JPS6151936A - Automatic mounting method for chip component - Google Patents

Abstract

PURPOSE:To enable various kinds of many chip components to be mounted automatically at high speed with high accuracy by a method wherein components are contrained in the stocker in trays, which are constructed in accoreance with the shapes of the chip components. CONSTITUTION:A means of arrangig chip components in trays tothe predetermined state, means of arranging a plurality of trays in a chip component container 4 to the predetermined stae, means of teaching the predetermined reference position of the container 4 by manual operation, control means 6 having a series of programs to successively take out the chip components of the first tray provided in the container by means of the signal of chip component position previously stored with a pickup tool 5 and to successively take out the chip components of the second tray, and a means of automatically carrying each taken chip component to the mount position are provided. Then, a material to fix the chip components is attached 1 and die-bonds the chip components to a ceramic printed circuit board carried from a magazine 3 at the mount position 2.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an automatic mounting method for die bonding using a tray stocker.

[Technical background of the invention and its problems]

The use of ICs in electrical circuits has had a great effect on power savings, but automation in factories is progressing to further reduce IC costs and improve productivity.

For example, it is commonly used to automatically mount an IC on a mounter at a predetermined position on a circuit board (Japanese Patent Laid-Open No. 55-56692). Regarding this mounter, there has recently been a demand for mounting a large number and various types of ICs on one circuit board. In order to automatically mount a large number of ICs of various types, it is difficult to recognize the positions of all ICs correctly and mount them at high speed on a mount, so it has not been put to practical use.

[Purpose of the invention]

The present invention has been made in view of the above points, and provides an automatic chip component mounting method that automatically mounts a large number of chip components of various types with high speed and high precision.

[Summary of the invention]

In this invention, the material for fixing the chip components is attached (1
) and transferred from a magazine (3) to a mounting position (2) for die-bonding chip components onto a ceramic printed circuit board (mounting table), the method comprising: means for arranging the chip components in a predetermined state on a tray; a means for arranging a plurality of the trays in a predetermined state in the storage container (4); a means for manually teaching a predetermined reference position of the storage container; The above storage container (
The chip components in the first tray provided in 1) are taken out one by one using the pick-up tool (5), and then
automatic mounting of chip components, comprising: a control means (6) having a series of programs for sequentially taking out chip components from a tray; and means for automatically transporting each chip component taken out to a mounting position. This is how you get it.

[Embodiments of the invention]

Next, an embodiment will be described in which the method of the present invention is applied to mounting a large number of semiconductor IC chips of various types.

One of the techniques for mounting a large number of semiconductor IC chips of various types is to mount a large number of semiconductor IC chips on a tray stocker.
This will be explained with reference to the figures. That is to say. An IC component @ is installed in the mounting groove (2υ) of this tray 02.The cross-sectional view of this tray (2) cut 1M at the position shown in Fig. 2 is the width υ in Fig. 3. The back side of the tray is hollowed out in a rectangular shape and has a recess 04).A tray (C) with such a structure can be used as a stocker (C) as shown in Fig. 4.
C), and on the surface of the rectangular substrate, six rectangular positioning parts are arranged in a matrix shape so as to slide into and fit into the recesses formed on the back surface of the tray. It is set in. A spring as shown in FIG. 5 is installed in at least one corner of each convex portion (5) to further improve positioning accuracy.

゛This spring example presses the side of the tray (2';!J) when the tray (2';!J) is inserted into the convex portion (5), and
The structure is such that the position is set using the side wall near the spring (to) as a reference. Each of these convex portions (5) has the same shape, and the tray (particularly the chip component placement groove Q1 provided) is appropriately selected depending on the external shape of the type of semiconductor IC chip. Therefore, once the circuit board is determined,
The type of IC to be inserted into the circuit board is also determined, and the layout of the tray containing the required type of IC is determined in advance, and the layout is stored in memory. The positioning of the stocker (■) configured in this way is performed by inputting two points in advance.These two points are, as is well known, for example, the positioning of the stocker (two corner parts on two diagonals or other reference positions). By using such a stocker (c), which is determined by setting and teaching in advance, it is possible to mount other parts (i), (7), and (7)xc parts at high speed.

Next, a specific example will be described with reference to FIG. That is, a thick film circuit board is used as a mounting table, and the size of the wiring pattern formed on the ceramic substrate is, for example, 3 mm horizontally.
Ceramic circuit board with cIrL length 5cIIL (30)
is placed on the carrier GD and loaded in multiple stages within the magazine (3). When this magazine 02 is loaded, the magazine 02 is moved downward of the loader so that it is pulled out one stage at a time from the bottom stage. It is controlled by the drive (i.e., the belt located at the lower stage of the magazine 0 side and arranged at regular intervals...) is driven to the conveying state, and the magazine country is driven by the downward movement of the loader @, and the carrier Oυ is When placed 11i14 on the belt 1.34), the downward movement of the magazine G is stopped, and the carrier 01) is linearly conveyed to the dispensing position below the dispensing head G and stopped.

At this position, the circuit board placed on the carrier C31) is imaged by a television camera mounted on the dispensing head C3n, such as a black and white television camera (support) K, and the part to which the semiconductor chip (37) is attached is captured. Automatically detect.

That is, the standard pattern of the mounting position of the semiconductor chip Gη on the circuit board is manually stored in advance in a memory (not shown). Therefore, the semiconductor chip 1 of the circuit board that arrives each time
．． The mounting position of 3'7: is imaged with the above TV camera (to), and the binary image output of and is compared with the above standard pattern to calculate the amount of positional deviation, and from this amount of positional deviation the actual The semiconductor chip attachment position is recognized, and a material for fixing the semiconductor chip c37), such as silver paste having adhesive properties, is applied, for example, by dripping, to this part. To perform such a process, the dispense head (to)
11ttl drive table (not shown). This completes the dispensing process. Thereafter, the carrier e1) is transported by the belt 04) and stopped at the mounting position.

At the mounting position, an image is taken by a television camera I, 39 mounted on the mounting head (top), and the mounting position of the semiconductor chip G37) is automatically detected. The detection means automatically detects the dispensing work position using pattern recognition technology, similar to the above-mentioned detection of the dispensing work position. When this automatic position detection is completed, the mount head (to) is moved and the e-table ←Q
The semiconductor chip Oη is picked up and placed on the mounting position of the semiconductor chip <37) whose position has been detected by picking it up, for example, by a suction means, and then applying pressing force to the head (to) to press the semiconductor chip Oη onto the circuit board. Attach. To perform such work, the mount head side is equipped with an X-Y axis drive table (
(not shown). This completes the mounting process.

After completing this mounting process, the carrier C31] is conveyed in a vertical direction with the conveyance direction toward the front and inserted into the receiving magazine (49) by six belts. The unloader (4 (
a) to lift it upward and drive it. Intermittent driving is performed in which the motor stops at every first step of the apex position. This loader
All intermittent operations of the unloader G3α are executed under the control of the conveter, and the control program also controls the conveyance of the carrier 131), such as dispensing position, stopping at the mounting position, starting and ending each operation, and conveyance. Everything is also controlled by a computer.

On the other hand, the semiconductor chips loaded on the θ table (9) are transported in the following manner. That is, semiconductor chip G'7
) For example, a large number of trays 09 each having a large number of recesses arranged in a predetermined arrangement according to the size of an IC chip are arranged in a predetermined manner in a stocker as shown in FIG.

The ICs accommodated in each tray (four) may be of the same type, or may be of the true type.

In addition, the tray system is used to store the ICs (i.e.,
io is configured. The stocker (46) is marked with a mark for position detection, and by manually detecting this mark in advance and storing it in memory, the stocker (46)
It is stored as the amount of positional deviation of 1 meter. A tool that moves in the X-Y direction based on this amount of deviation, such as a pickup head (47) VC, l, one tray (IC
Take out the chip. For example, the pickup head η is attached to υ11& and placed on the e-table GiO. The e-table Qll is a circular plate with a large number of suction holes (4Q is a rotary disk (it is installed so that it can be fixed and rotated independently. Therefore, the stocker (/, [i) The direction of the transferred IC chip is corrected by rotationally driving the O table 0Q. After this correction operation, the rotating disk (41O is rotated and transferred in the direction of the mount head, for example, 1tJO In the case of this 180 degree rotation, two O tables On are provided on a straight line passing through the center of the disc 0 barrel. This is determined by the transport position to the mount position. In the case of 120 degree rotation is a θ table (4 (currently there are 3 pieces). The direction correction means for the IC chip calculates the positional deviation by comparing the image output from the television camera KIIC and the standard position information stored in advance. The amount of rotation of the θ table 00 is calculated and corrected based on this amount of positional deviation.

The flowchart of the process of taking out the specified IC chip from the tray mentioned above with the backup tool (4η) is as shown in Figure 7. In other words, at the start, specify the number of 5 IC chips, and then use the tray stocker (a9 Check the presence or absence of the specified IC chip in the table, and if yes,
For the arrayed trays, it is determined whether the specified IC exists or not, and if there is, the IC information, tray information,
After setting the number of ICs in the tray and the tray origin information,
3) Find the matrix of IC chip pockets to be taken out. That is, for example, the X and Y coordinates are determined using the following equations.

X X coordinate = (PX + GX) × (pocket row - 1) + -
+TX+ 2 stocker origin X coordinate Y Y coordinate =: (PY+GY)X (pocket row -1) +-+
TY+2 Stocker origin Ym mark In the above formula, each symbol is as shown in FIG. 7(B). Input the coordinates obtained in this way to the CPU, and
Under the control of U, the designated IC chip is taken out from the tray using a tool. A television monitor so5i1) is also installed, the monitor ci1 displays the imaging output of the television camera (iω), and the monitor 51 switches and displays the imaging output of the television camera (to)01. That is, the computer is controlled so that when the dispense position is detected, the image pickup output of the television camera G36) is reproduced, and when the mount position is detected, the image pickup output of the television camera 01 is reproduced.

In this way, the dispensing work and the mounting work are automatically performed on the circuit board conveyance path, so that they can all be performed automatically, which is effective in saving labor.

[Effect of the first man]

As explained above, according to the present invention, it is possible to store chip components in trays in a stocker, and each tray has a structure corresponding to the shape of the chip components. It has effects such as enabling automatic mounting.

[Brief explanation of drawings]

FIG. 1 is a block diagram illustrating an overview of the method of the present invention;
FIG. 2 is a perspective view of a tray accommodated in the chip component storage container shown in FIG. 1, FIG. 3 is a sectional view taken along the line ■-■ in FIG. 2, and FIG. 4 is an example of the chip component storage container shown in FIG. 1. FIG. 5 is an explanatory diagram of the locking structure of each tray in FIG. 4,
6 is a perspective view of a mounter for explaining the embodiment of FIG. 1, and FIG. 7 (-(B) is a flowchart for taking out a specified IC chip from the tray of FIG. 1... Attaching the fixing material, 2... Mounting, 3...
...Magazine, 4...Chip parts storage 82
Table 5...Pickup tool, 6...Control device, A...Dispense position, Wing...Mount position, 46...Stocker, 45...Tray, 47...
...Pickup tool. Agent: Patent attorney Kensuke Chika (and 1 other person) Figure 1, Figure 2, Figure 4, Figure 5, Figure 6, Figure 7 (A)

Claims (3)

[Claims] (1) In a method of bonding a chip component to a mounting table on which a material for fixing the chip component is attached and transferred to a mounting position, means for arranging the chip component in a predetermined state on a tray; means for arranging a plurality of the trays in a predetermined state in a storage container; means for manually teaching a predetermined reference position of the storage container; and chip components stored in advance based on the reference position. A control procedure having a series of programs for sequentially taking out chip parts on a first tray provided in the storage container using a pickup tool based on a position signal, and then taking out chip parts on a second tray in sequence, and each of the chips taken out. 1. A method for automatically mounting chip components, comprising means for automatically transferring the component to a mounting position. (2) The automatic mounting method of a chip component according to claim 1, wherein the chip component is an LSI pellet. (3) A method for automatically mounting chip components, characterized in that each tray contains components of the same type.