線板を得ることができる。(Function) According to the printed wiring board laminate of the present invention configured as described above, by connecting and cutting the woven conductive threads at predetermined locations, the conductive threads can be used as the inner conductor layer. As a result, a double-sided printed wiring board having performance equivalent to that of a multilayer printed wiring board can be obtained.
（実施例〉 以下本発明の一実施例を図面に基づいて説明する。(Example> An embodiment of the present invention will be described below based on the drawings.
第１図は、導電性糸として銅線１を縦糸の一部に織り込
んだカラス布基材２の一部分を示す概略図である。直径
０．１２ｍｍの銅線１．１、・・・は各々２．５４ｍｍ
間隔で配列され、ガラス繊維３と共に織成されている。FIG. 1 is a schematic diagram showing a part of a crow cloth base material 2 in which a copper wire 1 is woven into a part of the warp thread as a conductive thread. Copper wires 1.1 with a diameter of 0.12 mm, ... are each 2.54 mm
They are arranged at intervals and woven together with the glass fibers 3.
このガラスイｆｉ阜材２に難燃性エポキシ樹脂（ジシア
ンジアミド、イミダゾール硬化）を塗工機により塗荀乾
燥さけてプリプレグ４を得た。同様の方法により、導電
性糸を織り込まないガラス４５塁材からなる通常のプリ
プレグ５を製造した。A prepreg 4 was obtained by applying a flame-retardant epoxy resin (dicyandiamide, imidazole curing) to the glass fiber material 2 using a coating machine and avoiding drying. In a similar manner, a normal prepreg 5 made of glass 45 base material without conductive threads woven into it was manufactured.
このようにして得られた銅線織り込みプリプレグ４を一
枚と通常のプリプレグ５の６枚とを第２図にその断面を
示すように組合°Ｕ、更にその表裏に厚さ１８μ■１の
電解処理銅箔６を重ねたうえ、多段プレスにより１７０
’Ｃで１時間加熱加圧成形して印刷配線板用積層板を製
造した。One sheet of the thus obtained copper wire woven prepreg 4 and six sheets of ordinary prepreg 5 were assembled as shown in the cross section in Figure 2, and further, a layer of 18 μm thick was coated on the front and back sides. After overlapping the treated copper foil 6, 170
A laminate for a printed wiring board was manufactured by heating and pressure molding at 'C for 1 hour.
しかる後、第３図にその断面を示すようにこの印刷配線
板の必要個所をドリル穴聞けして、銅線の不必要部分の
ドリル穴部分７には熱硬化性樹脂８を充填した後、通常
の手法により銅スルーホール９Ｗを形成し、印刷配線板
を作成した。After that, as shown in the cross section of FIG. 3, the printed wiring board was drilled at the necessary locations, and the drilled holes 7 where the copper wires were not needed were filled with thermosetting resin 8. Copper through-holes 9W were formed using a conventional method, and a printed wiring board was created.
なお、本発明の導電性糸は、この実施例のように縦糸に
織り込むほか、平織’（ｌｒの横糸に織り込／νだり、
場合によっては綾織りに織り込んだものを使用づること
も可能で必る。また、導電性糸の織り込まれる間隔ある
いはプリプレグの枚数、積層の仕方等ら必要に応じて適
宜変更することも可能である。In addition to being woven into the warp threads as in this example, the conductive threads of the present invention may also be woven into the weft threads of plain weave' (lr),
In some cases, it is also possible to use a twill weave. Further, it is also possible to change the interweaving interval of the conductive threads, the number of prepreg sheets, the method of lamination, etc., as necessary.
［Ｒ，明の効果］
以上説明したように本発明によれば、複雑な技術や装置
を必要とｔ！ツに、印刷配線板の高密度化を図ることか
可能である。[Effect of R, Light] As explained above, according to the present invention, complicated techniques and devices are not required! In other words, it is possible to increase the density of printed wiring boards.
第１図は本発明の一実施例に使用される導電性糸織り込
みカラスギ５基材を概略的に示す平面図、第２図は本弁
明の一実施例におけるプリプレグの用台ぜを示す断面図
、第３図は本発明の一実施例の拡大部分断面図である。
１・・・・・・・・・銅線
２・・・・・・・・・ガラス布基材
訃・・・・・・・・ガラス繊維
４・・・・・・・・・銅線織り込みプリプレグ５・・・
・・・・・・銅線なしプリプレグ６・・・・・・・・・
銅肪FIG. 1 is a plan view schematically showing a conductive thread-woven Karasugi 5 base material used in an embodiment of the present invention, and FIG. 2 is a sectional view showing a prepreg base material in an embodiment of the present invention. , FIG. 3 is an enlarged partial cross-sectional view of one embodiment of the present invention. 1...Copper wire 2...Glass cloth base material...Glass fiber 4...Copper wire woven Prepreg 5...
・・・・・・Prepreg without copper wire 6・・・・・・・・・
Copper fat
Claims (2)
、乾燥させてなるプリプレグを所定枚数積層し、これら
を一体に加熱加圧成形してなる印刷配線板用積層板にお
いて、前記プリプレグの基材の一部として、導電性糸を
織り込んでなる布基材を用いたことを特徴とする印刷配
線板用積層板。(1) A laminate for a printed wiring board, which is formed by laminating a predetermined number of prepregs made by impregnating and drying a thermosetting resin into a cloth base material or a nonwoven fabric base material, and integrally molding them under heat and pressure. A laminate for a printed wiring board, characterized in that a cloth base material woven with conductive thread is used as a part of the base material.
第１項記載の印刷配線板用積層板。(2) A laminate for a printed wiring board according to claim 1, wherein the outer layer copper foil is integrally laminated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10050986A JPH0685469B2 (en) | 1986-04-30 | 1986-04-30 | Laminated board for printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10050986A JPH0685469B2 (en) | 1986-04-30 | 1986-04-30 | Laminated board for printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62257795A true JPS62257795A (en) | 1987-11-10 |
| JPH0685469B2 JPH0685469B2 (en) | 1994-10-26 |
Family
ID=14275917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10050986A Expired - Lifetime JPH0685469B2 (en) | 1986-04-30 | 1986-04-30 | Laminated board for printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0685469B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06177547A (en) * | 1992-12-09 | 1994-06-24 | Nec Corp | Multilayer interconnection board |
-
1986
- 1986-04-30 JP JP10050986A patent/JPH0685469B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06177547A (en) * | 1992-12-09 | 1994-06-24 | Nec Corp | Multilayer interconnection board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0685469B2 (en) | 1994-10-26 |
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