JPS62199076A - Manufacture of laminated type piezoelectric element - Google Patents
Manufacture of laminated type piezoelectric elementInfo
- Publication number
- JPS62199076A JPS62199076A JP61042171A JP4217186A JPS62199076A JP S62199076 A JPS62199076 A JP S62199076A JP 61042171 A JP61042171 A JP 61042171A JP 4217186 A JP4217186 A JP 4217186A JP S62199076 A JPS62199076 A JP S62199076A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- piezoelectric ceramic
- piezoelectric
- laminated
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000000919 ceramic Substances 0.000 claims abstract description 38
- 238000005520 cutting process Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 21
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 238000010030 laminating Methods 0.000 abstract description 8
- 239000007767 bonding agent Substances 0.000 abstract 1
- 238000003475 lamination Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 210000004709 eyebrow Anatomy 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 150000002611 lead compounds Chemical class 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003746 solid phase reaction Methods 0.000 description 1
- 230000007847 structural defect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
- H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、圧電アクチュエータ等に用いられる積層型圧
電素子の製造方法に関し、更に詳しくは、表裏面に多数
の無電極部分を残すような所定形状の内部電極を有する
焼結済み圧電セラミック板を多数枚積層して接着により
一体化し、前記無電極部分が2個所以上かかるように切
断した後、該無電極部分をその寸法よりも僅かに小さく
切り欠き内部電極を交互に露出させ外部電極を施す積層
型圧電素子の製造方法に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing a laminated piezoelectric element used in a piezoelectric actuator, etc. A large number of sintered piezoelectric ceramic plates having internal electrodes of the same shape are laminated and integrated by adhesion, and then cut so that the electrodeless part spans two or more places, and then the electrodeless part is made slightly smaller than its size. The present invention relates to a method of manufacturing a laminated piezoelectric element in which cutout internal electrodes are alternately exposed and external electrodes are applied.
[従来の技術]
微細加工を必要とする半導体など各種電子部品の製造装
置や微小位置決めを必要とする光学装置等においては微
小変位を行わせるため圧電ア、クチュエー夕が用いられ
ている。[Prior Art] Piezoelectric actuators and actuators are used to perform minute displacements in manufacturing equipment for various electronic components such as semiconductors that require microfabrication, and in optical devices that require minute positioning.
このような圧電アクチュエータに用いられる積層型圧電
素子の製造方法としては、焼結済みの多数の圧電セラミ
ック板を接着一体化する方法と、未焼結シートを積層し
てから一体焼結する方法がある。There are two methods for manufacturing the laminated piezoelectric elements used in such piezoelectric actuators: one is to bond together a large number of sintered piezoelectric ceramic plates, and the other is to laminate unsintered sheets and then sinter them together. be.
前者の積層接着法は、例えば第4図に示すように、所定
の外形寸法(直径5〜30mm、Hさ0.1〜IIII
I11程度)の焼結済み圧電セラミック仮IOの表裏両
面に焼付は銀等で電極層を形成し、これとほぼ同寸法に
エツチング等で作成した金属端子板12(厚さ約35〜
50μm)とを1枚毎に接着剤を塗布して金属端子12
aの方向を揃えて数十〜数百層積層接着した後、対応す
る2組の金属端子12a毎にそれぞれリード線14で接
続し組み立てる方法である。The former lamination adhesion method is used, for example, as shown in FIG.
A metal terminal plate 12 (approximately 35 to 35 mm thick) is formed by baking an electrode layer of silver or the like on both sides of the sintered piezoelectric ceramic temporary IO (approximately I11), and etching it to approximately the same dimensions as the electrode layer.
50 μm) and apply adhesive to each sheet to attach the metal terminal 12.
This is a method of laminating and bonding several tens to hundreds of layers with the directions a aligned, and then connecting each two corresponding sets of metal terminals 12a with lead wires 14 for assembly.
それに対して後者の一体焼結方法は、圧電セラミックの
未焼結シートに内部電極を印刷し、積層圧着して一体焼
結し、所定寸法に切り出した後に外部電極を形成する方
法である0例えば第5図に示すように、圧電セラミック
板10の間に白金のような内部電極16が介在し、その
側面において内部電橋一層おきにガラス等の絶縁材18
を塗布して覆い、更にその上から外部電極20を塗布す
る構成である。On the other hand, the latter integral sintering method is a method in which internal electrodes are printed on an unsintered sheet of piezoelectric ceramic, laminated and crimped, integrally sintered, and external electrodes are formed after cutting to a predetermined size. As shown in FIG. 5, an internal electrode 16 such as platinum is interposed between the piezoelectric ceramic plates 10, and an insulating material 18 such as glass is disposed on the side surface of each internal electric bridge every other layer.
The structure is such that the external electrode 20 is coated and covered, and then the external electrode 20 is coated on top of that.
[発明が解決しようとする問題点]
ところが前者の積層接着による方法は、所定形状の圧電
セラミック板と金属端子板とをその端子方向を揃えて積
層しなければならないため作業が極めて煩瑣であり、量
産性に乏しく低廉化し難い欠点がある。[Problems to be Solved by the Invention] However, the former method using lamination adhesion requires extremely complicated work because it requires piezoelectric ceramic plates of a predetermined shape and metal terminal plates to be laminated with their terminal directions aligned. The drawback is that it is difficult to mass produce and is difficult to reduce in price.
それに対して後者の一体焼結する方法は、一度の積層に
よって多数の圧電積層体を切り出せることから積層作業
の手間が省ける利点がある。On the other hand, the latter integral sintering method has the advantage of being able to cut out a large number of piezoelectric laminates by laminating them once, thereby saving the labor of laminating work.
しかし圧電セラミックの焼結温度は1200〜1300
℃と高温であり、セラミックの組成物が鉛化合物で反応
性が高いことと相俟て内部電極は白金のような高価な貴
金属に限定されており、このため電極材料に要するコス
トが高(なる欠点がある。また白金内部電極は不拘−歪
を避けるため層間全面に形成する必要があり、それによ
って眉間のセラミック固相反応が制限され密着強度が低
下する構造的な欠陥を有している。However, the sintering temperature of piezoelectric ceramic is 1200-1300
℃, and the ceramic composition is lead compound, which is highly reactive, and the internal electrodes are limited to expensive noble metals such as platinum, which means that the cost of electrode materials is high. In addition, the platinum internal electrode must be formed on the entire surface of the interlayer to avoid unrestrained strain, which has a structural defect that limits the ceramic solid phase reaction between the eyebrows and reduces the adhesion strength.
本発明の目的は、上記のような従来技術の欠点を解消し
、内部電極に安価な材料を用いることができ、一度の積
層によって多数の圧電積層体を切り出すことができ、外
部電極の形成も含めて製造工程が著しく簡素化され、し
かも機械的強度等について十分高い信頼性を確保するこ
とができるような積層型圧電素子の製造方法を提供する
ことにある。The purpose of the present invention is to eliminate the above-mentioned drawbacks of the prior art, to enable the use of inexpensive materials for internal electrodes, to cut out a large number of piezoelectric laminates by laminating them once, and to form external electrodes as well. It is an object of the present invention to provide a method for manufacturing a laminated piezoelectric element, which greatly simplifies the manufacturing process, and can ensure sufficiently high reliability in terms of mechanical strength and the like.
[問題点を解決するための手段]
上記のような目的を達成することのできる本発明は、基
本的には焼結済み圧電セラミック板を積層接着する方法
を採用し、外部電極の形成ならびに内部i8iと外部電
極との接続構造に工夫を施し、量産化に通すように改良
したa l型圧電素子の製造方法である。[Means for Solving the Problems] The present invention, which can achieve the above objects, basically adopts a method of laminating and bonding sintered piezoelectric ceramic plates, and forms external electrodes and This is a method of manufacturing an AL-type piezoelectric element that has been improved to be suitable for mass production by devising the connection structure between i8i and external electrodes.
即ち本発明では、所定のピッチで且つ表裏両面で互いに
ずれた多数の無電極部分(111極が施されていない部
分)を残すように内部電極を形成した焼結済み圧電セラ
ミック板を用いている。That is, the present invention uses a sintered piezoelectric ceramic plate on which internal electrodes are formed so as to leave a large number of non-electrode portions (portions where 111 poles are not applied) which are shifted from each other at a predetermined pitch on both the front and back surfaces. .
そして、この圧電セラミック板を、その無電極部分の位
置が一致し且つ互いに向き合うように多数枚積層して接
着剤により接着一体化し、積層体ブロックを得る。Then, a large number of piezoelectric ceramic plates are stacked so that the positions of their non-electrode portions match and face each other, and are bonded together with an adhesive to obtain a laminate block.
次に得られた積層体ブロックを、前記無電極部分が少な
くとも2個所以上かかるように切断し圧電積層体を製作
する。この圧電積層体の無電極部分の位置でその寸法よ
りも僅かに小さく積層方向に切り欠き凹部を形成する。Next, the obtained laminate block is cut so that the non-electrode portions extend over at least two locations to produce a piezoelectric laminate. At the position of the non-electrode portion of this piezoelectric laminate, a notch recess is formed in the stacking direction, slightly smaller in size than the non-electrode portion.
この凹部に外部電極を設けて露出している内部電極間を
接続する。このようにして積層型圧電素子が製造される
のである。An external electrode is provided in this recess to connect the exposed internal electrodes. In this way, a laminated piezoelectric element is manufactured.
[作用]
本発明は基本的には焼結済み圧電セラミック板を積層接
着する方法であるから、内部を穫として銀やニッケルの
ような安価な材料を使用できる。また内部電極の引出し
構造を工夫したから、金属端子板を挾み込む必要は無く
、一度の積層作業により得られたブロックから所定寸法
に切り出すことによって多数の圧電積層体を得ることが
できる。[Function] Since the present invention is basically a method of laminating and bonding sintered piezoelectric ceramic plates, it is possible to use inexpensive materials such as silver and nickel while leaving the interior intact. Furthermore, since the internal electrode lead-out structure has been devised, there is no need to insert metal terminal plates, and a large number of piezoelectric laminates can be obtained by cutting out a block of predetermined dimensions from a block obtained by a single lamination operation.
内部電極と外部電極との接続も、圧電積層体の所定の位
置に絶縁物を付着させるのではなく、圧電積層体の側面
を所定の位置で切り欠くだけで内部電極が一層おきに露
出し、外部電極を付着するだけでよいから、圧電セラミ
ック板の厚みが極めて薄くても、また積層枚数が極めて
多くなっても作業が容易である。To connect the internal electrodes and external electrodes, instead of attaching insulators to predetermined positions on the piezoelectric laminate, the internal electrodes are exposed every other layer by simply cutting out the sides of the piezoelectric laminate at predetermined positions. Since it is only necessary to attach external electrodes, the work is easy even if the thickness of the piezoelectric ceramic plate is extremely thin or even if the number of laminated sheets is extremely large.
[実施例]
第1図は本発明方法の一実施例を示す工程説明図である
。まず同図へに示すように、表裏面に多数の無電極部分
30を有するような所定形状の内部電極32を形成した
焼結済み圧電セラミック板34を多数枚積層し、接着剤
を用いて接着一体化する。圧電セラミック板34として
は、例えば縦横各50a+s+、厚さ0.2ms程度の
寸法のものが好適である。[Example] FIG. 1 is a process explanatory diagram showing an example of the method of the present invention. First, as shown in the figure, a large number of sintered piezoelectric ceramic plates 34 on which internal electrodes 32 of a predetermined shape with a large number of non-electrode parts 30 are formed on the front and back surfaces are laminated and bonded together using an adhesive. Unify. As the piezoelectric ceramic plate 34, for example, one having dimensions of about 50a+s+ in length and width and about 0.2 ms in thickness is suitable.
各圧電セラミック板34の詳細を第2図および第3図に
示す、圧電セラミック仮34には2.5+m+aφ程度
の無電極部分30が縦横に所定のピッチで多数残るよう
に内部電極32が形成される。この無電極部分30は表
裏両面で互いにずれた位置に設けられる。The details of each piezoelectric ceramic plate 34 are shown in FIGS. 2 and 3. Internal electrodes 32 are formed on the piezoelectric ceramic temporary 34 so that a large number of non-electrode portions 30 of about 2.5+m+aφ remain at a predetermined pitch vertically and horizontally. Ru. The non-electrode portions 30 are provided at positions shifted from each other on both the front and back surfaces.
例えばある圧電セラミック板34aのある一つの無電極
部分の位置(212+ で示す)についてみると、その
上面では無電極部分30aが残るように内部電極32が
形成され、下面では残らないように全体に内部電極32
が形成される。そのすぐ下の圧電セラミック板34bの
対応する位置についてみると、その上面では全体に内部
電極32が形成され、下面では無電極部分30bが残る
ように内部電極32が形成される。1/2ピツチずれた
Zz Zzの位置では電極パターンが丁度逆になる。For example, if we look at the position of one non-electrode portion (indicated by 212+) of a certain piezoelectric ceramic plate 34a, the internal electrode 32 is formed so that the non-electrode portion 30a remains on the upper surface, and the internal electrode 32 is formed on the entire surface so that the non-electrode portion 30a remains on the lower surface. Internal electrode 32
is formed. Looking at the corresponding positions of the piezoelectric ceramic plate 34b immediately below it, internal electrodes 32 are formed on the entire upper surface thereof, and internal electrodes 32 are formed on the lower surface so that an electrodeless portion 30b remains. At the position Zz Zz, which is shifted by 1/2 pitch, the electrode pattern is exactly reversed.
内部電極32は、例えば銀ペーストをスクリーン印刷し
焼付けることによって容易に形成することができる。こ
の程度の寸法の圧電セラミック板に銀電極を形成する工
程は、例えば従来圧電ブザー等の素子製造において行わ
れていた工程と類似しており、既に量産技術が確立され
ているから安価に且つ容易に製作することが可能である
。The internal electrodes 32 can be easily formed, for example, by screen printing and baking silver paste. The process of forming silver electrodes on a piezoelectric ceramic plate of this size is similar to the process conventionally used to manufacture elements such as piezoelectric buzzers, and since mass production technology has already been established, it is inexpensive and easy. It is possible to manufacture
このような圧電セラミック板34に例えばエポキシ接着
剤をスクリーン印刷して数十〜数百枚積層し、バイスで
緊締し硬化させる。なお第1図においては図面を簡略化
するため圧電セラミンク板は比較的少ない枚数しか描い
ていないが、実際は前記のように多数枚積層されること
になる。この積層接着は、無電極部分の位置が−敗し且
つ互いに向き合うように行われる。接着剤の印刷厚さや
挾み込み圧力等により積層したブロックの高さは一定値
になる。For example, epoxy adhesive is screen printed on such piezoelectric ceramic plates 34, tens to hundreds of sheets are laminated, and the piezoelectric ceramic plates 34 are tightened and hardened in a vise. In order to simplify the drawing, only a relatively small number of piezoelectric ceramic plates are shown in FIG. 1, but in reality, a large number of piezoelectric ceramic plates are laminated as described above. This lamination bonding is carried out in such a way that the positions of the non-electrode parts are opposite and face each other. The height of the stacked blocks will be a constant value depending on the printing thickness of the adhesive, the pressure between the blocks, etc.
次にこの積層ブロックをダイヤモンドブレードを用いた
切断機等によって第1図Aの破線で示す位置で、すなわ
ち無電極部分30を少なくとも2個所以上(本実施例で
は2個所)かかるような形状に切り出し、同図Bに示す
ような圧電積層体36を製作する。Next, this laminated block is cut out using a cutting machine using a diamond blade or the like at the positions indicated by the broken lines in FIG. , a piezoelectric laminate 36 as shown in FIG. 3B is manufactured.
得られた圧電積層体36は両側2個所に無電極部分を有
する。この無電極部分の中央で、その寸法よりも僅かに
小さく積層方向に切り欠く(同図C参照)。例えば2.
5imφの無電極部分を0.7mmHに成形したダイヤ
モンドブレードで切り込む。このようにして形成された
凹部38では、全体に形成した(無電極部分を残さない
)内部電極端部は露出するが、無電極部分を残した内部
電極端部は露出しない。従って積層された各内部電極は
2個所の凹部38で交互に露出することになる。The obtained piezoelectric laminate 36 has electrodeless portions at two locations on both sides. At the center of this electrode-free part, a cutout is made in the stacking direction slightly smaller than the size of the non-electrode part (see C in the same figure). For example 2.
Cut the 5 mmφ non-electrode portion with a diamond blade shaped to 0.7 mmH. In the recess 38 thus formed, the end portion of the internal electrode formed entirely (without leaving any non-electrode portion) is exposed, but the end portion of the internal electrode with the non-electrode portion remaining is not exposed. Therefore, the stacked internal electrodes are exposed alternately at the two recesses 38.
最後に同図りに示すように、このような圧電積層体36
の両方の凹部38に、外部電極40として導電性接着剤
を塗布し、積層型圧電素子を得るのである。Finally, as shown in the figure, such a piezoelectric laminate 36
A conductive adhesive is applied as an external electrode 40 to both recesses 38 to obtain a laminated piezoelectric element.
なお各圧電セラミック板34の分極は、基本的には板単
体の状態の時に行うが、場合によっては積層接着した後
に行ってもよい。The polarization of each piezoelectric ceramic plate 34 is basically performed when the plate is alone, but in some cases it may be performed after lamination and bonding.
以上本発明の好ましい一実施例について詳述したが、本
発明はこのような構成のみに限定されるものではない。Although a preferred embodiment of the present invention has been described above in detail, the present invention is not limited to only such a configuration.
内部電極として上記の実施例では銀の焼付けを行ってい
るが、ニッケルメッキ等で形成することも可能である。Although the internal electrodes are baked with silver in the above embodiment, they can also be formed with nickel plating or the like.
圧電セラミック板に形成する無電極部分の形状や寸法、
配列等は適宜変更可能である。積層ブロックの切断位置
も形成した内部電極のパターンに応じて変更できる。無
電極部分の位置で十字に切り出さなくてもよい、つまり
無電極部分が圧電積屠体の隅に位置せず側面中央に現れ
るような構造とすることもできる。The shape and dimensions of the non-electrode portion formed on the piezoelectric ceramic plate,
The arrangement etc. can be changed as appropriate. The cutting position of the laminated block can also be changed depending on the pattern of the internal electrodes formed. It is not necessary to cut out the cross shape at the position of the electrodeless part, that is, the structure can be such that the electrodeless part is not located at the corner of the piezoelectric carcass but appears at the center of the side surface.
[発明の効果]
本発明は上記のように、多数の無電極部分を配列した所
定形状の内部電極を有する焼結済み圧電セラミック板を
積層接着し、前記無電極部分が2個所以上かかるように
細断した後、該無電極部分の位置で積層方向に僅かに切
り欠き交互に内部電極を露出させ外部電極を施すように
構成したから、金属端子板等の挾み込みが不要となり、
大きな圧電セラミック板を用いた積層接着と切断という
簡易な方法によって多数の圧電積層体を一度に得ること
ができる効果がある。[Effects of the Invention] As described above, the present invention comprises laminating and bonding sintered piezoelectric ceramic plates each having an internal electrode of a predetermined shape in which a large number of non-electrode portions are arranged so that the non-electrode portions span two or more locations. After shredding, slight notches are made in the stacking direction at the positions of the non-electrode parts to expose internal electrodes alternately and apply external electrodes, so there is no need to insert metal terminal plates, etc.
This method has the advantage that a large number of piezoelectric laminates can be obtained at the same time by a simple method of lamination bonding and cutting using large piezoelectric ceramic plates.
また本発明は接着による一体化方法だから、強固な構造
接着剤を用いることによって機械的強度が高くなり信転
性が向上するし、更に内部電極に安価な電極材料を使用
できるため、前記多数個の切り出しが行なえることと相
俟て掻めて安価に製造できる効果がある。Furthermore, since the present invention uses an adhesive-based integration method, the use of a strong structural adhesive increases mechanical strength and improves reliability.Furthermore, it is possible to use inexpensive electrode materials for the internal electrodes. Coupled with the fact that it can be cut out, it has the effect of being able to be manufactured at a low cost.
更に各内部電極の相互接続も溝加工とそれによって形成
された凹部への導電材料の付着だけで完了するため極め
て容易であり、圧電セラミック板が更に薄くなっても十
分対応できる等の優れた効果がある。Furthermore, the interconnection of each internal electrode is extremely easy, as it can be completed by simply machining grooves and attaching conductive material to the recesses formed thereby, and has excellent effects such as being able to cope with even thinner piezoelectric ceramic plates. There is.
第1図A−Dは本発明に係る積層型圧電素子の製造方法
の一実施例を示す工程説明図、第2図は圧電セラミック
板の構造を示す説明図、第3図はその■−■断面図、第
4図および第5図はそれぞれ従来技術の説明図である。
30・・・無電極部分、32・・・内部電極、34・・
・焼結済み圧電セラミック板、36・・・圧電積層体、
38・・・凹部、40・・・外部電極。
特許出願人 富士電気化学株式会社
代 理 人 茂 見 穣B
CD
5t j4 3’+ 55
3 623440第3図
第4図
第5図1A to 1D are process explanatory diagrams showing one embodiment of the method for manufacturing a laminated piezoelectric element according to the present invention, FIG. 2 is an explanatory diagram showing the structure of a piezoelectric ceramic plate, and FIG. The sectional view, FIG. 4, and FIG. 5 are explanatory diagrams of the prior art, respectively. 30... Non-electrode portion, 32... Internal electrode, 34...
・Sintered piezoelectric ceramic plate, 36... piezoelectric laminate,
38... Concave portion, 40... External electrode. Patent applicant: Fuji Electrochemical Co., Ltd. Agent: Minoru Shigeru B
CD 5t j4 3'+ 55
3 623440Figure 3Figure 4Figure 5
Claims (1)
部分を残すように内部電極を形成した圧電セラミック板
を、その無電極部分の位置が一致し向き合うように多数
枚積層して接着剤により接着一体化し、次に前記無電極
部分が少なくても2個所以上かかるように切断して圧電
積層体を製作し、無電極部分をその寸法よりも僅かに小
さく切り欠き、形成された凹部に外部電極を設けて露出
している内部電極間を接続することを特徴とする積層型
圧電素子の製造方法。1. A large number of piezoelectric ceramic plates on which internal electrodes are formed so as to leave a large number of non-electrode parts that are offset from each other on the front and back sides at a predetermined pitch are stacked together with adhesive so that the positions of the non-electrode parts match and face each other. A piezoelectric laminate is produced by bonding and integrating, and then cutting so that the non-electrode portion covers at least two or more locations.The non-electrode portion is cut out slightly smaller than its size, and the external A method for manufacturing a multilayer piezoelectric element, characterized by providing electrodes and connecting exposed internal electrodes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61042171A JPS62199076A (en) | 1986-02-27 | 1986-02-27 | Manufacture of laminated type piezoelectric element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61042171A JPS62199076A (en) | 1986-02-27 | 1986-02-27 | Manufacture of laminated type piezoelectric element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62199076A true JPS62199076A (en) | 1987-09-02 |
Family
ID=12628521
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61042171A Pending JPS62199076A (en) | 1986-02-27 | 1986-02-27 | Manufacture of laminated type piezoelectric element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62199076A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5252883A (en) * | 1991-01-30 | 1993-10-12 | Nec Corporation | Laminated type piezoelectric actuator |
DE19928180A1 (en) * | 1999-06-19 | 2001-01-11 | Bosch Gmbh Robert | Piezoactuator e.g. for valve, has multilayer structure of piezo layers and electrodes, and defined area of internal electrode removed near contacting part on piezo layers with no internal electrode to be contacted |
EP1160885A3 (en) * | 2000-05-31 | 2006-08-02 | Denso Corporation | Piezoelectric device for injector |
JP2008288283A (en) * | 2007-05-15 | 2008-11-27 | Sumida Corporation | Generator and generating system |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51132447A (en) * | 1975-05-12 | 1976-11-17 | Matsushita Electric Ind Co Ltd | Method of making vitreous ceramic capacitors |
JPS5351458A (en) * | 1976-10-21 | 1978-05-10 | Itt | Method of manufacturing capacttor and apparatus therefor |
JPS5730311A (en) * | 1980-07-29 | 1982-02-18 | Nippon Electric Co | Method of producing laminated ceramic condenser |
-
1986
- 1986-02-27 JP JP61042171A patent/JPS62199076A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51132447A (en) * | 1975-05-12 | 1976-11-17 | Matsushita Electric Ind Co Ltd | Method of making vitreous ceramic capacitors |
JPS5351458A (en) * | 1976-10-21 | 1978-05-10 | Itt | Method of manufacturing capacttor and apparatus therefor |
JPS5730311A (en) * | 1980-07-29 | 1982-02-18 | Nippon Electric Co | Method of producing laminated ceramic condenser |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5252883A (en) * | 1991-01-30 | 1993-10-12 | Nec Corporation | Laminated type piezoelectric actuator |
DE19928180A1 (en) * | 1999-06-19 | 2001-01-11 | Bosch Gmbh Robert | Piezoactuator e.g. for valve, has multilayer structure of piezo layers and electrodes, and defined area of internal electrode removed near contacting part on piezo layers with no internal electrode to be contacted |
DE19928180B4 (en) * | 1999-06-19 | 2006-12-07 | Robert Bosch Gmbh | piezo actuator |
EP1160885A3 (en) * | 2000-05-31 | 2006-08-02 | Denso Corporation | Piezoelectric device for injector |
JP2008288283A (en) * | 2007-05-15 | 2008-11-27 | Sumida Corporation | Generator and generating system |
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