JPS62235799A - Hybrid integrated circuit device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a hybrid integrated circuit device having a shield structure that is effective in reducing external radiation of signals or noise from an internal circuit or inkling from external noise.

[Conventional technology]

Conventionally, in order to shield a hybrid integrated circuit device, the entire hybrid integrated circuit board was hooked into a metal case and the metal case was dropped to ground potential when mounted on a printed circuit board, etc., or the exterior was covered with a conductive sheath. A method of collapsing is used.

[Problem that the invention seeks to solve]

However, with the former type, which is cast into a metal case, if the external shape of the hybrid integrated circuit device is different, it is necessary to create a dedicated one for each, which has disadvantages in terms of development time and cost. If the mold is small, the casting work must be done manually, which requires more man-hours and increases costs. Furthermore, the entire hybrid integrated circuit becomes larger and heavier, which is extremely disadvantageous in terms of mounting.

Next, the latter type of structure in which conductive contact is applied can be realized relatively easily by simply immersing it in a coating resin bath if the target is a structure in which the external terminals come out from a single direction. However, if it is pulled out in multiple directions, it is very difficult to implement.

SUMMARY OF THE INVENTION In view of the above circumstances, an object of the present invention is to provide a hybrid integrated circuit device having an extremely simple shielding structure including a shielding metal plate and a grounding external terminal inside the circuit device.

[Means for solving problems]

According to the present invention, a first resin coating is applied to a circuit board on which chip components and small molded electronic components are mounted, and a metal piece one size smaller than the first resin coating is mounted on the flattened board surface. be done. On this occasion.

If the part that requires shielding is a part of the board, a metal piece with a shape corresponding to this part is mounted. This metal piece is connected to an external terminal having a ground potential using a thin wire, and is further coated with a second resin to a thickness that completely hides these wires and the metal piece.

The shield structure according to the present invention can also be molded and encapsulated in a plastic case using a second resin, making it possible to obtain a hybrid integrated circuit device with improved appearance and moisture resistance.

〔Example〕

The present invention will be described in detail below with reference to the drawings.

FIG. 1 is a cross-sectional structural diagram showing one embodiment of the present invention.

In this embodiment, a ceramic substrate 1, thick film conductors 2a and 2b printed on both sides of a circuit board, a ceramic chip capacitor 3 mounted on the substrate, and a mini-flat type I
C4, the grounding external terminal 5a and the external terminal 5b, the first silicone resin 6 that covers and flattens the object mounted on the substrate l, the metal piece 7 provided on the upper surface of this resin, and the metal piece 7 and the grounding It includes a thin wire 8 that connects to the external terminal 5a, and a second silicon resin 9 that covers the metal piece 7 and the thin wire 8.

Here, IO indicates a solder material for securely connecting the metal piece 7 to the external grounding terminal 5a.

It is electrically connected by the metal piece 7 sandwiched between the membrane conductor 2b and the first resin 6.

In the above description, a silicone resin is used as the resin material, but it is of course possible to use other resins such as a borimide resin.

〔Effect of the invention〕

As explained in detail above, the shield structure of the hybrid integrated circuit device according to the present invention includes placing a metal plate for resin shielding on the first coating for flattening the component mounting surface and connecting this to an external ground terminal. Since it has a simple structure with a second resin applied for fixation coating, it can be made smaller and thinner than a case using a metal case.It is also possible to make a special mold necessary for manufacturing the case. It is possible to save costs and shorten the process period. In addition, when inserting a board into a case and mounting it, which requires relatively many man-hours, if a metal case is used, it is necessary to ground the printed circuit board by soldering, etc., but according to the present invention, the integrated circuit device itself must be grounded. Since the terminal already has a ground terminal, these operations are not necessary at all. Furthermore, it has a double resin structure sandwiching the metal plates, so it has improved moisture resistance! It can be used to significantly increase reliability. The above is DIL type (Dual In Line)
) Although only the implementation to the circuit device is shown, the SIL type (8
(In-Gle In Li1e) It is a matter of fact that it can be implemented very easily for other structures, and is not limited to this example.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional structural diagram showing one embodiment of the present invention. l...ceramic substrate, 2a...surface thick film conductor, 2b...back thick film conductor, 3...
... Ceramic chip, capacitor, 4 ... Mini flat type IC, 5a ... External terminal for grounding, 5
b...External terminal, 6. ? ...Silicone resin, 7...Metal plate, 8...Thin wire,
10...Solder material.

Claims (1)

[Claims] A first coating covering the hybrid integrated circuit board on which the circuit elements are mounted.
a resin film, a metal plate formed on the coating film, and a second resin film that covers the entire surface of the circuit board including the metal plate;
A hybrid integrated circuit device comprising: a grounding external terminal for connecting the metal plate to a ground potential.