JPS62168535A - Method and apparatus for controlling resin emitting amount - Google Patents
Method and apparatus for controlling resin emitting amountInfo
- Publication number
- JPS62168535A JPS62168535A JP799386A JP799386A JPS62168535A JP S62168535 A JPS62168535 A JP S62168535A JP 799386 A JP799386 A JP 799386A JP 799386 A JP799386 A JP 799386A JP S62168535 A JPS62168535 A JP S62168535A
- Authority
- JP
- Japan
- Prior art keywords
- time
- resin
- emitting
- amount
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 title claims abstract description 32
- 229920005989 resin Polymers 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title claims description 10
- 238000007599 discharging Methods 0.000 claims description 11
- 239000007788 liquid Substances 0.000 abstract description 18
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 238000012545 processing Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 6
- 230000006870 function Effects 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- YDLQKLWVKKFPII-UHFFFAOYSA-N timiperone Chemical compound C1=CC(F)=CC=C1C(=O)CCCN1CCC(N2C(NC3=CC=CC=C32)=S)CC1 YDLQKLWVKKFPII-UHFFFAOYSA-N 0.000 description 1
- 229950000809 timiperone Drugs 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J4/00—Feed or outlet devices; Feed or outlet control devices
- B01J4/008—Feed or outlet control devices
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、樹脂の吐出量の制御方法及びその制御を行う
吐出装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for controlling the amount of resin discharged and a discharge device that performs the control.
(従来の技術)
従来、この種の装置は、第3図に示されるように、吐出
装置本体1からシリンジ3に圧縮された空気を送り込み
、その空気の圧力P及び加圧時間tにより液体の吐出量
を制御するようにしている。(Prior Art) Conventionally, this type of device, as shown in FIG. 3, sends compressed air from the dispensing device main body 1 to the syringe 3, and uses the pressure P of the air and the pressurization time t to generate liquid. The discharge amount is controlled.
一般に粘度及び管径が一定であれば、圧力P及び加圧時
間tによって、吐出量■が決定される。Generally, if the viscosity and pipe diameter are constant, the discharge amount (2) is determined by the pressure P and pressurization time t.
しかしながら、2液性接着剤のような時間と共に粘度n
が変化する液体は、圧力P及び加圧時間tが一定の場合
でも、第4図に示されるように、吐出量■が指数関数的
に変化する。However, with time, the viscosity n
In the case of a liquid whose pressure changes, even when the pressure P and the pressurization time t are constant, the discharge amount ■ changes exponentially, as shown in FIG.
従って、必要とされる吐出量■1〜V2を得る方法とし
て、従来は予め、圧力P及び加圧時間tを設定しておき
、T’5−Tzの間の時間内に吐き出し使用するという
方法をとっていた。Therefore, as a method to obtain the required discharge amount ■1 to V2, the conventional method is to set the pressure P and pressurization time t in advance, and discharge and use it within the time between T'5 and Tz. was taking.
しかし、この従来の方法では前記したように樹脂の吐出
時間がT1〜T2の間に定まり、つまり、1回について
の樹脂の使用時間が限定されること、また、T、〜T、
の時間内においても吐出量■が■1〜■2の間で変化す
るという欠点がある。However, in this conventional method, as described above, the resin discharge time is fixed between T1 and T2, that is, the resin usage time per one time is limited, and T, ~T,
There is a drawback that the discharge amount (2) changes between (1) and (2) even within the time period (2).
従来の他の方法として2液温合吐出装置を使用する方法
がある。Another conventional method is to use a two-liquid heating and discharging device.
これは、第5図に示されるように、2系統の同様の吐出
装置を使用し、一定の混合比でミキサ部m内において混
合しながら吐き出しするものである。このことにより、
実時間で2液を混合できるので、吐出装置使用時間の粘
度変化は無視できる。As shown in FIG. 5, this uses two systems of similar discharge devices and discharges the mixture while mixing it in the mixer section m at a constant mixing ratio. Due to this,
Since the two liquids can be mixed in real time, changes in viscosity during the time the dispensing device is used can be ignored.
(発明が解決しようとする問題点)
しかしながら、本装置においては、第6図に示されるよ
うに、2液温合比が大きくなるに従い、最小吐出量が1
液吐出装置よりも太き(なり、微少量吐出には不都合で
ある。また、2液温合吐出装置は1液吐出装置に比べて
微少量を長時間かげて吐出する場合に硬化してしまう等
の格別の難しさを伴う。従って、従来より安全な方法と
して、予め2液を混合して1液とし、1液吐出装置を使
用することが一般に行われている。(Problems to be Solved by the Invention) However, in this device, as the two-liquid heating ratio increases, the minimum discharge amount decreases to 1.
It is thicker than a liquid dispensing device (which is inconvenient for dispensing very small amounts.Also, two-component heating dispensing devices harden when discharging minute amounts over a long period of time compared to single-component dispensing devices). Therefore, as a safer method than conventional methods, it is generally practiced to mix two liquids in advance to make one liquid and use a one-liquid discharging device.
本発明は、上記の問題点を除去し、樹脂吐出量が安定に
なるように制御可能な樹脂の吐出量制御方法及びその装
置を提供することを目的とする。SUMMARY OF THE INVENTION An object of the present invention is to provide a resin discharge amount control method and apparatus that can eliminate the above-mentioned problems and control the resin discharge amount so that the resin discharge amount becomes stable.
(問題点を解決するための手段)
本発明は、上記問題点を解決するために、時間の関数で
粘度が変化する樹脂の吐出量制御方法において、制御装
置によって経過時間を監視し、該樹脂の加圧時間tを経
過時間に応じて変化させるようにしたものである。また
、時間の関数で粘度が変化する樹脂を任意の量吐出する
樹脂の吐出装置において、加圧時間を調整する調整手段
と、該調整手段によって吐出時間を補正し、吐出量を制
御する手段とを設けるようにしたものである。(Means for Solving the Problems) In order to solve the above problems, the present invention provides a method for controlling the discharge amount of resin whose viscosity changes as a function of time, in which a control device monitors the elapsed time, and the resin The pressurizing time t is changed according to the elapsed time. Further, in a resin dispensing device for dispensing an arbitrary amount of resin whose viscosity changes as a function of time, an adjusting means for adjusting pressurization time, and a means for correcting the dispensing time by the adjusting means and controlling the dispensing amount are provided. It is designed to provide a.
(作用)
本発明によれば、樹脂を吐出させる場合に、経過時間に
応じて樹脂の加圧時間を調整して、吐出量を制御する。(Function) According to the present invention, when discharging resin, the pressurizing time of the resin is adjusted according to the elapsed time to control the discharge amount.
従って、時間の関数で粘度が変化する樹脂であってもそ
の吐出量を一定にすることができる。Therefore, even if the resin has a viscosity that changes as a function of time, the discharge amount can be kept constant.
(実施例)
以下、本発明の実施例について図面を参照しながら詳細
に説明する。(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.
第1図は本発明の実施例を示す樹脂の吐出装置の構成図
である。FIG. 1 is a configuration diagram of a resin discharging device showing an embodiment of the present invention.
図に示されるように、制御装置6には、CPU(中央処
理装置)7、クロック8、MDI(マニュアル・データ
・インプット)装置9、メモリ10、■/○インタフェ
ース11等を具備し、吐出装置本体12にはプログラマ
ブルタイマ13を具備している。As shown in the figure, the control device 6 includes a CPU (central processing unit) 7, a clock 8, an MDI (manual data input) device 9, a memory 10, a ■/○ interface 11, etc. The main body 12 is equipped with a programmable timer 13.
そこで、この発明においては、制御装置6のクロック8
によって経過時間を監視し、第2図に示されるように、
2液性接着剤混合後の経過時間Tに応じて、吐出装置本
体1の加圧時間tを変化させるようにしたものである。Therefore, in this invention, the clock 8 of the control device 6
Monitor the elapsed time by, as shown in Figure 2,
The pressurizing time t of the discharge device main body 1 is changed according to the elapsed time T after the two-component adhesive is mixed.
この点について、以下、詳細に説明する。This point will be explained in detail below.
第4図は加圧時間が一定の場合の2液温合後の経過時間
Tによる吐出量の変化を示したものであるが、これは次
の式で表される。FIG. 4 shows the change in the discharge amount depending on the elapsed time T after the two liquids have warmed up when the pressurization time is constant, and this is expressed by the following equation.
Vm −Voe’−”” −(1)この(1)式
において、V CT)は経過時間T&の吐出量、Voば
2液温合直後の吐出量、Kは樹脂固有の係数である。Vm -Voe'-""-(1) In this equation (1), VCT) is the discharge amount during the elapsed time T&, Vo is the discharge amount immediately after the two liquids are heated, and K is a coefficient specific to the resin.
また、■、アl+Voは次式で表される。In addition, ■ and Al+Vo are expressed by the following formula.
V +t+ −V (T) t ・・・(2
)この(2)式より、
Vo =Vo t ・・・ (3)
上記(2)、 (3)式において、V (T) は経過
時間T後の単位時間吐出量、VQは2液温合直後の単位
時間吐出量であり、圧力P及び樹脂の初期粘度noによ
って決定される量である。tは加圧時間であり、一定で
ある。V +t+ -V (T) t...(2
) From this formula (2), Vo = Vo t... (3)
In the above equations (2) and (3), V (T) is the discharge amount per unit time after the elapsed time T, VQ is the discharge amount per unit time immediately after the two liquids are heated, and depending on the pressure P and the initial viscosity of the resin, is the amount to be determined. t is the pressurization time and is constant.
上記(1) 、 (3)式より、次の式が成り立つ。From the above equations (1) and (3), the following equation holds true.
v 、T)= yOt e(−T/Kl 、・(4)
ここで、加圧時間tを経過時間Tに応じて変化させtを
t (T) とおく
V (T) =VQ t (Tl e ’−””
、 −(4) ’ここで、
t(T) = t o e ”” −
(5)とおけば、
■、、、 −vo t 、 e(T/II+ 、
e(−T/K)−V。t6 =V6 ・・・(
6)上記(5)、 (6)式において、1oは2液温
合直後の加圧時間である。即ち、上記(5)弐により制
御装置で加圧時間を変化させれば良い。上記(6)式に
は、経過時間Tの因子が含まれていないので、toを任
意に設定することにより、容易に吐出量■を制御するこ
とが可能である。v, T) = yOte(-T/Kl, ・(4)
Here, the pressurization time t is changed according to the elapsed time T and t is set as t (T). V (T) = VQ t (Tle '-""
, −(4) 'Here, t(T) = t o e "" −
(5), then ■, , -vo t , e(T/II+ ,
e(-T/K)-V. t6=V6...(
6) In the above equations (5) and (6), 1o is the pressurization time immediately after the two liquids are heated. That is, the pressurization time may be changed by the control device according to (5) 2 above. Since the above equation (6) does not include the factor of the elapsed time T, it is possible to easily control the discharge amount ■ by arbitrarily setting to.
そこで、経過時間1゛を制御装置6のクロック8からの
信号で監視しながら、その経過時間に対応した加圧時間
tを得る。つまり、メモ1月Oには経過時間Tに対応し
た加圧時間tがテーブル化されて記憶されており、経過
時間Tに対応した加圧時間tの信号がI10インタフェ
ースロを介して吐出装置本体12のタイマ13へ送られ
て、加圧時間の制御が行われる。また、吐出される樹脂
に応じてMDI装置からデータを適宜入力して吐出条件
を変更させることができる。Therefore, while monitoring the elapsed time 1'' using a signal from the clock 8 of the control device 6, the pressurization time t corresponding to the elapsed time is obtained. In other words, the pressurization time t corresponding to the elapsed time T is stored in a table form in the memo January O, and the signal of the pressurization time t corresponding to the elapsed time T is sent to the main body of the dispensing device via the I10 interface. 12 and is sent to the timer 13 to control the pressurization time. Furthermore, the ejection conditions can be changed by appropriately inputting data from the MDI device depending on the resin to be ejected.
このように構成することにより、第2図に示されるよう
に、樹脂の吐出量を一定に制御することができる。With this configuration, as shown in FIG. 2, the amount of resin discharged can be controlled to be constant.
なお、本発明は上記実施例に限定されるものではなく、
本発明の趣旨に基づいζ種々の変形が可能であり、これ
らを本発明の範囲から排除するものではない。Note that the present invention is not limited to the above embodiments,
Various modifications are possible based on the spirit of the present invention, and these are not excluded from the scope of the present invention.
(発明の効果)
以上、詳細に説明したように、本発明によれば、(1)
時間の関数で粘度が変化する樹脂を任意の量吐出する吐
出量制御方法において、吐出時間を加圧時間を変化させ
て補正し、吐出量を制御する。(Effects of the Invention) As described above in detail, according to the present invention, (1)
In a discharge amount control method for discharging an arbitrary amount of resin whose viscosity changes as a function of time, the discharge amount is controlled by correcting the discharge time by changing the pressurization time.
(2)時間の関数で粘度が変化する樹脂を任意の量吐出
する樹脂の吐出装置において、加圧時間を調整する調整
手段と、該調整手段によって吐出時間を補正し、吐出量
を制御する手段とを具備するようにしたようにしたので
、
(1)2液温合吐出装置に比べ設備も簡単であり、微少
量吐出が可能である。(2) In a resin dispensing device for dispensing an arbitrary amount of resin whose viscosity changes as a function of time, an adjusting means for adjusting pressurization time, and a means for correcting the dispensing time by the adjusting means and controlling the dispensing amount. (1) Compared to a two-liquid heating and discharging device, the equipment is simpler and a very small amount can be discharged.
(2)2液性樹脂をボットライフまで使用できるので、
混合1回について最大限有効に使用できる。(2) Two-component resin can be used until the bot life, so
Maximum efficiency can be achieved per mixing.
(3)吐出量Vが2液温合後の経過時間Tに影響されな
いので、極めて安定しており、制御も容易である。(3) Since the discharge amount V is not affected by the elapsed time T after the two liquids are heated, it is extremely stable and easy to control.
以」二のように本発明によれば、2液性樹脂を使用する
工程の生産性の向上に大きな効果があり、品質の安定及
びコストの低減に寄与するものである。As described above, the present invention has a significant effect on improving the productivity of processes using two-component resins, contributing to quality stability and cost reduction.
第1図は本発明の実施例を示す吐出装置の構成図、第2
図は本発明による吐出量制御特性図、第3図は従来の吐
出装置の構成図、第4図は従来の吐出量の説明図、第5
図は従来の2液型吐出装置の構成図、第6図は同2液型
吐出装置による最小吐出量の特性図である。
1.12・・・吐出装置本体、2・・・デユープ、3・
・・シリンジ、4・・・樹脂、5・・・ノズル、6・・
・制御装置、7・・・CPU、8・・・クロック、9・
・・MDIW置、10・・・メモリ、11・・・I10
インタフェース、13・・・タイマ、m・・・ミキサ部
。FIG. 1 is a configuration diagram of a discharge device showing an embodiment of the present invention, and FIG.
3 is a configuration diagram of a conventional discharge device, FIG. 4 is an explanatory diagram of a conventional discharge amount, and FIG.
The figure is a block diagram of a conventional two-liquid type discharge device, and FIG. 6 is a characteristic diagram of the minimum discharge amount by the two-liquid type discharge device. 1.12...discharge device main body, 2...duplex, 3...
...Syringe, 4...Resin, 5...Nozzle, 6...
・Control device, 7...CPU, 8...Clock, 9.
...MDIW placement, 10...Memory, 11...I10
Interface, 13...Timer, m...Mixer section.
Claims (2)
量制御方法において、吐出時間を加圧時間を変化させて
補正し、吐出量を制御することを特徴とする樹脂の吐出
量制御方法。(1) A resin discharge rate control method for dispensing resin whose viscosity changes as a function of time, the method comprising: correcting the discharge time by changing the pressurization time to control the discharge rate. .
の吐出装置において、加圧時間を調整する調整手段と、
該調整手段によって吐出時間を補正し、吐出量を制御す
る手段とを具備するようにしたことを特徴とする樹脂の
吐出装置。(2) In a resin discharging device that discharges resin whose viscosity changes as a function of time, an adjusting means for adjusting pressurization time;
A resin discharging apparatus characterized by comprising means for correcting the discharging time by the adjusting means and controlling the discharging amount.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP799386A JPS62168535A (en) | 1986-01-20 | 1986-01-20 | Method and apparatus for controlling resin emitting amount |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP799386A JPS62168535A (en) | 1986-01-20 | 1986-01-20 | Method and apparatus for controlling resin emitting amount |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62168535A true JPS62168535A (en) | 1987-07-24 |
Family
ID=11680926
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP799386A Pending JPS62168535A (en) | 1986-01-20 | 1986-01-20 | Method and apparatus for controlling resin emitting amount |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62168535A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6448693B1 (en) | 1999-10-01 | 2002-09-10 | Ngk Insulators, Ltd. | Piezoelectric/electrostrictive device and method of manufacturing same |
US6455984B1 (en) | 1999-10-01 | 2002-09-24 | Ngk Insulators, Ltd. | Piezoelectric/electrostrictive device and method of manufacturing same |
US6531805B2 (en) | 2000-06-16 | 2003-03-11 | Ngk Insultaors, Ltd. | Piezoelectric/electrostrictive device and method of producing the same |
US6534899B1 (en) | 1999-10-01 | 2003-03-18 | Ngk Insulators, Ltd. | Piezoelectric/electrostrictive device and method of manufacturing same |
US6657364B1 (en) | 1999-10-01 | 2003-12-02 | Ngk Insulators, Ltd. | Piezoelectric/electrostrictive device |
-
1986
- 1986-01-20 JP JP799386A patent/JPS62168535A/en active Pending
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6796011B2 (en) | 1999-10-01 | 2004-09-28 | Ngk Insulators, Ltd. | Piezoelectric/electrostrictive device and method of manufacturing same |
US6455984B1 (en) | 1999-10-01 | 2002-09-24 | Ngk Insulators, Ltd. | Piezoelectric/electrostrictive device and method of manufacturing same |
US6534899B1 (en) | 1999-10-01 | 2003-03-18 | Ngk Insulators, Ltd. | Piezoelectric/electrostrictive device and method of manufacturing same |
US6657364B1 (en) | 1999-10-01 | 2003-12-02 | Ngk Insulators, Ltd. | Piezoelectric/electrostrictive device |
US6448693B1 (en) | 1999-10-01 | 2002-09-10 | Ngk Insulators, Ltd. | Piezoelectric/electrostrictive device and method of manufacturing same |
US6817072B2 (en) | 1999-10-01 | 2004-11-16 | Ngk Insulators, Ltd. | Method of manufacturing a piezoelectric/electrostrictive device |
US6933658B2 (en) | 1999-10-01 | 2005-08-23 | Ngk Insulators, Ltd. | Method of manufacturing a piezoelectric/electrostrictive device |
US6968603B2 (en) | 1999-10-01 | 2005-11-29 | Ngk Insulators, Ltd. | Method of producing a piezoelectric/electrostrictive device |
US7245064B2 (en) | 1999-10-01 | 2007-07-17 | Ngk Insulators, Ltd. | Piezoelectric/electrostrictive device |
US7358647B2 (en) | 1999-10-01 | 2008-04-15 | Ngk Insulators, Ltd. | Piezoelectric/electrostrictive device |
US6531805B2 (en) | 2000-06-16 | 2003-03-11 | Ngk Insultaors, Ltd. | Piezoelectric/electrostrictive device and method of producing the same |
US6766568B2 (en) | 2000-06-16 | 2004-07-27 | Ngk Insulators, Ltd. | Method of producing a piezoelectric/electrostrictive device |
US7089637B2 (en) | 2000-06-16 | 2006-08-15 | Ngk Insulators, Ltd. | Method of producing a piezoelectric/electrostrictive device |
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