JPS62151091U - - Google Patents
Info
- Publication number
- JPS62151091U JPS62151091U JP1986038738U JP3873886U JPS62151091U JP S62151091 U JPS62151091 U JP S62151091U JP 1986038738 U JP1986038738 U JP 1986038738U JP 3873886 U JP3873886 U JP 3873886U JP S62151091 U JPS62151091 U JP S62151091U
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- assist gas
- processing device
- laser
- laser processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007921 spray Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000007664 blowing Methods 0.000 description 1
Description
第１図は本考案のレーザ加工装置の実施例を示
す構成図、第２図はアシストガス吹き付け状態を
示す図、第３図は従来例を示す図でてある。
第１図において、１はレーザ照射ノズル、２は
アシストガス噴出ノズル、３はワーク、４はＸ―
Ｙテーブルである。
FIG. 1 is a configuration diagram showing an embodiment of the laser processing apparatus of the present invention, FIG. 2 is a diagram showing an assist gas blowing state, and FIG. 3 is a diagram showing a conventional example. In Fig. 1, 1 is a laser irradiation nozzle, 2 is an assist gas ejection nozzle, 3 is a workpiece, and 4 is an X-
This is a Y table.
Claims (1)
、ノズル１からレーザ光を照射すると共に、ノズ
ル２からのアシストガスを横方向から吹き付ける
レーザ加工装置において、 上記アシストガス噴出ノズル２をレーザ照射ノ
ズル１の前方傾いた状態で、そのノズル１の周囲
を回動すべく取付け、 Ｘ―Ｙテーブル４上のワーク３の移動方向に対
して、アシストガス噴出ノズル２の噴出方向が常
に前方で対向するように制御するレーザ加工装置
。[Claims for Utility Model Registration] In a laser processing device that irradiates a workpiece 3 placed on an X-Y table 4 with a laser beam from a nozzle 1 and sprays assist gas from a nozzle 2 from the side, The assist gas ejection nozzle 2 is installed so as to rotate around the nozzle 1 while tilting forward of the laser irradiation nozzle 1, and the assist gas ejection nozzle 2 A laser processing device that controls the ejection directions so that they always face each other at the front.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986038738U JPS62151091U (en) | 1986-03-17 | 1986-03-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986038738U JPS62151091U (en) | 1986-03-17 | 1986-03-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62151091U true JPS62151091U (en) | 1987-09-25 |
Family
ID=30851260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986038738U Pending JPS62151091U (en) | 1986-03-17 | 1986-03-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62151091U (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100249702B1 (en) * | 1996-12-30 | 2000-04-01 | 정몽규 | Gas spraying device attachment laser welding head |
| JP2001212688A (en) * | 2000-01-31 | 2001-08-07 | Honda Motor Co Ltd | Laser welding method and apparatus |
| JP2002254185A (en) * | 2001-02-28 | 2002-09-10 | Honda Motor Co Ltd | Fragile part forming method and device for air bag |
| JP2011230153A (en) * | 2010-04-27 | 2011-11-17 | Fuji Electric Co Ltd | Method and device for processing wafer |
| WO2014077066A1 (en) * | 2012-11-13 | 2014-05-22 | 日本電気硝子株式会社 | Laser fusion-cutting method for plate glass |
| US20160001401A1 (en) * | 2013-02-14 | 2016-01-07 | Renishaw Plc | Selective laser solidification apparatus and method |
| CN105817621A (en) * | 2015-01-27 | 2016-08-03 | 通用电器技术有限公司 | Method of processing materials |
| JP6636213B1 (en) * | 2018-12-03 | 2020-01-29 | 三菱電機株式会社 | Laser processing apparatus and laser processing method |
| US10639879B2 (en) | 2013-03-15 | 2020-05-05 | Renishaw Plc | Selective laser solidification apparatus and method |
-
1986
- 1986-03-17 JP JP1986038738U patent/JPS62151091U/ja active Pending
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100249702B1 (en) * | 1996-12-30 | 2000-04-01 | 정몽규 | Gas spraying device attachment laser welding head |
| JP2001212688A (en) * | 2000-01-31 | 2001-08-07 | Honda Motor Co Ltd | Laser welding method and apparatus |
| JP4583535B2 (en) * | 2000-01-31 | 2010-11-17 | 本田技研工業株式会社 | Laser welding method and apparatus |
| JP2002254185A (en) * | 2001-02-28 | 2002-09-10 | Honda Motor Co Ltd | Fragile part forming method and device for air bag |
| JP2011230153A (en) * | 2010-04-27 | 2011-11-17 | Fuji Electric Co Ltd | Method and device for processing wafer |
| WO2014077066A1 (en) * | 2012-11-13 | 2014-05-22 | 日本電気硝子株式会社 | Laser fusion-cutting method for plate glass |
| JP2014097906A (en) * | 2012-11-13 | 2014-05-29 | Nippon Electric Glass Co Ltd | Laser beam fusion-cutting method of plate glass |
| EP2956262B1 (en) | 2013-02-14 | 2018-04-04 | Renishaw PLC | Selective laser solidification apparatus and method |
| US20160001401A1 (en) * | 2013-02-14 | 2016-01-07 | Renishaw Plc | Selective laser solidification apparatus and method |
| US10493562B2 (en) * | 2013-02-14 | 2019-12-03 | Renishaw Plc | Selective laser solidification apparatus and method |
| US11565346B2 (en) | 2013-02-14 | 2023-01-31 | Renishaw Plc | Selective laser solidification apparatus and method |
| US12030245B2 (en) | 2013-02-14 | 2024-07-09 | Renishaw Plc | Method of selective laser solidification |
| US10639879B2 (en) | 2013-03-15 | 2020-05-05 | Renishaw Plc | Selective laser solidification apparatus and method |
| US11104121B2 (en) | 2013-03-15 | 2021-08-31 | Renishaw Plc | Selective laser solidification apparatus and method |
| US11752694B2 (en) | 2013-03-15 | 2023-09-12 | Renishaw Plc | Selective laser solidification apparatus and method |
| CN105817621A (en) * | 2015-01-27 | 2016-08-03 | 通用电器技术有限公司 | Method of processing materials |
| EP3050666A1 (en) * | 2015-01-27 | 2016-08-03 | Alstom Technology Ltd | Method of processing materials by applying a laser beam with adaptive shielding gas flow |
| JP6636213B1 (en) * | 2018-12-03 | 2020-01-29 | 三菱電機株式会社 | Laser processing apparatus and laser processing method |
| WO2020115798A1 (en) * | 2018-12-03 | 2020-06-11 | 三菱電機株式会社 | Laser machining device and laser machining method |
| US11389907B2 (en) | 2018-12-03 | 2022-07-19 | Mitsubishi Electric Corporation | Laser machining apparatus and laser machining method |