JPS617694A - Composite printed circuit board - Google Patents
Composite printed circuit boardInfo
- Publication number
- JPS617694A JPS617694A JP12820484A JP12820484A JPS617694A JP S617694 A JPS617694 A JP S617694A JP 12820484 A JP12820484 A JP 12820484A JP 12820484 A JP12820484 A JP 12820484A JP S617694 A JPS617694 A JP S617694A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- composite printed
- conductor circuit
- composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、金属基板とフレキシブル基板を接続し、かつ
金属基板の内部に、冷却用空洞を有するプリント配線板
（以下複合プリント配線板と称する）に関する。このよ
うな構造の複合プリント配線板は、従来の金属基板に比
して、より高密度な面実装が可能であり、かつ放熱特性
も従来のものより優れており、ＯＡ機器、コンピュータ
などに利用効果が犬である。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a printed wiring board (hereinafter referred to as a composite printed wiring board) which connects a metal substrate and a flexible substrate and has a cooling cavity inside the metal substrate. ) regarding. Composite printed wiring boards with this structure can be mounted on surfaces with higher density than conventional metal substrates, and have better heat dissipation properties than conventional ones, making them suitable for use in office automation equipment, computers, etc. The effect is a dog.
（１）特開昭５８−９３９９号公報によれば、後示する
図面（第４図）の如く、金属板（イ）の表面にフレキシ
ブル基板（ロ）を貼付するプリント配線板の製造方法が
開示されている。(1) According to Japanese Patent Application Laid-open No. 58-9399, as shown in the drawing (Fig. 4) shown later, there is a method for manufacturing a printed wiring board in which a flexible substrate (b) is pasted on the surface of a metal plate (a). Disclosed.
（２）特開昭５８−９３９３号公報によれば後ポする図
面（第５図）の如く、ヒートパイプ３勺を有する金属芯
表面に絶縁被膜に）を形成し、前記絶縁被膜の表面に導
体回路（ホ）を形成したプリント配線板が開示されてい
る。。(2) According to JP-A No. 58-9393, as shown in the drawing (Fig. 5) shown later, an insulating coating is formed on the surface of a metal core having three heat pipes, and the surface of the insulating coating is A printed wiring board on which a conductive circuit (e) is formed is disclosed. .
（３）後示する図面（第６図）の如く、両面接続のため
に金属基板のスルホール化が行なわれてきた。(3) As shown in the drawing (FIG. 6) shown later, metal substrates have been formed with through holes for double-sided connection.
〔発明が解決しようとする問題点〕
（８１従来の技術 （１）に記載のプリント配線板は、
配線密度が従来の両面スルホールプリント配線板と同等
であり、放熱性もよ（なかった。[Problems to be solved by the invention] (81 Prior Art The printed wiring board described in (1)
The wiring density is the same as that of conventional double-sided through-hole printed wiring boards, and the heat dissipation is also good.
（ｂ） 従来の技術 （２）に記載のプリント配線板
は、ヒートパイプの加工が面倒であり、かつ導体回路は
一層のみであるから配線密度が低いという欠点があった
。(b) Prior Art The printed wiring board described in (2) has the disadvantage that processing of the heat pipe is troublesome, and since the conductor circuit is only one layer, the wiring density is low.
（Ｃ）従来の技術 （３）に記載のプリント配線板はス
ルホール（へ）のコーナ一部（ト）の絶縁層が薄りなり
、かつ比較的大きなＲがつくため、絶縁性が悪く、かつ
高密度配線の妨げとなる欠点があった。(C) Prior art The printed wiring board described in (3) has poor insulation properties because the insulating layer at the corner (g) of the through hole is thin and has a relatively large radius. This had the drawback of hindering high-density wiring.
本発明は従来の技術（１）〜（３）に記載の欠点のすべ
てを除去、改善することを目的とし、前記特許請求の範
囲各項に記載の複合プリント配線板を提供することによ
り、その目的を達成できるものである。The present invention aims to eliminate and improve all of the drawbacks described in conventional techniques (1) to (3), and by providing a composite printed wiring board as described in each of the claims above. It is possible to achieve the purpose.
〔問題点を解決するための手段およびその作用〕以下本
発明の複合プリント配線板を図面に基づいて具体的に説
明する。本発明の複合プリント配線板は第１図の縦断面
図に示す如く、金属板（１）の表面に絶縁層（２）が形
成されており、その表面に導体回路（３）が形成されて
おり、スルホール（４）を有スるフレキシブル基板（５
）が接着層（６）および導通接続部（７）を介して、該
金属基板に搭載されていることを特徴としている。前記
金属板にはアルミニウム。[Means for Solving the Problems and Their Effects] The composite printed wiring board of the present invention will be specifically described below with reference to the drawings. As shown in the longitudinal cross-sectional view of FIG. 1, the composite printed wiring board of the present invention has an insulating layer (2) formed on the surface of a metal plate (1), and a conductive circuit (3) formed on the surface. flexible substrate (5) with through holes (4).
) is mounted on the metal substrate via an adhesive layer (6) and a conductive connection part (7). The metal plate is aluminum.
鉄、銅などがあり、加工性を考慮して板厚は１．０〜５
．０順程度が好ましい。前記絶縁層にはポリイミド樹脂
、エポキシ樹脂などの絶縁性樹脂を使用し、防熱性を考
慮してその厚みは１０〜１００μｍ程度が好ましい。さ
らに、アルミナやシリカなどの無機絶縁性フィラーを混
入すると放熱性が向上する。前記接着層には接着シート
、接着剤などがある。また、前記フレキシブル基板は、
ポリイミド樹脂基板ビスマレイミド、トリアジン樹脂基
板、耐熱エポキシ樹脂基板などがある。基板厚みは、市
販品の中から比較、的自由に選択できるが、使用目的お
よびコストなどを考慮すると２５〜１００μｍ程度が好
ましい。そして、前記導通接続部は、導電ペースト印刷
、めっき、ソルダーコートの中から少くとも１種以上の
組合せにより形成する。There are iron, copper, etc., and the plate thickness is 1.0 to 5 in consideration of workability.
．． The order of 0 is preferable. An insulating resin such as polyimide resin or epoxy resin is used for the insulating layer, and its thickness is preferably about 10 to 100 μm in consideration of heat resistance. Furthermore, heat dissipation is improved by mixing an inorganic insulating filler such as alumina or silica. The adhesive layer includes an adhesive sheet, an adhesive, and the like. Further, the flexible substrate is
Examples include polyimide resin substrates, bismaleimide resin substrates, triazine resin substrates, and heat-resistant epoxy resin substrates. The thickness of the substrate can be selected freely by comparison from commercially available products, but it is preferably about 25 to 100 μm considering the purpose of use and cost. The conductive connection portion is formed by a combination of at least one of conductive paste printing, plating, and solder coating.
第２図は金属板の両面に導体回路を形成し、フレキシブ
ル基板により両面接続を行った本発明の複合プリント・
配線板の一例である。Figure 2 shows a composite printed circuit board of the present invention in which conductor circuits are formed on both sides of a metal plate and both sides are connected using a flexible board.
This is an example of a wiring board.
前記フレキシブル基板の表面には、カバーレイ（１１）
が施されている。前記カバーレイは、導体回路の保護お
よび、金属板（１）の角部との接触による電気絶縁性の
低下を防ぐという目的を兼ねている。A coverlay (11) is provided on the surface of the flexible substrate.
is applied. The coverlay serves both the purpose of protecting the conductor circuit and preventing deterioration of electrical insulation due to contact with the corners of the metal plate (1).
ｆｍ記カバーレイは、ポリイミドフィルム、ポリエステ
ルフィルムなどを使用する。The fm coverlay uses polyimide film, polyester film, etc.
第３図は金属板の内部に冷却用空洞（２１）を設けた本
発明の複合プリント配線板の一例である。前記冷却用空
洞は、２枚の金属板の片面に、フライス法、エツチング
法、レーザー法などにより凹部を形成したのち、仁れら
の凹部形成面同志を接着剤または金属接合用はんだ（２
２）を介して接合し形成されている。前記接着剤は、市
販の金属接合用接着剤の中から選択するが、冷却用空洞
に水又はフロンなどの冷却用流体を通すために耐水性、
耐薬品性、耐候性に優れた接着剤を使用すべきである。FIG. 3 is an example of a composite printed wiring board of the present invention in which a cooling cavity (21) is provided inside a metal plate. The cooling cavity is formed by forming a recess on one side of two metal plates by a milling method, an etching method, a laser method, etc., and then applying adhesive or metal bonding solder (2
2). The adhesive is selected from commercially available metal bonding adhesives, and is water resistant to allow cooling fluids such as water or Freon to pass through the cooling cavity.
Adhesives with excellent chemical and weather resistance should be used.
以下、本発明の複合プリント配線板の最も代表的な実施
例を第３図の縦断面図を用いて具体的化説明する。金属
板（１）として板厚２．０謂のアルミニウム板を使用し
、前記アルミニウム板の片面に、フライス加工により凹
部を形成し、前記凹部形成面同志を三井石油化学工業■
製エポキシ系接着剤（品名１ＡＨ−（３０Ｘ）にて接合
し、前記アルミニウム板表面を陽極酸化したのち、三井
石油化学工業■製耐熱エポキシ絶縁ワニス（品名ｉ Ｔ
Ａ−１８５０）を浸漬コーティング厚み４０μｍの絶縁
層（２）を形成した。前記絶縁層表面に、めっき法によ
り導体回路（３）を形成し、その表面にニラカン工業■
製接着シート（品名ｉ ５ＡＦＶ−４０）を介して板厚
５Ｑ７１ｍのポリイミド樹脂フレキシブル基板（団を搭
載した。Hereinafter, the most typical embodiment of the composite printed wiring board of the present invention will be explained in detail using the vertical cross-sectional view of FIG. An aluminum plate with a thickness of 2.0 is used as the metal plate (1), a concave portion is formed on one side of the aluminum plate by milling, and the concave-formed surfaces are separated by a Mitsui Petrochemical Co., Ltd.
After bonding with epoxy adhesive (product name 1AH-(30X) manufactured by Mitsui Petrochemical Industries ■ and anodizing the surface of the aluminum plate, heat-resistant epoxy insulating varnish manufactured by Mitsui Petrochemical Industries ■ (product name iT)
A-1850) was dip coated to form an insulating layer (2) with a thickness of 40 μm. A conductor circuit (3) is formed on the surface of the insulating layer by plating, and Nirakan Kogyo ■
A polyimide resin flexible substrate (group) having a plate thickness of 5Q71 m was mounted via a manufactured adhesive sheet (product name: i5AFV-40).
前記フレキシブル基板表面には、ポリイミドフィルムに
よるカバーレイ（１１）が施されている。さらに、無電
解銅めっきおよびソルダーコートにより導通接続部（７
）が形成されている。A coverlay (11) made of polyimide film is provided on the surface of the flexible substrate. Furthermore, conductive connections (7
) is formed.
以上のように本発明によれば、次に示すような数々の優
れた効果がもたらされる。As described above, according to the present invention, a number of excellent effects as shown below are brought about.
１、発明が解決しようとする問題点（ａ）〜（Ｃ）に記
載の配線密度が低いという点について、本発明の複合プ
リント配線板は、片面で少なくとも３層の導体パターン
を有しており、高密度配線が可能となった。1. Problems to be Solved by the Invention Regarding the low wiring density described in (a) to (C), the composite printed wiring board of the present invention has at least three layers of conductor patterns on one side. , high-density wiring became possible.
２、発明が解決しようとする問題点（ａ）に記載の放熱
性が低いという点について、本発明の複合プリント配線
板は、発熱の多い電子部品を金属基板上の導体回路に直
接搭載でき放熱性が向上した。2. Problem to be Solved by the Invention Regarding the low heat dissipation performance described in (a), the composite printed wiring board of the present invention can directly mount electronic components that generate a lot of heat on the conductor circuit on the metal substrate, and has high heat dissipation. sex has improved.
３、従来の技術（３）記載の両面接続法について本発明
の複合プリント配線板は、スルホールを介さずに、フレ
キシブル基板によって行うので電気絶縁性が向上し、大
電力用のプリント配線板としての使用が可能となった。3. Regarding the double-sided connection method described in conventional technology (3), the composite printed wiring board of the present invention uses a flexible substrate without using through holes, so electrical insulation is improved, and it is suitable as a printed wiring board for high power. Now available for use.
４、発明が解決しようとする問題点（１））に記載の冷
却用空洞の加工が面倒という点について、本発明の複合
プリント配線板は、各２枚の金属板の片面に凹部を形成
し、前記凹部形成面同志を接合するという単純な工程を
用いたため工数およびコストが大幅に低減できた。4. Problem to be Solved by the Invention Regarding the problem (1)) that processing of the cooling cavity is troublesome, the composite printed wiring board of the present invention has a recess formed on one side of each of the two metal plates. Since the simple process of joining the recessed surfaces together was used, the number of man-hours and cost could be significantly reduced.
第１図は特許請求の範囲第１項に示す本発明の複合プリ
ント配線板の一例の縦断面図である。
第２、特許請求の範囲第４項に示す本発明の複合プリン
ト配線板の一例の縦断面図である。
第３図は特許請求の範囲第６項に示す本発明の複合プリ
ント配線板の一例の縦断面図である。
第４図は従来の技術（１）に示す当該プリント配線板の
一例の縦断面図である。
第５図は従来の技術（２）に示す当該プリント配線板の
一例の縦断面図である。
第６図は従来の技術（３）に示す当該スルホールの一例
の縦断面図である。
（１）・・・金属板
（２）・・・絶縁層
（３）−・・導体回路
（４）・・・スルホール
（５）・・・フレキシブル基板
（６）・・・接着層
（７）・・・導通接続部
（１１）−・・カバーレイ
（２１）・・・冷却用空洞
（２２） −・・接着剤または金属接合用はんだ（イ）
・・・金属芯
幹）・・・フレキシブル基板
ｅ勺・・・ヒートパイプ
に）・・・絶縁被膜
（ホ）・・・導体回路
（へ）・・・スルホールFIG. 1 is a longitudinal sectional view of an example of a composite printed wiring board of the present invention as set forth in claim 1. 2. It is a longitudinal cross-sectional view of an example of the composite printed wiring board of this invention shown in Claim 4. FIG. 3 is a longitudinal sectional view of an example of the composite printed wiring board of the present invention as set forth in claim 6. FIG. 4 is a longitudinal cross-sectional view of an example of the printed wiring board shown in the prior art (1). FIG. 5 is a longitudinal cross-sectional view of an example of the printed wiring board shown in conventional technique (2). FIG. 6 is a longitudinal cross-sectional view of an example of the through hole shown in the prior art (3). (1) Metal plate (2) Insulating layer (3) Conductor circuit (4) Through hole (5) Flexible board (6) Adhesive layer (7) ... Continuity connection part (11) - Coverlay (21) - Cooling cavity (22) - Adhesive or metal bonding solder (A)
・・・Metal core) ・・・Flexible board ・For heat pipes) ・Insulating coating (E) ・Conductor circuit (H) ・Through hole
Claims (1)
縁層の表面に導体回路（３）を有し、前記導体回路の表
面に、スルホール（４）を有する両面フレキシブルプリ
ント配線板（５）が搭載され、前記導体回路とスルホー
ル部とが電気的に接続されていることを特徴とする複合
プリント配線板。 ２、金属板の内部に冷却用空洞を持つことを特徴とする
特許請求の範囲第１項記載の複合プリント配線板。 ３、前記冷却用空洞は、各２枚の金属板の片面に凹部を
形成し、これらの凹部形成面同志を接合して成ることを
特徴とする特許請求の範囲第２項記載の複合プリント配
線板。 ４、金属板（１）の両面に絶縁層（２）を有し、前記絶
縁層の表面に導体回路（３）を有し、前記導体回路の表
面に、スルホール（４）を有する両面フレキシブルプリ
ント配線板（５）が搭載され、前記導体回路とスルホー
ル部とが電気的に接続され、かつ前記フレキシブルプリ
ント配線板の少くとも一端が、他面に搭載されたフレキ
シブルプリント配線板と接続されてなる複合プリント配
線板。 ５、金属板の内部に冷却用空洞（２１）を持つことを特
徴とする特許請求の範囲第４項記載の複合プリント配線
板。 ６、前記冷却用空洞は、各２枚の金属板の片面に凹部を
形成し、これらの凹部形成面同志を接合して成ることを
特徴とする特許請求の範囲第５項記載の複合プリント配
線板。[Claims] 1. An insulating layer (2) is provided on the surface of the metal plate (1), a conductor circuit (3) is provided on the surface of the insulating layer, and a through hole (4) is provided on the surface of the conductor circuit. 1.) A composite printed wiring board characterized in that a double-sided flexible printed wiring board (5) having a double-sided flexible printed wiring board (5) is mounted, and the conductor circuit and the through-hole portion are electrically connected. 2. The composite printed wiring board according to claim 1, which has a cooling cavity inside the metal plate. 3. The composite printed wiring according to claim 2, wherein the cooling cavity is formed by forming a recess on one side of each of two metal plates, and joining these recessed surfaces to each other. Board. 4. Double-sided flexible print having an insulating layer (2) on both sides of a metal plate (1), a conductor circuit (3) on the surface of the insulating layer, and a through hole (4) on the surface of the conductor circuit. A wiring board (5) is mounted, the conductor circuit and the through-hole portion are electrically connected, and at least one end of the flexible printed wiring board is connected to a flexible printed wiring board mounted on the other side. Composite printed wiring board. 5. The composite printed wiring board according to claim 4, which has a cooling cavity (21) inside the metal plate. 6. The composite printed wiring according to claim 5, wherein the cooling cavity is formed by forming a recess on one side of each of two metal plates, and joining these recessed surfaces together. Board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12820484A JPS617694A (en) | 1984-06-21 | 1984-06-21 | Composite printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12820484A JPS617694A (en) | 1984-06-21 | 1984-06-21 | Composite printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS617694A true JPS617694A (en) | 1986-01-14 |
| JPH0220156B2 JPH0220156B2 (en) | 1990-05-08 |
Family
ID=14979045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12820484A Granted JPS617694A (en) | 1984-06-21 | 1984-06-21 | Composite printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS617694A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06309923A (en) * | 1993-04-26 | 1994-11-04 | Tafuto:Kk | Radiating body working also as insulator, manufacture of the body, low voltage heater using the body, and manufacture of the heater |
| EP1688099A1 (en) | 2005-02-02 | 2006-08-09 | PENTAX Corporation | Endoscopic high-frequency knife |
| US7427282B2 (en) | 2004-05-24 | 2008-09-23 | Hoya Corporation | High-frequency cutting instrument for endoscope |
| US7896876B2 (en) | 2005-10-31 | 2011-03-01 | Hoya Corporation | High frequency incision instrument for endoscope |
-
1984
- 1984-06-21 JP JP12820484A patent/JPS617694A/en active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06309923A (en) * | 1993-04-26 | 1994-11-04 | Tafuto:Kk | Radiating body working also as insulator, manufacture of the body, low voltage heater using the body, and manufacture of the heater |
| US7427282B2 (en) | 2004-05-24 | 2008-09-23 | Hoya Corporation | High-frequency cutting instrument for endoscope |
| EP1688099A1 (en) | 2005-02-02 | 2006-08-09 | PENTAX Corporation | Endoscopic high-frequency knife |
| US7585298B2 (en) | 2005-02-02 | 2009-09-08 | Hoya Corporation | Endoscopic high-frequency knife |
| US7896876B2 (en) | 2005-10-31 | 2011-03-01 | Hoya Corporation | High frequency incision instrument for endoscope |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0220156B2 (en) | 1990-05-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
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| EXPY | Cancellation because of completion of term |