JPS62166072A - Method and device for solder processing for printing board - Google Patents

Abstract

PURPOSE:To cope flexibly with various processing conditions by immersing or drawing up a printed board in a state that it as been inclined so that its inclined angle can be varied, against a liquid level of a molten solder liquid or a flux liquid. CONSTITUTION:A carrying device 7 for turning and moving by clamping a printed board PCB carries the board PCB from a loader part 1 to a flux processing part 3, and thereafter, carries the board PCB to which a flux has been stuck, to a pre-heat part 6. In the same way, a carrying device 11 carries a pre-heated board PCB to a solder dip part 9 and immerses it into a molten solder liquid, and thereafter, draws up the board PCM to which soldering has been performed and carried it to an unloader part 10. In this regard, the devices 7, 11 immerses or draws up the board PCM in a state that is has been inclined so that its inclined angle can be varied against a liquid level of a flux liquid or a solder liquid. In this way, solder processing can be executed with a high accuracy against various processing conditions.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a soldering device, and in particular to a soldering process technique that is effective when applied to solder dipping or flux application to a printed circuit board on which electronic components are mounted. It is.

[Conventional technology]

Several methods have been proposed for soldering or solder dipping to printed circuit boards.

One of them is to solder the required parts of the mounted printed circuit board one by one using a soldering iron.
There is a method for so-called handing.

On the other hand, another method is to automate the solder dipping mechanism for printed circuit boards to a certain extent, attach a special metal fitting type attachment to a chain conveyor, sandwich the printed circuit board between the metal fittings, and move the solder dipping mechanism for printed circuit boards to a flux bath at a constant speed. ,
In this method, the soldering process is performed by passing the solder through a jet-flow soldering bath, and the final finish is performed by manually correcting any defective parts while inspecting the parts.

[Problem that the invention seeks to solve]

However, of the above two methods, the former method is a manual method, so the efficiency of the soldering process is low, and it is not possible to meet the demands such as improving mounting density, improving productivity, and realizing double-sided mounting. There wasn't.

In addition, although the latter method has some merits from automation, since the soldering process is performed while transporting the printed circuit board at a constant speed, factors such as fluctuations in the mounting density of the printed circuit board and support for double-sided mounting may be affected. There is a serious problem in that there is a lack of diversity and flexibility in the soldering process that needs to be changed. In other words, when performing solder processing such as solder dipping and Franks deposition,
The implementation conditions depend on various factors, especially the semiconductor elements and resistors mounted on the printed circuit board,
The mounting density of electronic elements such as capacitors has a large effect on the time and number of soldering processes. For example, when high-density mounting is performed, as is the general trend in today's print a temporary, it may be assumed that the dip time is insufficient due to solder dipping at an insufficient constant speed for the mounting density. This causes defects such as insufficient solder swelling and the formation of so-called pinholes.

In addition, when the printed circuit board is transported in a plane direction, that is, parallel to the liquid level direction of the molten solder when performing solder dipping,
Because the solder does not cut well, defects such as solder protruding in the axial direction from the tip of the lead terminal in an icicle-like manner, and so-called pre-nozzle defects caused by solder bridging between two or more lead terminals occur. .

In order to eliminate such defects, it is conceivable to make the angle at which the chain conveyor carries the printed circuit board into and out of the solder tank or the flux tank to be inclined with respect to the plane direction.

However, the board conveyance posture by the chain conveyor is fixed due to its mechanism, and the inclination angle of the printed board cannot be changed depending on implementation conditions such as mounting density, so it is still insufficient as a solution to the above problem. was revealed by the present inventor.

Furthermore, the above-mentioned chain conveyor type solder processing equipment has a large structure and a large installation area, and the solder tank is limited to a jet solder tank, so it is necessary to add a solder oxidation inhibitor. It is difficult to control the purity of solder liquid,
Moreover, the amount of solder used increases, leading to problems such as higher costs.

It is an object of the present invention to solve the above-mentioned problems and to provide a solder processing technology for printed circuit boards that can flexibly respond to a wide variety of processing conditions.
It is an object of the present invention to provide a solder processing technology for a printed circuit board that can greatly reduce the occurrence of processing defects and perform highly accurate solder processing.

Still other objects of the invention are compact, space saving;
It is an object of the present invention to provide a solder processing device for printed circuit boards that can reduce costs.

Means for Solving Problem C] In the present invention, a printed circuit board is immersed or pulled up while being tilted at a variable inclination angle with respect to the liquid level of molten solder liquid in a solder tank or flux liquid in a flux tank. It is something.

[Effect]

By using the above method, printed circuit boards can be processed at the optimal tilt angle depending on the implementation conditions such as the mounting density of electronic components on the printed circuit board, and can be flexibly handled according to a wide variety of processing conditions. This makes it possible to perform a soldering process, etc., thereby achieving the above object.

〔Example〕

FIG. 1 is a schematic front view of a printed circuit board solder processing apparatus according to an embodiment of the present invention, FIG. 2 is a plan view thereof, FIG. 3 is a partial side sectional view of a conveying device, and FIG. 4 is a schematic thereof. Front view,
FIG. 5 is an enlarged partial plan view of the conveyance device, FIG. 6 is a schematic front view of the printed circuit board holding mechanism, FIG. 7 is a diagram illustrating the operation of dipping and lifting a printed circuit board into a solder bath or flux bath, and FIG. 8 The figure is a schematic explanatory diagram showing the overall process of soldering a printed circuit board according to the present invention.

The solder processing apparatus for printed circuit boards in this embodiment has a first
As shown in Figures 1 and 2, the rotor section is supplied with a printed circuit board with or without various electronic components such as semiconductor elements, resistors, and capacitors mounted on one or both sides of the rotor at the required packaging density. and a flux tank 2 that applies flux liquid to the surface of the printed circuit board to be soldered.
a preheating section 6 having two preheating stations 4.5 for preheating the printed circuit board coated with flux and activating the flux; A printed circuit board transport device 7 that transports the printed circuit board to the preheating section 6 by a complex motion such as horizontal and vertical linear motion and arcuate motion, and performs flux deposition.
(a first printed circuit board transfer device); a solder dip section 9 that performs solder dipping by immersing the surface to be soldered of the printed circuit board preheated in the preheat section 6 into molten solder liquid in a solder bath 8; An unrotor section 10 collects the printed circuit board that has undergone solder dipping, and the printed circuit board is moved from the preheat section 6 through the solder dipping section 9 to the unrotor section 10 by complex movements such as horizontal and vertical linear movement and circular arc movement. It consists of a printed circuit board transport device 11 (second printed circuit board 45. transport device) that transports the board and dips the solder onto the surface of the printed circuit board to be soldered during the transport.

The flux liquid in the flux tank 2 of the flux processing section 3 is mixed with the flux stock solution from the stock solution tank and the diluted solution from the dilution tank to a desired specific gravity and temperature by a flux control system (not shown) to form a mixed solution. The flux is supplied to the flux tank 2.

On the other hand, in this embodiment, the solder tank 8 of the solder dip section 9 is constructed as a so-called stationary solder tank, and its liquid level is precisely controlled by a sensor and a control system (not shown). Since the solder tank 8 is a static solder tank, there is no need to add solder oxidation inhibitor, no need to check the purity, and there is less need to replace the molten solder solution compared to a jet solder tank. Benefits include reduced usage and cost advantages.

Further, the solder bath 8 is configured to incorporate an ultrasonic oscillator (not shown) and use the ultrasonic energy to perform solder swelling and solder dipping with good wettability.

Next, the printed circuit board conveying devices 7 and 11 will be explained. The former is a flux coating printed circuit board conveying device, and the printed circuit board conveying devices 7 and 11 are used to transfer printed circuit boards from the rotor section 1 to the flux tank 2. The latter is used as a printed circuit board transfer device for solder dipping, and transfers the preheated printed circuit board to the molten solder in the solder bath 8. The only difference in usage is that they are immersed in a liquid, subjected to solder dipping, and transported to the unrotor section 10, but their configurations and functions are substantially the same and are compatible with each other, so they will not be described here. Explain in common.

That is, these printed circuit board transfer devices 7 or 11
As shown in FIGS. 3 to 7, the swing shaft 13 extends horizontally through the worm reducer 12, the bearing mechanism 14 that supports the tip of the swing shaft 13, and the swing shaft 13 that extends horizontally through the worm reducer 12. A swinging arm 15 fixed upward in the radial direction near the tip of the shaft 13, a shaft 16 horizontally supported on the upper end of this arm 15, and one end (right end in FIG. 3) of this shaft. The printed circuit board holding mechanism 17 (see FIGS. 5 and 6) is attached to the PC board holding mechanism 17 (see FIGS. 5 and 6).

The entire printed circuit board transfer device 7 or 11 is moved over the machine frame from left to right in FIGS. 1 and 2 using a cylinder device (not shown), or vice versa by arrow F in FIGS. 1 and 8. As shown by G, it is configured to be movable linearly in the horizontal direction.

In the above, the swing arm 15 attached to the moving shaft 13 is at one point t! in FIGS. 1 and 8. MA, B, C, D, E
.

The pudding +-i swings in an arcuate trajectory as shown by F and G and is held by the printed circuit board holding mechanism 17.
Although the board is conveyed in the vertical direction, it is provided with an attitude maintenance function that maintains the printed circuit board in a desired attitude in a fixed direction, for example, in the horizontal direction. In order to obtain this posture maintenance function, a timing heald 20 (a first transmission means ) are installed. Further, a servo motor 21 (first driving means) is provided for swinging the swing shaft 13, and the servo motor 21 drives the swing shaft 1 through a worm reducer 12.
3, the swing arm 15 moves 12, and the printed circuit board held by the printed circuit board holding mechanism 17 is conveyed in an arcuate trajectory (U) in the vertical direction, and at the same time The printed circuit board is maintained in a constant posture by the printed circuit board holding mechanism 17 by rotating the shaft 16 from the pulley 18 through the timing belt 20 and the pulley 19 independently of the tg movement of the swing arm 15.

Furthermore, the printed circuit board transfer device 7 or 11 of this embodiment
In addition to the above-mentioned posture maintenance function, the function is used to mount electronic components on printed circuit boards in order to improve the flux adhesion and solder wettability of printed circuit boards that are carried into and out of the flux bath 2 or solder bath 8. It is equipped with a variable tilting function that allows the tilting angle to be variably tilted to a desired angle depending on the processing conditions such as density. That is, in order to obtain this variable tilt function, a pulse motor 22 (second driving means) for temporarily tilting the pudding 14 is provided separately from the servo motor 21. This pulse motor 22 has a worm reducer 23
, a shaft 24 extending from this worm reduction m23, a pulley 25 attached to the outer end of this shaft 24, and this pulley 25.
The swing shaft 13 is oscillated at a timing independent of the servo motor 21 via a timing belt 27 (second transmission means) stretched between the servo motor 21 and the pulley 26 on the swing shaft 13. can be moved. The operation of the servo motor 21 and the pulse motor 22 is controlled by a control device 28.

In addition, in order to tilt the printed circuit board by operating the pulse motor 22, the boot IJ26 on the swing shaft 13 and the pulley 1
8 and are connected to each other by a pin 29 so as to rotate simultaneously. That is, with this pulley connection structure, when the pulse motor 22 is operated, the pulley 26 rotates on the swing shaft 13 via the pulley 25 and the timing belt 27, and the pulley 18 also rotates along with the pulley 26 on the swing shaft 13. As the IJ 19 and the shaft 16 are rotated via the timing belt 20 wound around the 8-pulley 18
Depending on the amount of rotation, the printed circuit board holding mechanism 17 attached to the shaft 16 can be tilted by a required angle.

Here, the printed circuit board holding mechanism 17 will be explained. As shown in FIGS.
A block 30 is fixedly attached to the block 30, two guide bars 31 are attached to the block 30 so as to pass through the block 30 in a direction perpendicular to the axis 16, and a guide bar 31 is provided in parallel between the two guide bars 31. It has a rotatable tension shaft 32 and slides 33 provided at both ends of the guide bar 31 so as to be slidable in a direction orthogonal to the guide bar 31.

A clamp support 35, which is attached with a butterfly bolt 34, hangs below the slide 33. A clamp member 36 made of, for example, an elastic transparent resin material is attached to the lower end of the clamp support 35 so as to face downward. The lower part of the clamp member 36 is bent into a dogleg shape so that the inner surfaces facing each other are concave, and the both ends of the printed circuit board PCB are inserted between the doglegged bent parts to be locked and held. ing.

As shown by the two-dot chain line in FIG. 6, the slide 33, clamp support 35, clamp member 36, etc.
By rotating them, they centrifugally move relative to each other along the guide bar 31 according to the planar dimension of the printed circuit board PCB, and can automatically and reliably hold and solder a printed circuit board of any size. ing. - As described above, the printed circuit board holding mechanism 17 of this embodiment
As shown in FIG. 7, by operating the pulse motor 22 while holding the printed circuit board PCB, the printed circuit board PCB can be tilted to any desired angle according to the processing conditions such as the density of electronic component mounting. It is configured so that it can be tilted.

The operation of this embodiment will be explained below.

First, as illustrated in FIG. 7, a printed circuit board PCB with or without electronic components EP such as a semiconductor element, an abrasive, or a capacitor mounted thereon is supplied to the rotor section 1 of a solder processing apparatus. The printed circuit board PCB supplied to the rotor section 1 is held between the pair of clamp members 36 of the printed circuit board transfer device 7 from opposite ends thereof.

That is, the clamp member 36 of the printed circuit board transfer device 7
As shown in FIG.
As shown by 91A, as it swings by a predetermined angle counterclockwise in FIGS. 1 and 8, it moves in an arc toward the rotor portion l, and holds the printed circuit board PCB between the clamp members 36 on both sides as described above. do.

Thereafter, by driving the servo motor 21 in the opposite direction, the clamp member 36 holding the printed circuit board PCB etc. moves in an arc shape in the direction in which the swing arm 15 stands upright as shown by arrow B, that is, in the clockwise direction. Exercise. This arcuate movement is further continued as shown by arrow C, and as a result, the printed circuit board PCl3 reaches above the flux tank 2 while remaining in a horizontal state as shown in FIG.

In this case, if the printed circuit board PCB is immersed in the flux liquid in a horizontal direction parallel to the liquid level in the flux tank 2, air bubbles will remain on the back surface of the printed circuit board PCB.
It is difficult to perform a complete fluxing operation.

Therefore, in this embodiment, in this position, the control device! 2
By driving the pulse motor 22 in accordance with the command signal from the pulley 25. Timing belt 27.
Pulley 26. Pin 29, pulley 18. Timing belt 20. The signal is transmitted to the printed circuit board holding mechanism 17 via the pulley 19° shaft 16, and the printed circuit board holding mechanism 17 is tilted by a predetermined angle as shown by the two-dot chain line in FIG. 7, for example. The angle of inclination at this time can be input to the control device 28 according to the mounting density of the electronic components EP on the printed circuit board PCB, the conditions of the flux liquid, etc., and can be automatically variably controlled to an arbitrary angle.

For example, when the printed circuit board PCB is inclined as shown by the two-dot chain line in FIG. 7, the printed circuit board PCB is tilted as shown by the two-dot chain line in FIG.
Since the printed circuit board inclination angle caused by the pulse motor 22 becomes larger than the swinging speed of the swinging arm caused by the servo motor 21, the CB lowers from the two-dot ti line position to the one-dot chain line position while gradually changing the inclination angle horizontally. do.

At this point U1 line position, the inclined printed circuit board PCB
First, the lower part is dipped little by little into the flux solution.

From this state, by operating both motors 21 and 22 so that the printed circuit board tilting speed by the pulse motor 22 is slower than the swinging speed by the servo motor 21, the printed circuit board PCB is finally moved to the surface of the flux liquid. It becomes a substantially parallel state, that is, a horizontal state.

Therefore, in this embodiment, the printed circuit board PCB moves in an arcuate motion trajectory through a compound movement caused by the combination of the swinging of the swinging arm 15 by the driving force of the servo motor 21 and the pulse motor 22 and the tilting of the printed circuit board holding mechanism 17. While changing the inclination angle along the flux, the lower surface to be soldered gradually changes from an inclined state to a horizontal state with respect to the liquid level of the flux liquid, and is finally immersed so as to be in full contact with the liquid level.

As a result, the printed circuit board PCB-h<
It is possible to eliminate problems such as air bubbles remaining on the back side of the film, which prevents complete flux adhesion.

Next, the printed circuit board PCB that has undergone flux application
When pulling up the printed circuit board PC from the flux liquid, the printed circuit board holding mechanism 17
B is tilted and gradually pulled up from one end (the right end in FIGS. 7 and 8), and the opposite end is finally pulled away from the liquid level. Then, the swing arm 15 and the printed circuit board holding mechanism 17 are returned to the upright position as shown by the arrows. In this way, by lifting the printed circuit board PCB from the surface of the flux liquid at an angle of about 1 with a variable inclination angle, the flux liquid can be easily drained (and the liquid may remain concentrated in some areas). can eliminate heterogeneity.

Thereafter, the printed circuit board transport device 7 is linearly moved by a predetermined distance in the direction of arrow E using a cylinder device (not shown) or the like. Then, by operating the servo motor 21 at that position, the printed circuit board PCB held by the printed circuit board holding mechanism 17 is moved horizontally along an arcuate locus of movement as shown by arrow F to the preheat station of the preheat section 6. 4.

Next, the printed circuit board holding mechanism 17 swings in the return direction along an arcuate locus of motion as shown by arrow G, and then the entire printed circuit board transfer device 7 performs a linear return motion as shown by arrow H to return to the initial position. Return to position.

The printed circuit board PCB in the preheat section 6 is moved from the preheat station 4 to the preheat station 5 by a moving means (not shown), and is preheated in one step to a desired temperature, and is adhered to the surface of the printed circuit board PCB to be soldered. Improves solder wettability by activating flux.

Next, the preheated printed circuit board PCB is immersed in the static solder liquid in the solder tank 8 in the solder dip section 9 from the preheat section 6 by the printed circuit board transfer device 11, and then pulled up and subjected to solder dipping treatment. , unrotor section 1
0 and collected.

Operations such as transporting the printed circuit board PCB from the preheat section 6 to the unrotor section 10 via the solder dip section 9 and solder dipping are carried out only depending on whether the processing liquid is flux liquid or solder liquid. The case of the printed circuit board conveying device 11 for use in the present invention is also substantially the same as the case of the printed circuit board conveying device 7 for applying flux, so a redundant explanation will be omitted.

That is, the solder dipping process of the printed circuit board PCB by the printed circuit board transfer device 11 is also performed by immersing the printed circuit board PCB in a tilted state with a variable tilt angle and pulling it up into the solder liquid in the solder tank 8.

Therefore, the printed circuit board PCB is immersed in the solder liquid reliably and uniformly over the entire surface to be soldered, and the solder can be easily cut when the printed circuit board PCB is pulled up from the solder liquid. As a result, solder dipping is performed satisfactorily, and solder dipping defects such as so-called insufficient swelling, formation of pinholes, formation of icicle-like protrusions, and formation of bridges can be avoided.

Of course, even in the case of solder dipping, the inclination angle of the printed circuit board PCB can be variably controlled to the optimum state depending on the processing conditions such as the mounting density of electronic components EP on the printed circuit board PCB and the processing time, so that Accurate solder dipping can be performed flexibly.

Moreover, in the present invention, since the above-mentioned structure is used as the printed circuit board transfer value W7°11, flux application or solder dipping can be repeated as many times as necessary, thereby making it even more reliable. Flux deposition or solder dipping can be performed.

Note that the present invention is not limited to the above embodiments,
Various other variations are possible.

For example, the angle, direction, speed, etc. of the inclination of the printed circuit board can be arbitrarily changed depending on the mounting density of electronic components on the printed circuit board, other processing conditions, etc. to perform optimal soldering processing.

Flux application and solder dipping are not limited to one time each, but either one or both may be repeated multiple times.

In addition to the arrangement of each processing section in a straight line as in the above embodiment, each processing section may be arranged in a staggered manner on a plane, in a loop shape, or three-dimensionally in a vertical direction. It is also possible to place the

Furthermore, in addition to providing two printed circuit board transfer devices, it is also possible to use only one or three or more.

Further, the variable inclination of the printed circuit board may not be performed both for the application of the flux and for the solder dip, but may be performed only for the solder dip, for example.

Further, the solder tank is not limited to a stationary solder tank, but may be a jet solder tank or a solder tank in which solder dipping is performed by stirring the solder liquid with a stirring plate.

Further, as the driving means, something other than a servo motor or a pulse motor may be used, and as the transmission means, a chain or the like may be used instead of a timing belt.

〔Effect of the invention〕

(1) A solder processing method for performing solder dipping or flux deposition on an i-board (printer on which electronic components are mounted), comprising:
With the printed circuit board tilted at a variable angle with respect to the liquid level of the molten solder liquid in the solder tank or the flux liquid in the flux liquid, at least the surface to be soldered of the printed circuit board is moved from the lower end side to the upper end in the tilted state. After processing the desired area of the surface to be soldered by immersing it in the liquid while returning it from a tilted state to a horizontal state so as to bring the printed circuit board into contact with the liquid surface sequentially, the printed circuit board is tilted at a variable inclination angle while being immersed in the liquid. By raising the surface above the liquid level, the flexopull can respond to changes in the mounting density of printed circuit boards and a wide variety of other processing conditions, and it is possible to always perform optimal soldering processing for printed plates.

(2) According to (1) above, processing defects can be greatly reduced, and highly accurate soldering processing can be performed efficiently and automatically.

(3) A rotor section that supplies the printed circuit board on which six electronic components are mounted, a flux processing section that applies flux to the soldering surface of the printed circuit board supplied from this rotor section, and a printed circuit board that has undergone flux processing. a preheating section that preheats the board; a solder dipping section that includes a molten solder tank that dips solder onto the soldering surface of the printed circuit board that has been preheated in the preheating section; and an unrotor section that collects the printed circuit board that has undergone solder dipping. and a printed circuit board transport device that holds the printed circuit board in the rotor section and transports it from the rotor section to the unrotor section via the flux processing section, the preheat section, and the solder dip section, the printed circuit board transport device is held by a swing shaft, a swing arm attached to the swing shaft, a printed circuit board holding mechanism swingably provided at the tip of the swing arm, and a printed circuit board holding mechanism. a first transmission means that interlocks and connects the swing shaft and the printed circuit board holding mechanism to maintain the printed circuit board in a predetermined posture following the swing of the swing arm; a first drive means for applying a driving force; a second drive means for swinging the swing shaft to variably tilt the printed circuit board held by the printed circuit board holding mechanism to a desired tilt angle;
By using the second transmission means that connects the second drive means and the swing shaft, even if there is a change in the mounting density of the printed circuit board or a variety of other processing conditions, the printed circuit board By changing the inclination angle of the solder, it can be flexibly handled and the soldering process for printed circuit boards that is always optimal can be reliably automated.

(4) According to (3) above, the occurrence of soldering defects can be greatly reduced.

(5) According to the above (3), it is possible to obtain a solder processing apparatus for printed circuit boards that is small in size, saves installation space, and can reduce costs.

(6), above +11. With f31, printed circuit boards are conveyed not only in a planar direction like a chain conveyor, but also along a compound movement locus such as an arcuate motion, a linear motion, or a tilted motion, making it easier to solder in the planar direction. The system can be made smaller.

(7), (11, (31) above, the printed circuit board conveyance Vz'll of the present invention is different from a chain conveyor that simply conveys the printed circuit board in a plane direction, and the printed circuit board is transported once from the flux bath or solder bath. It is easily possible to carry out more reliable flux application or solder dipping by pulling up and repeating flux deposition or solder dipping as many times as necessary depending on the processing conditions.

[Brief explanation of drawings]

FIG. 1 is a schematic front view of a printed circuit board solder processing apparatus according to an embodiment of the present invention, FIG. 2 is a plan view thereof, FIG. 3 is a partial side sectional view of a conveying device, and FIG. 4 is a schematic thereof. Front view,
FIG. 5 is an enlarged partial plan view of the conveyance device, FIG. 6 is a schematic front view of the printed circuit board holding mechanism, FIG. 7 is a diagram illustrating the operation of dipping and lifting a printed circuit board into a solder bath or flux bath, and FIG. 8 The figure is a schematic explanatory diagram showing the overall process of soldering a printed circuit board according to the present invention. 1... Rotor section, 2... Flux tank, 3... Flux processing section, 4.5... Preheat station, 6... Preheat section, 7... ... Printed circuit board transfer device (first printed circuit board transfer device), 8 ... Solder bath, 9 ... Solder dip section, 10 ... Unrotor section, 11 ... Printed circuit board transfer device (second printed circuit board feeding device), 12... Worm reducer, 13... Swing shaft, 14... Bearing mechanism, 15... (3-movement arm, 16...axis, 17...printed circuit board holding mechanism, 18.19)
・Pulley, 20... Timing helmet (first transmission means), 21... Servo motor (first drive means), 22
...Pulse motor (second drive means), 23...
... Worm reducer, 24 ... Shaft, 25.26 ... Pulley, 27 ... Timing belt (second transmission means), 28 ... Control device, 29 ... ...Pin, 30...Block, 31...Guide bar, 32...
Tension shaft, 33...Slide, 34...Butterfly bolt, 35...Clamp support, 36...Clamp member, PCB...Printed circuit board, EP... ...Electronic parts. Figure 3

Claims (6)

[Claims] (1) A soldering method for performing solder dipping or flux deposition on a printed circuit board on which electronic components are mounted, the method comprising:
While the printed circuit board is tilted at a variable angle with respect to the liquid level of the molten solder liquid in the solder tank or the flux liquid in the flux tank, at least the surface to be soldered of the printed circuit board is moved from the lower end side to the upper end in the tilted state. After processing the desired area of the surface to be soldered by immersing it in the liquid while returning it from a tilted state to a horizontal state so as to bring the printed circuit board into contact with the liquid surface sequentially, the printed circuit board is tilted at a variable inclination angle while being immersed in the liquid. A soldering method for printed circuit boards characterized by raising the surface above the liquid level. (2) The soldering method for a printed circuit board according to claim 1, characterized in that the inclination angle of the printed circuit board is variably adjusted according to the mounting density of electronic components on the printed circuit board. (3) A rotor unit that supplies printed circuit boards on which electronic components are mounted, a flux processing unit that applies flux to the soldering surface of the printed circuit board supplied from this rotor unit, and a printed circuit board that has undergone flux processing. a preheating section that preheats the board; a solder dipping section that includes a molten solder tank that dips solder onto the soldering surface of the printed circuit board that has been preheated in the preheating section; and an unrotor section that collects the printed circuit board that has undergone solder dipping. and a printed circuit board transport device that holds the printed circuit board in the rotor section and transports it from the rotor section to the unrotor section via the flux processing section, the preheat section, and the solder dip section, the printed circuit board transport device is held by a swing shaft, a swing arm attached to the swing shaft, a printed circuit board holding mechanism swingably provided at the tip of the swing arm, and a printed circuit board holding mechanism. a first transmission means that interlocks and connects the swing shaft and the printed circuit board holding mechanism to maintain the printed circuit board in a predetermined posture following the swing of the swing arm; a first drive means for applying a driving force; a second drive means for swinging the swing shaft to variably tilt the printed circuit board held by the printed circuit board holding mechanism to a desired tilt angle;
A solder processing apparatus for a printed circuit board, comprising a second transmission means that connects the second drive means and the swing shaft. (4), the first driving means is a servo motor, the second driving means is a servo motor;
3. A printed circuit board according to claim 3, wherein the driving means is a pulse motor, and the first and second transmission means are belts partially wrapped around the swing shaft. Solder processing equipment. (5) The tilt angle of the printed circuit board held by the printed circuit board holding mechanism is varied to a desired tilt angle by driving the second driving means according to the mounting density of electronic components on the printed circuit board. The solder processing apparatus for printed circuit boards according to claim 3 or 4, characterized in that the solder processing apparatus for printed circuit boards is adjusted. (6) a first printed circuit board conveying device, wherein the printed circuit board conveying device holds the printed circuit board supplied to the rotor section, coats the printed circuit board with flux in the flux processing section, and then conveys the printed circuit board to the preheating section; , after holding the preheated printed circuit board in the preheating section and dipping its surface to be soldered into the molten solder liquid in the molten solder tank,
Claim 3, further comprising a second printed circuit board transport device that transports the printed circuit board to the unrotor section.
The printed circuit board solder processing apparatus according to any one of Item 4 and Item 5.