JPS6218275B2 - - Google Patents
Info
- Publication number
- JPS6218275B2 JPS6218275B2 JP3377881A JP3377881A JPS6218275B2 JP S6218275 B2 JPS6218275 B2 JP S6218275B2 JP 3377881 A JP3377881 A JP 3377881A JP 3377881 A JP3377881 A JP 3377881A JP S6218275 B2 JPS6218275 B2 JP S6218275B2
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- surface roughness
- filler metal
- present
- brazing filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005219 brazing Methods 0.000 claims description 30
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 239000000945 filler Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 7
- 229910052748 manganese Inorganic materials 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052738 indium Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- 230000003746 surface roughness Effects 0.000 description 15
- 238000004439 roughness measurement Methods 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 6
- 230000008018 melting Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 238000003892 spreading Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000004154 testing of material Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Conductive Materials (AREA)
Description
本発明は真空中もしくは雰囲気中で使用する銀
ろう材に関する。
従来より金属のろう付には銀ろう、金ろう、パ
ラジウムろう、白金ろう等が用いられている。そ
の中でも銀ろうは融点が比較的低く作業性がよい
こと及び価格が比較的低廉であることから特殊な
場合を除いては広く用いられている。銀ろうの中
でも特に72Ag−Cu合金（BAg−８）が電子管や
真空管等の電子部品などをはじめとして多用され
ており、また、融点あるいは価格を考慮して銀の
含有量を増減させたAg−Cu合金が使用されてい
る。
しかしながら、特に電子工業の分野において
は、ろう付後の工程の関係からろう付後の表面の
平滑度が要求される。それは、ろう付後の表面の
粗さの度合が大きいとその後のはんだ付工程の作
業性が低下し、まためつき工程において前処理の
脱脂が充分に行なわれなかつたり、酸洗処理の酸
が表面に残留して表面が腐食されたりしてめつき
不良をきたす等の問題を起す虞れがあるからであ
り、できるだけ平滑な表面に仕上がるろう材が要
求されている。
そしてろう付表面の粗さの原因は以下の二つに
よるものと考えられる。(i)ろう材凝固時に生ずる
ガスによつて表面が粗される。(ii)ろう材凝固時の
金属組織が微細化しないことにより粗される。
従つて上記の原因を取除くことによりろう付面
の表面の平滑さは得られることになる。
本発明は上記の要求を満すことを目的とし、
Ag−CuにMnおよびNiを加えてろう材とする
か、さらにこれにIn、Snを一種または二種添加
してろう材とすることにより平滑なろう付表面が
得られることを特徴とする。
以下本発明について説明する。
なお以下の元素の配合比はすべて重量％として
説明する。
Agを50〜95％、Cuを５〜50％、Mnおよびも
しくはNiを0.005〜１％加えてろう材とするか、
さらにこれにIn、Snを一種または二種を0.005〜
５％添加してろう材とする。
ここで、添加するMn、Ni、In、Snは蒸気圧の
低い金属であり、その添加量は0.005％未満であ
ると効果を上げることはできず、また上記所定量
を越えると、(i)融点の上昇が大きく、ろう付使用
に不便となる。(ii)流動性が低下する。(iii)加工性が
低下して鋳造後の製造工程に支障をきたす。(iv)価
格が高くなりすぎる。等の欠点の内の少なくとも
１つの欠点が生ずる。
次に本発明の実施例について説明する。
(A) Ag85％ Cu13.8％ Mn0.1％ Ni0.1％
Sn1％
(B) Ag72％ Cu24.5％ Mn0.3％ Ni0.2％ In3
％
(C) Ag72％ Cu25.4％ Mn0.5％ Ni0.1％
Sn2％
(D) Ag60％ Cu39％ Mn0.5％ Ni0.5％
以上の本発明の試料について、従来品との性能
を比較してみた。従来品は以下の３種とする。
(E) Ag85％ Cu15％（85Ag−Cu）
(F) Ag 72％ Cu28％（BAg−８）
(G) Ag 60％ Cu 40％（60Ag−Cu）
(1) 融点について以下のような結果を得た。
The present invention relates to a silver brazing material used in vacuum or atmosphere. Conventionally, silver solder, gold solder, palladium solder, platinum solder, etc. have been used for brazing metals. Among these, silver solder is widely used except in special cases because it has a relatively low melting point, good workability, and a relatively low price. Among silver solders, 72Ag-Cu alloy (BAg-8) is particularly widely used in electronic components such as electron tubes and vacuum tubes. Cu alloy is used. However, especially in the field of electronics industry, the smoothness of the surface after brazing is required due to the post-brazing process. If the degree of surface roughness after brazing is large, the workability of the subsequent soldering process will be reduced, and the degreasing in the pretreatment may not be carried out sufficiently in the soldering process, or the acid in the pickling process may not be sufficient. This is because there is a risk that the brazing filler metal may remain on the surface and cause problems such as corrosion of the surface and poor plating, and there is a need for a brazing filler metal that can finish as smooth a surface as possible. The roughness of the brazed surface is thought to be due to the following two reasons. (i) The surface is roughened by the gas generated during solidification of the brazing material. (ii) The metal structure during solidification of the brazing material is not refined and becomes rough. Therefore, by eliminating the above-mentioned causes, the surface smoothness of the brazed surface can be obtained. The present invention aims to meet the above requirements,
It is characterized in that a smooth brazing surface can be obtained by adding Mn and Ni to Ag-Cu to make a brazing material, or by adding one or both of In and Sn to it to make a brazing material. The present invention will be explained below. In addition, all the compounding ratios of the following elements are explained as weight %. Add 50 to 95% Ag, 5 to 50% Cu, and 0.005 to 1% Mn and/or Ni to make a brazing filler metal, or
Furthermore, 0.005 ~ 0.005 of one or both of In and Sn are added to this.
Add 5% to make a brazing filler metal. Here, Mn, Ni, In, and Sn to be added are metals with low vapor pressure, and if the amount added is less than 0.005%, it will not be effective, and if the amount exceeds the above specified amount, (i) The melting point rises significantly, making it inconvenient for brazing. (ii) liquidity decreases; (iii) Workability deteriorates, causing problems in the manufacturing process after casting. (iv) Prices become too high. At least one of the following disadvantages occurs. Next, examples of the present invention will be described. (A) Ag85% Cu13.8% Mn0.1% Ni0.1%
Sn1% (B) Ag72% Cu24.5% Mn0.3% Ni0.2% In3
% (C) Ag72% Cu25.4% Mn0.5% Ni0.1%
The performance of samples of the present invention with Sn2% (D) Ag60% Cu39% Mn0.5% Ni0.5% or more was compared with conventional products. There are three types of conventional products: (E) Ag85% Cu15% (85Ag−Cu) (F) Ag 72% Cu28% (BAg−8) (G) Ag 60% Cu 40% (60Ag−Cu) (1) Obtain the following results regarding the melting point. Obtained.
【表】
(2) 引張強度については下記のような結果を得
た。[Table] (2) Regarding tensile strength, the following results were obtained.
【表】
但し
500℃ 30分焼鈍材２φ
(3) ろう付の引張強度については下記のような結
果を得た。[Table] However, the following results were obtained regarding the tensile strength of 2φ (3) brazed material annealed at 500℃ for 30 minutes.
【表】
但し
アムスラー材料試験機により行ない、各試料
の液相温度より40℃高い温度にて真空中または
水素雰囲気中でろう付を行なつた。
断面が４×４mmの突合わせ継手を測定した。
(4) 拡がり試験についてな下記のような結果を得
た。[Table] However, brazing was performed using an Amsler material testing machine, and brazing was performed in vacuum or in a hydrogen atmosphere at a temperature 40°C higher than the liquidus temperature of each sample. A butt joint with a cross section of 4 x 4 mm was measured. (4) Regarding the spread test, we obtained the following results.
【表】【table】
【表】
但し、
拡がり試験は厚さ0.1mm、10mm角のろう材を
用い各ろう材の液相温度より40℃高い温度にて
真空中または水素雰囲気中で行ない、２分間保
持した。
(5) 表面粗さの測定結果は第１図〜第７図に示す
通りである。
但し、各ろう材の流動後の表面粗さは表面粗
さ測定機により測定を行なつた。各ろう材は
Ni板でその液相温度より40℃高い温度におい
て真空中または水素雰囲気中で流動させた。
以上第１表から第４表に示す如く本発明による
ろう材の基本的性能は、添加金属の種類や添加量
によつて若干の融点の上下変動があるが、それ自
身の引張強度は添加前より向上し、実際のろう付
け強度も添加による実質的な低下は見られず、む
しろ著しい向上を示すものすらある。拡がり試験
においても添加によつて拡がりがやや低下するも
のと増大するものがあるがほぼ同等の結果を示し
ている。
そして、ろう付後の表面粗さは第１図〜第７図
に示す如く、85Ag−Cu、72Ag−Cu（BAg−
８）、60Ag−Cuのろう材と本発明のろう材と
は、添加金属の種類や添加量により若干の程度差
はあるが明らかに表面のざらつきが改善され、特
にBAg−８についてはその効果は著しい。
以上の如く本発明はAg−Cu系のろう材の基本
的性能を損うことなく、ろう付後の表面の状態を
改善し、多方面に亘つて有用なろう材となる。
さらにMnおよびNiを加えたことによりAg−
Cu系合金の結晶粒を微細することができ、表面
のざらつきを改善し、その結果電子工業の分野は
もちろん装飾品についてもより美麗な外観を与え
る効果を有する。[Table] However, the spreading test was conducted using a 10 mm square brazing filler metal with a thickness of 0.1 mm at a temperature 40°C higher than the liquidus temperature of each brazing filler metal in a vacuum or in a hydrogen atmosphere and held for 2 minutes. (5) The measurement results of surface roughness are as shown in Figs. 1 to 7. However, the surface roughness of each brazing filler metal after flowing was measured using a surface roughness measuring machine. Each filler metal
A Ni plate was flowed in vacuum or in a hydrogen atmosphere at a temperature 40°C higher than its liquidus temperature. As shown in Tables 1 to 4 above, the basic performance of the brazing filler metal according to the present invention is that the melting point slightly fluctuates depending on the type and amount of added metal, but its own tensile strength is The actual brazing strength does not show any substantial decrease due to addition, and in some cases even shows a significant improvement. In the spreading test, the results were almost the same, although in some cases the spreading slightly decreased and in others it increased due to addition. The surface roughness after brazing is 85Ag-Cu, 72Ag-Cu (BAg-Cu), as shown in Figures 1 to 7.
8) Between the 60Ag-Cu brazing filler metal and the brazing filler metal of the present invention, the surface roughness is clearly improved, although there are slight differences depending on the type and amount of added metal. is remarkable. As described above, the present invention improves the surface condition after brazing without impairing the basic performance of Ag--Cu based brazing filler metal, making it a brazing filler metal useful in many fields. Furthermore, by adding Mn and Ni, Ag−
It is possible to make the crystal grains of Cu-based alloys finer, improve surface roughness, and as a result, it has the effect of giving a more beautiful appearance not only in the electronic industry but also in decorative items.
第１図は従来品(F)の表面粗さ測定結果を示すグ
ラフ、第２図は本発明(A)の表面粗さ測定結果を示
すグラフ、第３図は従来品（Ｇ）の表面粗さ測定
結果を示すグラフ、第４図は本発明(B)の表面粗さ
測定結果を示すグラフ、第５図は本発明(C)の表面
粗さ測定結果を示すグラフ、第６図は従来品
（Ｇ）の表面粗さ測定結果を示すグラフ、第７図
は本発明(D)の表面粗さ測定結果を示すグラフであ
る。
Figure 1 is a graph showing the surface roughness measurement results of the conventional product (F), Figure 2 is a graph showing the surface roughness measurement results of the present invention (A), and Figure 3 is the surface roughness of the conventional product (G). Fig. 4 is a graph showing the surface roughness measurement results of the present invention (B), Fig. 5 is a graph showing the surface roughness measurement results of the present invention (C), and Fig. 6 is a graph showing the surface roughness measurement results of the present invention (C). FIG. 7 is a graph showing the surface roughness measurement results of the product (G), and FIG. 7 is a graph showing the surface roughness measurement results of the invention (D).
Claims (1)
MnおよびNiを0.005〜１重量％を加えたことを特
徴とする銀ろう材。 ２ Agを50〜95重量％、Cuを５〜50重量％、
MnおよびNiを0.005〜１重量％、さらにIn、Snの
一種または二種を0.005〜５重量％加えたことを
特徴とする銀ろう材。[Claims] 1 50 to 95% by weight of Ag, 5 to 50% by weight of Cu,
A silver brazing filler metal containing 0.005 to 1% by weight of Mn and Ni. 2 Ag 50-95% by weight, Cu 5-50% by weight,
A silver brazing material characterized by containing 0.005 to 1% by weight of Mn and Ni, and 0.005 to 5% by weight of one or both of In and Sn.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3377881A JPS57149092A (en) | 1981-03-11 | 1981-03-11 | Silver solder material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3377881A JPS57149092A (en) | 1981-03-11 | 1981-03-11 | Silver solder material |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6438086A Division JPS61216887A (en) | 1986-03-22 | 1986-03-22 | Silver brazing filler metal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57149092A JPS57149092A (en) | 1982-09-14 |
| JPS6218275B2 true JPS6218275B2 (en) | 1987-04-22 |
Family
ID=12395904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3377881A Granted JPS57149092A (en) | 1981-03-11 | 1981-03-11 | Silver solder material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57149092A (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60127093A (en) * | 1983-12-12 | 1985-07-06 | Tanaka Kikinzoku Kogyo Kk | Brazing material |
| US6596229B2 (en) * | 2000-12-29 | 2003-07-22 | United Technologies Corporation | Silver braze alloy |
| DE102004040778B4 (en) * | 2004-08-23 | 2011-11-24 | Umicore Ag & Co. Kg | Silberhartlotlegierungen |
| DE102004040779B4 (en) * | 2004-08-23 | 2009-06-18 | Abb Technology Ag | Use of silver alloys as brazing alloys |
| EP2756914A1 (en) | 2013-01-18 | 2014-07-23 | Umicore AG & Co. KG | Solder alloy |
| US9731384B2 (en) * | 2014-11-18 | 2017-08-15 | Baker Hughes Incorporated | Methods and compositions for brazing |
| CN105397334A (en) * | 2015-12-16 | 2016-03-16 | 郑州机械研究所 | Silver-based filler metal applicable to vacuum environment |
| CN110238559A (en) * | 2019-06-17 | 2019-09-17 | 无锡日月合金材料有限公司 | A kind of novel quaternary alloy solder and preparation method thereof |
| CN112605556A (en) * | 2020-12-22 | 2021-04-06 | 无锡日月合金材料有限公司 | Brazing filler metal for multistage brazing of vacuum device and preparation method thereof |
| CN114393345A (en) * | 2021-12-30 | 2022-04-26 | 无锡日月合金材料有限公司 | Low-silver vacuum solder with small temperature difference of melting point and flow point |
-
1981
- 1981-03-11 JP JP3377881A patent/JPS57149092A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57149092A (en) | 1982-09-14 |
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