JPS62147355U - - Google Patents
Info
- Publication number
- JPS62147355U JPS62147355U JP3522086U JP3522086U JPS62147355U JP S62147355 U JPS62147355 U JP S62147355U JP 3522086 U JP3522086 U JP 3522086U JP 3522086 U JP3522086 U JP 3522086U JP S62147355 U JPS62147355 U JP S62147355U
- Authority
- JP
- Japan
- Prior art keywords
- recess
- semiconductor chip
- wiring board
- wiring
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- 239000000110 cooling liquid Substances 0.000 description 1
Description
第１図は本考案の一実施例の断面図、第２図は
第１図に用いられた半導体チツプの斜視図である
。
１：半導体チツプ、１１：周辺面、２：凹部、
４：配線基板、５：導線、６：配線、７：空洞部
、８１，８２：貫通孔、９：冷却液。
FIG. 1 is a sectional view of one embodiment of the present invention, and FIG. 2 is a perspective view of the semiconductor chip used in FIG. 1. 1: semiconductor chip, 11: peripheral surface, 2: recess,
4: wiring board, 5: conducting wire, 6: wiring, 7: cavity, 81, 82: through hole, 9: cooling liquid.
Claims (1)
た半導体チツプが配線基板の絶縁面に前記凹部を
囲む周辺面において固着され、前記凹部と前記基
板の間に生ずる空洞部が該基板を貫通する二つの
冷却液通路に連通し、前記半導体チツプ表面の電
極が前記配線基板の配線に接続されたことを特徴
とする半導体装置。 A semiconductor chip having an electrode on one surface and a recess in the center of the other surface is fixed to an insulating surface of a wiring board at a peripheral surface surrounding the recess, and a cavity formed between the recess and the substrate is 1. A semiconductor device, characterized in that the electrodes on the surface of the semiconductor chip are connected to the wiring of the wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3522086U JPS62147355U (en) | 1986-03-11 | 1986-03-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3522086U JPS62147355U (en) | 1986-03-11 | 1986-03-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62147355U true JPS62147355U (en) | 1987-09-17 |
Family
ID=30844510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3522086U Pending JPS62147355U (en) | 1986-03-11 | 1986-03-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62147355U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008112749A (en) * | 2006-10-27 | 2008-05-15 | Kyocera Corp | Semiconductor device, and fluid device equipped with semiconductor device |
-
1986
- 1986-03-11 JP JP3522086U patent/JPS62147355U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008112749A (en) * | 2006-10-27 | 2008-05-15 | Kyocera Corp | Semiconductor device, and fluid device equipped with semiconductor device |