JPS62172800A - Method for automatically mounting free-form leaded parts on printed board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Object of the Invention Industrial Application Field The present invention relates to a method for automatically attaching irregular shaped lead components to a printed wiring board, which is used when automatically assembling electronic circuits onto a printed wiring board. be.

Conventional technology Various electronic circuits, including audio and video circuits, are assembled on printed wiring boards, but how to increase the automation rate of assembly is an important issue in reducing manufacturing costs. .

Electronic circuits are assembled by inserting lead wires of electronic components into openings formed on a printed wiring board and temporarily fixing them, or by soldering them at predetermined locations on a wiring pattern.

At present, assembly automation has almost been achieved for electronic components such as semiconductor integrated circuits whose lead wires have extremely high accuracy in shape and size. On the other hand, it is difficult to automate electronic components such as single transistors and wire-wound resistors that have long, thin lead wires with low rigidity because their shapes vary widely due to deformation of the lead wires. For this reason, conventionally, such irregular lead components have been manually attached to printed wiring boards.

Problems to be Solved by the Invention In the above-mentioned prior art, irregular lead components such as single transistors are attached to printed wiring boards manually, which increases manufacturing costs and assembly time.
There is also the problem that human errors and variations are likely to occur.

Means for Solving the Constituent Problems of the Invention According to the automatic mounting method of the present invention which solves the problems of the prior art described above, firstly, each lead wire length is different and each cut surface is set relative to the bottom surface of the main body. 2 so that it is tilted approximately 45 degrees.
The tip of the book's irregular lead wire is cut off.

After this, the bottom of the main body is almost parallel to the printed wiring board, and the cut surface of the tip of each irregular lead wire is positioned near the opening to be inserted, facing the light source that projects a light beam parallel to the printed wiring board. The relative positions and angles of the electronic component and the printed wiring board are coarsely adjusted based on open-loop control so that the electronic component and the printed wiring board are roughly adjusted.

Next, the relative position of the electronic component and the printed wiring board is finely adjusted based on optical closed-loop control so that the reflected light from the cut surface of the longer lead wire is located approximately at the center of the corresponding aperture. is inserted into the corresponding opening.

Finally, the relative position of the electronic component and the printed wiring board is finely adjusted based on optical closed-loop control so that the reflected light from the cut surface of the shorter lead wire is located approximately at the center of the corresponding aperture. The tip portion is inserted into the corresponding opening.

By automatically performing each of the above steps, it is possible to automatically attach irregularly shaped lead parts with large variations in shape.
Cost and assembly time are reduced, and human errors and variations associated with manual work are avoided.

Hereinafter, the operation of the present invention will be explained in detail together with examples.

1 to 6 are diagrams showing the steps of an automatic mounting method according to an embodiment of the present invention.

First, as shown in FIG. 1, two amorphous lead wires 1b extend downward from the bottom of the main body 1a with variations in shape, and an electronic component 1 such as a single transistor or capacitor having an IC is connected. It is held by the holding section 2 and carried from a storage space such as a parts storage box to the vicinity of the single wire cutting sections 3a and 3b. This holding part 2 has a function of gripping the top of the electronic component 1, and is moved in the illustrated orthogonal three (X, Y, Z) directions with the rotation of a servo motor (not shown).

Next, as shown in FIG. 2, the lead wire 1b and the tip of the IC are applied to the cutting sections 3b and 3C, respectively, and cutting is performed by the operation of the cutting sections 3b and 30. As the cutting parts 3a and 3b, a cutting tool similar to a nipper is used, in which the shape and movement of the cutting edges on both sides are symmetrical in order to maintain the flatness of the cut surface.

The lead wires 1b and lc after cutting are as shown in FIG.
The mutual lengths differ by δ, and each cut surface is the main body 1a.
It is inclined at approximately 45 degrees with respect to the bottom surface.

After this, as shown in FIG. 4, a light beam 6 is projected such that the bottom of the main body 1a is almost parallel to the printed wiring board 4, and the cut surfaces of the lead wire 1b and the tip of the IC are parallel to the printed wiring board. The relative positions and angles of the electronic component 1 and the printed wiring board 4 are roughly adjusted based on open loop control using rotation of a servo motor so that the electronic component 1 and the printed wiring board 4 are located near the openings 4b and 40 to be inserted while facing a light source (not shown). be done.

Thereafter, a well-known optical system using a servo motor and an optical system is used so that the light beam reflected by the cut surface of the longer lead wire 1b is incident on the center of the optical fiber 5b arranged at the center of the aperture 4b. The relative position of electronic component 1 and printed wiring board 4 is finely adjusted by closed loop control. optical fiber 5b
The convex tip of the optical fiber 5b has a convergence function for the incident light beam, and the image of the cut surface formed in the optical fiber 5b is digitized and calculated by a subsequent quantization circuit (not shown). The position of the holding part 2 is finely adjusted by driving the servo motor in a direction that reduces this error signal.

When this fine adjustment is completed, as shown in FIG. 5, the printed wiring board 4 is moved upward so that the tip of the longer lead wire 1b is inserted into the corresponding opening 4b.

Subsequently, the light beam reflected by the cut surface of the shorter lead wire 1c is connected to the optical fiber 5C arranged at the center of the aperture 4c.
The relative position of the electronic component 1 and the printed wiring board 4 is finely adjusted by optical closed loop control using a servo motor and an optical system so that the light is incident on the center of the electronic component 1 and the printed wiring board 4.

When this fine adjustment is completed, the printed wiring board 4 is moved further upwards as shown in FIG.
The tip of the shorter lead wire 1c is inserted into the corresponding opening 4c.

Finally, although not shown, the lead wires 1b and the leading ends of the IC inserted into the openings 4b and 4C are bent to complete the automatic mounting process.

In the above, the structure in which the printed wiring board 4 is moved upward in the insertion process shown in FIGS.
, 5c may also be used to move it downward.

Effects of the Invention As explained in detail above, the automatic mounting method of the present invention has the following effects:
A configuration that automatically cuts the tip of an irregular lead wire, roughly adjusts the relative position and angle using open-loop control, and inserts it into the opening with fine adjustment of the position using optical closed-loop control for each lead wire. Therefore, it is possible to automatically attach irregularly shaped lead components, which has been difficult in the past due to large variations in shape, reducing costs and assembly time, and avoiding human errors and variations that would otherwise occur when done manually.

[Brief explanation of drawings]

1 to 6 are process diagrams showing the steps of an automatic mounting method according to an embodiment of the present invention. 1. Irregular lead parts, la.. Main body part, lb, l
c... Lead wire, 3b, 3c... Cutting section, 4... Printed wiring board, 4b, 4c... Opening, 5b, 5c... Optical fiber, 6... Light beam projected in parallel to printed wiring board 4 .

Claims (1)

[Claims] The tips of two irregularly shaped lead wires extending downward from the bottom of the main body of the electronic component with variations in shape are automatically inserted into two openings formed in the printed wiring board. A method of automatically mounting this electronic component on a printed wiring board by inserting the electronic component into a printed wiring board, the tip portions of the two irregular shaped lead wires being inserted so that each lead wire length is different and each cut surface is Approximately 4 to the bottom of the main unit
It was cut at a 5 degree inclination, and the bottom of the main body was almost parallel to the printed wiring board, and the cut surface of the tip of each irregular lead wire faced a light source that projected a light beam parallel to the printed wiring board. The relative position and angle of the electronic component and the printed wiring board are roughly adjusted based on open-loop control so that the electronic component and the printed wiring board are located near the opening to be inserted while the reflected light from the cut surface of the longer lead wire is inserted into the corresponding opening. While finely adjusting the relative position of the electronic component and printed wiring board based on optical closed-loop control so that they are located approximately at the center, the tip is inserted into the corresponding opening, and the reflected light from the cut surface of the shorter lead wire is To automatically perform the process of finely adjusting the relative position of the electronic component and the printed wiring board based on optical closed-loop control so that the electronic component and the printed wiring board are located approximately at the center of the corresponding opening, and inserting the tip thereof into the corresponding opening. A method for automatically attaching irregularly shaped lead components to a printed board, characterized by: